JP3589521B2 - Method of spreading adhesive on storage disk - Google Patents

Method of spreading adhesive on storage disk Download PDF

Info

Publication number
JP3589521B2
JP3589521B2 JP07807996A JP7807996A JP3589521B2 JP 3589521 B2 JP3589521 B2 JP 3589521B2 JP 07807996 A JP07807996 A JP 07807996A JP 7807996 A JP7807996 A JP 7807996A JP 3589521 B2 JP3589521 B2 JP 3589521B2
Authority
JP
Japan
Prior art keywords
circular resin
adhesive
resin substrate
boss
extension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP07807996A
Other languages
Japanese (ja)
Other versions
JPH09245386A (en
Inventor
正美 井内
Original Assignee
日本政策投資銀行
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本政策投資銀行 filed Critical 日本政策投資銀行
Priority to JP07807996A priority Critical patent/JP3589521B2/en
Publication of JPH09245386A publication Critical patent/JPH09245386A/en
Application granted granted Critical
Publication of JP3589521B2 publication Critical patent/JP3589521B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1477—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
    • B29C65/1483—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003—Records or discs
    • B29L2017/005—CD''s, DVD''s

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Description

【０００１】
【発明の属する利用分野】
この発明は、記憶ディスクの貼り合わせ技術に関するものであり、更に詳しくは、中心穴を有する２枚の円形樹脂基板の間に接着剤を介在させてなる記憶ディスクにおいて該接着剤を回転保持台上で延展する方法に関するものである。
【０００２】
【従来の技術】
近年、コンピュータ、取り分けパソコン等の普及は目ざましく、それに使用する記憶媒体、特に、記憶ディスクの容量は益々高密度化しており、その種類も多くなってきている。
記憶ディスクとしては、例えば、磁気ディスク、光ディスク（例えば、ＣＤ−ＲＯＭ）、光磁気ディスク（例えば、ＭＯ）等があるが、その中でも、最近、光ディスクの需要が増大している。
【０００３】
ＤＶＤと呼ばれる光ディスクを例にとっていうと、それを構成する単板である円形樹脂基板は、その厚みが０．６ｍｍ、外形が１２０ｍｍ、その中心穴の内径が１５ｍｍ、と規格されている。
このような薄い円形樹脂基板一枚では機械的強度が低くまた変形もし易いため、同じ厚み（０．６ｍｍ）の円形樹脂基板を合体し貼り合わせて合体することにより使用される。
例えば、図７は、２枚の円形樹脂基板（第１円形樹脂基板２と第２円形樹脂基板１Ｄ）を貼り合わせた状態の光ディスクであるＤＶＤを概略的に示す。
【０００４】
そして（ａ）は、情報信号が一方の円形樹脂基板に印加されているもの、また（ｂ）は、両方の円形樹脂基板に印加されているものを示す。
このようにして２枚の円形樹脂基板Ｄ１、Ｄ２が貼り合わされた光ディスクＤは、レーザビームを使って反射膜Ｄ１１から反射される光を図示しない光検出器等で受光して信号を再生するものである。
このように ＤＶＤ等の光ディスクも含めて高密度の記憶ディスクの多くは、単板ではなく上記のような合板構造として使用されるので、製造する上で第１円形樹脂基板Ｄ１と第２円形樹脂基板Ｄ２の貼り合わせが当然必要となる。
【０００５】
単板を貼り合わせて一体の記憶ディスク（即ちここでは光ディスク）にするために、次の一連の工程が行なわれる（図８参照）。
（１）回転保持台Ｃに第１円形樹脂基板Ｄ１を載置する工程
この工程（１）では、信号面に反射膜ならびに保護膜をコーティングした第１円形樹脂基板Ｄ１が、回転保持台Ｃ上に均等に吸着保持される。
【０００６】
（２）第１円形樹脂基板Ｄ１に接着剤Ｒを塗布する工程
この工程（２）では、第１円形樹脂基板Ｄ１を載置した回転保持台Ｃを低速回転させながら、吐出ノズルＮより接着剤Ｒ、例えば紫外線硬化樹脂を静かに吐出させる。
尚、吐出する接着剤Ｒは、吐出ノズルＮの移動の仕方により第１円形樹脂基板Ｄ１の上に吐出される軌跡は異なるが、例えば、図のようにドーナツ状軌跡として形成することが好ましい。
【０００７】
（３）第１円形樹脂基板Ｄ１に第２円形樹脂基板Ｄ２を載置して重ね合わせるせる工程
この工程（３）では、接着剤Ｒが塗布された第１円形樹脂基板Ｄ１の上に（透明の）第２円形樹脂基板Ｄ２が載置される。
ここでの第２円形樹脂基板Ｄ２は、情報信号が印加されてない透明なもの、又は情報信号が印加されてたもの（この場合、反射膜を有するので、通常、透明ではない）がある。
【０００８】
（４）両円形樹脂基板Ｄ１，Ｄ２の間に介在する接着剤Ｒを延展する工程
次にこの工程（４）では、両円形樹脂基板Ｄ１、Ｄ２間に介在する接着剤Ｒが満遍なく均等に行き渡るように延展が行なわれる。
この延展は、２枚の円形樹脂基板Ｄ１、Ｄ２が合体した合体円形樹脂基板、即ち光ディスクＤが載置された状態において、回転保持台Ｃを高速回転（通常、回転数は数千ｒｐｍ以上、回転時間は数秒程度）させることで行なう。
この回転により、重ね合わされた両円形樹脂基板Ｄ１、Ｄ２間に存在する余分な接着剤Ｒは延展と共に外に放出され、同時に両円形樹脂基板Ｄ１、Ｄ２間に閉じ込まれた空気（空気の泡等）は外に排出される。
【０００９】
（５）延展された接着剤Ｒを硬化する工程
この工程（５）では、貼り合わされ一体となった第１円形樹脂基板Ｄ１と第２円形樹脂基板Ｄ２を回転（例えば、６０ｒｐｍ程度）させた状態又は回転しない状態で、紫外線を照射させ接着剤Ｒ、例えば、紫外線硬化樹脂層を硬化させる。具体的には、背面に反射鏡を有する紫外線光源体Ｌを照射させて、効率よく硬化がなされる。
尚、硬化工程は、使用する接着剤Ｒの種類により異なるもので、使用する接着剤Ｒの特性に合致した硬化方法が採用されることは言うまでもない。
以上のようにして貼り合わせ工程が終了する。
【００１０】
ところで、上記貼り合わせ工程のうち工程４の延展工程は、接着剤Ｒを満遍なく均一に行き渡らせるところであり、全工程の中でも極めて重要な工程に位置する。
ここで、記憶ディスクが第１円形樹脂基板Ｄ１と第２円形樹脂基板Ｄ２との両方に情報信号が記録されている規格のものについて言うと、記憶ディスクから出力する場合、一方向から光線を当て信号を読み取る方式（例えば、デュアルレイヤーＤＶＤに使用されている規格の記憶ディスク読み取り手法の場合がこれに相当する）、及び両方向から光線を当てて読み取る方式（シングルレイヤー，ダブルサムディッド）の２通りの方式がある。
【００１１】
このうち前者においては、第１円形樹脂基板Ｄ１と第２円形樹脂基板Ｄ２と間にズレがあると印加された情報の正確な読み取りはできない。
図１に、２枚の円形樹脂基板が、ズレが生じた状態の場合を示すが、このようにズレた状態においては、印加された記録情報にも両者間にズレが生じ、それがそのまま貼り合わされると、一方方向からの読み取り方式では正確な読み取りができないのである。
因みに、デュアルレイヤーＤＶＤの規格においては、欠陥商品とならないよう、例えば、両者のズレが１５ミクロン以内に収まることが望ましい。
【００１２】
このようなズレは、上記第３工程において、回転保持台の第１円形樹脂基板Ｄ１の上に第２円形樹脂基板Ｄ２を重ね合わせる段階で発生する。
従って、次に行われる延展工程では、両円形樹脂基板がズレて重ね合わされた状態のまま回転保持台上で接着剤Ｒの延展が行われることになる。
延展工程では、回転保持台のボス体が、両円形樹脂基板の中心穴に挿入されて両円形樹脂基板の位置決めが一応なされるが、ボス体Ａの外径と円形樹脂基板の中心穴の径とは、円形樹脂基板の出し入れのために多少差を設けており、ボス体Ａにより両樹脂基板間の微細なズレを修正することはできない。
【００１３】
従って、延展が終了した後でも このズレは修正がなされずそのまま残った状態となる。
延展工程の後、接着剤の硬化がなされるのであるが、このようにズレが生じたまま、硬化されると、ズレはそのまま固定してしまって結果的に製品に残ることになる。
以上のようなことから、少なくとも延展時にこのようなズレを極力排除してしまうことが要請されていた。
しかしながら、未だそれに対する決定的な解決策は提案されていない。
【００１４】
【発明が解決しようとする課題】
本発明は、上記のような背景のもとで問題点の解決を図ったものである。
即ち、本発明の目的は、記憶ディスクの２枚の円形樹脂基板の貼り合わせ技術において、延展段階で２枚の円形樹脂基板のズレを排除する方法を提供することを目的とするものである。
【００１５】
【課題を解決するための手段】
しかして、本発明者等はこのような課題に対して、鋭意研究を重ねた結果、延展時において中心穴に外方に押圧力を加えることにより、上下重なった２枚の円形樹脂基板間のズレが修正されることを見出した。
そしてこの知見により本発明を完成させるに至ったものである。
【００１６】
即ち、本発明は、（１）、中心穴を有する２枚の円形樹脂基板の間に接着剤を介在させてなる記憶ディスクにおいて該記憶ディスクを回転させて接着剤を延展する方法であって、延展の際、記憶ディスクの中心穴から外方に押圧力を加えることにより両円形樹脂基板の中心穴を同芯化するようにした延展方法において、外方に加える押圧力は、回転保持台に取り付けられ上記中心穴に挿入されたボス体の遠心力を利用した拡張により行われる延展方法に存する。
【００１７】
そして、（２）、ボス体からの接着剤の吸引を更に行なう上記（１）記載の延展方法に存する。
【００１８】
【作用】
上記のような延展方法を採用することで、延展時、中心穴に外向きの力が加わり２枚の円形樹脂基板の相互のズレは確実に修正される。
【００１９】
【発明の実施の形態】
先ず本発明の延展方法に供される延展装置について述べる。
図２は、延展装置を概略的に示すもので、該延展装置は円板状の回転保持台Ｘとその周りに配置される飛散防止手段Ｙを備える。
接着剤Ｒを介して重ね合わされた両円形樹脂基板Ｄ１，Ｄ２は、鎖線で示すごとく、回転保持台Ｘの上面に載置される。
この回転保持台Ｘの上面には、円形樹脂基板を吸着するための図示しない吸着穴が多数設けられており、所定の吸着制御がなされる。
【００２０】
回転保持台Ｘ上の中心部にはボス体Ａが設けられており、このボス体Ａは、回転保持台Ｘに装着自在となっている。
このボス体Ａは回転保持台Ｘの上に嵌め外し自在に取り付けられるが、回転保持台Ｘと一体に固定してもよい。
回転保持台Ｘは、図示しない原動機を含む駆動装置により高速回転するように制御されている。
一方、回転保持台Ｘの周りには、円形ドーム形状をしたカバーである飛散防止手段Ｙが設けられている。
【００２１】
この飛散防止手段Ｙは、延展の際、両円形樹脂基板から外方に放出される接着剤Ｒを受け止めて、その飛散を防止するためのものである。
尚、飛散防止手段Ｙについては、その詳しい説明を省略する。
本発明の延展方法においては、円形樹脂基板の中心穴ＤＨを押圧することがキーポイントである。
この押圧力を加える手段としてボス体Ａが使用されるので、その使用されるボス体の構造について述べる。
【００２２】
図３は、ボス体Ａ１の構造を概略的に示したものである。
このボス体Ａ１は、回転保持台上の中心部に取り付けられるもので、円形樹脂基板Ｄ１，Ｄ２の中心穴ＤＨに出し入れができる外径を有する。
ボス体Ａ２の外側には、周囲数カ所に拡張部材である開閉翼１１が設けられている。
この開閉翼１１は、上部のピン軸１２を支点として下方が外方に起立することができ、ボス体Ａ１の溝に対して出没自在となっている。
【００２３】
回転保持台Ｘが回転することにより、即ちボス体Ａ１が回転することにより、開閉翼１１には、遠心力が加わって、上部を支点として下方が外方に起立しボス表面から突出する。
この突出した開閉翼１１は、後述するように２枚の円形樹脂基板の中心穴ＤＨを押圧して両円形樹脂基板の相互のズレを修正するように作用する。
因みに、ボス体Ａ１に設けられた開閉翼１１の数は、両円形樹脂基板の中心穴ＤＨのズレを除去して同芯化するためには、少なくとも、３か所に設けることが好ましい。
【００２４】
また、ボス体Ａ１の周囲には、吸引溝Ｐが開口されており、この吸引溝Ｐは、接着剤Ｒを吸引する機能を有する。
延展工程において、中心方向にも接着剤Ｒが十分延展するように、ボス体Ａから円形樹脂基板間の接着剤Ｒを吸引して、中心方向に引き込むことが必要で、吸引溝Ｐはその吸引のために設けられている。
吸引溝Ｐは図示しないボス内部の通路を通って回転保持台から外部の制御された吸引源に通じており、延展の際に吸引作用が行なわれる。
尚、この吸引溝を有するボス体については、発明者等は、既に出願済である。吸引溝Ｐはボス内部を通り回転保持台Ｘの図示しない吸引源につながって吸引制御される。
【００２５】
次ぎに図３のボス体Ａ１を備えた回転保持台Ｘを使った延展方法を述べる。
先ず、延展に先だって、静止した回転保持台Ｘの第１円形樹脂基板Ｄ１の上に接着剤Ｒを介して第２円形樹脂基板Ｄ２が載置される〔図８（工程３）参照〕。この場合、第１円形樹脂基板Ｄ１と第２円形樹脂基板Ｄ２とが相互にズレた状態にあるものとする（図４（ａ）参照）。
この後、回転保持台Ｘが回転され、第１円形樹脂基板Ｄ１と第２円形樹脂基板Ｄ２との間に介在する接着剤Ｒは、遠心力により外方に放出されながらディスク全体に均一に延展される。
【００２６】
この回転保持台Ｘの回転により、ボス体Ａ１の開閉翼１１が、遠心力により外方に開き、両円形樹脂基板の中心穴端面に圧力を加える、即ち中心穴ＤＨを押圧するのである。
この開閉翼１１は、ボス体Ａ１の周囲に間隔を開けて数個設けられているため、外方に全部が開くことで、数カ所から均等に中心穴端面を押圧することができる。
開閉翼１１が少なくとも３カ所にあれば、２枚の円形樹脂基板は確実に同芯化される。
この押圧力により、先程の第１円形樹脂基板Ｄ１と第２円形樹脂基板Ｄ２とのズレは修正され全く無くなる。
【００２７】
図４（ｂ）は、その２枚の円形樹脂基板のズレが修正されて両者が同芯化された状態を示す。
回転保持台Ｘの回転を止めることにより、延展は終了し、２枚の円形樹脂基板のズレは解消された状態となる。
尚、以上のように行なわれる延展の際、ボス体の吸引溝から同時に吸引が行なわれる。
この延展が終了した後、接着剤Ｒの硬化が行われる。
【００２８】
図５は、別の異なったボス体Ａ２の例を示したものである。
このボス体Ａ２の外側には、周囲数カ所に、拡張部材である膨張膜２１が設けられている。
この膨張膜２１は、空気等の流体圧により膨張するもので、図のように周囲に少なくとも３カ所設けると好適である。
ボス体Ａ２の内部は一部断面で示すように、流体の通路２２が設けられており図示しない制御された圧力源に通じている。
先述した図３のようなボス体Ａ１の延展の際の回転力を利用したものではなく、膨張膜２１の拡張は流体圧を利用したもので、通路２２を介して流体圧を加えることにより膨張膜２１を外方に拡張させることができる。
尚、このボス体Ａ２にも、先述の図３のボス体Ａ１と同じように、ボス体Ａ２の周囲には、接着剤Ｒを吸引する機能を有する吸引溝Ｐが開口されている。
【００２９】
次ぎに図５のボス体Ａ２を備えた回転保持台Ｘを使った延展方法を述べる。
先ず、延展に先だって、静止した回転保持台Ｘの第１円形樹脂基板Ｄ１の上に接着剤Ｒを介して第２円形樹脂基板Ｄ２が載置される〔図８（工程３）参照〕。この場合、第１円形樹脂基板Ｄ１と第２円形樹脂基板Ｄ２とが相互にズレた状態にあるものとする（図６（ａ）参照）。
この後、回転保持台Ｘが回転され、第１円形樹脂基板Ｄ１と第２円形樹脂基板Ｄ２との間に介在する接着剤Ｒは、遠心力により外方に放出されながら、記憶ディスクＤ全体に均一に延展される。
【００３０】
ここで、回転保持台Ｘの回転が始まると同時に、又はやや遅れて圧力源を作動し膨張膜２１を加圧する。
この加圧により膨張膜２１は膨張し、両円形樹脂基板の中心穴端面に圧力を加える、即ち中心穴ＤＨを押圧する。
この膨張膜２１は、ボス体Ａ２の周囲に等間隔を開けて数個設けられているため、外方に全部が膨張することで均等に中心穴端面を押圧することができる。
膨張膜２１が少なくとも３カ所にあれば、２枚の円形樹脂基板は確実に同芯化される。
【００３１】
この押圧力により、先程の第１円形樹脂基板Ｄ１と第２円形樹脂基板Ｄ２とのズレは修正され皆無となる。
図６（ｂ）は、その２枚の円形樹脂基板のズレが修正されて両者が同芯化された状態を示す。
回転保持台Ｘの回転を止め、同時又はやや遅れて加圧源を停止することで膨張膜２１は元の位置に戻る。
ここで、延展は終了し、２枚の円形樹脂基板のズレは解消された状態となる。尚、以上のように行なわれる延展の際、ボス体の吸引溝Ｐから同時に吸引が行なわれる。
【００３２】
この延展が終了した後、接着剤Ｒの硬化が行われる。
図４に示ような遠心力を使って開閉する開閉翼１１を備えたボス体Ａ１の場合と異なって、回転保持台Ｘの回転に依存しないため、膨張膜２１の加圧タイミングを調整することができる。
従って、中心穴端面を押圧する時期に自由度が出るため、膨張膜２１の拡張時を延展の最初の時期に集中して行うようなことも可能となる。
【００３３】
以上、本発明を述べてきたが、本発明は実施の形態にのみ限定されるものではなく、その本質から逸脱しない範囲で、他の色々な変形例が可能であることはいうまでもない。
例えば、本発明のボス体Ａの拡張は、流体圧、遠心力を利用したものを示したが、磁反力を利用したものや、電気を利用したもの等も当然採用される。
ボス体Ａの拡張は少なくとも、中心穴端面に圧力を加えて２枚の円形樹脂基板のズレを修正することができるものであればよい。
【００３４】
【発明の効果】
記憶ディスクにおいて、延展された後では、２枚の円形樹脂基板のズレが除去され極めて高品質なものとなる。
ボス体の拡張を利用することから、延展方法を遂行する上で、装備的に大きくならない。
【図面の簡単な説明】
【図１】図１は、２枚の円形樹脂基板のズレを示す図であり、（ａ）は正面図、（ｂ）は、側面断面図である。
【図２】図２は、回転保持台を示す図であり、（ａ）は平面図、（ｂ）は、側面図である。
【図３】図３は、遠心力を利用して拡張するボス体の例を示し、（ａ）は、平面図で、（ｂ）は、側面図である。
【図４】図４は、遠心力を利用して拡張するボス体によるズレの修正原理を示す図であり、（ａ）は、２枚の円形樹脂基板がズレた延展前の状態を、また（ａ）はズレが修正された延展後の状態を示す。
【図５】図５は、膨張力を利用して拡張するボス体の例を示し、（ａ）は、平面図で、（ｂ）は、側面図である。
【図６】図６は、膨張力を利用して拡張するボス体によるズレの修正原理を示す図であり、（ａ）は、２枚の円形樹脂基板がズレた延展前の状態を、また（ａ）は、ズレが修正された延展後の状態を示す。
【図７】図７は、記憶ディスク（光ディスクであるＤＶＤ）を概略的に示す。
【図８】図８は、単板を張り合わせて一体の記憶ディスクにするための一連の工程を概略的に示す。
【符号の説明】
Ａ…ボス体
Ａ１…ボス体
Ａ２…ボス体
１１…開閉翼
１２…ピン軸
２１…膨張膜
２２…通路
Ｄ…記憶ディスク（光ディスク）
Ｄ１…第１円形樹脂基板
Ｄ１１…反射膜
Ｄ２…第２円形樹脂基板
ＤＨ…中心穴
Ｘ…回転保持台
Ｙ…飛散防止手段
Ｐ…吸引溝
Ｌ…紫外線光源体
Ｎ…ノズル
Ｒ…接着剤
Ｔ…ズレ幅[0001]
FIELD OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a storage disk bonding technique, and more particularly, to a storage disk in which an adhesive is interposed between two circular resin substrates having a center hole, the adhesive being mounted on a rotary holding table. It is about the method of extending.
[0002]
[Prior art]
2. Description of the Related Art In recent years, computers, especially personal computers, and the like have been remarkably popularized, and the storage media used for them, particularly storage disks, have been increasing in density and type.
Examples of the storage disk include a magnetic disk, an optical disk (for example, CD-ROM), and a magneto-optical disk (for example, MO). Among them, the demand for optical disks has recently been increasing.
[0003]
Taking an optical disk called a DVD as an example, a circular resin substrate as a single plate constituting the optical disk is standardized to have a thickness of 0.6 mm, an outer diameter of 120 mm, and an inner diameter of a center hole of 15 mm.
Since such a thin circular resin substrate alone has low mechanical strength and is easily deformed, it is used by combining circular resin substrates having the same thickness (0.6 mm) and bonding them together.
For example, FIG. 7 schematically shows a DVD which is an optical disk in a state where two circular resin substrates (a first circular resin substrate 2 and a second circular resin substrate 1D) are bonded together.
[0004]
(A) shows a case where the information signal is applied to one of the circular resin substrates, and (b) shows a case where the information signal is applied to both the circular resin substrates.
The optical disk D on which the two circular resin substrates D1 and D2 are bonded in this manner is a device for reproducing a signal by receiving light reflected from the reflection film D11 with a photodetector (not shown) using a laser beam. It is.
As described above, most of high-density storage disks including optical disks such as DVDs are used not as a single plate but as a plywood structure as described above, so that the first circular resin substrate D1 and the second circular resin Naturally, the bonding of the substrate D2 is required.
[0005]
In order to bond the veneers to form an integrated storage disk (that is, an optical disk here), the following series of steps is performed (see FIG. 8).
(1) Step of Placing First Circular Resin Substrate D1 on Rotation Holder C In this step (1), the first circular resin substrate D1 having a signal surface coated with a reflective film and a protective film is placed on the rotation holder C. Is held evenly by suction.
[0006]
(2) Step of Applying Adhesive R to First Circular Resin Substrate D1 In this step (2), the adhesive is ejected from the discharge nozzle N while the rotation holder C on which the first circular resin substrate D1 is mounted is rotated at a low speed. R, for example, an ultraviolet curable resin is gently discharged.
The trajectory of the adhesive R to be discharged onto the first circular resin substrate D1 differs depending on the manner of movement of the discharge nozzle N. However, for example, it is preferable to form the adhesive R as a donut-shaped trajectory as illustrated.
[0007]
(3) Step of Placing Second Circular Resin Substrate D2 on First Circular Resin Substrate D1 and Overlapping In this step (3), (transparent) is placed on first circular resin substrate D1 on which adhesive R is applied. 2) The second circular resin substrate D2 is placed.
Here, the second circular resin substrate D2 is a transparent substrate to which no information signal is applied, or a substrate to which an information signal is applied (in this case, the substrate is usually not transparent because it has a reflective film).
[0008]
(4) Step of spreading adhesive R interposed between both circular resin substrates D1 and D2 Next, in this step (4), adhesive R interposed between both circular resin substrates D1 and D2 is evenly distributed. The extension is performed as follows.
In this extension, the rotation holding table C is rotated at a high speed (typically, the rotation speed is several thousand rpm, (Rotation time is about several seconds).
By this rotation, the excess adhesive R existing between the superposed circular resin substrates D1 and D2 is discharged to the outside together with the spreading, and at the same time, the air (air bubbles) trapped between the circular resin substrates D1 and D2 is closed. Etc.) are discharged outside.
[0009]
(5) Step of curing the spread adhesive R In this step (5), the first circular resin substrate D1 and the second circular resin substrate D2 that are bonded and integrated are rotated (for example, at about 60 rpm). Alternatively, in a state where the adhesive R is not rotated, the adhesive R, for example, an ultraviolet curable resin layer is cured by irradiating ultraviolet rays. Specifically, curing is performed efficiently by irradiating an ultraviolet light source L having a reflecting mirror on the back surface.
The curing step differs depending on the type of the adhesive R used, and it goes without saying that a curing method that matches the characteristics of the adhesive R used is employed.
The bonding step is completed as described above.
[0010]
By the way, the spreading step of the step 4 in the laminating step is to spread the adhesive R evenly and uniformly, and is positioned as a very important step among all the steps.
Here, regarding a storage disk of a standard in which an information signal is recorded on both the first circular resin substrate D1 and the second circular resin substrate D2, when outputting from the storage disk, a light beam is applied from one direction. A signal reading method (for example, a storage disk reading method of a standard used for a dual-layer DVD corresponds to this method) and a signal reading method using a light beam from both directions (single layer, double thumbed). There is a method.
[0011]
In the former, if the first circular resin substrate D1 and the second circular resin substrate D2 are misaligned, the applied information cannot be accurately read.
FIG. 1 shows a state in which two circular resin substrates are displaced. In such a displaced state, the applied recording information is also displaced between the two, and this is adhered as it is. When combined, accurate reading cannot be performed by a reading method from one direction.
Incidentally, in the standard of the dual layer DVD, it is desirable that the deviation between the two is within 15 microns, for example, so as not to be a defective product.
[0012]
Such a shift occurs in the above-described third step at the stage where the second circular resin substrate D2 is superimposed on the first circular resin substrate D1 of the rotary holding table.
Therefore, in the subsequent spreading step, the adhesive R is spread on the rotary holding table while the two circular resin substrates are shifted and overlapped.
In the extension step, the boss body of the rotary holding table is inserted into the center hole of both circular resin substrates to position the two circular resin substrates temporarily, but the outer diameter of the boss body A and the diameter of the center hole of the circular resin substrate are adjusted. The difference is that a small difference is provided for the insertion and removal of the circular resin substrate, and the boss A cannot correct a minute deviation between the two resin substrates.
[0013]
Therefore, even after the extension has been completed, the deviation remains unchanged without being corrected.
After the extension step, the adhesive is cured. When the adhesive is cured with such a deviation, the deviation is fixed as it is and remains on the product as a result.
In view of the above, there has been a demand for eliminating such a deviation as much as possible at least at the time of extension.
However, no definitive solution has yet been proposed.
[0014]
[Problems to be solved by the invention]
The present invention has been made to solve the problems in the background described above.
That is, an object of the present invention is to provide a method for eliminating a deviation between two circular resin substrates in an extension stage in a bonding technique of two circular resin substrates of a storage disk.
[0015]
[Means for Solving the Problems]
However, the present inventors have conducted intensive studies on such a problem, and as a result, by applying a pressing force outward to the center hole at the time of extension, between the two circular resin substrates vertically stacked. We found that the gap was corrected.
This finding has led to the completion of the present invention.
[0016]
That is, the present invention provides (1) a method of rotating a storage disk and extending the adhesive in a storage disk in which an adhesive is interposed between two circular resin substrates having a center hole, At the time of extension, in the extension method in which the central holes of both circular resin substrates are made concentric by applying a pressing force outward from the central hole of the storage disk, the external pressing force is applied to the rotary holding table. The present invention resides in an extension method performed by expansion using centrifugal force of a boss body attached and inserted into the center hole.
[0017]
(2) The spreading method according to the above (1), wherein the adhesive is further suctioned from the boss body.
[0018]
[Action]
By employing the above-described extension method, an outward force is applied to the center hole during extension, and the mutual displacement between the two circular resin substrates is reliably corrected.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
First, the spreading device used in the spreading method of the present invention will be described.
FIG. 2 schematically shows the spreading device. The spreading device includes a disk-shaped rotation holding base X and scattering prevention means Y disposed around the rotation holding base X.
The two circular resin substrates D1 and D2 superposed via the adhesive R are placed on the upper surface of the rotation holding base X as shown by a chain line.
A large number of suction holes (not shown) for sucking the circular resin substrate are provided on the upper surface of the rotation holding table X, and predetermined suction control is performed.
[0020]
A boss A is provided at the center of the rotation holding base X, and the boss A is attachable to the rotation holding base X.
The boss body A is mounted on the rotation holder X so that it can be fitted and removed freely, but may be fixed integrally with the rotation holder X.
The rotation support X is controlled to rotate at a high speed by a driving device including a motor (not shown).
On the other hand, around the rotation support X, a scattering prevention means Y which is a cover having a circular dome shape is provided.
[0021]
The scattering prevention means Y is for receiving the adhesive R discharged outward from the two circular resin substrates at the time of spreading and preventing the scattering.
The detailed description of the scattering prevention means Y is omitted.
In the spreading method of the present invention, pressing the center hole DH of the circular resin substrate is a key point.
Since the boss A is used as a means for applying the pressing force, the structure of the boss used will be described.
[0022]
FIG. 3 schematically shows the structure of the boss A1.
The boss A1 is attached to the center of the rotation holding table, and has an outer diameter that can be inserted into and removed from the center holes DH of the circular resin substrates D1 and D2.
Outside the boss body A2, an opening / closing wing 11 as an expansion member is provided at several locations around the boss body A2.
The opening / closing wing 11 can stand upright outward with the upper pin shaft 12 as a fulcrum, and can be freely protruded and retracted from the groove of the boss body A1.
[0023]
When the rotation holding table X rotates, that is, when the boss body A1 rotates, centrifugal force is applied to the open / close wing 11, and the lower part stands outward with the upper part as a fulcrum, and protrudes from the boss surface.
The protruding opening / closing wings 11 act to press the center holes DH of the two circular resin substrates and correct the mutual deviation between the two circular resin substrates as described later.
Incidentally, the number of the opening / closing wings 11 provided on the boss body A1 is preferably provided at least at three places in order to remove the misalignment of the center holes DH of the two circular resin substrates and make them concentric.
[0024]
A suction groove P is opened around the boss A1, and the suction groove P has a function of sucking the adhesive R.
In the extending step, it is necessary to suck the adhesive R between the circular resin substrates from the boss body A and draw it in the center direction so that the adhesive R also sufficiently spreads in the center direction. It is provided for.
The suction groove P passes through a passage inside the boss (not shown) from the rotary holding table to an external controlled suction source, and a suction action is performed at the time of extension.
The inventors have already filed an application for the boss having the suction groove. The suction groove P passes through the inside of the boss, and is connected to a suction source (not shown) of the rotation holding table X to perform suction control.
[0025]
Next, an extension method using the rotation holding table X having the boss A1 in FIG. 3 will be described.
First, prior to the extension, the second circular resin substrate D2 is placed on the first circular resin substrate D1 of the stationary rotary holder X via the adhesive R (see FIG. 8 (Step 3)). In this case, it is assumed that the first circular resin substrate D1 and the second circular resin substrate D2 are shifted from each other (see FIG. 4A).
Thereafter, the rotation holder X is rotated, and the adhesive R interposed between the first circular resin substrate D1 and the second circular resin substrate D2 is uniformly spread over the entire disk while being discharged outward by centrifugal force. Is done.
[0026]
By the rotation of the rotation holding table X, the open / close wings 11 of the boss A1 are opened outward by centrifugal force to apply pressure to the end faces of the center holes of the two circular resin substrates, that is, to press the center hole DH.
Since several of these opening / closing wings 11 are provided around the boss body A1 with a space therebetween, the entire opening outwardly allows the center hole end face to be pressed evenly from several places.
If there are at least three open / close wings 11, the two circular resin substrates are surely concentric.
Due to this pressing force, the deviation between the first circular resin substrate D1 and the second circular resin substrate D2 is corrected and completely eliminated.
[0027]
FIG. 4B shows a state in which the deviation between the two circular resin substrates has been corrected and the two have been concentric.
By stopping the rotation of the rotation holding table X, the extension is completed, and the displacement between the two circular resin substrates is eliminated.
During the extension performed as described above, suction is simultaneously performed from the suction grooves of the boss body.
After the extension is completed, the adhesive R is cured.
[0028]
FIG. 5 shows another example of the boss body A2.
On the outer side of the boss A2, expansion films 21 as expansion members are provided at several locations around the boss body A2.
The inflation film 21 is inflated by a fluid pressure of air or the like, and is preferably provided in at least three places as shown in the figure.
As shown in a partial cross section, the inside of the boss body A2 is provided with a fluid passage 22 and communicates with a controlled pressure source (not shown).
The expansion of the inflation film 21 is not performed by using the rotational force at the time of the extension of the boss body A1 as shown in FIG. 3 described above, but is performed by using the fluid pressure, and the expansion is performed by applying the fluid pressure through the passage 22. The membrane 21 can be expanded outward.
The boss A2 also has a suction groove P having a function of sucking the adhesive R around the boss A2, similarly to the boss A1 in FIG.
[0029]
Next, a description will be given of an extension method using the rotation holding table X provided with the boss body A2 in FIG.
First, prior to the extension, the second circular resin substrate D2 is placed on the first circular resin substrate D1 of the stationary rotary holder X via the adhesive R (see FIG. 8 (Step 3)). In this case, it is assumed that the first circular resin substrate D1 and the second circular resin substrate D2 are shifted from each other (see FIG. 6A).
Thereafter, the rotation support X is rotated, and the adhesive R interposed between the first circular resin substrate D1 and the second circular resin substrate D2 is discharged outward by centrifugal force, and spreads over the entire storage disk D. It is spread evenly.
[0030]
At this time, at the same time as the rotation of the rotation holding table X starts or with a slight delay, the pressure source is operated to pressurize the expansion film 21.
Due to this pressurization, the expansion film 21 expands and applies pressure to the end faces of the center holes of both circular resin substrates, that is, presses the center hole DH.
Since several inflatable films 21 are provided at equal intervals around the boss body A2, the inflatable films 21 can be evenly pressed against the end face of the center hole by expanding outward.
If there are at least three inflatable films 21, the two circular resin substrates are reliably concentric.
[0031]
Due to this pressing force, the deviation between the first circular resin substrate D1 and the second circular resin substrate D2 is corrected and eliminated.
FIG. 6B shows a state in which the deviation between the two circular resin substrates has been corrected and both have been concentric.
By stopping the rotation of the rotation holding table X and stopping the pressurizing source at the same time or slightly later, the expansion film 21 returns to the original position.
Here, the extension is completed, and the displacement between the two circular resin substrates is eliminated. In addition, at the time of the extension performed as described above, suction is simultaneously performed from the suction groove P of the boss body.
[0032]
After the extension is completed, the adhesive R is cured.
Unlike the case of the boss body A1 having the opening / closing wings 11 that open and close using the centrifugal force as shown in FIG. Can be.
Therefore, since there is a degree of freedom in pressing the end face of the center hole, the expansion of the inflation film 21 can be performed intensively at the first time of extension.
[0033]
Although the present invention has been described above, the present invention is not limited to the embodiment, and it goes without saying that other various modifications can be made without departing from the essence of the present invention.
For example, although the expansion of the boss body A of the present invention has been described using a fluid pressure and a centrifugal force, one using a magnetic reaction force, one using electricity, and the like are naturally adopted.
The expansion of the boss body A may be any as long as it can correct the displacement between the two circular resin substrates by applying pressure to the end face of the center hole.
[0034]
【The invention's effect】
After the storage disk is extended, the deviation between the two circular resin substrates is removed, and the storage disk becomes extremely high quality.
Since the extension of the boss body is used, the equipment does not become large in performing the extension method.
[Brief description of the drawings]
FIGS. 1A and 1B are diagrams showing a deviation between two circular resin substrates, wherein FIG. 1A is a front view and FIG. 1B is a side sectional view.
FIGS. 2A and 2B are views showing a rotation holding table, wherein FIG. 2A is a plan view and FIG. 2B is a side view.
FIGS. 3A and 3B show examples of a boss body that expands by using centrifugal force. FIG. 3A is a plan view, and FIG. 3B is a side view.
FIGS. 4A and 4B are diagrams showing a principle of correcting a displacement caused by a boss body that expands by using centrifugal force. FIG. 4A shows a state before two circular resin substrates are displaced and before spreading. (A) shows the state after the extension in which the deviation has been corrected.
FIGS. 5A and 5B show examples of a boss body that expands by using an expansion force, where FIG. 5A is a plan view and FIG. 5B is a side view.
FIGS. 6A and 6B are diagrams showing a principle of correcting a displacement by a boss body that expands by using an expansion force. FIG. 6A shows a state before two circular resin substrates are displaced and before spreading. (A) shows the state after the extension in which the deviation has been corrected.
FIG. 7 schematically shows a storage disk (DVD which is an optical disk).
FIG. 8 schematically shows a series of steps for laminating the veneers into an integrated storage disk.
[Explanation of symbols]
A: Boss body A1 ... Boss body A2 ... Boss body 11 ... Opening / closing wing 12 ... Pin shaft 21 ... Inflatable film 22 ... Path D ... Storage disk (optical disk)
D1 First circular resin substrate D11 Reflective film D2 Second circular resin substrate DH Center hole X Rotation support Y Scattering prevention means P Suction groove L Ultraviolet light source N Nozzle R Adhesive T Deviation width

Claims (2)

中心穴を有する２枚の円形樹脂基板の間に接着剤を介在させてなる記憶ディスクにおいて該記憶ディスクを回転させて接着剤を延展する方法であって、延展の際、記憶ディスクの中心穴から外方に押圧力を加えることにより両円形樹脂基板の中心穴を同芯化するようにした延展方法において、  A method of extending an adhesive by rotating a storage disk in a storage disk in which an adhesive is interposed between two circular resin substrates having a center hole. In the extension method in which the center holes of both circular resin substrates are made concentric by applying a pressing force outward,
外方に加える押圧力は、回転保持台に取り付けられ上記中心穴に挿入されたボス体の遠心力を利用した拡張により行われることを特徴とする延展方法。  The spreading method, wherein the pressing force applied to the outside is performed by expansion using centrifugal force of a boss body attached to the rotation holding table and inserted into the center hole. ボス体からの接着剤の吸引を更に行うことを特徴とする請求項１記載の延展方法。2. The spreading method according to claim 1, further comprising suctioning the adhesive from the boss.
JP07807996A 1996-03-07 1996-03-07 Method of spreading adhesive on storage disk Expired - Fee Related JP3589521B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP07807996A JP3589521B2 (en) 1996-03-07 1996-03-07 Method of spreading adhesive on storage disk

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07807996A JP3589521B2 (en) 1996-03-07 1996-03-07 Method of spreading adhesive on storage disk

Publications (2)

Publication Number Publication Date
JPH09245386A JPH09245386A (en) 1997-09-19
JP3589521B2 true JP3589521B2 (en) 2004-11-17

Family

ID=13651847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP07807996A Expired - Fee Related JP3589521B2 (en) 1996-03-07 1996-03-07 Method of spreading adhesive on storage disk

Country Status (1)

Country Link
JP (1) JP3589521B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0895234B1 (en) 1996-04-19 2002-08-28 Matsushita Electric Industrial Co., Ltd. Method and apparatus for manufacture of laminated optical disc
US5888433A (en) * 1996-07-31 1999-03-30 Kitano Engineering Co., Ltd. Method of correcting nonalignment of a storage disc
DE19927514C2 (en) * 1999-06-16 2002-07-18 Steag Hamatech Ag Device for the centric joining of substrates

Also Published As

Publication number Publication date
JPH09245386A (en) 1997-09-19

Similar Documents

Publication Publication Date Title
EP0833315B1 (en) Method of correcting nonalignment of a storage disc
US20040152501A1 (en) Gaming machine and display device therefor
JP2002170279A (en) Optical recording medium, its manufacturing method and injection molding machine
JP3090611B2 (en) Method of extending storage disk and rotation holder therefor
EP0773372B1 (en) Rotation holding table for rotating and holding a storage disc thereon and a boss thereof
JP3589521B2 (en) Method of spreading adhesive on storage disk
JP3703230B2 (en) How to pick a storage disk from a holding stand
JP3865524B2 (en) Optical disc manufacturing method and optical disc manufacturing apparatus
JP3628816B2 (en) Storage disk holder and its boss body
JP3277989B2 (en) Correction method of misalignment in storage disk
EP1580741B1 (en) Recording medium producting method, recording medium producting apparatus and recording medium
JP2002251802A (en) Manufacturing method for disk-like recording medium and metal mold device
JP3187725B2 (en) Storage disk rotation holder
JPH0944917A (en) Production of optical disk and placing base plate to be used for the production
JP2004213738A (en) Optical disk, its manufacturing method, and disk manufacturing apparatus
JP2006286165A (en) Disk centering apparatus and disk centering method
JP2742524B2 (en) Optical information medium, optical information medium manufacturing method, and optical information medium manufacturing apparatus
JP2005032443A (en) Holding base
JP2001014738A (en) Production of optical recording medium
JPH10289494A (en) Manufacture of pasting type optical disk
JPH11273163A (en) Method and device for manufacturing laminated disk
JPH10320851A (en) Manufacture of optical laminated disk and its manufacturing device
JPH09161328A (en) Method for spreading adhesive on memory disk
JP2003242694A (en) Method for manufacturing optical recording medium
JP2007310994A (en) Flexible optical disk and holder

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20040419

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20040518

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040701

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20040810

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20040817

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

S303 Written request for registration of pledge or change of pledge

Free format text: JAPANESE INTERMEDIATE CODE: R316303

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S803 Written request for registration of cancellation of provisional registration

Free format text: JAPANESE INTERMEDIATE CODE: R316803

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

S803 Written request for registration of cancellation of provisional registration

Free format text: JAPANESE INTERMEDIATE CODE: R316803

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

S321 Written request for registration of change in pledge agreement

Free format text: JAPANESE INTERMEDIATE CODE: R316321

S803 Written request for registration of cancellation of provisional registration

Free format text: JAPANESE INTERMEDIATE CODE: R316803

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080827

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080827

Year of fee payment: 4

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080827

Year of fee payment: 4

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080827

Year of fee payment: 4

R360 Written notification for declining of transfer of rights

Free format text: JAPANESE INTERMEDIATE CODE: R360

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080827

Year of fee payment: 4

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080827

Year of fee payment: 4

R371 Transfer withdrawn

Free format text: JAPANESE INTERMEDIATE CODE: R371

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080827

Year of fee payment: 4

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313113

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080827

Year of fee payment: 4

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

LAPS Cancellation because of no payment of annual fees