JP2004158097A - Device for sticking disk substrates - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-quality optical disk (DVD) by suppressing the increase of a temperature during the sticking of disk substrates and simultaneously easily separating and removing the disk substrate by a supporting means. <P>SOLUTION: The sticking device of a disk substrate is a means having a smooth surface on which the laminated disk substrates is mounted. This device is provided with a supporting means having one or more through-holes through which a gas flows, and a substrate separating/cooling means for easily removing the disk substrate from the smooth surface of the supporting means by supplying the gas from a surface opposite the surface of the supporting means on which the disk substrate is mounted through the through-holes thereof to a part between the disk substrate and the supporting means, and cooling the supporting means. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of an optical disk capable of reading recorded information with light, and more particularly to an apparatus for bonding two disk substrates to each other.
[0002]
2. Description of the Related Art Techniques for increasing the recording capacity of optical discs have been developed and spread, and the recording capacity tends to be further increased. In a digital versatile disk (DVD), two disc substrates each having an information recording layer on one side or both sides are bonded together, a DVD in which they are further bonded, and a cover layer and a disk having a thickness of 0.1 mm. There is known a DVD having a large recording capacity called a next-generation disk in which a substrate is bonded to the substrate. These include a ROM type in which information is already recorded and a RAM type in which information can be recorded.
The following patent documents disclose the entirety of such an optical disk manufacturing apparatus.
[Patent Document 1] Japanese Patent Application Laid-Open No. 2002-245592 (page 6-8, FIG. 1)
[Patent Document 2] JP-A-09-231625 (page 3-6, FIG. 1)
In such a manufacturing apparatus, the bonding between the disk substrates is performed by laminating the two disk substrates via an adhesive supplied in a donut shape, rotating the disk substrate at a high speed, and spinning the disk substrates. Spreading out and removing excess adhesive. Next, the disc substrate is placed on a support means (not shown), and the adhesive is cured by irradiating ultraviolet rays from one side or both sides of the disc substrate. At the time of irradiation with the ultraviolet rays, the adhesive causes a photopolymerization reaction and cures. At this time, reaction heat is generated, and the temperature of the disk substrate rises. Also, the temperature of the disk substrate rises even with the radiant heat itself due to the ultraviolet irradiation. The bearing means (not shown) is made of glass having a smooth surface, preferably a mirror surface, so as not to damage the surface of the disk substrate. Therefore, the disk substrate is in close contact with the surface of the bearing means (not shown). Tend.
[0004]
As the temperature of the disk substrate rises, the temperature of the bearing means (not shown) gradually rises, and the temperature rise causes the temperature of the disk substrate on which the disk is mounted to be further raised. There is a problem that the substrate is warped and its tilt characteristics are deteriorated.
Further, when the support means (not shown) has a smooth surface or a mirror surface, the disc substrate tends to be in close contact with the surface of the support means (not shown). Occurs.
Therefore, in the present invention, by supplying an air current between the bearing means (not shown) and the disk substrate, the bearing means and the disk substrate are easily separated, and at the same time, the bearing means and the disk substrate are cooled. It is characterized by doing.
[0006]
In order to solve this problem, according to the first aspect of the present invention, a disk substrate superposed with an adhesive is rotated at a high speed to apply the adhesive to the disk substrate. In a disk substrate bonding apparatus including a spinner device extending between the disk substrate and a curing device that cures the adhesive by irradiating ultraviolet light from one or both sides of the disk substrate, the laminated disk substrate is Means having a smooth surface on which the disk substrate is mounted, wherein the support means has at least one through hole through which an air flow passes, and the support means has a surface opposite to the surface on which the disk substrate is mounted. By supplying the gas between the disk substrate and the bearing means through the through hole, the disk substrate can be easily removed from the smooth surface of the bearing means. While, is to propose a bonding apparatus of the disc substrate, characterized in that a substrate separation and cooling means also performs cooling of the bearing means. ADVANTAGE OF THE INVENTION According to the optical disk bonding apparatus of this invention, a high quality DVD can be obtained.
Further, in the invention of claim 2, in claim 1, the substrate separating / cooling means is arranged such that after the adhesive between the disk substrates is hardened, the disk substrate of the support means is placed. The present invention proposes a disk substrate bonding apparatus characterized in that an air flow is supplied in contact with a surface opposite to the surface.
Further, in the invention of claim 3, in claim 1, the substrate separating / cooling means may be configured such that, during the irradiation of the ultraviolet rays, the surface on which the disk substrate is mounted on the support means is provided. The present invention proposes a disk substrate bonding apparatus characterized by supplying an air current from the opposite side.
According to a fourth aspect of the present invention, in the first aspect, the through hole has a larger width on a surface on which the disk substrate is mounted on the support means. It proposes a matching device.
Further, in the invention according to claim 5, in claim 1, a part or all of the adhesive spread between the disk substrates by the spinner device is semi-cured or partially cured so that the disk substrate is cured. It is intended to propose a state in which an airflow is supplied to the bearing means from a surface opposite to the surface on which the disk substrate is placed after the temporary attachment.
[0011]
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Before describing the present invention, in order to facilitate understanding of the present invention, an example of an overall DVD manufacturing apparatus using a disc substrate bonding apparatus of the present invention will be described by taking a case of a DVD 9 as an example. This will be described with reference to FIG. In FIG. 1, reference numerals 21A and 21B denote equivalent first and second molding machines, which respectively mold a disk substrate on which information is recorded by a stamper. The take-out mechanisms 22A, 22B take out the disk substrates from the first and second molding machines 21A, 21B, respectively, and deliver them to the spin cooling mechanisms 23A, 23B. The spin cooling mechanisms 23A and 23B rotate the received soft disk substrate at a high speed to cool the substrate in a short time, and at the same time, reduce the warpage by centrifugal force. Since the spin cooling mechanisms 23A and 23B occupy a small area, they contribute to miniaturization of the apparatus. However, if miniaturization does not pose a problem, another normal cooling mechanism may be used.
The transfer mechanisms 24A and 24B mount the disk substrates, which have been cooled and changed in direction by the spin cooling mechanisms 23A and 23B, respectively, on the disk holders 25A and 25B at the reversing positions. Here, the disk substrate is turned upside down, but this inversion is not necessarily required. Next, the transfer mechanisms 26A and 26B each having two transfer arms sequentially transfer the sputtered disk substrates to the turntable 29 at positions A and B on the sputter table 27 with one arm, respectively. Then, the disk substrates of the disk receivers 25A and 25B at the reversing positions are transferred to the receivers (not shown) at positions A and B on the sputtering table 27 by the other arm. The sputter table 27 is formed by removing a square-shaped sputter table 27 so that its four sides are depressed in an arc shape in order to reduce the weight and forming a plurality of holes. The sputtering table 27 rotates intermittently by 90 degrees, and at positions C and D, which are two steps forward, the sputtering devices 28A and 28B deposit metal films on the disk substrates transferred at positions A and B, respectively.
The sputtering device 28A sputters gold (Au) on the disk substrate placed at the position A of the sputtering table 27 to form an Au film, and the sputtering device 28B deposits the Au film on the disk substrate placed at the position B. Aluminum (Al) is sputtered to form an Al film. The metal film can be formed in various combinations, in various orders, and the like, and can be selected. The disk substrate on which the semi-reflective film and the reflective film are formed in this manner is mounted on the turntable 29 at the positions E and F by the transfer mechanisms 26A and 26B when returning to the positions A and B again. At this time, the metal film is on the upper side. Then, at the position G, the image is transferred to the next position H of the turntable 31 by the transfer mechanism 30 having one arm. The turntable 31, the reversing mechanism 32, the adhesive supply nozzle 33, the overlapping mechanism 34, the two spinners 35A and 35B, and the transfer mechanism 36 are described in the above-mentioned Patent Document 1 (Japanese Patent Application Laid-Open No. 2002-245592). The details are omitted because they are the same as those described above, but the outline is as follows.
The disk substrates sequentially transferred to the position H of the turntable 31 are reversed by the reversing mechanism 32 for every other disk substrate. Next, the adhesive supply nozzle 33 supplies the adhesive in a donut shape only to the disk substrate having the bonding surface facing upward. Next, the two disk substrates are superimposed via an adhesive by the superposing mechanism 34 such that both metal films are inside. At the position I of the turntable 31, the disk substrate is alternately distributed to the spinner devices 35A and 35B by the transfer mechanism 36, and the adhesive between the disk substrates is spread by the high-speed rotation process, and excess adhesive is shaken off. It is. The disk substrate thus bonded is then placed on the option stage 37. The optional stage 37 is provided only when necessary. Here, since the end face processing of the disk substrate is required, an end face processing mechanism 38 is provided. Instead of the end face processing mechanism 38, for example, a temporary attachment mechanism may be provided, and a temporary attachment mechanism that partially cures or cures the adhesive or partially cures the entire surface after centering the disk substrate may be provided. This optional stage 37 may not be provided.
Then, the disk substrate having been subjected to the end face processing is transferred by a transfer mechanism 39 having two transfer arms to a support means (not shown) made of heat-resistant glass or the like at the position J of the turntable 40. . The disk substrate on the support means (not shown) is irradiated with ultraviolet rays generated by the ultraviolet curing device 41, and the adhesive is cured. The ultraviolet curing device 41 may be provided on both sides of the disk substrate. The disc substrate is transferred to the next turntable 42 by the transfer mechanism 39 at the position J, then inverted by the reversing mechanism 43, and further discharged by the discharging device 44. The disk substrate from which the charge has been removed is sent to the inspection device 46 by the transfer means 45, where a predetermined inspection is performed. Then, the disc substrate for which the inspection result is determined to be a non-defective product is discharged to the non-defective product discharge table 48 by the discrimination transfer mechanism 47, and the defective product is discharged to the defective product discharge table 49 or 50. If the defective product is caused by the scratch, the defective product is discharged to the defective product discharge table 49, and if the defective product is caused by the tilt, the defective product is discharged to the defective product discharge table 50. Reference numeral 51 denotes a sample stage, which allows the transfer means 30 to take out, for example, up to ten disk substrates of the sample.
Next, an embodiment of the present invention will be described with reference to FIGS. The present invention is an invention of a part related to the ultraviolet curing device 41 and the turntable 40 described in FIG. 1, and the holder 60 is attached to a turntable 61 corresponding to the turntable 40 in FIG. The support means 62 is supported. A centering member 63 is attached to the center of the support means 62, and the centering member 63 engages with a center hole of the disk substrate DK bonded by an adhesive to perform positioning of the disk substrate DK. The holder 60, the support means 62, and the centering member 63 constitute a disk receiving stand.
The bearing means 62 has one or more through holes 62a which play an important role in the present invention. Preferably, three or more through holes 62a are provided at substantially equal intervals. FIG. 3 is an enlarged view of this portion. One end side of the through hole 62a is an annular ring for receiving an annular projection Da called a stack rib of the disk substrate DK, and has a larger diameter than the diameter of the through hole 62a. Also has a wide portion 62b formed of a shallow groove having a large width. The wide portion 62b also serves to relieve the air pressure in the through hole 62a and to spread the air flow evenly between the support means 62 and the disk substrate DK, so that the disk substrate DK is smoothly separated from the support means 62. Act to be. However, the through hole 62a and the wide portion 62b do not necessarily need to be at the same position, and the original function of the through hole 62a can be performed even at a position slightly apart. The upper surface of the support means 62 on which the disk substrate DK is mounted is a smooth surface without roughness, preferably a mirror surface, so that the surface is not damaged when the disk substrate DK is mounted. Conversely, this makes it difficult to separate the disk substrate DK from the bearing means 62.
As shown in FIG. 2A, when the disk substrate DK is mounted on the upper surface of the support means 62, the substrate separating / cooling means 64 is at the original position and contacts the lower surface of the support means 62. Not. The substrate separating / cooling means 64 includes a sealing member 64a for sealing a surface including a lower surface in which the through hole 62a formed in the bearing means 62 is formed, a compressed air flow supply hole 64b provided in the sealing member 64a, and a cylinder. A driving member 64c that moves the sealing member 64a up and down, and a flexible hose (not shown) that connects between the compressed air flow supply hole 64b and the mechanism that supplies the compressed air flow. Consists of Here, although not shown, an elastic body such as rubber is stuck on the upper surface of the sealing member 64a, or an O-ring is provided to prevent air flow from leaking and to make a scratch on the back surface of the support means 62. Prevents sticking.
When the disk substrate DK is placed on the support means 62, the turntable 61 rotates, and the turntable 40 of FIG. 1 intermittently turns two steps to reach the ultraviolet irradiation position. At this ultraviolet irradiation position, ultraviolet curing devices 65 and 66 are arranged on the upper and lower sides of the turntable 61, and the disk substrate DK is irradiated with ultraviolet rays from the upper surface and the lower surface as indicated by arrows. Next, when the turntable 61 rotates one step and stops, as shown in FIG. 2C, the driving member 64c of the substrate separating / cooling means 64 operates to raise the sealing member 64a, and the upper surface thereof is supported by the supporting means. 62 is brought into contact with the lower surface. At the same time, an airflow such as air is supplied from the compressed airflow supply hole 64b into the sealing member 64a, and flows between the upper surface of the support means 62 and the lower surface of the disk substrate DK through the through hole 62a of the support means 62. Thereby, as shown in FIG. 3, the disk substrate DK is separated from the support means 62, and the support means 62 and the disk substrate DK are cooled by the flowing air current. The separation / cooling time is substantially equal to the stop time of the turntable 61. Before the turntable 61 rotates, the driving member 64c of the substrate separating / cooling means 64 operates to lower the sealing member 64a and separate the sealing member 64a from the lower surface of the support means 62.
When the turntable 61 is further rotated by one step equal to a predetermined angle and stopped, as shown in FIG. 2D, another substrate separating / cooling means 64 provided at that position is turned on. Operating as described above, the disk substrate DK is separated from the upper surface of the support means 62. In this state, the transfer means (not shown) easily lifts the disk substrate DK and transfers it to a predetermined position. Here, the position in FIG. 2A and the position in FIG. 2D are the same. Therefore, in this embodiment, the substrate separating / cooling means 64 is provided at each of the two positions on the front side and the rear side of the ultraviolet irradiation position where the ultraviolet curing devices 65 and 66 are provided. The means 62 and the disk substrate DK are cooled. Further, the disk substrate DK is separated from the support means 62.
In the above embodiment, the adhesive between the disk substrates is cured by irradiating ultraviolet rays from both sides of the disk substrate DK. However, when an ultraviolet curing device is provided only on one side, for example, only on the upper side, the disk The above-described substrate separating / cooling means may be provided below the substrate DK. In particular, when a flash lamp is used as the ultraviolet irradiation source, the ultraviolet light is flashed once or several times and the irradiation time is short, so that the substrate is separated and cooled until just before the turntable 40 rotates in FIG. If the airflow is supplied from the means, the bearing means and the disk substrate can be cooled without separately securing a cooling time.
Furthermore, an air flow may be supplied between the support means and the disk substrate DK via the substrate separating / cooling means at a point in time when a certain time has elapsed from the start of the ultraviolet irradiation. In this case, the adhesive between the disk substrates starts to be cured by the first ultraviolet irradiation, that is, the disk substrate slightly floats from the upper surface of the support means in a semi-cured state, and the remaining state in the floating state. UV irradiation is performed. Therefore, the remaining ultraviolet irradiation is performed in a state in which both the support means and the disk substrate are cooled by the airflow, so that the temperature rise of the disk substrate DK is further suppressed. In this method, since the temperature rise of the support means is also suppressed, the temperature rise of the disk substrate DK can be further suppressed.
The applicant has already proposed that the adhesive spread between the disk substrates is semi-cured or cured by a spinner device to perform temporary attachment, and then the adhesive is cured. In this case, an air current can be supplied between the bearing means and the disk substrate before the irradiation with the ultraviolet rays. Since the disk substrates are temporarily attached to each other, the air current is supplied before the ultraviolet irradiation, and the adhesive is hardened by irradiating the ultraviolet light while the disk substrate is floated from the support means. Therefore, the temperature rise of the disk substrate and the supporting means can be largely suppressed.
[0024]
As described above, according to the present invention, the temperature rise is suppressed during the bonding of the disk substrates, and at the same time, the disk substrates are easily separated and detached from the support means. An optical disk can be obtained.
[Brief description of the drawings]
FIG. 1 is a diagram showing an example of an optical disk manufacturing apparatus to which a disk substrate bonding apparatus according to the present invention is applied.
FIG. 2 is a view for explaining one embodiment of a disk substrate bonding mechanism according to the present invention.
FIG. 3 is an enlarged view for explaining a part of the disk substrate bonding apparatus according to the present invention.
[Explanation of symbols]
35A, 35B ... spinner devices 36, 39 ... transfer means 40 ... turntable 41 ... ultraviolet curing device 60 ... holder 61 ... turntable 62 ... support means 62a ... · Through hole 62b · · · Wide section 63 · · · Centering member 64 · · · Board separating and cooling means 64a · Sealing member 64b · Compressed air flow supply hole 64c · Drive members 65 and 66 ··· UV curing equipment

Claims (5)

A spinner device that rotates the disk substrates superimposed via the adhesive at a high speed to spread the adhesive between the disk substrates, and cures the adhesive by irradiating ultraviolet rays from one or both sides of the disk substrate. In a disk substrate bonding apparatus having a curing device for
A means having a smooth surface on which the superposed disk substrates are mounted, the bearing means having at least one through hole through which an air flow passes;
By supplying the gas between the disk substrate and the support means through a through hole of the support means from the surface of the support means opposite to the surface on which the disk substrate is mounted, A substrate separating / cooling means for facilitating removal from the smooth surface of the bearing means, and also for cooling the bearing means;
An apparatus for bonding a disk substrate, comprising: In claim 1,
After the adhesive between the disk substrates is hardened, the substrate separating / cooling unit abuts on the surface of the support unit opposite to the surface on which the disk substrate is mounted, and supplies the airflow. Disc substrate bonding device. In claim 1,
The substrate separation / cooling unit may supply an airflow to the support unit from a surface opposite to a surface on which the disk substrate is mounted, while the ultraviolet light is being irradiated. Matching device. In claim 1,
The through-hole has a large width on a surface on which the disk substrate is mounted on the support means, and the disk substrate bonding apparatus is characterized in that: In claim 1,
After partially or completely curing the adhesive spread between the disk substrates by the spinner device, or partially curing and temporarily attaching the disk substrate, the disk substrate was placed on the bearing means. An apparatus for bonding a disk substrate, wherein the ultraviolet irradiation is performed in a state where an air current is supplied from a surface opposite to the surface.

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