JPH11285666A - Liquid material coating method - Google Patents

Liquid material coating method

Info

Publication number
JPH11285666A
JPH11285666A JP10868698A JP10868698A JPH11285666A JP H11285666 A JPH11285666 A JP H11285666A JP 10868698 A JP10868698 A JP 10868698A JP 10868698 A JP10868698 A JP 10868698A JP H11285666 A JPH11285666 A JP H11285666A
Authority
JP
Japan
Prior art keywords
liquid material
substrate
coating
atomized
gate valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10868698A
Other languages
Japanese (ja)
Inventor
Katsumi Oyama
勝美 大山
Masayuki Hachitani
昌幸 蜂谷
Masuzo Ikumi
益三 生見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Electronics Engineering Co Ltd
Priority to JP10868698A priority Critical patent/JPH11285666A/en
Publication of JPH11285666A publication Critical patent/JPH11285666A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To perform uniform coating by atomizing a liquid material and electrostatically adsorbing the particles on a substrate to which static electricity is imparted. SOLUTION: A liquid material 7 such as a resist stored in a liquid material vessel 9 is atomized by using a piezoelectric vibrator 11. An atomizing means except the piezoelectric vibrator 11 can be used. A gate valve 13 is provided on the upper part of the liquid material vessel 9 and the atomized liquid material 7 is supplied to a coating treating vessel 3 by opening the gate valve 13. An ionizer 15 is arranged between the gate valve 13 and a large sized glass substrate 1 to electrify the atomized liquid material 7 into a reverse polarity to an electrostatic chuck 5. On the other hand, a DC power source 17 is connected to the electrostatic chuck 5 to impress a high voltage. As a result, the atomized liquid material 7 impressed into the reverse polarity is electrostatically adsorbed to the surface of the large sized substrate 1. As a result, the uniform coating is performed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は液体材料の塗布方法
に関する。更に詳細には、本発明は塗布膜厚ムラが発生
しない液体材料の塗布方法に関する。
The present invention relates to a method for applying a liquid material. More specifically, the present invention relates to a method for applying a liquid material that does not cause unevenness in the coating thickness.

【0002】[0002]

【従来の技術】液晶基板に代表される大型基板へのレジ
スト又はSOGなどの塗布には、スピンコート法、ワイ
ヤーコート法、ローラコート法などが用いられている。
2. Description of the Related Art A spin coat method, a wire coat method, a roller coat method and the like are used for applying a resist or SOG to a large substrate represented by a liquid crystal substrate.

【0003】図2はスピンコート法の実施状態を示す模
式図である。図示されているように、大型ガラス基板1
を搬入し、真空チャック23に保持させる。レジストな
どの液体材料を供給配管25から基板中に、所定流量で
滴下する。その後、チャックを所定の回転数(例えば、
2000〜6000rpm)で所定時間回転させ、遠心
力でレジストを均一に延ばす。この方法では、塗布膜厚
を±5%以内に維持しなければならない場合、±20〜
50rpmの回転精度が必要になる。真空チャック3の
軸5をモータ(図示されていない)に直接連結して回転
させる(直接ドライブ方式)場合、回転精度を所望どお
りに制御できるが、軸5への異常な負荷が直接回転モー
タへの負荷となる欠点がある。
FIG. 2 is a schematic diagram showing the state of implementation of the spin coating method. As shown, a large glass substrate 1
And carried by the vacuum chuck 23. A liquid material such as a resist is dropped from the supply pipe 25 into the substrate at a predetermined flow rate. Thereafter, the chuck is rotated at a predetermined rotation speed (for example,
(2000 to 6000 rpm) for a predetermined time, and the resist is uniformly spread by centrifugal force. In this method, when the coating film thickness must be maintained within ± 5%, ± 20%
A rotation accuracy of 50 rpm is required. When the shaft 5 of the vacuum chuck 3 is directly connected to a motor (not shown) and rotated (direct drive method), the rotation accuracy can be controlled as desired, but an abnormal load on the shaft 5 is directly applied to the rotary motor. There is a drawback that becomes a load of.

【0004】一方、ベルト又はOリングでモータの回転
を伝える機構(ベルトドライブ法)の場合、モータへの
異常な負荷は緩和できるが、所望の回転精度を得るのが
難しいという欠点がある。また、スピンコート法の場
合、基板が円形の場合には比較的均一な塗布膜厚が得ら
れるが、基板が矩形の場合、基板コーナー部での塗布膜
厚ムラが発生し、生産に適用できない。
On the other hand, in the case of a mechanism for transmitting the rotation of the motor by a belt or an O-ring (belt drive method), an abnormal load on the motor can be reduced, but there is a disadvantage that it is difficult to obtain a desired rotation accuracy. In the case of the spin coating method, a relatively uniform coating film thickness can be obtained when the substrate is circular, but when the substrate is rectangular, the coating film thickness unevenness occurs at the corner of the substrate and cannot be applied to production. .

【0005】更に、基板が大型の場合、スピンコート法
では遠心力による基板の破損が生じやすいことも知られ
ている。この他、回転中、基板の上から飛散したレジス
トが塗布装置のまわりで跳ね返り、基板に再付着するこ
とがある。これを防止するため、基板周囲に跳ね返り防
止壁を設置しなければならず、この防止壁の構造に細心
の注意が必要となる。
It is also known that when a substrate is large, the substrate is easily damaged by centrifugal force in the spin coating method. In addition, during the rotation, the resist scattered from above the substrate may bounce around the coating device and adhere again to the substrate. In order to prevent this, a bounce-prevention wall must be provided around the substrate, and the structure of this prevention wall requires careful attention.

【0006】図3はワイヤーコート法又はローラコート
法の実施状態を示す模式図である。図示されているよう
に、大型ガラス基板1を搬入し、真空チャック33に保
持させる。レジストなどの液体材料を供給配管35から
基板中に、所定流量で滴下する。その後、液体材料供給
配管前面に位置するワイヤー又はローラ35でレジスト
を均一化する。この方法の場合、塗布膜厚ムラが発生
し、未だ実用レベルに至っていない。
FIG. 3 is a schematic diagram showing the state of implementation of the wire coating method or the roller coating method. As shown in the figure, the large glass substrate 1 is loaded and held by the vacuum chuck 33. A liquid material such as a resist is dropped from the supply pipe 35 into the substrate at a predetermined flow rate. After that, the resist is made uniform by a wire or roller 35 positioned in front of the liquid material supply pipe. In the case of this method, unevenness in the coating film thickness occurs, and it has not yet reached a practical level.

【0007】従って、現在のところ、生産に適用できる
塗布器は皆無の状態にある。また、基板の大型化に伴
い、レジストの滴下量が増加し、その大半が平坦化時に
排出されるため、収率の悪化より、ランニングコストの
増加が懸念されている。
Therefore, at present, there is no applicator applicable to production. In addition, as the size of the substrate increases, the amount of resist dropped increases, and most of the resist is discharged during flattening. Therefore, there is a concern that the running cost may increase due to a decrease in yield.

【0008】[0008]

【発明が解決しようとする課題】従って、本発明の目的
は、基板表面へ液体材料を均一に塗布することができる
液体材料塗布方法を提供することである。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for applying a liquid material which can uniformly apply a liquid material to a substrate surface.

【0009】[0009]

【課題を解決するための手段】前記課題は、液体材料を
噴霧化し、基板に印加した静電気により液体材料の粒子
を前記基板表面に静電吸着し、液体材料を基板表面に均
一に塗布することにより解決される。
The object of the present invention is to atomize a liquid material, electrostatically apply particles of the liquid material to the substrate surface by static electricity applied to the substrate, and uniformly apply the liquid material to the substrate surface. Is solved by

【0010】[0010]

【発明の実施の形態】本発明の方法によれば、レジスト
などの液体材料を真空又は振動子などにより噴霧化し、
基板のチャックに印加した高電圧で、液体粒子を基板表
面に静電吸着し、塗布することができる。静電吸着力は
比較的均一に発生するため、塗布の膜厚ムラは少なく、
レジストなどのロス(損耗量)が少ないため、ランニン
グコストに優れた方法である。
According to the method of the present invention, a liquid material such as a resist is atomized by a vacuum or a vibrator, etc.
The liquid particles can be electrostatically attracted to the surface of the substrate and applied by a high voltage applied to the chuck of the substrate. Since the electrostatic attraction force is generated relatively uniformly, the coating thickness unevenness is small,
Since the loss (amount of wear) of the resist and the like is small, the method is excellent in running cost.

【0011】図1は、本発明の液体材料塗布方法を実施
するのに使用される塗布装置の一例の概要断面図であ
る。大型ガラス基板1を塗布処理槽3内に搬入し、この
基板を静電チャック5に保持させる。レジストなどの液
体材料7は液体材料槽9内に貯留されており、この液体
材料7をを振動子11を使用して液体材料を噴霧化す
る。振動子以外の霧化手段(例えば、真空)も当然使用
できる。このような霧化手段は当業者に周知である。真
空と振動子を併用することもできる。液体材料槽9の上
部に設けられた仕切弁13を開き、液体材料の霧を塗布
処理槽3内に供給する。仕切弁13と大型ガラス基板1
との間に位置するイオナイザー15により霧を静電チャ
ック5と逆の極性に帯電させる。イオナイザーとして
は、公知慣用のものならば全て本発明で使用できる。こ
のようなイオナイザーは当業者に周知である。
FIG. 1 is a schematic sectional view of an example of a coating apparatus used to carry out the liquid material coating method of the present invention. The large glass substrate 1 is carried into the coating tank 3, and the substrate is held by the electrostatic chuck 5. A liquid material 7 such as a resist is stored in a liquid material tank 9, and the liquid material 7 is atomized by using a vibrator 11. Atomizing means (for example, vacuum) other than the vibrator can of course be used. Such atomizing means are well known to those skilled in the art. A vacuum and a vibrator can be used together. The gate valve 13 provided on the upper part of the liquid material tank 9 is opened, and the mist of the liquid material is supplied into the coating tank 3. Gate valve 13 and large glass substrate 1
The fog is charged to the polarity opposite to that of the electrostatic chuck 5 by the ionizer 15 located between the fog and the ionizer. Any known and commonly used ionizer can be used in the present invention. Such ionizers are well-known to those skilled in the art.

【0012】静電チャック5には直流(DC)電源17
が接続されている。DC電源17により静電チャック5
に高電圧を印加し、霧を大型基板表面に静電吸着し、液
体材料を均一に塗布する。印加電圧は特に限定されない
が、一般的に、1kV〜10kVの範囲内である。所定
時間静電吸着させた後、仕切弁13を閉じ、高電圧印加
を停止し、塗装済み大型基板を塗布処理槽3外に搬出す
る。塗布に寄与しない液体材料の霧は塗布処理槽3の上
部に設けられた排気配管19を介し、真空排気される。
The electrostatic chuck 5 has a direct current (DC) power supply 17.
Is connected. Electrostatic chuck 5 by DC power supply 17
A high voltage is applied to the mist to electrostatically attract the fog to the surface of the large substrate, and the liquid material is uniformly applied. The applied voltage is not particularly limited, but is generally in the range of 1 kV to 10 kV. After the electrostatic adsorption for a predetermined time, the gate valve 13 is closed, the application of high voltage is stopped, and the large coated substrate is carried out of the coating tank 3. The mist of the liquid material that does not contribute to the coating is evacuated via an exhaust pipe 19 provided above the coating tank 3.

【0013】なお、液体材料の霧を供給後、排気配管1
9の途中に配設されたエアーバルブ21,21を閉じ、
所定時間供給した後、仕切弁13を閉じて、塗布処理槽
3内に液体材料の霧を充満させた状態で高電圧を印加す
ると、液体材料の塗布に対する消費量を少なく抑えるこ
とができる。
After supplying the mist of the liquid material, the exhaust pipe 1
9. Close the air valves 21 and 21 arranged in the middle of 9,
After supplying for a predetermined time, when the gate valve 13 is closed and a high voltage is applied in a state where the mist of the liquid material is filled in the coating tank 3, the consumption amount of the liquid material for application can be reduced.

【0014】静電チャック5として、ヒータ内臓の静電
チャックを使用することもできる。このヒータ内臓静電
チャックを使用すれば、塗布と同時にレジストのベーク
が可能となり、レジスト膜形成時間を大幅に短縮でき
る。
As the electrostatic chuck 5, an electrostatic chuck with a built-in heater can be used. If this electrostatic chuck with a built-in heater is used, the resist can be baked simultaneously with the application, and the time for forming the resist film can be greatly reduced.

【0015】塗料の塗装方法の一例として、従来から静
電塗装法が知られている。静電塗装法とは、高圧静電電
圧極間におこるイオン電流を利用して、塗料の微粒子を
両極間に浮遊させ、イオンの電荷を塗料に与えて、その
粒子を静電場の作用で品物に吸収塗着させるもので、細
い針金枠に高圧直流負電圧を与え、品物との間に100
kVの電圧を生じさせる。この状態で塗料を噴射する
と、粒子は負イオンを受け、品物に吸着される。利点は
塗料損失10%以内で、塗面に気泡がなく、均一で、電
力は5kW以内で、場所をとらないなどである。
As one example of a coating method of a paint, an electrostatic coating method has been conventionally known. The electrostatic coating method uses ion current generated between high-voltage electrostatic voltage poles to suspend paint particles between the two poles, imparts ionic charges to the paint, and applies the particles to the product by the action of an electrostatic field. A high voltage DC negative voltage is applied to a thin wire frame, and 100
This produces a voltage of kV. When the paint is sprayed in this state, the particles receive negative ions and are adsorbed on the article. Benefits include less than 10% paint loss, no air bubbles on the painted surface, uniformity, less than 5 kW of power, and space saving.

【0016】本発明による液体材料塗布方法は従来の静
電塗装法に比べて、 (1)完全密閉式のため、塗布収率が著しく高い; (2)粒子の帯電部分を分割しているため、膜厚の制御性
に優れる。すなわち、塗布粒子が充満するまではイオナ
イザーで同極性に帯電させて付着を抑制し、充満と同時
に逆の極性に帯電させ、付着の時間管理の精度を上げる
ことにより膜厚の制御性を向上させることに成功した; (3)液体材料の噴霧化に空気を使用しないため、粒子速
度が遅く、塗布収率が向上されるばかりか、異物も付着
しにくい; (4)塗布材料の電気抵抗の影響を受けることなく微細粒
子を発生できる; (5)静電チャック自体は基本的に電力を消費せず(若干
リーク電流があるものの、約1.4w程度の電力しか必
要としない)、また、イオナイザーも30w程度と電力
を殆ど消費しないので、電力コストが著しく低い; (6)粒子の帯電部分を分割したことにより、放電の火花
による印火事故が起こり難く、安全性が高い;などの利
点を有する。
The method for applying a liquid material according to the present invention has the following advantages. (1) Completely closed, so that the coating yield is remarkably high; (2) Since the charged portion of the particles is divided, Excellent in controllability of film thickness. In other words, until the coated particles are filled, the ionizer charges it to the same polarity to suppress adhesion, and charges it to the opposite polarity at the same time as filling, thereby improving the controllability of the film thickness by increasing the accuracy of time management of the adhesion. (3) Since no air is used for atomizing the liquid material, the particle velocity is low, the coating yield is improved, and foreign substances are not easily attached. (4) The electric resistance of the coating material is low. Fine particles can be generated without being affected; (5) The electrostatic chuck itself does not basically consume power (although there is a slight leak current, it requires only about 1.4 watts of power), and The ionizer also consumes very little power at about 30 watts, so the power cost is remarkably low. (6) By dividing the charged portion of the particles, it is unlikely that an ignition accident due to the spark of discharge will occur and the safety is high. Have .

【0017】[0017]

【発明の効果】以上説明したように、本発明によれば、
レジストなどの液体材料を真空又は振動子などにより噴
霧化し、基板のチャックに印加した高電圧で、液体粒子
を基板表面に静電吸着し、塗布することができる。静電
吸着力は比較的均一に発生するため、塗布の膜厚ムラは
少なく、レジストなどのロス(損耗量)が少ないため、
ランニングコストに優れた方法である。
As described above, according to the present invention,
A liquid material such as a resist is atomized by a vacuum or a vibrator or the like, and the liquid particles can be electrostatically adsorbed on the substrate surface by a high voltage applied to a chuck of the substrate and applied. Since the electrostatic attraction force is generated relatively uniformly, the coating thickness unevenness is small, and the loss (amount of wear) of the resist and the like is small.
This is an excellent method for running costs.

【図面の簡単な説明】[Brief description of the drawings]

【図1】図1は、本発明の液体材料塗布方法を実施する
のに使用される塗布装置の一例の概要断面図である。
FIG. 1 is a schematic cross-sectional view of an example of a coating apparatus used to carry out a liquid material coating method of the present invention.

【図2】図2は、従来のスピンコート法の実施状態を示
す模式図である。
FIG. 2 is a schematic diagram showing an implementation state of a conventional spin coating method.

【図3】図3は、従来のワイヤーコート法又はローラコ
ート法の実施状態を示す模式図である。
FIG. 3 is a schematic view showing an implementation state of a conventional wire coating method or a roller coating method.

【符号の説明】[Explanation of symbols]

1 基板 3 塗布処理槽 5 静電チャック 7 液体材料 9 液体材料槽 11 振動子 13 仕切弁 15 イオナイザー 17 DC電源 19 排気配管 21 エアーバルブ 23,33 真空チャック 35 ワイヤー又はローラ Reference Signs List 1 substrate 3 coating treatment tank 5 electrostatic chuck 7 liquid material 9 liquid material tank 11 vibrator 13 gate valve 15 ionizer 17 DC power supply 19 exhaust pipe 21 air valve 23, 33 vacuum chuck 35 wire or roller

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 液体材料を噴霧化し、基板に印加した静
電気により液体材料の粒子を前記基板表面に静電吸着
し、液体材料を基板表面に均一に塗布することを特徴と
する液体材料塗布方法。
1. A liquid material applying method, wherein a liquid material is atomized, particles of the liquid material are electrostatically attracted to the substrate surface by static electricity applied to the substrate, and the liquid material is uniformly applied to the substrate surface. .
【請求項2】 液体材料を、真空及び振動子からなる群
から選択される少なくとも1種類の霧化手段を用いて噴
霧化することを特徴とする請求項1に記載の方法。
2. The method according to claim 1, wherein the liquid material is atomized using at least one atomizing means selected from the group consisting of a vacuum and a vibrator.
【請求項3】 噴霧化された液体材料粒子をイオナイザ
ーにより、基板の極性と逆の極性に帯電させることを特
徴とする請求項1に記載の方法。
3. The method according to claim 1, wherein the atomized liquid material particles are charged to a polarity opposite to the polarity of the substrate by an ionizer.
【請求項4】 液体材料がレジスト、SOG又は表面保
護膜形成材料であることを特徴とする請求項1、2又は
3に記載の方法。
4. The method according to claim 1, wherein the liquid material is a resist, SOG or a material for forming a surface protective film.
JP10868698A 1998-04-03 1998-04-03 Liquid material coating method Pending JPH11285666A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10868698A JPH11285666A (en) 1998-04-03 1998-04-03 Liquid material coating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10868698A JPH11285666A (en) 1998-04-03 1998-04-03 Liquid material coating method

Publications (1)

Publication Number Publication Date
JPH11285666A true JPH11285666A (en) 1999-10-19

Family

ID=14491096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10868698A Pending JPH11285666A (en) 1998-04-03 1998-04-03 Liquid material coating method

Country Status (1)

Country Link
JP (1) JPH11285666A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008260015A (en) * 2008-05-15 2008-10-30 Dainippon Printing Co Ltd Method and apparatus for manufacturing alternate adsorption membrane
JP2010095599A (en) * 2008-10-15 2010-04-30 Seiji Kagawa Method and apparatus for modifying film surface

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008260015A (en) * 2008-05-15 2008-10-30 Dainippon Printing Co Ltd Method and apparatus for manufacturing alternate adsorption membrane
JP2010095599A (en) * 2008-10-15 2010-04-30 Seiji Kagawa Method and apparatus for modifying film surface

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