JPH11284302A - Connecting terminal structure of circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a terminal structure which can make the connection between connection terminals easier when the size of a circuit board is reduced and, at the same time, can make the connection terminals to be connected surely to each other. SOLUTION: In a connection terminal structure, a bundle of a plurality of planar connection terminal, lines formed on a substrate A by using a conductive film is divided into a plurality of stages of connection terminals 2a and 2b which are separated from each other in the vertical direction with an insulating layer 7 in between at a connection terminal section 1 on the main surface of the substrate A. In the structure, the connecting section of each terminal in the terminal section 1 has a boarder width than the other portion of each terminal has.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection terminal structure for an electronic circuit board, and more particularly, to connecting leads for connecting a glass panel provided with an optical sensor, a liquid crystal display element and the like to an integrated circuit board. The present invention relates to a connection terminal structure using a circuit unit.

[0002]

2. Description of the Related Art In order to electrically connect a glass panel provided with an optical sensor and the like to an integrated circuit board, a sheet-like integrated circuit unit for connection (IC chip or the like is formed on the upper surface of a resin film by a conductive film. A unit bonded to a metal lead foil, so-called TAB: Tape Au
It is known to use a "bonded bonding", but this unit has a single-layer structure in which a conductive film is formed on only one surface of a resin film.
The connection between the glass panel and the integrated circuit substrate by the connection integrated circuit unit (hereinafter, referred to as an IC unit) must be maintained in a reliable connection state in handling at the time of mounting. Must be joined together.

[0003] This point will be described in detail below with reference to the structure shown in FIGS. 3 and 4 as a conventional example. FIG. 3 is a schematic cross-sectional view of a structure in which substrates (glass panel A and integrated circuit substrate B) are connected by an IC unit C. FIG. 4A is a plan view of the connection terminal structure of the substrate A or B, and FIG. 4B is a plan view of the connection terminal structure of the IC unit C. In the figure, 1 is a connection terminal on the side of the substrate A or B, 2 is a connection terminal, 3 is a connection terminal on the IC unit C side, and 4 is
Connection terminals on the C unit C side, 5 is a sheet (resin film for holding connection terminals), 6 is a lead portion of the IC unit, 10
Is an IC chip.

A large number of connection terminals 2 and 4 made of a conductive film are formed in a row on each of the connection terminal portions 1 and 3 in FIG. 4, and the terminals correspond to each other on a one-to-one basis. . The connection terminals 2 and 4 (for example, the glass panel A and the IC unit C, or the circuit board B and the IC unit C) are bonded to each other by thermocompression bonding or the like in a state where their respective terminal surfaces are overlapped. It is electrically connected while maintaining a predetermined strength.

[0005]

In such a circuit board, conditions such as reducing the area of the circuit board A; and increasing the number of connection terminals 2 of the circuit board A are required.

However, under these conditions, the area of the connection terminal 2 per unit area increases, and as a result, the width of the connection terminal 2 itself or the distance between adjacent connection terminals 2 becomes smaller. Therefore, the circuit boards B and I
There is a problem that manufacturing of the C unit C itself becomes difficult.

[0007] The connection between the circuit board B and the IC unit C also has the following disadvantages.

If the connection terminals 1 and 3 are misaligned when they are connected to each other, the distance between the adjacent terminals is reduced, and a contact failure or a failure due to a short circuit is likely to occur.

[0009] Since thermal compression is performed when connecting the connection terminals 1 and 3, thermal stress is applied to the thin connection terminals 4 on the IC unit C side, and the connection terminals 4 and the resin film 5 for holding connection terminals are subjected to thermal stress. Inconveniences, such as peeling, are likely to occur.

According to the present invention, according to the present invention, an insulating coating layer is formed on a plurality of terminal wires made of a conductive coating on a substrate (glass panel A or integrated circuit board B), and the conductive coating is formed on the insulating coating. By distributing the circuit board into upper and lower stages, the present invention can prevent contact failure due to narrowing of connection terminals due to miniaturization of a circuit board and failure due to short circuit, and can prevent peeling after thermocompression bonding, an integrated circuit or a glass panel It is an object of the present invention to provide a terminal connection structure for a circuit board.

[0011]

According to the present invention, there is provided a circuit board having a plurality of connection terminal wire bundles formed two-dimensionally by a conductive coating on a board. A circuit, wherein a bundle of the plurality of connection terminal wires formed in a plane is divided at connection terminal portions in the vertical direction of the main surface of the substrate via an insulating layer, and a plurality of connection terminal portions are formed. It is intended to provide a connection terminal structure of a substrate.

[0012] Also, there is provided a connection terminal structure for a circuit board, wherein the line width of the connection terminal portion at the end of each terminal wire is formed larger than the line width of the other portions.

[0013] Further, the connection terminal portions of the integrated circuit unit are overlapped in correspondence with each of the plurality of connection terminal portions,
A connection terminal structure of a circuit board, wherein the integrated circuit units are connected in a plurality of stages.

[0014] Further, there is provided a connection terminal structure for a circuit board, wherein the plurality of connection terminal portions are formed stepwise inward from a peripheral portion of the substrate.

Further, the substrate is a glass panel on which an electric circuit is formed or an integrated circuit substrate, and also has a connection terminal structure of a circuit substrate.

Further, in the structure in which the glass substrate and the integrated circuit board are connected by an integrated circuit unit for connection, each connection terminal portion is connected by the plurality of connection terminals. It is also a connection terminal structure.

The connection terminal portion has a connection terminal portion formed on the surface of the substrate and a connection terminal portion formed by connecting a connection terminal wire on the back surface of the substrate to the surface via a through hole. The connection terminal structure of the circuit board is characterized in that the connection terminal portions are formed in a plurality of rows substantially parallel to the periphery of the board.

Further, the connection terminal portion of the circuit board is characterized in that the connection terminals of the plurality of stages are formed so that the connection terminals of the respective stages do not overlap.

As described above, according to the present invention, the terminal portion formed on the substrate by the conductive film is correspondingly connected to the terminal portion formed on the sheet surface of the integrated circuit unit by the conductive film. In the terminal connection structure of the integrated circuit in which the sheets of the unit are joined to the substrate, an insulating coating layer is formed on the conductive coating on the substrate, and the conductive coating is distributed to the upper and lower layers of the insulating coating. The width / spacing of the terminals (connections) of the coating is increased, and a plurality of steps are provided.
It is characterized in that the integrated circuit units are connected in a plurality of stages by superposing the terminal connected portions of the integrated circuit unit in correspondence with each of the plurality of stages of the terminal connected portions.

In a preferred embodiment, the substrate is a glass panel such as an optical sensor or an integrated circuit substrate, and the unit is used for connecting the substrate to another or to connecting leads to each other. Connection integrated circuit unit or connection integrated circuit.

According to the present invention, an insulating film layer is formed on a plurality of terminal wires made of a conductive film on a substrate (glass panel A or integrated circuit substrate B), and the conductive film is formed on the upper and lower layers of the insulating film. Since the distance and line width of the connection terminals can be increased by distributing the connection terminals, the contact failure due to the narrowing of the connection terminals due to the miniaturization of the conventional circuit board,
It is possible to provide a terminal connection structure of a circuit board such as an integrated circuit or a glass panel which can prevent a defect due to a short circuit and prevent peeling after thermocompression bonding.

That is, according to the present invention, the following effects can be obtained.

When the glass panel and the IC unit are connected, the width and the interval of the connection terminals are doubled, so that non-contact due to displacement during bonding and defects due to short-circuit with adjacent terminals are reduced. In addition, since the width of the connection terminal is increased, the connection strength is increased, and the peeling failure at the later manufacturing stage is reduced.

The connection terminals of the IC unit are divided into a plurality of stages, and the width of the lead wires, the width of the connection terminals, and the interval can be doubled. Peeling is avoided or reduced.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below.

FIG. 1 is a schematic sectional view showing the connection structure of the present embodiment. 2 is an enlarged plan view of each connection terminal portion. FIG. 2A is a connection terminal portion of the substrate A of FIG. 1, and FIG. 2B is a connection terminal portion of the substrate B of FIG. FIG. 2C shows another example of the connection terminal portion of the substrate A in FIG.

In FIG. 1 and FIG. 2A, A is a glass panel equipped with an optical sensor and the like, and 1 is a glass panel A
In the connection terminal portion 1, an insulating coating layer 7 is formed on a conductive coating 9 serving as a bundle of a plurality of terminal wires, and adjacent conductive coatings 9a and 9b are alternately insulated. Coating 7
Of the connection terminals 2 (2a, 2a,
2b) are arranged.

It should be noted that the present invention is not limited to two rows and two rows, but may be more than two rows.

B is the connection terminal 2 of the glass panel A.
The integrated circuit board B is a control-side integrated circuit board for controlling the signals a and 2b with the IC chip 10 interposed therebetween. The integrated circuit board B has two rows of conductive films 11a and 11b, 11b through and 11a without
11b through the through hole 8 is electrically connected to the conductive film on the back side of the substrate.

Further, C is an IC unit for connecting the glass panel A and / or the integrated circuit board B (in this embodiment, it is used for bridging both, but one of them is connected to the other. It can also be used for connection to an integrated circuit, etc.), in which IC units each having a sheet of a conductive film formed thereon are connected in two layers.

The connection terminals of the IC unit Ca are connected to the connection terminals 2a and 11a of the glass panel A and the integrated circuit board B.
a, and the connection terminals of the IC unit Cb are similarly connected to the connection terminals 2b and 11b.

The number of IC units is not limited to two and two, but may be more than two.

FIG. 2A is a schematic plan view of the connection terminal portion of the glass substrate A of FIG. 1. The conductive coating (connection terminal line) 9 of the glass panel A is divided into two stages and distributed. The conductive coatings (connection terminal wires) 9a and 9b are formed thicker above and below the insulating coating 7, and the connection terminals 2 can also be formed thicker.

FIG. 2B is a schematic plan view of the connection terminal portion of the circuit board B. The connection terminal 11b connects to the wiring on the back side of the board through the through hole 8 and the connection terminal connects to the wiring on the front side of the board. 11a, and on the substrate surface, 2
By forming them in rows, the width and spacing of each connection terminal can be increased.

[Other Embodiments] In the example of FIG. 2A, the conductive film 9a on the insulating film 7 and the conductive film 9b under the insulating film 7 are overlapped in a top view. FIG.
In the embodiment shown in (c), the conductive film 9a on the insulating film 7 and the conductive film 9b under the insulating film 7 are not overlapped in a top view, thereby providing a short circuit when the insulating film is broken. And formation of unnecessary capacitance can be prevented.

In the above-described embodiment, the connection terminal 11b on the integrated circuit board B is electrically connected to the conductive film on the opposite side of the board through the through-hole 8, but without passing through the through-hole 8. An insulating coating layer 7 is formed on the conductive coating 9 similarly to the glass panel A side shown in FIG. 2A, and terminal wires made of the adjacent conductive coating are alternately distributed to the upper and lower stages of the insulating coating 7. Of course, the connection terminals 11 may be formed in two stages and two rows.

According to this embodiment, the insulating coating layer 7 is formed on the conductive coating 9 at the edge of the conductive coating 9 of the glass panel A, and the adjacent conductive coatings are alternately formed on the insulating coating 7. As a result of arranging the connection terminals 2 in two rows and two rows by dividing the connection terminals into upper and lower stages, the width and interval of the connection terminals 2 can be doubled by the conventional conductive film width and interval.

[0038]

As described above, according to the present invention,
The following effects are obtained.

When the glass panel is connected to the IC unit, the connection terminal width and the interval are increased, so that non-contact due to displacement during bonding and defects due to short-circuit with adjacent terminals are reduced. In addition, since the connection terminal width is increased, the connection strength is increased, and peeling failure in a later manufacturing stage is reduced.

Since the IC unit is divided into a plurality of stages and the lead wire width, the connection terminal width, and the interval can be increased, peeling of the connection terminals of the IC unit from the sheet surface (the resin film for protecting the connection terminals) due to thermal stress is avoided. Or decrease.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view in which a glass panel of the present invention and a circuit board are connected by an IC unit.

FIG. 2 is a plan view (a) showing a connection terminal portion of a glass panel A of the present invention, a plan view (b) showing a connection terminal portion of a circuit board B of the present invention, and another embodiment of the present invention. It is a top view (c) of the conductive coat part (connection terminal part) of the glass panel A shown.

FIG. 3 is a schematic cross-sectional view showing a structure in which a conventional glass panel and a circuit board are connected by an IC unit.

4A is a diagram of a connection terminal portion of a conventional glass panel and a circuit board, and FIG. 4B is a diagram of a connection terminal portion of a conventional IC unit.

[Explanation of symbols]

A Glass panel B Circuit board C IC unit 1 Connection terminal (of glass panel or circuit board) 2 Connection terminal (of glass panel or circuit board) 3 Connection terminal (of IC unit) 4 Connection terminal (of IC unit) 5 Sheet (resin film for holding connection terminals of IC unit) 6 Lead portion (of IC unit) 7 Insulation coating (of glass panel) 8 Through hole 9 Conductive coating (connection terminal wire) 10 IC chip 11 Connection terminal (of circuit board )

Claims (8)

[Claims] 1. A circuit board having a plurality of connection terminal line bundles formed two-dimensionally by a conductive film on a substrate, wherein the plurality of two-dimensionally formed connection terminal line bundles are connected to a connection terminal part. 3. A connection terminal structure for a circuit board according to claim 1, wherein a plurality of connection terminal portions are formed by dividing the main surface of the substrate up and down through an insulating layer. 2. The connection terminal structure for a circuit board according to claim 1, wherein the line width of the connection terminal portion at the end of each of the terminal wires is formed larger than the line width of the other portions. 3. The integrated circuit unit according to claim 1, wherein the connection terminal portions of the integrated circuit unit are overlapped with each other for each of the plurality of connection terminal portions, and the integrated circuit units are connected in a plurality of stages. Terminal structure of circuit board. 4. The connection terminal structure for a circuit board according to claim 1, wherein the plurality of connection terminal portions are formed in a stepped shape inside from a peripheral portion of the substrate. 5. The connection terminal structure for a circuit board according to claim 1, wherein the board is a glass panel on which an electric circuit is formed or an integrated circuit board. 6. A structure in which a glass substrate on which an electric circuit is formed and an integrated circuit substrate are electrically connected by an integrated circuit unit for connection, wherein respective connection terminal portions are connected by the plurality of connection terminals. The connection terminal structure for a circuit board according to claim 1, wherein: 7. The connection terminal portion has a connection terminal portion formed on the surface of the substrate, and a connection terminal portion formed by connecting a connection terminal line on the back surface of the substrate to the surface via a through hole. 2. The connection terminal structure for a circuit board according to claim 1, wherein the connection terminal portions are formed in a plurality of rows substantially parallel to the periphery of the board. 8. The connection terminal structure for a circuit board according to claim 1, wherein the connection terminals of the plurality of stages are formed so that the connection terminals of the respective stages do not overlap.