JPS59102474A - Film formation of powder - Google Patents
Film formation of powderInfo
- Publication number
- JPS59102474A JPS59102474A JP21240482A JP21240482A JPS59102474A JP S59102474 A JPS59102474 A JP S59102474A JP 21240482 A JP21240482 A JP 21240482A JP 21240482 A JP21240482 A JP 21240482A JP S59102474 A JPS59102474 A JP S59102474A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- substrate
- high voltage
- power source
- impressed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Electrostatic Spraying Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、基板に粉体の塗膜を形成する用に供される
粉体の塗膜形成方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming a powder coating film on a substrate.
粉体を基板に塗布し塗膜を形成することは、膜厚を一定
にしたシ、均一性が要求される場合には、とくに難しい
。たとえば、基板に粘着性を附与し、この基板に粉体を
吹きつけて塗膜を形成する方法が提案されているが、吹
きつけ量を調節して均一な膜を得るには限度がある。Applying powder to a substrate to form a coating film is particularly difficult when uniform thickness and uniformity are required. For example, a method has been proposed in which a coating film is formed by imparting adhesiveness to a substrate and spraying powder onto the substrate, but there is a limit to the ability to obtain a uniform film by adjusting the spray amount. .
この発明は、この問題を解消するためになされたもので
、粉体を静電的に基板に附着させることによシ、所望の
塗膜を容易に得ることができる粉体の塗膜形成方法を提
供しようとするものである。This invention was made to solve this problem, and is a method for forming a powder coating film, which allows a desired coating film to be easily obtained by electrostatically adhering the powder to a substrate. This is what we are trying to provide.
以下、この発明の実施例を図面にしたがって説明する。Embodiments of the present invention will be described below with reference to the drawings.
第１図は、この発明の方法に用いられる装置の一例を模
式的に示す斜視図である。同図において、（１）は基板
、（２）は基板（１）に、たとえば３０ＫＶ程度の高電
圧を印加する電源である。（３）は導電材で構成された
的体であシ、この的体（３）は接地を通して高電圧電源
（２）の負極側に接続されている。（４）は的体（３）
に配備された送風機であシ、的体（３）内に収容された
高分子物質などの粉体（５）を上記基板（１）には到達
しない程度に噴霧状に吹き上げるようになっている。FIG. 1 is a perspective view schematically showing an example of an apparatus used in the method of the present invention. In the figure, (1) is a substrate, and (2) is a power source that applies a high voltage of, for example, about 30 KV to the substrate (1). (3) is a target made of a conductive material, and this target (3) is connected to the negative electrode side of the high voltage power supply (2) through ground. (4) is target (3)
A blower installed in the target body (3) blows up the powder (5) such as a polymeric substance contained in the target body (3) in the form of a spray to such an extent that it does not reach the substrate (1). .
このような構成において、送風機（４）を駆動して粉体
り６）を吹き上げさせる。一方基板（１）に高電圧を印
加すると、基板（１）と内体（３）の間に高電圧電界が
発生して空気中の水分子がイオン化する。負極性イオン
が上記粉体（５）に附着したとき、粉体（５）が静電的
に引きつけられて基板（１）に静電的に附着し、これに
より基板（りに塗膜が形成される。この際、基板（１）
には予め、粘着性を附与しておいてもよい。In such a configuration, the blower (4) is driven to blow up the powder 6). On the other hand, when a high voltage is applied to the substrate (1), a high voltage electric field is generated between the substrate (1) and the inner body (3), and water molecules in the air are ionized. When the negative polarity ions adhere to the powder (5), the powder (5) is electrostatically attracted and electrostatically adheres to the substrate (1), thereby forming a coating film on the substrate (1). At this time, the substrate (1)
may be imparted with adhesive properties in advance.
以上のような方法によると、粉体（５）の粒度をそろえ
ておけば、塗膜を粉体（５）の他の特性に影響されるこ
となく、基板（１）に流入するイオン電流の積算量によ
って制御できるため、所定の膜厚を容易に得ることがで
きる。また、基板（１）と内体（３）の間の電界と、送
風機（４）による粉体（５）の吹き上げ状綿とを一様に
設定することによって粉体（５）の特性に左右されずに
均一的な塗膜を得ることができる。According to the above method, if the particle size of the powder (5) is made uniform, the coating film will not be affected by other characteristics of the powder (5), and the ionic current flowing into the substrate (1) will be controlled. Since it can be controlled by the integrated amount, a predetermined film thickness can be easily obtained. In addition, by uniformly setting the electric field between the substrate (1) and the inner body (3) and the blowing up of the powder (5) by the blower (4), the characteristics of the powder (5) can be influenced. It is possible to obtain a uniform coating film without any damage.
さらに粉体（５）を静電的に吸着させるから、粉体が周
辺に飛散することもなく、粉体の歩留りの向上を図れる
利点がある。Furthermore, since the powder (5) is electrostatically adsorbed, the powder does not scatter to the surroundings, and there is an advantage that the yield of the powder can be improved.
以上のように、この発明は粉体を静電的に基板に吸着さ
せる簡単な構成により、膜厚の均一な塗膜を容易に得る
ことができる。As described above, according to the present invention, a coating film having a uniform thickness can be easily obtained using a simple structure in which powder is electrostatically attracted to a substrate.
図面はこの発明に係る粉体の塗膜形成方法に用いられる
装置の一例を模式的に示す斜視図である。
（１）・・・基板、（２）・・・高電圧電源、（３）・
・・内体、（４）・・・送風機、（５）・・・粉体。
なお、図中同一符号は同一または相当部分を示す。
代理人 葛野信−（外１名）The drawing is a perspective view schematically showing an example of an apparatus used in the powder coating film forming method according to the present invention. (1)... Board, (2)... High voltage power supply, (3)...
...Inner body, (4)...Blower, (5)...Powder. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Shin Kuzuno (1 other person)
Claims (1)
高電圧を印加する高電圧電源と、基板主面に対向して配
置されて上記粉体を収容した導電性の鉤体と、該的体に
配備されて前記粉体を吹き上げる送風機とを備え、前記
基板に上記高電圧電源から高電圧を印加し、前記的体に
は前記高電圧電源の前記基板とは逆極性の電圧を印加し
て、前記送風機からの送風によって吹き上げられた前記
粉体をイオン化して静電的に上記基板に附着させること
を特徴とする粉体の塗膜形成方法。(1), in the step of applying powder to a substrate, a high voltage power source that applies a high voltage to the substrate; a conductive hook disposed opposite to the main surface of the substrate and containing the powder; a blower disposed on the target to blow up the powder, applying a high voltage from the high voltage power source to the substrate, and applying a voltage of opposite polarity to the substrate of the high voltage power source to the target. A method for forming a coating film of powder, characterized in that the powder is ionized and electrostatically attached to the substrate by applying air from the blower.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21240482A JPS59102474A (en) | 1982-12-01 | 1982-12-01 | Film formation of powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21240482A JPS59102474A (en) | 1982-12-01 | 1982-12-01 | Film formation of powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59102474A true JPS59102474A (en) | 1984-06-13 |
Family
ID=16622021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21240482A Pending JPS59102474A (en) | 1982-12-01 | 1982-12-01 | Film formation of powder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59102474A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01215377A (en) * | 1988-02-24 | 1989-08-29 | Sanueebu Kogyo Kk | Production of coated metallic sheet |
-
1982
- 1982-12-01 JP JP21240482A patent/JPS59102474A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01215377A (en) * | 1988-02-24 | 1989-08-29 | Sanueebu Kogyo Kk | Production of coated metallic sheet |
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