JP2007207402A - Sticking method of optical disk substrate and stick apparatus for optical disk substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sticking method of optical disk substrates and a sticking apparatus of the optical disk substrates capable of preventing distortion of the surfaces of the optical disk substrates when two substrates are stuck to each other sandwiching an energy ray curing resin therebetween and the energy ray curing resin is cured by irradiation with an energy ray. <P>SOLUTION: The sticking apparatus 10 of the optical disk substrates is provided with a vacuum chamber 11 capable of housing a lower side substrate 34 and an upper side substrate 32 held to be parallel to each other and separated from each other, a vacuum suction device 14 for evacuating in the inner part of the vacuum chamber 11, a supporting table 37 for placing the lower side substrate 34 on a supporting surface 37a, a pressing member 13 pressing the upper side substrate 32 toward the supporting table 37, a device 29 for irradiation with the energy ray for irradiating the energy ray curing resin 33 with the energy ray and a separating means separating the lower side substrate 34 from the supporting table 37 before irradiation with the energy ray. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical disk substrate bonding method and an optical disk substrate bonding apparatus.

  CD-R (Compact disk-recordable), CD (Compact disc), DVD (Digital versatile disc), DVD-R (Digital versatile disc-recordable) are optical discs that record or reproduce information using laser light. Etc. are already popular.

  In the manufacturing process of an optical disk, for example, an optical disk substrate is placed on a turntable, a liquid energy beam curable resin is applied on the optical disk substrate, and then the energy beam is bonded to another optical disk substrate. To cure the energy ray curable resin. As an optical disk substrate bonding apparatus, for example, the following Patent Document 1 is known.

JP-A-10-208316

  FIG. 13 shows a conventional optical disk substrate bonding apparatus 100. The lower substrate 4 coated with the energy ray curable resin 3 is placed on a support base 7 through which energy rays can be transmitted, and the upper substrate 2 is put on standby. Then, after the lower substrate 4 and the upper substrate 2 are housed in a vacuum chamber and the inside of the vacuum chamber is evacuated, the upper substrate 2 is overlaid on the lower substrate 4.

  By the way, even if the upper substrate 2 is superposed on the lower substrate 4 and then unloaded from the vacuum chamber, the state in which the lower substrate 4 is in close contact with the support base 7 remains maintained. When energy rays are irradiated toward the energy beam curable resin 3 sandwiched between the substrates while the lower substrate 4 is in close contact with the support base 7, only the energy beam curable resin 3 is cured and contracted, and the lower substrate 4 There is a problem that the surface of the optical disk substrate is distorted after the energy beam curable resin 3 is cured due to a difference in contraction between the energy beam curable resin 3 and the lower substrate 4 because the substrate is not contracted by being attached to the support base 7. It was. This distortion impairs the appearance of the optical disk.

  The present invention has been made in view of the above circumstances, and its purpose is to use two optical discs for optical disks when they are overlapped with energy beam curable resin, and the energy beam curable resin is irradiated with energy rays and cured. An object of the present invention is to provide an optical disk substrate bonding method and an optical disk substrate bonding apparatus capable of preventing the surface of the substrate from being distorted.

  The above object of the present invention is a method for laminating a substrate for an optical disk in which a lower substrate coated with an energy beam curable resin and an upper substrate are bonded to each other, and the lower substrate coated with the energy beam curable resin; A step of holding the upper substrate in a parallel and spaced apart state, a step of vacuuming the vacuum chamber, a step of pressing the upper substrate toward the support base and bringing it into close contact with the lower substrate, and the vacuum chamber An optical disc comprising: a step of releasing the atmosphere; and a step of irradiating the energy ray curable resin with an energy ray, and a separation step of separating the lower substrate and the support base before irradiating the energy ray. This is achieved by the method for pasting the substrates for use.

  In the method of laminating a substrate for an optical disk according to the present invention, the lower substrate is separated from the support base before the energy beam is irradiated to the energy beam curable resin. When the lower substrate is separated from the support base, the state where the lower substrate and the support base are attached is released. When energy rays are irradiated toward the energy ray curable resin after the separation step, the lower substrate also shrinks as the energy ray curable resin cures and shrinks, resulting in a shrinkage difference between the energy ray curable resin and the lower substrate. Absent. For this reason, it is possible to prevent the surface of the optical disk substrate from being distorted.

Further, in the method for laminating the optical disk substrate, it is preferable that pressurized air is sent between the lower substrate and the support table as means for separating the lower substrate from the support table.
By sending pressurized air between the lower substrate and the support base, a gap is formed between the lower substrate and the support base. The lower substrate is separated from the support base by this gap. Further, since the means for separating the lower substrate from the support base is pressurized air, the surface of the lower substrate is not damaged.

Further, in the method for laminating the optical disk substrate, the support table includes a protruding member as means for separating the lower substrate from the support table, and the protruding member attaches the lower substrate to the support table. It is preferable to push up.
By operating the protrusion member and pushing up the lower substrate with a force larger than the adhesion force between the lower substrate and the support base, the lower substrate can be separated from the support base. Further, since the protruding member is brought into contact with the lower substrate and pushed up, the contact state between the lower substrate and the support base can be reliably released.

  The above-mentioned object of the present invention is an optical disk substrate laminating apparatus for laminating a lower substrate and an upper substrate to which an energy ray curable resin is applied, and is held in a state of being parallel and separated from each other. A vacuum chamber capable of accommodating the lower substrate and the upper substrate, a vacuum suction device for making the inside of the vacuum chamber a vacuum atmosphere, a support base for placing the lower substrate on a support surface, A pressing member that presses the upper substrate toward the support; and an energy beam irradiator that irradiates an energy beam toward the energy beam curable resin, and before irradiating the energy beam, the lower substrate is This is achieved by an optical disk substrate laminating apparatus comprising a separating means for separating from the support base.

  The optical disk substrate bonding apparatus according to the present invention includes a separating means for separating the lower substrate from the support base. When the means for separating the lower substrate from the support table separates the lower substrate from the support table, the state where the lower substrate is stuck to the support table is released. After the lower substrate is separated from the support by the separating means, if the energy beam is irradiated from the energy beam irradiator toward the energy beam curable resin, the lower substrate also contracts as the energy beam curable resin is cured and contracted. No shrinkage difference occurs between the energy ray curable resin and the lower substrate. For this reason, the surface of the optical disk substrate can be prevented from being distorted.

Further, in the above optical disk substrate bonding apparatus, the separating means is provided so as to open to the support surface, and is a vent hole that supplies pressurized air between the lower substrate and the support base. It is preferable.
Since the space between the lower substrate and the support base is in a vacuum state, a force that maintains a state in which the lower substrate and the support base are in close contact with each other works. Therefore, a vent hole is provided in the support surface facing the lower substrate, and pressurized air is sent out from the vent hole. When pressurized air is supplied between the lower substrate and the support base, a gap is formed between the lower substrate and the support base. The lower substrate can be separated from the support base by the formed gap. Further, a gap is formed by supplying pressurized air between the lower substrate and the support base, and the surface of the lower substrate is not damaged.

Furthermore, it is preferable that the optical disk substrate laminating apparatus is a protruding member that is provided on the support base and can be advanced and retracted as the separating means.
In this case, the lower substrate can be separated from the support base by operating the protruding member and pushing up the lower substrate with a force larger than the adhesion force between the lower substrate and the support base. Further, since the protruding member is brought into contact with the lower substrate and pushed up, the contact state between the lower substrate and the support base can be reliably released.

  According to the present invention, it is possible to prevent the surface of the optical disk substrate from being distorted when the two substrates are sandwiched between energy beam curable resins and overlapped and irradiated with energy rays to be cured. .

  Embodiments of an optical disk substrate bonding method and an optical disk substrate bonding apparatus according to the present invention will be described below in detail with reference to the drawings.

  FIG. 1 is a diagram showing a configuration of a first embodiment of an optical disk substrate bonding apparatus according to the present invention. The optical disk substrate bonding apparatus 10 is an apparatus used in the process of manufacturing an optical disk used as an information recording medium. The upper substrate 32 and the lower substrate 34 coated with the energy ray curable resin 33 in a vacuum state. Are then cured, the energy ray curable resin 33 is cured, and the lower substrate 34 and the upper substrate 32 are bonded together to manufacture an optical disk.

  The optical disk substrate bonding apparatus 10 includes a turntable having a regular circular shape. The turntable is provided with a plurality of support bases 37 on which optical disk substrates are placed at equal intervals in the circumferential direction of the upper surface thereof.

  The support base 37 has a substantially cylindrical shape protruding upward from the upper surface of the turntable, and a support surface 37 a on which the optical disk substrate 31 is placed is formed at the upper end of the support base 37. A circular center opening is provided at the center of the upper substrate 32 and the lower substrate 34 with the axis S serving as the rotation center of the optical disk substrate 31 as the center, and is placed at the center of the support surface 37a. The center pin 20 that is inserted through the central opening of the optical disk substrate 31 and holds the optical disk substrate 31 on the support base 37 is provided so as to protrude.

  By rotating the turntable, the circumferential position of the support table 37 can be changed. Therefore, the support table 37 is moved to a position corresponding to a processing apparatus separately provided radially outward of the turntable. Thus, the optical disk substrate 31 held on the support base 37 can be subjected to predetermined processing. In this embodiment, the turntable functions as a conveying member.

  The support surface 37a according to the present embodiment is provided with a vent hole 35. When the optical disk substrate 31 is placed on the support base 37, the vent hole 35 is in a position covered with the lower substrate 34. . The vent hole 35 communicates with the air feed pump 36 through a path in the support base 37, and pressurized air sent from the air feed pump 36 is supplied from the vent hole 35. There may be a plurality of vent holes 35.

  FIG. 2 is a diagram illustrating a configuration of the optical disk substrate bonding apparatus 10 when the vacuum chamber 11 is brought into a vacuum state according to the present embodiment. As shown in the drawing, the center substrate 20 is inserted into the center pin 20 of the lower substrate 34 to which the upper substrate 32 and the energy beam curable resin 33 are applied, and is held by a support base 37.

  The center pin 20 includes a pin body portion 27 having a cylindrical shape. The tip of the pin body 27 is tapered so that the diameter of the upper peripheral surface, which is the substrate insertion side, is smaller than the lower peripheral surface in the vertical direction. By being guided by the tapered pin body 27, it becomes easy to insert the center openings of the lower substrate 34 and the upper substrate 32 into the center pin 20.

  The center pin 20 is provided with one or more (two in this embodiment) chuck levers 26 in the circumferential direction of the pin body 27. The chuck lever 26 is a member having a longitudinal dimension along the vertical direction and swingable in an open state and a closed state.

  The chuck lever 26 is supported by the support shaft portion 28, and an upper portion of the support shaft portion 28 is applied with a biasing force toward the outer diameter side of the pin barrel portion 27 by a member that biases the pin barrel portion 27. It is the structure supported by. In the center pin 20, a cylindrical opening / closing pin 25 is provided inside the pin body portion 27. The opening / closing pin 25 is formed with a reduced diameter portion 23 having a smaller diameter than the other part of the peripheral surface, and is formed above the reduced diameter portion 23 via the tapered portion 22, and the reduced diameter portion A tip 21 having a diameter larger than 23 is formed. The lower end of the open / close pin 25 is connected to driving means such as a cylinder for moving the open / close pin 25 up and down as indicated by arrows in FIG. 2 inside the pin body 27 of the center pin 20. Yes.

  The chuck lever 26 has an engaging portion 24 formed at the lower end portion located below the support shaft portion 28 so that at least a part thereof enters the inner side of the pin body portion 27. The chuck lever 26 is provided so that the engaging portion 24 is in contact with or close to the peripheral surface of the opening / closing pin 25.

  When the engaging portion 24 at the lower end of the chuck lever 26 is brought into contact with or close to the outer peripheral side of the reduced diameter portion 23 on the peripheral surface of the opening / closing pin 25, the portion above the support shaft portion 28 of the chuck lever 26 is The biasing force of the member that biases the pin body portion 27 is allowed to rotate around the support shaft portion 28, and the portion above the support shaft portion 28 of the chuck lever 26 is positioned radially outward of the pin body portion 27. Protruding. Thus, the chuck lever 26 is opened. When the chuck lever 26 is open, the upper substrate 32 inserted through the center pin 20 is held on the chuck lever 26.

  On the other hand, when the open / close pin 25 is moved downward with respect to the pin body portion 27, the position of the engagement portion 24 of the chuck lever 26 moves to the position of the reduced diameter portion 23 as the position of the reduced diameter portion 23 also moves downward. Relative movement from the outer peripheral side to the outer peripheral side of the tip portion 21 via the tapered portion 22. Then, the engaging portion 24 abuts on the distal end portion 21 having a diameter larger than that of the reduced diameter portion 23 in the opening / closing pin 25, whereby the lower end portion of the chuck lever 26 is rotated around the support shaft portion 28 by the urging force. The portion of the chuck lever 26 above the support shaft portion 28 is close to the pin body portion 27. Thus, the chuck lever 26 is closed. When the chuck lever 26 is in the closed state, the diameter of the center pin 26 is smaller than the diameter of the central opening of the optical disk 31.

  Also, since the center opening is inserted into the center pin 20 and the upper substrate 32 and the lower substrate 34 held by the support overlap each other in a vacuum state, the optical disk substrate bonding apparatus 10 according to this embodiment includes the vacuum chamber 11. It has.

  The vacuum chamber 11 is a rigid body having an internal space, and is a metal member having a substantially cylindrical shape. The lower part of the vacuum chamber 11 is open and has a lower opening. The diameter of the lower opening is larger than the diameter of the optical disc 31. The vacuum chamber 11 is movable in the vertical direction. When the vacuum chamber 11 is lowered, the vacuum chamber 11 comes into contact with the support surface 37a, and the space inside the vacuum chamber 11 becomes a sealed space.

  A vacuum suction device 14 is connected to the vacuum chamber 11, and when the internal space of the vacuum chamber 11 becomes a sealed space, the vacuum suction device 14 sucks air in the internal space and creates a vacuum state. Device.

  A pressing mechanism is provided inside the vacuum chamber 11. The pressing mechanism includes a pressing member 13 that presses the optical disk 31 placed on the support base 37, and an engagement release pin 12 that presses the opening / closing pin 25 inside the pin body portion 27 provided in the center pin 20. The pressing member 13 and the drive unit that drives the operation of the disengagement pin 12 are configured.

  The pressing member 13 has a longitudinal dimension along the vertical direction and is bent in the middle. The bent portion is parallel to the optical disc 31 placed on the support base 37. The pressing member 13 is driven in the vertical direction by the driving unit, and presses the optical disc 31 placed on the support base 37. Moreover, it is preferable that there are two or more pressing members 13 (two in this embodiment), and the plurality of pressing members 13 are driven in synchronization.

  The disengagement pin 12 has a substantially cylindrical shape, and the diameter of the disengagement pin 12 is smaller than the inner diameter of the pin body portion 27. The disengagement pin 12 driven downward by the drive unit is inserted into the pin body 27. The inserted disengagement pin 12 abuts on the distal end portion 21 of the open / close pin 25, the disengagement pin 12 is driven further downward by the drive portion, and the disengagement pin 12 presses the distal end portion 21 of the open / close pin 25. To do. The open / close pin 25 pressed on the tip 21 moves downward. Then, as described above, the chuck lever 26 is in a closed state.

  Next, an operation when the upper substrate 32 and the lower substrate 34 are bonded by the optical disk substrate bonding apparatus 10 of the present embodiment will be described with reference to FIGS. As shown in FIG. 2, the lower substrate 34 with the surface to which the energy ray curable resin 33 having a uniform thickness is applied facing upward is inserted through the center pin 20 and placed on the support surface 37a.

  When the opening / closing pin 25 is moved upward, a portion of the chuck lever 26 above the support shaft portion 28 protrudes radially outward of the pin body portion 27, and the chuck lever 26 is in an open state. The upper substrate 32 is inserted through the center pin 20 and is held in parallel with the lower substrate 34 on the chuck lever 26 in the open state.

  The vacuum chamber 11 is lowered in a state where the upper substrate 32 and the lower substrate 34 placed on the support surface 37a are parallel and separated from each other. The vacuum chamber 11 contacts the support surface 37a, and the space inside the vacuum chamber 11 becomes a sealed space. Thereafter, the sealed space inside the vacuum chamber 11 is vacuumed by the vacuum suction device 14.

  FIG. 3 is a diagram for explaining the operation of the center pin 20 of the present embodiment. After the sealed space inside the vacuum chamber 11 is evacuated, the engagement release pin 12 of the pressing mechanism is driven downward, and the chuck lever 26 is closed. Since the diameter of the center pin 20 is smaller than the diameter of the central opening of the optical disk 31, the upper substrate 32 held on the chuck lever 26 is lowered while maintaining a parallel state with the lower substrate 34, and energy beam curing is performed. It overlaps with the lower substrate 34 to which the resin 33 is applied. Since the upper substrate 32 and the lower substrate 34 overlap in a vacuum state, no bubbles are mixed between the upper substrate 32 and the lower substrate 34.

  FIG. 4 is a diagram for explaining the operation of the pressing member 13 of this embodiment. The pressing member 13 is driven downward toward the upper substrate 32 and the lower substrate 34 superimposed in a vacuum state. The driven pressing member 13 presses the upper substrate 32, and the pressed upper substrate 32 presses the lower substrate 34 to which the energy beam curable resin 33 is applied. The pressed lower substrate 34 presses the support base 37 and receives a repulsive force from the support base 37. The upper substrate 32 is pressed vertically downward by the pressing member 13, and the lower substrate 34 receives a repulsive force vertically upward from the support base 37, so that the upper substrate 32 and the lower substrate 34 sandwich the energy beam curable resin 33. In close contact. At this time, the thickness of the energy beam curable resin 33 is approximately 20 μm to 50 μm.

  FIG. 5 is a diagram for explaining an operation when pressurized air is sent between the lower substrate 34 and the support base 37 that are in close contact with each other according to this embodiment. After the upper substrate 32 and the lower substrate 34 are brought into close contact with each other in a vacuum state, the vacuum chamber 11 is raised and the inside of the vacuum chamber 11 is opened to the atmosphere. Even when the inside of the vacuum chamber 11 is opened to the atmosphere, the state in which the upper substrate 32 and the lower substrate 34 are in close contact with each other is maintained, and bubbles are not mixed between the upper substrate 32 and the lower substrate 34.

  After the inside of the vacuum chamber 11 is opened to the atmosphere, the lower substrate 34 is separated from the support base 37. As a means for separating, in this embodiment, pressurized air is supplied between the lower substrate 34 and the support base 37. Specifically, pressurized air sent from an air pump 36 (not shown) passes through a path in the support base 37 and is supplied from a vent hole 35 provided in the support surface 37a.

  A predetermined amount of pressurized air supplied from the vent hole 35 forms a gap between the lower substrate 34 and the support base 37. Due to the gap, the lower substrate 34 is separated from the support base 37.

  In the present embodiment, the step of opening the interior of the vacuum chamber 11 to the atmosphere is the step of separating the lower substrate 34 from the support base 37, but the step of separating the lower substrate 34 from the support base 37. The process of opening the inside of the vacuum chamber 11 to the atmosphere may be performed.

  FIG. 6 is a diagram for explaining the operation of the energy beam irradiator 29 according to the present embodiment. By rotating the turntable, the circumferential position of the support base 37 on which the upper substrate 32 and the lower substrate 34 that are in close contact with each other with the energy beam curable resin 33 interposed therebetween is changed, and the energy beam is placed below the support base 37. It moves to a position where the irradiator 29 is provided. The energy beam irradiator 29 is a device capable of irradiating the energy beam toward the support base 37 and curing the energy beam curable resin 33.

  An energy beam is irradiated from an energy beam irradiator 29 provided below the support base 37 toward the energy beam curable resin 33 between the upper substrate 32 and the lower substrate 34. The irradiated energy rays pass through the support base 37 having excellent light transmittance, and the energy ray curable resin 33 is cured. Since the lower substrate 34 also contracts as the energy beam curable resin 33 cures and contracts, no difference in contraction occurs between the energy beam curable resin 33 and the lower substrate 34. The upper substrate 32 and the lower substrate 34 can be bonded together without the surface of the optical disk substrate 31 being distorted.

  FIG. 7 is a diagram showing the configuration of the second embodiment of the optical disk substrate bonding apparatus 30 according to the present invention. In the embodiments described below, members having the same configuration / action as the members already described are denoted by the same or corresponding reference numerals in the drawings, and description thereof is simplified or omitted.

  The optical disk substrate bonding apparatus 30 according to the present embodiment includes a protruding member 41 that is provided on the support base 37 and can be moved forward and backward as means for separating the lower substrate 34 from the support base 37. The protruding member 41 has a substantially cylindrical shape, and preferably includes three or more (four in this embodiment).

  FIG. 8 is a diagram showing the configuration of the optical disk substrate bonding apparatus 30 when the vacuum chamber 11 is brought into a vacuum state according to the present embodiment. As shown in the figure, when the optical disk substrate 31 is placed on the support base 37, the protruding member 41 is in a position covered with the lower substrate 34.

  A drive member 42 is provided below the protruding member 41 and is in contact with the lower surface of the protruding member 41. The drive member 42 can drive the protrusion member 41 vertically upward, and for example, a piezoelectric element or the like is used. When the drive member 42 does not drive the protruding member 41, the protruding end of the protruding member 41 is at the same height as the support surface 37a or lower. When the drive member 42 drives the protrusion member 41, the protrusion member 41 is driven vertically upward to press the lower substrate 34.

  Next, an operation when the upper substrate 32 and the lower substrate 34 are bonded using the optical disk substrate bonding apparatus 30 of the present embodiment will be described with reference to FIGS.

  As shown in FIG. 8, the vacuum chamber 11 is lowered in a state where the upper substrate 32 and the lower substrate 34 placed on the support surface 37a are parallel and separated from each other, and the sealed space inside the vacuum chamber 11 is evacuated to a vacuum suction device. Vacuum at 14.

  FIG. 9 is a diagram for explaining the operation of the center pin 20 of the present embodiment. After the sealed space inside the vacuum chamber 11 is evacuated, the upper substrate 32 held on the chuck lever 26 and the lower substrate 34 coated with the energy beam curable resin 33 are overlapped.

  FIG. 10 is a diagram for explaining the operation of the pressing member 13 of the present embodiment. The upper substrate 32 and the lower substrate 34 overlapped in a vacuum state are brought into close contact with the pressing member 13.

  FIG. 11 is a diagram for explaining an operation when pushing out the protruding member 41 according to the present embodiment. After the upper substrate 32 and the lower substrate 34 are brought into close contact with each other in a vacuum state, the vacuum chamber 11 is raised and the inside of the vacuum chamber 11 is opened to the atmosphere.

  After the inside of the vacuum chamber 11 is opened to the atmosphere, the lower substrate 34 is separated from the support base 37. As a means for separating, in this embodiment, the protruding member 41 pushes the lower substrate 34 up from the support base 37. Specifically, the drive member 42 provided directly below the protrusion member 41 drives the protrusion member 41 vertically upward. The protruding member 41 can be pushed up from the support table 37 by being driven with a force larger than the adhesion force generated between the lower substrate 34 and the support table 37.

  In the present embodiment, the step of opening the interior of the vacuum chamber 11 to the atmosphere is the step of separating the lower substrate 34 from the support base 37, but the step of separating the lower substrate 34 from the support base 37. The process of opening the inside of the vacuum chamber 11 to the atmosphere may be performed.

  FIG. 12 is a diagram for explaining the operation of the energy beam irradiator 29 according to the present embodiment. After moving to a position where the energy beam irradiator 29 is provided below the support base 37, the pushed-up protruding member 41 is returned to the original position, and the energy beam curable resin 33 between the upper substrate 32 and the lower substrate 34 is applied. The energy beam is irradiated from an energy beam irradiator 29 provided below the support 37. The irradiated energy rays pass through the support 37 and harden the energy ray curable resin 33.

  As the energy beam curable resin 33 is cured and contracted, the lower substrate 34 is also contracted, so that there is no difference in contraction between the energy beam curable resin 33 and the lower substrate 34. The upper substrate 32 and the lower substrate 34 can be bonded together without the surface of the optical disk substrate 31 being distorted.

  The first embodiment of the optical disk substrate bonding method according to the present invention can be suitably implemented by using the optical disk substrate bonding apparatus 10 shown in FIG. That is, the step of holding the lower substrate 34 and the upper substrate 32 coated with the energy beam curable resin 33 in a state of being parallel and separated from each other, the step of vacuum-suctioning the vacuum chamber 11, and the support substrate 37. Before irradiating the energy beam, including a step of pressing to the lower substrate 34, a step of opening the vacuum chamber 11 to the atmosphere, and a step of irradiating the energy beam toward the energy beam curable resin 33. If the process of sending pressurized air between the lower substrate 34 and the support base 37 is performed, the state where the lower substrate 34 is stuck to the support base 37 is released, and the energy ray curable resin 33 is cured and contracted. Therefore, the lower substrate 34 also contracts, so that no difference in contraction occurs between the energy ray curable resin 33 and the lower substrate 34, thereby preventing the surface of the optical disk substrate from being distorted.

When the optical disk substrate bonding apparatus 30 shown in FIG. 7 is used in the above optical disk substrate bonding method, the protruding member 41 pushes up the lower substrate 34 to separate the lower substrate 34 from the support base 37. can do. By so doing, the close contact state between the lower substrate 34 and the support base 37 can be reliably released.
The present invention is not limited to the above-described embodiment, and appropriate modifications and improvements can be made.

It is a figure showing the structure of the bonding apparatus of the board | substrate for optical disks based on the 1st Embodiment of this invention. It is a figure explaining operation | movement when making a vacuum chamber into a vacuum state based on the 1st Embodiment of this invention. It is a figure explaining operation | movement of the center pin based on the 1st Embodiment of this invention. It is a figure explaining the operation | movement when the upper side board | substrate and the lower side board | substrate are piled up based on the 1st Embodiment of this invention. It is a figure explaining operation | movement when sending pressurized air between the lower board | substrate and the support stand based on the 1st Embodiment of this invention. It is a figure explaining operation | movement of the energy-beam irradiator based on the 1st Embodiment of this invention. It is a figure showing the structure of the bonding apparatus of the board | substrate for optical disks based on the 2nd Embodiment of this invention. It is a figure explaining operation | movement when making a vacuum chamber into a vacuum state based on the 2nd Embodiment of this invention. It is a figure explaining operation | movement of the center pin based on the 2nd Embodiment of this invention. It is a figure explaining the operation | movement when the upper side board | substrate and the lower side board | substrate are piled up based on the 2nd Embodiment of this invention. It is a figure explaining the operation | movement when pushing out the protrusion member based on the 2nd Embodiment of this invention. It is a figure explaining operation | movement of the energy-beam irradiator based on the 2nd Embodiment of this invention. It is a schematic diagram of a conventional optical disk substrate bonding apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Optical disk substrate bonding apparatus 20 Center pin 31 Optical disk substrate 32 Upper substrate 33 Energy beam curable resin 34 Lower substrate 35 Vent hole 36 Air pump 37 Support base 37a Support surface

Claims (6)

A method for laminating a substrate for an optical disk by laminating a lower substrate and an upper substrate to which an energy ray curable resin is applied,
Holding the lower substrate and the upper substrate coated with the energy beam curable resin in parallel and apart from each other;
Vacuuming the vacuum chamber;
A step of pressing the upper substrate toward the support base and closely contacting the lower substrate;
Opening the vacuum chamber to the atmosphere;
Irradiating energy rays toward the energy ray curable resin,
A method for bonding optical disk substrates, comprising: a separation step of separating the lower substrate from the support base before irradiating the energy beam.   2. The method for bonding optical disk substrates according to claim 1, wherein pressurized air is sent between the lower substrate and the support base.   2. The method for laminating a substrate for an optical disk according to claim 1, wherein a protrusion member is provided on the support base, and the protrusion member pushes up the lower substrate from the support base. An apparatus for laminating a substrate for an optical disk for laminating an upper substrate and a lower substrate coated with an energy ray curable resin,
A vacuum chamber capable of accommodating the lower substrate and the upper substrate held in parallel and apart from each other;
A vacuum suction device for creating a vacuum atmosphere inside the vacuum chamber;
A support base for placing the lower substrate on a support surface;
A pressing member that presses the upper substrate toward the support; and
An energy beam irradiator that irradiates energy beams toward the energy beam curable resin;
A bonding apparatus for an optical disk substrate, comprising: a separating unit that separates the lower substrate from the support before the energy beam is irradiated.   5. The optical disk according to claim 4, wherein the separating means is a vent hole provided so as to open to the support surface and supplying pressurized air between the lower substrate and the support base. Substrate bonding device.   5. The optical disk substrate bonding apparatus according to claim 4, wherein the separating means is a protruding member provided on the support base and capable of moving forward and backward.

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