JPH10134427A - Method for taking up memory disk from holding base and holding base used for the purpose - Google Patents

Method for taking up memory disk from holding base and holding base used for the purpose

Info

Publication number
JPH10134427A
JPH10134427A JP8305879A JP30587996A JPH10134427A JP H10134427 A JPH10134427 A JP H10134427A JP 8305879 A JP8305879 A JP 8305879A JP 30587996 A JP30587996 A JP 30587996A JP H10134427 A JPH10134427 A JP H10134427A
Authority
JP
Japan
Prior art keywords
storage disk
holding table
boss
holding
circular resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8305879A
Other languages
Japanese (ja)
Other versions
JP3703230B2 (en
Inventor
Masami Inai
正美 井内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitano Engineering Co Ltd
Original Assignee
Kitano Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitano Engineering Co Ltd filed Critical Kitano Engineering Co Ltd
Priority to JP30587996A priority Critical patent/JP3703230B2/en
Publication of JPH10134427A publication Critical patent/JPH10134427A/en
Application granted granted Critical
Publication of JP3703230B2 publication Critical patent/JP3703230B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/7805Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
    • B29C65/7808Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots
    • B29C65/7811Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of holes or slots for centring purposes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845Radiation curing adhesives, e.g. UV light curing adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7841Holding or clamping means for handling purposes
    • B29C65/7847Holding or clamping means for handling purposes using vacuum to hold at least one of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45Joining of substantially the whole surface of the articles
    • B29C66/452Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/83General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832Reciprocating joining or pressing tools
    • B29C66/8322Joining or pressing tools reciprocating along one axis
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406Ultraviolet [UV] radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1477Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
    • B29C65/1483Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/521Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/80General aspects of machine operations or constructions and parts thereof
    • B29C66/82Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/824Actuating mechanisms
    • B29C66/8242Pneumatic or hydraulic drives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00Carriers for sound or information
    • B29L2017/001Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003Records or discs
    • B29L2017/005CD''s, DVD''s

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a method for taking up a memory disk which obviates the occurrence of the misalignment of two sheets of circular resin disks from each other. SOLUTION: This method for taking up the memory disk is method of taking up the memory disk placed on a holding base in the state of inserting its boss part into its central hole by means of expansion chucks. The stages consist of a stage for pushing the boss part 1 downward on the rear surface of the expansion chucks 5 by lowering the expansion chucks 5, thereby inserting the expansion chucks 5 into the central hole of the memory disk D, a stage for expanding the expansion chuck 5 to press the central hole DH of the memory disk D, thereby holding the memory disk and a stage for rising the expansion chucks 5 while holding the memory disk D.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、記憶ディスクの
貼り合わせに関するものであり、更に詳しくは、記憶デ
ィスクから取り上げるための方法及びそのために使用す
る保持台に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of bonding storage disks, and more particularly, to a method for picking up a storage disk and a holding table used for the method.

【0002】[0002]

【従来の技術】近年、コンピュータ、取り分けパソコン
等の普及は目ざましく、それに使用される記憶媒体、特
に、記憶ディスクの容量は益々高密度化しており、その
種類も多くなると共に、その適応分野も拡大してきてい
る。そのため、例えば音楽用を中心とするCDにおい
て、最近は映像用へと発展する傾向にある。記憶ディス
クとしては、例えば、磁気ディスク、光ディスク(例え
ば、CD−ROM等)、光磁気ディスク(例えば、M
O)等があるが、その中でも、最近、光ディスクの需要
が増大している。
2. Description of the Related Art In recent years, computers, especially personal computers, etc., have become remarkably widespread, and the storage media used for them, particularly storage disks, have been increasing in density and their types have been increased, and their application fields have been increasing. It is expanding. For this reason, for example, CDs mainly for music use have recently tended to develop to video use. As the storage disk, for example, a magnetic disk, an optical disk (for example, a CD-ROM), a magneto-optical disk (for example,
O), among which, the demand for optical disks has recently increased.

【0003】DVDと呼ばれる光ディスクを例にとって
いうと、それを構成する単板である円形樹脂基板は、そ
の厚みが0.6mm、外形が120mm、その中心穴D
Hの径が15mm、と規格されている。このような薄い
円形樹脂基板一枚では、機械的強度が低くまた変形もし
易いため、同じ厚み(0.6mm)のこのような円形樹
脂基板を貼り合わせて合体することにより使用される。
[0003] Taking an optical disk called a DVD as an example, a circular resin substrate as a single plate constituting the optical disk has a thickness of 0.6 mm, an outer diameter of 120 mm, and a center hole D.
It is specified that the diameter of H is 15 mm. Since such a thin circular resin substrate has low mechanical strength and is easily deformed, it is used by bonding together such circular resin substrates having the same thickness (0.6 mm).

【0004】例えば、図7は、2枚の円形樹脂基板(第
1円形樹脂基板2と第2円形樹脂基板1D)を貼り合わ
せて合体された状態の光ディスクであるDVDを概略的
に示す。そして(a)は、情報信号が一方の円形樹脂基
板に印加されているもの、また(b)は、両方の円形樹
脂基板に情報が印加されているものを示す。このように
して2枚の円形樹脂基板D1、D2が貼り合わされた光
ディスクDは、レーザビームを使って反射膜aから反射
される光を図示しない光検出器等で受光して信号を再生
するものである。
For example, FIG. 7 schematically shows a DVD which is an optical disk in a state where two circular resin substrates (a first circular resin substrate 2 and a second circular resin substrate 1D) are bonded together. (A) shows the information signal applied to one of the circular resin substrates, and (b) shows the information signal applied to both the circular resin substrates. The optical disk D on which the two circular resin substrates D1 and D2 are bonded in this manner is a device for reproducing a signal by receiving light reflected from the reflection film a using a laser beam with a photodetector (not shown) or the like. It is.

【0005】このように、DVD等の光ディスクも含め
て高密度の記憶ディスクの多くは、単板ではなく上記の
ような合板構造として使用されるので、製造する上で第
1円形樹脂基板D1と第2円形樹脂基板D2の貼り合わ
せが当然必要となる。単板を貼り合わせて一体の記憶デ
ィスク(即ち、ここでは光ディスク)にするために、次
の一連の工程(STEP)が行なわれる(図6参照)。
As described above, many high-density storage disks including optical disks such as DVDs are used not as a single plate but as a plywood structure as described above. Naturally, it is necessary to bond the second circular resin substrate D2. The following series of steps (STEP) are performed to bond the veneers to form an integrated storage disk (that is, an optical disk here) (see FIG. 6).

【0006】(1)回転保持台Xに第1円形樹脂基板D
1を載置する工程 先ずこの工程(1)では、信号面に反射膜ならびに保護
膜をコーティングし情報信号を印加した第1円形樹脂基
板D1が、回転保持台X上に載置され均等に吸着保持さ
れる。
(1) The first circular resin substrate D
First, in this step (1), a first circular resin substrate D1 having a signal surface coated with a reflective film and a protective film and applied with an information signal is placed on a rotation holding table X and uniformly adsorbed. Will be retained.

【0007】(2)第1円形樹脂基板D1に接着剤Rを
塗布する工程 この工程(2)では、第1円形樹脂基板D1を載置した
回転保持台Xを低速回転させながら、吐出ノズルNより
接着剤R、例えば紫外線硬化樹脂を静かに吐出させる。
尚、吐出する接着剤Rは、吐出ノズルNの移動の仕方に
より第1円形樹脂基板D1の上に吐出される軌跡は異な
るが、例えば、図のようにドーナツ状軌跡として形成す
ることが好ましい。
(2) Step of Applying Adhesive R to First Circular Resin Substrate D1 In this step (2), the rotation nozzle X on which the first circular resin board D1 is mounted is rotated at a low speed while the discharge nozzle N The adhesive R, for example, an ultraviolet curable resin is discharged more gently.
The trajectory of the adhesive R to be discharged onto the first circular resin substrate D1 differs depending on the manner in which the discharge nozzle N moves. For example, it is preferable to form the adhesive R as a donut-shaped trajectory as shown in the figure.

【0008】(3)第1円形樹脂基板D1に第2円形樹
脂基板D2を載置して重ね合わせる工程 この工程(3)では、接着剤Rが塗布された第1円形樹
脂基板D1の上に(透明の)第2円形樹脂基板D2が載
置される。ここでの第2円形樹脂基板D2は、情報信号
が印加されてない透明なもの、又は情報信号が印加され
てたもの(この場合、反射膜を有するので、通常、透明
ではない)がある。なお、図では、第2円形樹脂基板D
2は、爪チャックを使っているが、吸着チャックにより
表面を吸引保持することも多く行われる。
(3) Step of placing the second circular resin substrate D2 on the first circular resin substrate D1 and superimposing them In this step (3), the first circular resin substrate D1 on which the adhesive R is applied is placed on the first circular resin substrate D1. The (transparent) second circular resin substrate D2 is mounted. Here, the second circular resin substrate D2 may be a transparent substrate to which no information signal is applied, or a substrate to which an information signal is applied (in this case, the substrate is usually not transparent because it has a reflective film). In the drawing, the second circular resin substrate D
2, a nail chuck is used, but the surface is often suction-held by a suction chuck.

【0009】(4)両円形樹脂基板D1,D2の間に介
在する接着剤Rを延展する工程 次にこの工程(4)では、両円形樹脂基板D1、D2間
に介在する接着剤Rが満遍なく且つ均一に行き渡るよう
に延展が行なわれる。この延展は、2枚の円形樹脂基板
D1、D2が合体した合体円形樹脂基板、即ち光ディス
クDが載置された状態において、回転保持台Xを高速回
転(通常、回転数は数千rpm以上、回転時間は数秒程
度)させることで行なう。
(4) Step of extending adhesive R interposed between both circular resin substrates D1 and D2 Next, in this step (4), the adhesive R interposed between both circular resin substrates D1 and D2 is evenly distributed. In addition, the spread is performed so as to be evenly distributed. In this extension, the rotation holding table X is rotated at a high speed in a state where the optical disk D is mounted, that is, the combined circular resin substrate in which the two circular resin substrates D1 and D2 are combined (normally, the rotation speed is several thousand rpm or more, (Rotation time is about several seconds).

【0010】この回転により、重ね合わされた両円形樹
脂基板D1,D2間に存在する余分な接着剤Rは、延展
と共に外に放出され、同時に両円形樹脂基板D1、D2
間に閉じ込まれた空気(空気の泡等)は外に排出され
る。ここで、延展の際に円形樹脂基板D1、D2の中心
穴に挿入した回転保持台のボス体1から接着剤を中心方
向へ吸引することが行なわれる。この吸引は、円形樹脂
基板に備わった液止め溝の位置や更に中心穴の位置まで
接着剤が達するような吸引力で行なわれる。
[0010] By this rotation, the excess adhesive R existing between the superposed circular resin substrates D1 and D2 is discharged to the outside together with the spreading, and at the same time, the two circular resin substrates D1 and D2 are superposed.
The air (such as air bubbles) trapped in between is discharged to the outside. At this time, the adhesive is sucked in the center direction from the boss 1 of the rotary holder inserted into the center holes of the circular resin substrates D1 and D2 during the extension. This suction is performed with a suction force such that the adhesive reaches the position of the liquid stopping groove and the position of the center hole provided in the circular resin substrate.

【0011】(5)延展された接着剤Rを硬化する全面
硬化工0 この工程(5)では、第1円形樹脂基板D1と第2円形
樹脂基板D2の間の接着剤の延展が終わった後の光ディ
スクをゆっくり回転(ここでの回転速度は、前記延展工
程の際の回転速度より大幅に少なく例えば、0rpm程
度)させた状態、又は回転させない状態で、紫外線を照
射させ接着剤R、例えば、紫外線硬化樹脂層を硬化させ
る。具体的には、背面に反射鏡Mを有する紫外線光源体
Lにより紫外線を照射させて、効率よく硬化がなされ
る。この延展工程によって、両円形樹脂基板間の全接着
剤が硬化され両円形樹脂基板は全体的に固定される。
(5) Complete curing step 0 for curing the spread adhesive R In this step (5), after the spread of the adhesive between the first circular resin substrate D1 and the second circular resin substrate D2 is completed. The optical disc is slowly rotated (the rotation speed here is substantially lower than the rotation speed in the spreading step, for example, about 0 rpm), or in a state where the optical disc is not rotated, the adhesive is irradiated with ultraviolet rays, and the adhesive R, for example, The ultraviolet curing resin layer is cured. More specifically, curing is efficiently performed by irradiating ultraviolet rays from an ultraviolet light source body L having a reflecting mirror M on the back surface. By this extension step, the entire adhesive between the two circular resin substrates is hardened, and the two circular resin substrates are entirely fixed.

【0012】尚、硬化工程は、使用する接着剤Rの種類
により異なるもので、使用する接着8Rの特性に合致し
た硬化方法が採用されることは言うまでもない。また、
この硬化工程は延展工程とは異なったステーションにて
行なわれることが多い。以上のようにして貼り合わせ工
程が終了する。
The curing step differs depending on the type of the adhesive R used, and it goes without saying that a curing method suitable for the characteristics of the adhesive 8R used is employed. Also,
This curing step is often performed at a different station from the spreading step. The bonding step is completed as described above.

【0013】ところで、記憶ディスクが第1円形樹脂基
板D1と第2円形樹脂基板D2との両方に情報信号が記
録されている規格のものについて言うと、記憶ディスク
から出力する場合、一方向から光線を当て信号を読み取
る方式(例えば、デュアルレイヤーDVDに使用されて
いる規格の記憶ディスク読み取り手法の場合がこれに相
当する)、及び両方向から光線を当ててそれぞれの基板
の信号を読み取る方式(シングルレイヤー,ダブルサイ
ディッド)の2通りの方式がある。
By the way, in the case of a storage disk of a standard in which an information signal is recorded on both the first circular resin substrate D1 and the second circular resin substrate D2, when outputting from the storage disk, light beams are transmitted from one direction. (For example, a method of reading a storage disk of a standard used for a dual layer DVD corresponds to this), and a method of reading a signal of each substrate by irradiating light from both directions (single layer) , Double-sided).

【0014】このうち前者においては、第1円形樹脂基
板D1と第2円形樹脂基板D2と間にズレがあると印加
された情報の正確な読み取りはできない。図5に、2枚
の円形樹脂基板にズレが生じた状態の場合を示すが、こ
のようにズレた状態においては、印加された記録情報に
も両者間にズレが生じ、それがそのまま貼り合わされる
と、一方方向からの読み取り方式では正確な読み取りが
できないのである。
In the former case, if there is a deviation between the first circular resin substrate D1 and the second circular resin substrate D2, the applied information cannot be accurately read. FIG. 5 shows a state in which the two circular resin substrates are displaced. In such a displaced state, the applied recording information is also displaced between the two, and the two pieces are bonded as they are. Then, accurate reading cannot be performed by the reading method from one direction.

【0015】因みに、デュアルレイヤーDVDの規格に
おいては、欠陥商品とならないよう、両者のズレが、例
えば、15ミクロン以内に収まることが望ましいとされ
ている。このような円形樹脂基板相互のズレは、上述の
第3工程において、回転保持台の第1円形樹脂基板D1
の上に第2円形樹脂基板D2を重ね合わせる段階で発生
する。従って、次に行われる延展工程では、両円形樹脂
基板がズレて重ね合わされた状態のまま回転保持台上で
接着剤Rの延展が行われることになる。
By the way, according to the standard of the dual layer DVD, it is desirable that the difference between the two be within 15 microns, for example, so as not to be defective. Such a displacement between the circular resin substrates is caused by the first circular resin substrate D1 of the rotation holding base in the third step described above.
This occurs when the second circular resin substrate D2 is superimposed on the substrate. Therefore, in the subsequent spreading step, the adhesive R is spread on the rotary holding table while the two circular resin substrates are shifted and overlapped.

【0016】延展工程では、回転保持台Xのボス体1
が、両円形樹脂基板の中心穴DHに挿入されて両円形樹
脂基板の位置決めが一応なされるが、ボス体1の外径と
円形樹脂基板の中心穴DHの径とは、円形樹脂基板の出
し入れのために多少差を設けており、ボス体1により両
樹脂基板間の微細なズレを修正することはできない。従
って、延展が終了した後でも このズレは修正がされず
そのまま残った状態が起こりうる。更に、上述の第3工
程において、第1円形樹脂基板D1と第2円形樹脂基板
D2円形樹脂基板相互との間にズレが生じなくても、回
転保持台Xを回転させて接着剤Rを延展させる段階で発
生する場合も当然生ずる。
In the extension step, the boss 1
Are inserted into the center holes DH of the two circular resin substrates, and the positioning of the two circular resin substrates is temporarily performed. However, the outer diameter of the boss body 1 and the diameter of the center hole DH of the circular resin substrate are determined by inserting and removing the circular resin substrate. Therefore, the boss 1 cannot correct a minute displacement between the two resin substrates. Therefore, even after the extension has been completed, this deviation may not be corrected and may remain as it is. Further, in the above-mentioned third step, even if there is no deviation between the first circular resin substrate D1 and the second circular resin substrate D2, the adhesive R is extended by rotating the rotation holder X. Of course, it may occur at the stage of causing it to occur.

【0017】回転保持台上で延展が終了しても、全くズ
レが生じていない場合もあるが、この場合も、表面を吸
着することで、次の工程に移動すると、その移動の過程
でズレが生ずることがある。これらの円形樹脂基板の相
互のズレは、品質確保の上で確実に排除しなければなら
ない。一方、DVD等の記憶容量が緻密に印加されて容
量の大きい記憶ディスクは、極力、表面を吸引しないで
把持することが、記憶ディスクを傷めないためにも重要
である。記憶ディスクを保持する方法として、記憶ディ
スクの周囲を圧着して爪チャックにより把持する方法
と、記憶ディスクの表面を吸引して吸着チャックにより
保持する方法があるが、前者は、記憶ディスクが湾曲し
易い欠点があり、後者は、表面を傷つける恐れがある。
このようなことから中心部から保持する方法が望まれて
いたが、回転保持台には位置決め用のボス部が存在する
ため困難であった。
In some cases, no displacement occurs even when the extension is completed on the rotary holding table. In this case, too, the surface is attracted, and when the process is moved to the next step, the displacement occurs in the process of the movement. May occur. Mutual displacement of these circular resin substrates must be reliably eliminated in order to ensure quality. On the other hand, in the case of a storage disk such as a DVD having a large storage capacity to which the storage capacity is applied precisely, it is important to hold the storage disk as much as possible without sucking the surface so as not to damage the storage disk. As a method for holding the storage disk, there are a method in which the periphery of the storage disk is pressed and gripped by the claw chuck, and a method in which the surface of the storage disk is suctioned and held by the suction chuck. It has the disadvantage that it is easily damaged, and the latter may damage the surface.
For this reason, a method of holding from the center has been desired, but it has been difficult because the rotary holding table has a boss for positioning.

【0018】[0018]

【発明が解決しようとする課題】本発明は、上記のよう
な背景のもとで問題点の解決を図ったものである。即
ち、本発明の目的は、2枚の円形樹脂基板の相互のズレ
を生じないように記憶ディスクを取り上げる方法及びそ
のために使用する保持台を提供するものである。更にな
る目的は、記憶ディスクを中心穴を使って記憶ディスク
を取り上げる方法及びそのために使用する保持台を提供
するものである。
SUMMARY OF THE INVENTION The present invention has been made to solve the problems in the background described above. That is, an object of the present invention is to provide a method for picking up a storage disk so that two circular resin substrates do not shift from each other, and a holding table used for the method. A further object is to provide a method for picking up a storage disk with a center hole in the storage disk and a holding table used therefor.

【0019】[0019]

【課題を解決するための手段】しかして、本発明者等は
このような課題に対して、鋭意研究を重ねた結果、ボス
体を弾圧的に上下移動可能にすることにより取り上げる
ためのチャックを記憶ディスクの中心穴に挿入できるこ
とを見出し、この知見により本発明を完成させるに至っ
たものである。
Means for Solving the Problems The inventors of the present invention have made intensive studies on such problems, and as a result, have developed a chuck for picking up the boss body by making the boss body vertically resiliently movable. The inventor has found that it can be inserted into the center hole of the storage disk, and has completed the present invention based on this finding.

【0020】即ち、本発明は、(1)、中心穴にボス部
を挿入させた状態で保持台に載置された記憶ディスクを
拡張チャックにより取り上げる方法であって、拡張チャ
ックを下降させて、該拡張チャックの下面にてボス部を
下方に押し下げ、拡張チャックを記憶ディスクの中心穴
に挿入させる工程、拡張チャックを拡張し記憶ディスク
の中心穴を押圧して該記憶ディスクを保持する工程、記
憶ディスクを保持したまま拡張チャックを上昇させる工
程を有する取り上げ方法に存する。
That is, the present invention provides (1) a method of picking up a storage disk placed on a holding table with an expansion chuck in a state where a boss is inserted into a center hole. Pushing down the boss on the lower surface of the expansion chuck to insert the expansion chuck into the center hole of the storage disk; expanding the expansion chuck and pressing the center hole of the storage disk to hold the storage disk; The pick-up method includes a step of raising the expansion chuck while holding the disk.

【0021】そして、(2)、中心穴を有する2枚の円
形樹脂基板の間に接着剤を介在させてなる記憶ディスク
を載置するための保持台であって、該保持台が上記2枚
の円形樹脂基板の中心穴に挿入されるボス体を備え、該
ボス体が保持台に弾圧的に上下移動可能となっている保
持台に存する。
(2) A holding table for mounting a storage disk having an adhesive interposed between two circular resin substrates having a center hole, wherein the holding table is composed of the two circular resin substrates. And a boss inserted into the center hole of the circular resin substrate, and the boss is resiliently movable up and down on the holder.

【0022】そしてまた、(3)、ボス体は保持台表面
より下方位置まで下降可能に設定されている上記(2)
の保持台に存する。
Further, (3), the boss body is set so as to be able to descend to a position below the surface of the holding table (2).
In the holding table.

【0023】そしてまた、(4)、ボス体が吸引機能を
有する上記(2)の保持台に存する。
Further, (4) the boss exists in the holding table of (2) having a suction function.

【0024】そしてまた、(5)、保持台の表面が吸着
機能を有する上記(2)の保持台に存する。
Further, (5) the surface of the holding table has the holding table of the above (2) having a suction function.

【0025】そしてまた、(6)、保持台が回転可能で
ある上記(2)の保持台に存する。
Further, (6) the present invention resides in the above-mentioned holding table (2) in which the holding table is rotatable.

【0026】そしてまた、(7)、ボス体の吸引機能と
保持台の吸着機能とは、その吸引源が異なる経路で行わ
れている上記(2)の保持台に存する。
Further, (7) the suction function of the boss body and the suction function of the holding table exist in the holding table of (2) in which the suction source is performed through different paths.

【0027】[0027]

【作用】拡張チャックを下降してボス体を押し下げ、拡
張チャックを記憶ディスクの中心穴に挿入し、同時に中
心穴からボス体を下に抜き去る。拡張チャックを拡張す
ることで記憶ディスクの中心穴内周面を外方に押圧して
保持する。記憶ディスクを保持したらそのまま拡張チャ
ックを上昇させる。
The extension chuck is lowered to push down the boss body, the extension chuck is inserted into the center hole of the storage disk, and the boss body is simultaneously pulled out from the center hole. By expanding the expansion chuck, the inner peripheral surface of the center hole of the storage disk is pressed outward and held. After holding the storage disk, the extension chuck is raised as it is.

【0028】[0028]

【発明の実施の形態】本発明の保持台Xから記憶ディス
クを取り上げる方法においては、保持台の上方に位置す
る拡張チャックが使用される。本発明の保持台は、接着
剤を延展する延展工程において使用される回転する保持
台と、それ以外の、回転しない保持台をも含むものであ
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS In the method of picking up a storage disk from a holding table X according to the present invention, an expansion chuck located above the holding table is used. The holding table of the present invention includes a rotating holding table used in the spreading step of spreading the adhesive, and other non-rotating holding tables.

【0029】〔発明の第1の実施の形態〕図1は、延展
工程において使用される保持台(ここでは回転するため
回転保持台という)及び記憶ディスクを保持して持ち上
げるための拡張手段を示す概略断面図である。図2は、
回転保持台を示したもので、(a)は平面図で、(b)
は側面図である。接着剤Rを介して重ね合わされた記憶
ディスクD(両円形樹脂基板D1,D2)は、図2の鎖
線で示すごとく、円形の回転保持台Xの上面に載置され
る。この回転保持台Xの上面には、円形樹脂基板を吸着
するための後述する吸着穴(図示しない)が多数設けら
れており、所定の強さで吸着制御がなされる。回転保持
台X上の中心部にはボス体1が設けられており、このボ
ス体1は、円形樹脂基板の中心穴DHに挿入される部分
となる。
[First Embodiment of the Invention] FIG. 1 shows a holding table (here, referred to as a rotation holding table for rotation) used in an extension process and an expansion means for holding and lifting a storage disk. It is an outline sectional view. FIG.
(A) is a plan view and (b) is a view showing a rotation holding table.
Is a side view. The storage disks D (both circular resin substrates D1 and D2) superimposed via the adhesive R are mounted on the upper surface of the circular rotary holder X as indicated by the chain line in FIG. A large number of suction holes (not shown) for sucking the circular resin substrate are provided on the upper surface of the rotation holding table X, and suction control is performed with a predetermined strength. A boss 1 is provided at the center on the rotation holding base X, and the boss 1 is a portion to be inserted into the center hole DH of the circular resin substrate.

【0030】回転保持台Xは、図示しない原動機を含む
駆動装置により高速回転するように制御されている。な
お、回転保持台Xの周りには、円形ドーム形状をしたカ
バーである飛散防止手段X1が設けられている。この飛
散防止手段X1は、延展の際、両円形樹脂基板から外方
に放出される接着剤Rを受け止めてその飛散を防止する
ためのものであるが、その委細な説明は省略する。
The rotation support X is controlled to rotate at a high speed by a driving device including a motor (not shown). Around the rotation support X, scattering prevention means X1, which is a cover having a circular dome shape, is provided. The scattering prevention means X1 is for receiving the adhesive R discharged outward from the two circular resin substrates at the time of spreading to prevent the scattering, and a detailed description thereof will be omitted.

【0031】さて図1に断面で示すように、回転保持台
Xは、円形樹脂基板D1,D2を載置するためのテーブ
ル体2と、該テーブル体2を支えるための回転支持軸3
とを備える。テーブル体2は、回転支持軸3の径大部3
1に嵌め込まれることで、取り付けられる。また回転支
持軸3の径大部31に設けられた嵌合穴32には、後述
するボス体1が嵌め込まれて取り付けられ、その中で弾
圧的に上下方向に摺動することができる。回転支持軸3
は、軸受け41を介して固定スリーブ4により回転可能
に支持されている。
As shown in cross section in FIG. 1, the rotary holding table X includes a table body 2 for mounting the circular resin substrates D1 and D2, and a rotation support shaft 3 for supporting the table body 2.
And The table 2 has a large diameter portion 3 of the rotation support shaft 3.
It is attached by being fitted into 1. Further, a boss body 1 described later is fitted and fitted in a fitting hole 32 provided in the large-diameter portion 31 of the rotation support shaft 3, and can resiliently slide vertically in the fitting hole 32. Rotary support shaft 3
Is rotatably supported by the fixed sleeve 4 via the bearing 41.

【0032】空間A4は、回転支持軸3と固定スリーブ
4の両者の間に密封された円筒状の空間として形成され
る。この空間A4は、固定スリーブ4と回転支持軸3と
の間で、例えばシール体42を使って厳密に気密性が保
証されている。また、この空間A4は、固定スリーブ4
の適当な上下位置に設けられた図示しない貫通口を通じ
て同じく図示しない制御された負圧源(負圧源として
は、例えば、真空吸引装置が採用される)に連結されて
いる。
The space A4 is formed as a cylindrical space sealed between the rotation support shaft 3 and the fixed sleeve 4. The space A4 is strictly hermetically sealed between the fixed sleeve 4 and the rotation support shaft 3 by using, for example, a seal body 42. In addition, this space A4 is
Are connected to a controlled negative pressure source (not shown) (for example, a vacuum suction device is adopted as the negative pressure source) through through holes (not shown) provided at appropriate vertical positions.

【0033】回転支持軸3の下端部には図示しないプー
リと伝動ベルトが設けられており、これにより回転する
ことができる。この回転支持軸3が回転することによ
り、回転保持台X全体が一体となって回転される。回転
支持軸3の更なる下端は、ロータリージョイントに結合
され、内部の通路B3は、このロータリージョイントを
介して外部の図示しない制御された負圧源(負圧源とし
ては、例えば真空吸引装置が採用される)に接続され
る。
A pulley (not shown) and a transmission belt (not shown) are provided at the lower end of the rotation support shaft 3 so that it can rotate. As the rotation support shaft 3 rotates, the entire rotation support X is integrally rotated. A further lower end of the rotary support shaft 3 is connected to a rotary joint, and an internal passage B3 is connected to an external controlled negative pressure source (not shown, for example, a vacuum suction device) through the rotary joint. To be adopted).

【0034】一方、テーブル体2は、直接に記憶ディス
クDが載置される部分(載置部)で、表面が平坦な着座
面として形成されている。そして、その表面に多数の吸
着穴A1が設けられており、この吸着穴A1は、テーブ
ル内の通路A2を経て、回転支持軸3の径大部31の通
路A3に通じている。
On the other hand, the table 2 is a portion (mounting portion) on which the storage disk D is directly mounted, and has a flat seating surface. A large number of suction holes A1 are provided on the surface of the rotation support shaft 3. The suction holes A1 communicate with the passage A3 of the large-diameter portion 31 of the rotary support shaft 3 via the passage A2 in the table.

【0035】また、この通路A3は、回転支持軸3と固
定スリーブ4との間の先述した空間(間隙)A4に開放
される。このように、記憶ディスクを吸着するための連
続する吸引通路は、吸着穴A1、通路A2、通路A3、
空間A4、等により形成される。空間A4に通じる図示
しない負圧源を作動することで、吸着穴A1が負圧とな
って、載置部であるテーブル体2の表面(着座面)に吸
着力が働き、その上に載置された記憶ディスクDは、吸
着保持される。
The passage A3 is open to the space (gap) A4 between the rotation support shaft 3 and the fixed sleeve 4. As described above, the continuous suction passage for sucking the storage disk includes the suction hole A1, the passage A2, the passage A3,
The space A4 is formed. By operating a negative pressure source (not shown) communicating with the space A4, the suction hole A1 becomes a negative pressure, and a suction force acts on the surface (seating surface) of the table body 2 as a mounting portion, and the mounting portion is placed thereon. The stored storage disk D is suction-held.

【0036】次にボス体について述べる。図3は、ボス
体を構成する2つの要部、即ち基部11と蓋部12とに
分解した状態を示す。図に示すように、ボス体1は、基
部11と蓋部12とよりなり、この両者は、連通するボ
ルト体Pを螺合することにより互いに一体に取り付けら
れる。このボルト体Pは、バネ体Fを回転支持軸3の径
大部31の嵌合穴32に装着する際に、支持部となる。
Next, the boss body will be described. FIG. 3 shows a state where the boss body is disassembled into two main parts, that is, a base part 11 and a lid part 12. As shown in the figure, the boss body 1 includes a base portion 11 and a lid portion 12, both of which are integrally attached to each other by screwing a communicating bolt body P. The bolt body P serves as a support portion when the spring body F is mounted in the fitting hole 32 of the large-diameter portion 31 of the rotation support shaft 3.

【0037】蓋部12は、その外周面は、テーパ面Tを
備えたものとして示されているが、このテーパ面は、こ
の発明の場合、必ずしも必要ではない。基部11は、小
径の下部円筒部11Aとそれより大径の第2円筒部11
Bとよりなる。両円筒部の境の肩部が11C、ボス体1
を嵌合穴32に装着した際、テーブル体2の下面に弾圧
的に当接して抜け止めとなる部分である。基部11は、
蓋部を上に取り付けた状態で回転保持台Xの嵌合穴32
に嵌め込まれるものであり、その上面には、放射状の突
出部111が形成されている。突出部111の股の部分
の底には、吸引のために小穴112が空けられており、
この小穴112は、ボス体1、詳しくは基部11の内部
空間B2に開放される
Although the outer peripheral surface of the lid portion 12 is shown as having a tapered surface T, this tapered surface is not always necessary in the present invention. The base 11 includes a lower cylindrical portion 11A having a smaller diameter and a second cylindrical portion 11 having a larger diameter.
B. The shoulder at the boundary between the two cylindrical portions is 11C, and the boss body 1
This is a portion that resiliently abuts against the lower surface of the table body 2 when it is mounted in the fitting hole 32 to prevent it from coming off. The base 11 is
With the lid attached to the upper side, the fitting hole 32
And a radial projection 111 is formed on the upper surface thereof. At the bottom of the crotch portion of the protrusion 111, a small hole 112 is provided for suction,
This small hole 112 is opened to the boss body 1, specifically, the internal space B2 of the base 11.

【0038】ボス体1の内部空間B2は、回転支持軸3
に貫通された通路B3に連絡される構造になっている。
ところで、基部11に蓋部12を上から被せるようにし
て嵌め合わせた状態では、蓋部12の裏底面と基部11
の突出部111とが当接して、両者の外周面には間隙が
形成され、吸引口B1となる(図1参照)。吸引口B1
は、ボス体1の小穴112を介して、ボス体1の内部空
間B2に通じ、また、上述したように、内部空間B2
は、回転支持軸3に貫通された通路B3に連絡される。
The internal space B2 of the boss 1 is
Is connected to the passage B3 penetrated through the hole.
By the way, in a state where the lid portion 12 is fitted on the base portion 11 from above, the back bottom surface of the lid portion 12 is
Abuts on the outer peripheral surfaces of the two to form a suction port B1 (see FIG. 1). Suction port B1
Communicates with the internal space B2 of the boss 1 through the small hole 112 of the boss 1 and, as described above, the internal space B2
Is connected to a passage B3 penetrated by the rotation support shaft 3.

【0039】通路B3に通じる負圧源の作動により、吸
引口B1から接着剤の吸引が行なわれる。基部11と蓋
部12とで形成された間隙、即ち吸引口B1は、ボス体
の全周囲に連続して形成されることになり、全方向に均
等な吸引力が作用する。尚、今まで説明したボス体1
は、基部11と蓋部12に分離できるボス体1であった
が、加工上の制約を受けないならば、基部11と蓋部1
2とが一体となったボス体とすることも当然可能であ
る。
The adhesive is sucked from the suction port B1 by the operation of the negative pressure source communicating with the passage B3. The gap formed between the base 11 and the lid 12, that is, the suction port B1, is formed continuously around the entire periphery of the boss body, and a uniform suction force acts in all directions. The boss body 1 described so far.
Is a boss 1 that can be separated into a base 11 and a lid 12, but if there is no restriction on processing, the base 11 and the lid 1
Of course, it is also possible to form a boss body in which the two are integrated.

【0040】ところで、回転保持台Xを組み立てるに
は、先ず最初に、回転支持軸3の径大部31にある嵌合
穴32に、後述するようなボス体を嵌め込む。この時、
ボス体1に螺合されたボルト体Pと嵌合穴32の底面3
2Aとの間にバネ体Fを介在させ、ボス体1を押圧して
バネ体Fを縮ませた状態にする。そして、回転支持軸3
の径大部31の小径円筒部33にテーブル体の凹部21
を嵌め込むのである。ボス体1は、その肩部がテーブル
体2の下面で押さえられて、上方に付勢された状態で装
着される。
In order to assemble the rotation holding table X, first, a boss body, which will be described later, is fitted into a fitting hole 32 formed in the large-diameter portion 31 of the rotation support shaft 3. At this time,
Bolt body P screwed to boss body 1 and bottom surface 3 of fitting hole 32
A spring body F is interposed between the spring body 2A and the boss body 1 and the spring body F is compressed. And the rotation support shaft 3
The concave portion 21 of the table body is inserted into the small-diameter cylindrical portion 33 of the large-diameter portion 31.
Is inserted. The boss body 1 is mounted in a state where its shoulder is pressed by the lower surface of the table body 2 and is urged upward.

【0041】このようにして、ボス体1は回転保持台X
の嵌合穴32の中で弾圧的に上下移動自在に取り付けら
れるのである。先述したように、ボス体1は、延展工程
において、記憶ディスクの中心穴に挿入された状態で接
着剤を吸引する機能を備えるものである。この接着剤の
吸引のための連続する吸引通路は、吸引口B1,小穴1
12、基部11の内部空間B2、回転支持軸3の嵌合穴
32、通路B3等により形成され、該通路B3が図示し
ない負圧源(好ましくは、前述した吸着穴A1の吸着の
ための負圧源とは異なる負圧源を使用する)に通じる。
As described above, the boss body 1 is connected to the rotation holder X
Is vertically resiliently mounted in the fitting hole 32 of the above. As described above, the boss body 1 has a function of sucking the adhesive while being inserted into the center hole of the storage disk in the extension step. The continuous suction passage for suctioning the adhesive includes a suction port B1 and a small hole 1.
12, an inner space B2 of the base 11, a fitting hole 32 of the rotation support shaft 3, a passage B3, and the like. The passage B3 is connected to a negative pressure source (not shown) (preferably, a negative pressure for sucking the suction hole A1 described above). (Use a negative pressure source different from the pressure source).

【0042】この負圧源を作動することにより吸引口B
1から所定の吸引が行なわれる。なお、この吸引機能
は、第1円形樹脂基板D1と第2円形樹脂基板D2の間
に介在する接着剤を、内方へ引き込んで中心穴DHの方
向への延展を助ける作用を行うものであり、この点の技
術については、当発明者等は既に出願済である。記憶デ
ィスクDが載置された状態では、ボス体1と回転支持軸
3の径大部上面、及び記憶ディスクDの下面とで空所S
が区画形成される。この空所Sは、径大部31に設けら
れた図示しない導入路により外部に開放されており、ボ
ス体1からの吸引に際し、外気を導入するための部分と
なる。
By operating this negative pressure source, the suction port B
A predetermined suction is performed from 1. In addition, this suction function is to perform an action of helping the adhesive interposed between the first circular resin substrate D1 and the second circular resin substrate D2 to extend in the direction of the center hole DH by drawing inward. The present inventors have already applied for a technique in this regard. When the storage disk D is mounted, the space S is formed between the boss 1 and the upper surface of the large-diameter portion of the rotation support shaft 3 and the lower surface of the storage disk D.
Are formed. The space S is opened to the outside by an introduction path (not shown) provided in the large-diameter portion 31, and serves as a portion for introducing outside air when suctioning from the boss body 1.

【0043】さて、次に、保持台から記憶ディスクを取
り上げる際に使用される拡張チャックYについて述べ
る。この拡張チャックYは、回転保持台Xの上方に配置
され、該保持台に載置された記憶ディスクを吸引して他
のステーションに移送するものである。拡張チャックY
は、記憶ディスクDの中に挿入される円筒部5を備え、
この円筒部5が複数の分割片に分割されている。図では
円筒部5は、2つの分割片5A,5Bに分割されている
例を示すが、分割片の数は2つに限らない。各分割片5
A,5Bが外方に移動することにより拡張チャックYは
拡張された状態となる。なお、拡張チャックの拡張構造
は、例えば、既に本発明者等が出願した特願平8−21
9470号のボス体の拡開構造等を採用すればよい。こ
の各分割片5A,5Bは外方に付勢された状態に設定し
ている。従って、各分割片5A,5Bが外方に移動する
においては、各分割片5A,5Bは弾圧力を保持して拡
張することができ、またこの拡張の度合いは自由に設定
できる。
Next, the extension chuck Y used when picking up the storage disk from the holding table will be described. The expansion chuck Y is disposed above the rotary holding table X, and sucks the storage disk placed on the holding table and transfers it to another station. Extended chuck Y
Comprises a cylindrical part 5 inserted into the storage disk D,
This cylindrical portion 5 is divided into a plurality of divided pieces. Although the figure shows an example in which the cylindrical portion 5 is divided into two divided pieces 5A and 5B, the number of divided pieces is not limited to two. Each split piece 5
As A and 5B move outward, the expansion chuck Y is in an expanded state. The expansion structure of the expansion chuck is described in, for example, Japanese Patent Application No. 8-21 filed by the present inventors.
No. 9470 boss body expanding structure may be adopted. Each of the divided pieces 5A and 5B is set in a state of being urged outward. Therefore, when each of the divided pieces 5A and 5B moves outward, each of the divided pieces 5A and 5B can be expanded while maintaining the elastic pressure, and the degree of the expansion can be freely set.

【0044】拡張チャックYは、各分割片5A,5Bが
それぞれ接触して一体になった時が、縮小した状態(通
常の状態)である。縮小した状態においては、拡張チャ
ックYの外径は記憶ディスクDの中心穴DHの径よりや
や小さい径に設定されている。従って、拡張チャックY
を記憶ディスクDの中心穴DHに挿入することができ、
またその状態で拡張することによりそれを保持すること
ができる。即ち、拡張チャックYが拡張した状態では、
分割片5A,5Bが弾圧的に維持されているので、記憶
ディスクDの中心穴DHの内周面を一定圧で押圧するこ
とができる。
The expansion chuck Y is in a contracted state (normal state) when the divided pieces 5A and 5B come into contact with each other and become integrated. In the reduced state, the outer diameter of the expansion chuck Y is set to be slightly smaller than the diameter of the center hole DH of the storage disk D. Therefore, the extension chuck Y
Can be inserted into the center hole DH of the storage disk D,
Also, by expanding in that state, it can be retained. That is, when the expansion chuck Y is expanded,
Since the divided pieces 5A and 5B are elastically maintained, the inner peripheral surface of the center hole DH of the storage disk D can be pressed with a constant pressure.

【0045】次に、以上説明したような拡張チャックY
と先述した回転保持台Xを使って記憶ディスクDを取り
上げる方法を説明する。図4は、回転保持台から記憶デ
ィスクを取り上げる方法を工程順に示した図である。 (拡張チャック下降工程)回転保持台Xの上で接着剤の
延展が終了した段階では、記憶ディスクDは、そのまま
の状態、即ち、記憶ディスクDの中心穴DHに回転保持
台Xのボス部1が挿入された状態で載置されている。
〔図4(1)〕
Next, the extension chuck Y as described above is used.
A method of picking up the storage disk D using the rotation holding table X described above will be described. FIG. 4 is a diagram showing a method of picking up the storage disk from the rotary holder in the order of steps. (Extension Chuck Lowering Step) At the stage where the spread of the adhesive on the rotary holder X is completed, the storage disk D is left as it is, that is, the boss 1 of the rotary holder X is inserted into the center hole DH of the storage disk D. Is placed in a state where is inserted.
[Fig. 4 (1)]

【0046】この状態では記憶ディスクDの円形樹脂基
盤D1,D2がズレて載置されているものとする。拡張
チャックYは、通常、回転保持台Xの真上で待機してい
る。今、拡張チャックYを下降させる。拡張チャックY
が一定の位置まで下がると、該拡張チャックYの下面で
ボス部の上面を押圧する。なおも拡張チャックを下降さ
せると、ボス体もそれと一体となって押し下げられる。
その結果、記憶ディスクDの中心穴DHに拡張チャック
Yが挿入されていき、ボス体1は中心穴DHから下に抜
き去られる。拡張チャックYが所定の挿入状態となった
時、拡張チャックYの移動を停止する。〔図4(2)〕 (記憶ディスク保持工程)
In this state, it is assumed that the circular resin substrates D1 and D2 of the storage disk D are mounted with a displacement. The extension chuck Y is usually waiting just above the rotation holding table X. Now, the extension chuck Y is lowered. Extended chuck Y
Is lowered to a certain position, the lower surface of the expansion chuck Y presses the upper surface of the boss. When the extension chuck is further lowered, the boss body is also pushed down integrally therewith.
As a result, the expansion chuck Y is inserted into the center hole DH of the storage disk D, and the boss 1 is pulled down from the center hole DH. When the extension chuck Y enters a predetermined insertion state, the movement of the extension chuck Y is stopped. [FIG. 4 (2)] (Storage disk holding step)

【0047】次に、拡張チャックYを拡張させて、その
外周面で記憶ディスクの中心穴を外方に押圧しそれを保
持した状態とする。〔図4(3)〕 この時、記憶ディスクDの2枚の円形樹脂基盤D1,D
2の相互のズレは修正される。 (拡張チャック上昇工程)記憶ディスクを保持した状態
のまま、今度は拡張チャックを上昇させていく。拡張チ
ャックに保持された記憶ディスクは一体となって上昇し
ていく。〔図4(4)〕 以上で、記憶ディスクの回転保持台からの取り上げ工程
は終了する。
Next, the expansion chuck Y is expanded, and the center hole of the storage disk is pressed outward on the outer peripheral surface thereof to be held. [FIG. 4 (3)] At this time, the two circular resin substrates D1 and D of the storage disk D
The gap between the two is corrected. (Extension Chuck Elevation Step) The extension chuck is raised this time while holding the storage disk. The storage disk held by the expansion chuck rises integrally. [FIG. 4 (4)] Thus, the step of picking up the storage disk from the rotary holder is completed.

【0048】このように、拡張チャックにより、記憶デ
ィスクは、中心穴が保持された状態で取り上げられるの
で、従来の記憶ディスク表面を吸着する方法と異なっ
て、極めて優れた利点のあるものとなる。以上、本発明
を実施の形態を挙げて説明したきたが、本発明はこれら
の実施の形態にのみ限定されるものではなく、その本質
から逸脱しない範囲で、他の種々の変形例が可能である
ことはいうまでもない。
As described above, since the storage disk is picked up with the center hole held by the expansion chuck, the storage disk has an extremely excellent advantage, unlike the conventional method of sucking the storage disk surface. As described above, the present invention has been described with reference to the embodiments. However, the present invention is not limited to these embodiments, and various other modifications can be made without departing from the essence of the present invention. Needless to say, there is.

【0049】例えば、本発明の回転保持台は、他の位置
から記憶ディスクを載置する方法にも使用できるもので
ある。その場合は、先述べたような記憶ディスクを取り
上げる方法とは逆の手順となる。すなわち、記憶ディス
クを中心穴に挿入し、それを保持した状態の拡張チャッ
クを、他の地点から回転保持台の上方に位置せしめる。
そのまま拡張チャックを降下させていき、その下面でボ
ス部を下方に押し下げる。記憶ディスクの中心穴にボス
体の代わりとして拡張チャックが挿入されていくので、
所定の挿入状態となった時、拡張チャックの下降を停止
する。
For example, the rotary holding table of the present invention can be used for a method of mounting a storage disk from another position. In that case, the procedure is the reverse of the method for picking up the storage disk as described above. That is, the storage disk is inserted into the center hole, and the expansion chuck holding the storage disk is positioned above the rotary holder from another point.
The extension chuck is lowered as it is, and the boss is pushed down on the lower surface. As the expansion chuck is inserted in the center hole of the storage disk instead of the boss body,
When the predetermined insertion state is reached, the lowering of the extension chuck is stopped.

【0050】次に、拡張チャックを縮小させて記憶ディ
スクの中心穴内周面から離反させてやる。これで記憶デ
ィスクは拡張チャックから開放され、回転保持台の上に
記憶ディスクが載置された状態となる。その後、縮小し
たままの拡張チャックを上昇する。ボス体は、上方に弾
圧的に移動可能となっているので、拡張チャックと一体
となって上昇する。ボス体が、記憶ディスクの中心穴に
挿入されていき、一定の距離上昇したら止まる。この
後、ボス体と拡張チャックとは、離反して拡張チャック
のみが上昇していく。以上で、記憶ディスクの回転保持
台への載置工程は終了する。
Next, the expansion chuck is contracted and separated from the inner peripheral surface of the center hole of the storage disk. As a result, the storage disk is released from the expansion chuck, and the storage disk is placed on the rotary holder. Thereafter, the expansion chuck that has been reduced is raised. Since the boss body can be elastically moved upward, it rises integrally with the expansion chuck. The boss body is inserted into the center hole of the storage disk, and stops after a certain distance. Thereafter, the boss body and the expansion chuck separate from each other, and only the expansion chuck rises. Thus, the process of placing the storage disk on the rotary holder is completed.

【0051】[0051]

【発明の効果】回転保持台から、記憶ディスクを取り上
げる場合、2枚の円形樹脂基板の相互のズレが修正され
る。また、ズレが生じていない記憶ディスクにあって
は、そのままズレが生じない状態で回転保持台から取り
上げられる。記憶ディスクDの中心穴を利用して取り上
げるので表面に傷を付けることがない。
When the storage disk is picked up from the rotary holder, the mutual displacement between the two circular resin substrates is corrected. In addition, a storage disk in which no displacement has occurred is picked up from the rotary holding table without any displacement. Since the pickup is performed by using the center hole of the storage disk D, the surface is not damaged.

【図面の簡単な説明】[Brief description of the drawings]

【図1】図1は、回転保持台及び記憶ディスクを保持し
て持ち上げるための拡張チャックを示す図であり、回転
保持台は概略断面図で示す。
FIG. 1 is a view showing a rotation holding table and an expansion chuck for holding and lifting a storage disk, and the rotation holding table is shown in a schematic sectional view.

【図2】図2は回転保持台を示す図であり、(a)は平
面図、(b)は側面図である。
FIGS. 2A and 2B are diagrams showing a rotation holding table, wherein FIG. 2A is a plan view and FIG. 2B is a side view.

【図3】図3は、ボス体の分解図である。FIG. 3 is an exploded view of a boss body.

【図4】図4は、記憶ディスクを取り上げる方法を示す
工程図である。
FIG. 4 is a process chart showing a method of picking up a storage disk.

【図5】図5は、2枚の円形樹脂基板がズレた状態(正
面図及び側面図)を示す図である。
FIG. 5 is a diagram showing a state in which two circular resin substrates are displaced (a front view and a side view).

【図6】図6は、単板を貼り合わせて一体の光ディスク
にするための一連の工程を概略的に示す。
FIG. 6 schematically shows a series of steps for bonding single plates to form an integrated optical disk.

【図7】図7は、記憶ディスク(例えば光ディスクであ
るDVD)を示す概略断面図である。
FIG. 7 is a schematic cross-sectional view showing a storage disk (for example, a DVD which is an optical disk).

【図面の簡単な説明】[Brief description of the drawings] 【符号の説明】[Explanation of symbols]

1…ボス体 11…基部 112…小穴 111…突出部 11A…第1円筒部 11B…第2円筒部 12…蓋部 2…テーブル体 3…回転支持軸 31…径大部 32…嵌合穴 4…固定スリーブ 5…円柱部 5A…分割片 5B…分割片 A1…吸着穴 A2…通路 A3…通路 A4…空間 B1…吸引口 B2…内部空間 B3…通路 D…記憶ディスク(光ディスク) D1…第1円形樹脂基板 a…反射膜 b…保護膜 D2…第2円形樹脂基板 DH…中心穴 F…バネ体 M…反射鏡 N…ノズル P…ボルト体 R…接着剤(紫外線硬化樹脂) S…空所 T…テーパ面 L…紫外線光源体 X…回転保持台 X1…飛散防止手段 Y…拡張チャック DESCRIPTION OF SYMBOLS 1 ... Boss body 11 ... Base part 112 ... Small hole 111 ... Projection part 11A ... 1st cylindrical part 11B ... 2nd cylindrical part 12 ... Cover part 2 ... Table body 3 ... Rotation support shaft 31 ... Large diameter part 32 ... Fitting hole 4 ... Fixing sleeve 5 ... Cylindrical part 5A ... Split piece 5B ... Split piece A1 ... Suction hole A2 ... Path A3 ... Path A4 ... Space B1 ... Suction port B2 ... Internal space B3 ... Path D ... Storage disk (optical disk) D1 ... First Circular resin substrate a ... Reflection film b ... Protective film D2 ... Second circular resin substrate DH ... Center hole F ... Spring body M ... Reflector N ... Nozzle P ... Bolt body R ... Adhesive (ultraviolet curing resin) S ... Vacancy T: tapered surface L: ultraviolet light source X: rotation holder X1: scattering prevention means Y: expansion chuck

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 中心穴にボス部を挿入させた状態で保持
台に載置された記憶ディスクを拡張チャックにより取り
上げる方法であって、下記の(1)〜(3)工程を有す
ることを特徴とする取り上げ方法。 (1)拡張チャックを下降させて、該拡張チャックの下
面にてボス部を下方に押し下げ、拡張チャックを記憶デ
ィスクの中心穴に挿入させる工程 (2)拡張チャックを拡張し記憶ディスクの中心穴を押
圧して該記憶ディスクを保持する工程 (3)記憶ディスクを保持したまま拡張チャックを上昇
させる工程
1. A method for picking up a storage disk mounted on a holding table with an expansion chuck with a boss inserted into a center hole, comprising the following steps (1) to (3). And how to take up. (1) Step of lowering the extension chuck, pushing down the boss portion on the lower surface of the extension chuck, and inserting the extension chuck into the center hole of the storage disk. (2) Expanding the extension chuck to remove the center hole of the storage disk. Step of pressing and holding the storage disk (3) Step of raising the expansion chuck while holding the storage disk
【請求項2】 中心穴を有する2枚の円形樹脂基板の間
に接着剤を介在させてなる記憶ディスクを載置するため
の保持台であって、該保持台が上記2枚の円形樹脂基板
の中心穴に挿入されるボス体を備え、該ボス体が保持台
に弾圧的に上下移動可能となっていることを特徴とする
保持台。
2. A holding table for mounting a storage disk in which an adhesive is interposed between two circular resin substrates having a center hole, wherein the holding table is composed of the two circular resin substrates. A boss inserted into the center hole of the holding base, wherein the boss is resiliently movable up and down on the holding base.
【請求項3】 ボス体は保持台表面より下方位置まで下
降可能に設定されていることを特徴とする請求項2記載
の保持台。
3. The holding table according to claim 2, wherein the boss is set so as to be able to descend to a position below the surface of the holding table.
【請求項4】 ボス体が吸引機能を有することを特徴と
する請求項2記載の保持台。
4. The holding table according to claim 2, wherein the boss has a suction function.
【請求項5】 保持台の表面が吸着機能を有することを
特徴とする請求項2記載の保持台。
5. The holding table according to claim 2, wherein the surface of the holding table has a suction function.
【請求項6】 保持台が回転可能であることを特徴とす
る請求項2記載の保持台。
6. The holding table according to claim 2, wherein the holding table is rotatable.
【請求項7】 ボス体の吸引機能と保持台の吸着機能と
は、その吸引源が異なる経路で行われていることを特徴
とする請求項2記載の保持台。
7. The holding base according to claim 2, wherein the suction function of the boss body and the suction function of the holding base are performed by different suction sources.
JP30587996A 1996-10-31 1996-10-31 How to pick a storage disk from a holding stand Expired - Fee Related JP3703230B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30587996A JP3703230B2 (en) 1996-10-31 1996-10-31 How to pick a storage disk from a holding stand

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30587996A JP3703230B2 (en) 1996-10-31 1996-10-31 How to pick a storage disk from a holding stand

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004317391A Division JP2005032443A (en) 2004-10-29 2004-10-29 Holding base

Publications (2)

Publication Number Publication Date
JPH10134427A true JPH10134427A (en) 1998-05-22
JP3703230B2 JP3703230B2 (en) 2005-10-05

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ID=17950432

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999024336A1 (en) * 1997-11-12 1999-05-20 First Light Technology, Inc. System and method for maintaining concentricity of a combination of a top and bottom substrate during the assembly of a bonded storage disk
US6098272A (en) * 1998-05-19 2000-08-08 First Light Technology, Inc. System for maintaining concentricity of a combination of a top and bottom substrate during the assembly of a bonded storage disk
EP1059344A3 (en) * 1999-06-11 2001-05-02 Kitano Engineering Co., Ltd. Method of an apparatus for curing an optical disc
JP2006296046A (en) * 2005-04-07 2006-10-26 Ckd Corp Direct drive motor and rotating table device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999024336A1 (en) * 1997-11-12 1999-05-20 First Light Technology, Inc. System and method for maintaining concentricity of a combination of a top and bottom substrate during the assembly of a bonded storage disk
US6098272A (en) * 1998-05-19 2000-08-08 First Light Technology, Inc. System for maintaining concentricity of a combination of a top and bottom substrate during the assembly of a bonded storage disk
EP1059344A3 (en) * 1999-06-11 2001-05-02 Kitano Engineering Co., Ltd. Method of an apparatus for curing an optical disc
JP2006296046A (en) * 2005-04-07 2006-10-26 Ckd Corp Direct drive motor and rotating table device
JP4676233B2 (en) * 2005-04-07 2011-04-27 シーケーディ株式会社 Rotary table device

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