JPH02166645A - Manufacture of substrate for optical recording medium - Google Patents

Manufacture of substrate for optical recording medium

Info

Publication number
JPH02166645A
JPH02166645A JP32061988A JP32061988A JPH02166645A JP H02166645 A JPH02166645 A JP H02166645A JP 32061988 A JP32061988 A JP 32061988A JP 32061988 A JP32061988 A JP 32061988A JP H02166645 A JPH02166645 A JP H02166645A
Authority
JP
Japan
Prior art keywords
substrate
stamper
recording medium
optical recording
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32061988A
Other languages
Japanese (ja)
Inventor
Ryuichi Yokoyama
隆一 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP32061988A priority Critical patent/JPH02166645A/en
Publication of JPH02166645A publication Critical patent/JPH02166645A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Optical Record Carriers (AREA)

Abstract

PURPOSE:To release a substrate from a stamper by a small force without damaging them by making the substrate and a photosetting resin into one body, drawing the substrate from the stamper by vacuum chucking, and at the same time, pushing the substrate around its center hole to the drawing direction. CONSTITUTION:The disk-like stamper 1 having ruggedness such as guide grooves and recorded informations is coated with the photosetting resin 2, on which the disk substrate 3 with a center hole 10 is stacked. By irradiating it with light to cure the photosetting resin 2, the resin 2 and the substrate 3 are made into one body and then released from the stamper 1. Thus, the optical recording medium is produced. In the process of releasing the substrate, the substrate with the photosetting resin 2 is drawn from the stamper 1 by the vacuum chucking 5 and at the same time, the area 11 around the center hole 10 of the substrate 3 is pushed toward the drawing direction. By this method, the substrate 3 can be released from the stamper 1 by a small force at high yield without damaging the substrate 3 nor the stamper 1.

Description

【発明の詳細な説明】 [産業上の利用分野コ 本発明は光ビームにより記録、再生を行なうことか可能
な光学的記録媒体用基板の製造方法に関するものである
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of manufacturing a substrate for an optical recording medium that can be recorded and reproduced using a light beam.

[従来の技術] 従来、光学的記録媒体用基板の製造方法の1つとして、
スタンパの上に光硬化性スタンパ樹脂を塗布した後、熱
硬化性樹脂、熱可塑性樹脂からなる透明な基板を密着さ
せて基板側から紫外線の如き光エネルギーを封手し、前
記光硬化型樹脂を硬化させてスタンパのレプリカを基板
に転写する、いわゆる2P法が知られている。この22
法において、ディスク状の基板とスタンパとの離型方法
として、■基板とスタンパの間に爪状のものを挿入して
離型する方法、■基板を真空チャックして引っ張る方法
、また■基板の中心孔の周辺部を押し上げてRI型する
方法(特開昭53− [1352号公報)等が知られて
いる。
[Prior Art] Conventionally, as one of the methods for manufacturing a substrate for an optical recording medium,
After applying a photocurable stamper resin onto the stamper, a transparent substrate made of a thermosetting resin or a thermoplastic resin is placed in close contact with the stamper, and light energy such as ultraviolet rays is sealed from the substrate side. A so-called 2P method is known in which a replica of the stamper is transferred onto a substrate by curing. This 22
In this method, there are two methods for releasing the disc-shaped substrate and the stamper: ■ a method of inserting a claw-like object between the substrate and the stamper, ■ a method of pulling the substrate by vacuum chuck, and ■ a method of separating the substrate from the stamper. A method is known in which the periphery of the center hole is pushed up to create an RI type (Japanese Patent Application Laid-open No. 1352/1983).

[発明が解決しようとする課8] しかしながら、上記のいずれの方法においても、下記に
示す様な問題点が残されていた。
[Problem 8 to be solved by the invention] However, in any of the above methods, the following problems remain.

すなわち、まず、■の方法の爪状の物を挿入する場合、
離型なかなり容易に行うことができるか、スタンパや光
硬化型樹脂層を傷つけたり、また基板に局所的な力が加
わるため、基板が割れることがあり、歩留り2作業の安
全性に問題があった。
In other words, first, when inserting the claw-like object using method ■,
If mold release is fairly easy, it may damage the stamper or photocurable resin layer, and local force may be applied to the substrate, which may cause the substrate to crack, resulting in problems with the safety of the yield 2 work. there were.

次に、■の基板を真空チャックして引っ張る方法は離型
の為に必ずしも適した方法とは言えず、力がうまくかけ
られないため離型が困難である場合が少なくない。また
、部分的に離型するのが困難なため、基板全面を離型し
なければならず、その為には大きな力が必要になり、大
きな装置を必要とする問題があった。
Next, the method (2) of vacuum chucking and pulling the substrate is not necessarily suitable for releasing the mold, and it is often difficult to release the mold because the force cannot be applied properly. Furthermore, since it is difficult to release the mold partially, the entire surface of the substrate must be released from the mold, which requires a large force and a large apparatus.

更に、■のディスク状の基板の中心孔の周辺部を押し上
げて離型する方法においては、基板の中心孔付近だけを
押し上げ軸で押し上げるため、基板が大きな場合、離型
が困難になる場合があった。また、離型完了時に、基板
の外周がはね上がるために、離型完了後に押し上げ軸を
下降する際に、はね上がった基板の外周部がスタンパを
傷つける事があった。
Furthermore, in the method (3) of pushing up the periphery of the center hole of a disk-shaped substrate to release it from the mold, only the area around the center hole of the substrate is pushed up using the push-up shaft, so if the substrate is large, it may be difficult to release the mold. there were. Furthermore, since the outer periphery of the substrate springs up when the demolding is completed, the outer periphery of the substrate that has sprung up may damage the stamper when the push-up shaft is lowered after the demolding is completed.

本発明は、この様な従来技術の問題点を改善するために
なされたものであり、小さな力で、基板およびスタンパ
を傷つけることがなく、歩留りよく、基板をスタンパか
ら離型することが可能な光学的記録媒体用基板の製造方
法を提供することを目的とするものである。
The present invention was made in order to improve the problems of the conventional technology, and it is possible to release the substrate from the stamper with a small force without damaging the substrate or the stamper, and with a high yield. An object of the present invention is to provide a method for manufacturing a substrate for an optical recording medium.

[課題を解決するための手段] 即ち、本発明は、案内溝および記録情報などの凹凸を有
するディスク状のスタンパの上に、光硬化型樹脂を塗布
して中心孔を有するディスク状の基板を積置し、次いで
光を照射して光硬化型樹脂を硬化させて光硬化型樹脂と
基板を一体化した後、スタンパから離型して光学的記録
媒体用基板を製造する方法において、前記光硬化型樹脂
と一体化した基板を真空チャックしてスタンパから引き
上げると共に、その引き上げ方向に基板の中心孔の周辺
部を押し上げて離型することを特徴とする光学的記録媒
体用基板の製造方法である。
[Means for Solving the Problems] That is, the present invention coats a photocurable resin on a disc-shaped stamper having unevenness such as guide grooves and recorded information to form a disc-shaped substrate having a center hole. In the method of manufacturing a substrate for an optical recording medium by stacking the photocurable resin and then curing the photocurable resin by irradiating light to integrate the photocurable resin and the substrate, the mold is released from the stamper. A method for manufacturing a substrate for an optical recording medium, characterized in that a substrate integrated with a curable resin is pulled up from a stamper by a vacuum chuck, and the peripheral part of the center hole of the substrate is pushed up in the direction of the lifting direction to release the substrate. be.

以下、本発明を図面に基づいて説明する。Hereinafter, the present invention will be explained based on the drawings.

第1図(a)〜(C)は本発明の光学的記録媒体用基板
の製造方法の一例を示す工程図である。同図において、
本発明の光学的記録媒体用基板の製造方法は、まず、第
1図(a)に示す様に、案内溝および記録情報などの凹
凸を有するディスク状のスタンパlの上に、光硬化型樹
脂2を塗布し、その上に中心孔10を有するディスク状
の透明な基板3を積置し、次いで透明な基板3側から紫
外線を照射して光硬化型樹脂2を硬化させて光硬化型樹
脂2と基板3を一体化した後、中心部に中心軸7を上下
方向に可動自在に設けた相持体4の上にスタンパlが接
触する様にv1置し、また基板3の上部には真空吸引管
6を有し基板よりやや小さい真空チャック5を0リング
8を介して設器し、真空吸引管6,6aから吸引して基
板3を真空チャックする。
FIGS. 1(a) to 1(C) are process diagrams showing an example of the method for manufacturing an optical recording medium substrate of the present invention. In the same figure,
In the method of manufacturing a substrate for an optical recording medium of the present invention, first, as shown in FIG. A disk-shaped transparent substrate 3 having a center hole 10 is placed thereon, and then ultraviolet rays are irradiated from the side of the transparent substrate 3 to harden the photocurable resin 2. 2 and the substrate 3, the stamper 1 is placed on the supporting body 4, which has a center axis 7 movable in the vertical direction, so that the stamper 1 is in contact with the supporting body 4, and a vacuum is placed on the top of the substrate 3. A vacuum chuck 5 having a suction tube 6 and slightly smaller than the substrate is installed via an O-ring 8, and the substrate 3 is vacuum chucked by suction from the vacuum suction tubes 6, 6a.

次いで、第1図(b)に示す様に、光硬化型樹脂2と一
体化した基板3を真空チャックして、担持体4に真空チ
ャックされているスタンパlから引き上げると共に、中
心軸7を上方に移動しその引き上げ方向に基板3の中心
孔IOの周辺部11を押し上げる。
Next, as shown in FIG. 1(b), the substrate 3 integrated with the photocurable resin 2 is vacuum chucked and pulled up from the stamper 1 vacuum chucked to the carrier 4, and the central axis 7 is moved upward. , and pushes up the peripheral portion 11 of the center hole IO of the substrate 3 in the lifting direction.

その後、第1図(c)に示す様に、真空チャック5を上
昇させる事により、基板3はスタンパlから全面剥離さ
れて離型を完了し、光学的記録媒体用基板を得ることが
できる。
Thereafter, as shown in FIG. 1(c), by raising the vacuum chuck 5, the entire surface of the substrate 3 is peeled off from the stamper I, completing the mold release and obtaining a substrate for an optical recording medium.

次に、第2図(a)〜(C)は本発明の光学的記録媒体
用基板の製造方法の他の例を示す工程図である。同図に
おいては、担持体4の中心部に設けられている中心軸7
にガス吐出口9が形成されており、第1図と同様に、光
硬化型樹脂2と一体化した基板3を真空チャックしてス
タンパlから引き上げると共に、中心軸7を上方に移動
しその引き上げ方向に基板3の中心孔IOの周辺部11
を押し上げ、さらにその際に基板3とスタンパ1の間に
形成された間隙12に中心軸7に形成されているガス吐
出口9からガスを圧送して離型する方法である。
Next, FIGS. 2(a) to 2(C) are process diagrams showing another example of the method for manufacturing an optical recording medium substrate of the present invention. In the figure, a central shaft 7 provided at the center of the carrier 4 is shown.
1, the substrate 3 integrated with the photocuring resin 2 is vacuum chucked and pulled up from the stamper 1, and the central axis 7 is moved upward to pull it up. The peripheral part 11 of the center hole IO of the substrate 3 in the direction
This is a method for releasing the mold by pushing up the stamper and then pumping gas from the gas discharge port 9 formed on the central shaft 7 into the gap 12 formed between the substrate 3 and the stamper 1.

上記の本発明における離型方法においては、強力な真空
チャックは必要ではなく、基板をささえる程度で良い。
In the above-described mold release method according to the present invention, a strong vacuum chuck is not necessary, and it is sufficient to just support the substrate.

これは、離型の際に最も力が必要な離型の始まりを、上
記の第1図(b)および第2図(b)に示す様に、基板
の真空チャックと同時に基板の基板の中心孔の周辺部を
押し上げるが、または中心孔の周辺部を押し上げると共
にそこにガスを圧送することにより行なうので、その後
の工程には大きな力がなくても離型することができる。
As shown in Figures 1 (b) and 2 (b) above, the beginning of mold release, which requires the most force during mold release, occurs at the same time as the vacuum chuck of the substrate and at the center of the substrate. This is done by pushing up the periphery of the hole, or by pushing up the periphery of the center hole and pumping gas there, so that the mold can be released without a large force in the subsequent process.

本発明において、基板Iは記録・再生時に用いられる光
に対して透明なものであれば良く、例えばアクリル樹脂
、エポキシ樹脂等の樹脂、ガラス等を用いることができ
る。
In the present invention, the substrate I may be any material as long as it is transparent to the light used during recording and reproduction, and may be made of, for example, resin such as acrylic resin or epoxy resin, glass, or the like.

また、光硬化型樹脂としては、ウレタン系、ポリカーボ
ネイト系などの紫外線硬化型スタンパ樹脂や、電子線、
X線など硬化型スタンパ樹脂を用いる事も可能である。
In addition, photo-curable resins include ultraviolet-curable stamper resins such as urethane-based and polycarbonate-based resins, electron beam,
It is also possible to use a stamper resin that is cured by X-rays or the like.

[作用コ 本発明の光学的記録媒体用基板の製造方法は、案内溝お
よび記録情報などの凹凸を有するディスク状のスタンパ
の上に、光硬化型樹脂を塗布して中心孔を有するディス
ク状の基板を積置し、次いで光を照射して光硬化型樹脂
を硬化させて光硬化型樹脂と基板を一体化した後、基板
を真空チャックしてスタンパから引き上げると共に、そ
の引き上げ方向に基板の中心孔の周辺部を押し上げるか
或いはその押し上げと共に基板とスタンパの間に形成さ
れた間隙にガスを圧送して離型するのて、真空チャック
のみで離型する場合に比べて小さな力で、また基板およ
びスタンパを傷つけることかなく、歩留りよく、基板を
スタンパから離型することが可能となる。
[Function] The method of manufacturing a substrate for an optical recording medium of the present invention is to apply a photocurable resin onto a disc-shaped stamper having unevenness such as guide grooves and recording information, and to form a disc-shaped stamper having a central hole. After stacking the substrates and then curing the photocurable resin by irradiating light to integrate the photocurable resin and the substrate, vacuum chuck the substrate and lift it from the stamper, and align the center of the substrate in the lifting direction. By pushing up the periphery of the hole, or by pumping gas into the gap formed between the substrate and stamper at the same time as pushing up, the mold can be released with a smaller force than when releasing using only a vacuum chuck. Moreover, it becomes possible to release the substrate from the stamper with a high yield without damaging the stamper.

[実施例] 以下、実施例を示し本発明をさらに具体的に説明する。[Example] Hereinafter, the present invention will be explained in more detail with reference to Examples.

実施例1 第1図に示す方法により、光学的記録媒体用基板を製造
した。ピッチL、S p−m 、段差900人のスパイ
ラル状の案内溝を形成したNiスタンパl上に、紫外線
硬化型のエポキシアクリレート系の光硬化型樹脂(商品
名: MRA−5000,三菱レイヨン■製)2(以下
、樹脂2と記す)を塗布し、その上に直ffl:10m
mφ、内径15mmφ、厚さ1.2a+mのガラス製の
基板3を積置した。樹脂2が基板3の内周縁近傍部分ま
てまわり込まない様にしておき、この状態で、基板3側
から波長:160nmの紫外線を基板上の光強度230
mW/am2で照射し、樹脂2を硬化させた。
Example 1 An optical recording medium substrate was manufactured by the method shown in FIG. A UV-curable epoxy acrylate-based photocurable resin (product name: MRA-5000, manufactured by Mitsubishi Rayon ■) was placed on a Ni stamp plate with a spiral guide groove of pitch L, S p-m, and 900 steps. ) 2 (hereinafter referred to as resin 2), and directly ffl: 10 m
Glass substrates 3 having an inner diameter of 15 mm and a thickness of 1.2 a+m were stacked. Prevent the resin 2 from reaching near the inner edge of the substrate 3, and in this state, apply ultraviolet light with a wavelength of 160 nm from the substrate 3 side to a light intensity of 230 nm on the substrate.
The resin 2 was cured by irradiation at mW/am2.

次いで、一体化しているスタンパ、樹脂、基板を、スタ
ンパ1が下となるように、中心軸7の設置されている担
持体4上に積置し、続いて真空吸引管6aからの真空吸
引により、それらを担持体4上に固定した。また、基板
3上に真空チャック5を積置して、基板3を真空チャッ
クした後、中心軸7を3 kg/cs”の力で上に押し
上げ、基板3の内周部から離型を始める。次いで、真空
チャック5を上方に引き上げる事により、基板3をスタ
ンパlから離型して、光学的記録媒体用基板を製造した
Next, the integrated stamper, resin, and substrate are stacked on the carrier 4 on which the central shaft 7 is installed, with the stamper 1 facing downward, and then vacuum suction is applied from the vacuum suction tube 6a. , and fixed them on a carrier 4. Further, after placing the vacuum chuck 5 on the substrate 3 and vacuum chucking the substrate 3, the central shaft 7 is pushed upward with a force of 3 kg/cs'', and mold release starts from the inner circumference of the substrate 3. Next, by lifting the vacuum chuck 5 upward, the substrate 3 was released from the stamper 1, and an optical recording medium substrate was manufactured.

実施例2 実施例1の基板をチャックして、中心軸を押し上げる際
、第2図に示す様に、中心軸7を2kg/cn+2の力
で押し上げると共に、中心軸7のガス吐出口9より窒素
ガスを1kg/c112の圧力で流したこと以外は、実
施例Iと同様にして光学的記録媒体用基板を製造した。
Example 2 When chucking the substrate of Example 1 and pushing up the center shaft, as shown in FIG. An optical recording medium substrate was produced in the same manner as in Example I, except that the gas was flowed at a pressure of 1 kg/c112.

上記の窒素ガスを吐出する事により、基板の局所的に力
を加える事かさけられる。また、離型が始−まると、樹
脂とスタンパ間を、ガスが外周に向かって流れるので、
実施例1よりもよりスムーズに剥離できる。
By discharging the nitrogen gas mentioned above, it is possible to avoid applying force locally on the substrate. Additionally, when mold release begins, gas flows between the resin and the stamper toward the outer periphery.
It can be peeled off more smoothly than in Example 1.

実施例3,4 基板としてポリカーボネイト樹脂を用いた以外は、実施
例1.2と同様にして、光学的記録媒体用基板を製造し
た。
Examples 3 and 4 A substrate for an optical recording medium was manufactured in the same manner as in Example 1.2, except that polycarbonate resin was used as the substrate.

比較例1 基板として、ポリカーボネート樹脂を用いた。Comparative example 1 Polycarbonate resin was used as the substrate.

実施例1て用いた基板上面の真空チャックを行なわない
以外は、実施例1と同様にして、光学的記録媒体用基板
を製造した。
An optical recording medium substrate was manufactured in the same manner as in Example 1, except that the vacuum chuck on the top surface of the substrate used in Example 1 was not performed.

基板として、樹脂基板を用いた場合、比較例に示す従来
法では、基板中心部を持ち上げる離型の力により基板の
変形があったが、上記の実施例の方法では、基板にかか
る力は小さく、変形する事はなかった。
When a resin substrate is used as the substrate, in the conventional method shown in the comparative example, the substrate was deformed due to the release force that lifts the center of the substrate, but in the method of the above example, the force applied to the substrate is small. , there was no deformation.

[発明の効果] 以上説明した様に、本発明の方法によれば、スタンパか
ら基板を離型する際に、基板に局所的に力を加える事が
なく、また従来法に比べ小さな力で離型てききるのて、
基板を傷つけることがなく、歩留りが向上される。更に
、剥離による衝撃がないので、スタンパを傷つける事も
ない。
[Effects of the Invention] As explained above, according to the method of the present invention, when releasing the substrate from the stamper, no force is applied locally to the substrate, and the separation can be performed with a smaller force than in the conventional method. Once the mold is finished,
The yield is improved without damaging the substrate. Furthermore, since there is no impact due to peeling, the stamper will not be damaged.

また、離型する際に基板の中心孔の周辺部を押し上げる
と共に、そこにガスを圧送する事により、離型がスムー
ズに行なわれる事の他に、離型詩に発生するゴミが、基
板の外周に向かって流れる前記ガスによって、基板及び
スタンパの外に飛ばされる。したがって、スタンパを傷
つけることかないと共に、欠陥の少ない高品質の光学的
記録媒体用基板を得ることができる。
In addition, when releasing the mold, by pushing up the periphery of the center hole of the substrate and pumping gas there, not only does the mold release occur smoothly, but also the dust generated in the mold release area is removed from the substrate. The gas flowing toward the outer periphery is blown out of the substrate and stamper. Therefore, it is possible to obtain a high quality optical recording medium substrate that does not damage the stamper and has few defects.

更に、基板の大きさが大きな場合でも、小さな時と同様
にスムーズに離型する事ができる。
Furthermore, even if the substrate is large, it can be released from the mold as smoothly as when it is small.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)〜(C)は本発明の光学的記録媒体用基板
の製造方法の一例を示す工程図および第2図(a)〜(
C)は本発明の製造方法の他の例を示す工程図である。 l・・・スタンパ 2・・・紫外線硬化スタンパ樹脂
FIGS. 1(a) to (C) are process diagrams showing an example of the method for manufacturing an optical recording medium substrate of the present invention, and FIGS. 2(a) to (C)
C) is a process diagram showing another example of the manufacturing method of the present invention. l... Stamper 2... Ultraviolet curing stamper resin

Claims (2)

【特許請求の範囲】[Claims] (1)案内溝および記録情報などの凹凸を有するディス
ク状のスタンパの上に、光硬化型樹脂を塗布して中心孔
を有するディスク状の基板を積置し、次いで光を照射し
て光硬化型樹脂を硬化させて光硬化型樹脂と基板を一体
化した後、スタンパから離型して光学的記録媒体用基板
を製造する方法において、前記光硬化型樹脂と一体化し
た基板を真空チャックしてスタンパから引き上げると共
に、その引き上げ方向に基板の中心孔の周辺部を押し上
げて離型することを特徴とする光学的記録媒体用基板の
製造方法。
(1) A photocurable resin is applied onto a disk-shaped stamper with unevenness such as guide grooves and recorded information, and a disk-shaped substrate with a center hole is placed on top of it, and then light is irradiated to photocure it. In a method for manufacturing a substrate for an optical recording medium by curing a mold resin to integrate the photocurable resin and the substrate and then releasing the mold from a stamper, the substrate integrated with the photocurable resin is vacuum chucked. 1. A method of manufacturing a substrate for an optical recording medium, which comprises lifting the substrate from a stamper using a stamper, and releasing the substrate by pushing up the peripheral part of the center hole of the substrate in the direction of the lifting.
(2)前記光硬化型樹脂と一体化した基板を真空チャッ
クしてスタンパから引き上げると共に、その引き上げ方
向に基板の中心孔の周辺部を押し上げ、さらに基板とス
タンパの間に形成された間隙にガスを圧送して離型する
請求項1記載の光学的記録媒体用基板の製造方法。
(2) The substrate integrated with the photocurable resin is vacuum chucked and lifted from the stamper, and the periphery of the center hole of the substrate is pushed up in the lifting direction, and gas is added to the gap formed between the substrate and the stamper. 2. The method for manufacturing an optical recording medium substrate according to claim 1, wherein the mold is released by pressure-feeding.
JP32061988A 1988-12-21 1988-12-21 Manufacture of substrate for optical recording medium Pending JPH02166645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32061988A JPH02166645A (en) 1988-12-21 1988-12-21 Manufacture of substrate for optical recording medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32061988A JPH02166645A (en) 1988-12-21 1988-12-21 Manufacture of substrate for optical recording medium

Publications (1)

Publication Number Publication Date
JPH02166645A true JPH02166645A (en) 1990-06-27

Family

ID=18123431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32061988A Pending JPH02166645A (en) 1988-12-21 1988-12-21 Manufacture of substrate for optical recording medium

Country Status (1)

Country Link
JP (1) JPH02166645A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5217850A (en) * 1991-02-07 1993-06-08 Pioneer Electronic Corporation Optical recording disk and manufacturing method thereof
JP2007242098A (en) * 2006-03-07 2007-09-20 Ricoh Co Ltd Sheet peeling method, sheet peeling device, transfer device, coat device, disk manufacturing device and holding device
JP2007529851A (en) * 2004-03-22 2007-10-25 オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト Method and apparatus for separating disk-type substrates
US7377765B2 (en) 2006-02-14 2008-05-27 Hitachi Global Storage Technologies System, method, and apparatus for non-contact and diffuse curing exposure for making photopolymer nanoimprinting stamper
JP2008537513A (en) * 2005-01-31 2008-09-18 モレキュラー・インプリンツ・インコーポレーテッド Method for separating a mold from a solidified layer disposed on a substrate
JP2009056762A (en) * 2007-09-03 2009-03-19 Toshiba Mach Co Ltd Mold release device, feed and discharge system, and mold releasing method
WO2010143302A1 (en) * 2009-06-12 2010-12-16 パイオニア株式会社 Transfer apparatus, and transfer method
WO2011077882A1 (en) * 2009-12-25 2011-06-30 株式会社日立ハイテクノロジーズ Double-side imprint device
WO2012096076A1 (en) * 2011-01-10 2012-07-19 Scivax株式会社 Demolding device, demolding method, and imprinting device using said demolding device and demolding method

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5217850A (en) * 1991-02-07 1993-06-08 Pioneer Electronic Corporation Optical recording disk and manufacturing method thereof
JP2007529851A (en) * 2004-03-22 2007-10-25 オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト Method and apparatus for separating disk-type substrates
EP1730737B1 (en) * 2004-03-22 2013-01-16 Singulus Technologies AG Method and apparatus for separating disc-shaped substrates
JP2008537513A (en) * 2005-01-31 2008-09-18 モレキュラー・インプリンツ・インコーポレーテッド Method for separating a mold from a solidified layer disposed on a substrate
US7377765B2 (en) 2006-02-14 2008-05-27 Hitachi Global Storage Technologies System, method, and apparatus for non-contact and diffuse curing exposure for making photopolymer nanoimprinting stamper
US7731889B2 (en) 2006-02-14 2010-06-08 Hitachi Global Storage Technologies Netherlands B.V. Method for non-contact and diffuse curing exposure for making photopolymer nanoimprinting stamper
JP2007242098A (en) * 2006-03-07 2007-09-20 Ricoh Co Ltd Sheet peeling method, sheet peeling device, transfer device, coat device, disk manufacturing device and holding device
JP4601565B2 (en) * 2006-03-07 2010-12-22 株式会社リコー Sheet peeling method and sheet peeling apparatus
JP2009056762A (en) * 2007-09-03 2009-03-19 Toshiba Mach Co Ltd Mold release device, feed and discharge system, and mold releasing method
WO2010143302A1 (en) * 2009-06-12 2010-12-16 パイオニア株式会社 Transfer apparatus, and transfer method
WO2011077882A1 (en) * 2009-12-25 2011-06-30 株式会社日立ハイテクノロジーズ Double-side imprint device
WO2012096076A1 (en) * 2011-01-10 2012-07-19 Scivax株式会社 Demolding device, demolding method, and imprinting device using said demolding device and demolding method

Similar Documents

Publication Publication Date Title
EP0833315B1 (en) Method of correcting nonalignment of a storage disc
US7964135B2 (en) Method and apparatus for imprinting energy ray-setting resin, and discs and semiconductor devices with imprinted resin layer
KR20020093960A (en) Method of manufacturing disk substrate, and method and device for manufacturing optical disk
JPH02166645A (en) Manufacture of substrate for optical recording medium
JP5416420B2 (en) Microstructure transfer device
US7221640B2 (en) Method of manufacturing an optical storage medium and optical storage medium
JP4577522B2 (en) Pattern transfer apparatus and pattern transfer method
JPH02126434A (en) Optical disk substrate molding method
WO2003081584A1 (en) Multi-layered optical information recording medium manufacturing method
US6280661B1 (en) Apparatus and process for producing optical recording medium
JPS63131352A (en) Manufacture of substrate for optical recording medium
JP3232665B2 (en) Optical disk manufacturing equipment
JP4237231B2 (en) Disc manufacturing method
KR100923816B1 (en) Method for manufacturing multi-layer optical information recording medium
JPS6381639A (en) Production of substrate for optical recording medium
US20050048154A1 (en) Shape replication method
JP2822251B2 (en) Disk substrate manufacturing equipment
JPS5942933A (en) Method and apparatus for manufacture of recording carrier for information
JP2638224B2 (en) Method and apparatus for duplicating optical record carrier
JPS6253338B2 (en)
JP2007226870A (en) Disk manufacturing method and transfer device
JPS61206942A (en) Production of substrate for optical recording medium
JPH09167385A (en) 2p molding device
JPH10154360A (en) Disk sticking apparatus
JP2000251335A (en) Production of optical information recording medium