JPH11284163A - Solid-state imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To raise immunity characteristics of a solid-state imaging device. SOLUTION: Around a package 2 where at least a solid-state imaging element 1 is housed (and at a lens fitting member surrounding it), a loop 5 of one or more turns of a conductor surrounding the solid-state imaging element 1 is formed. The loop 5 of one or more turns with a conductor forms an anti- magnetic field against a magnetic field from outside inside the loop 5, so, the magnetic field from outside is canceled with the anti-magnetic field. Thus, the inside of the loop 5 becomes no-magnetic field.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a solid-state imaging device in which at least a solid-state imaging device is housed in a package.

[0002]

2. Description of the Related Art In general, a solid-state image pickup device is formed by enclosing a solid-state image pickup device in a package made of, for example, ceramic and sealing the solid-state image pickup device. Such a solid-state imaging device is
For example, video cameras, surveillance cameras, still cameras, and the like, have become indispensable, as well as electronic devices, such as personal computers, which have not conventionally required an imaging means. I'm going all the way.

[0003] In the conventional solid-state imaging device, no effective countermeasures have been taken especially for improving the immunity characteristics.

[0004]

In recent years, EMC regulations for electronic devices have been strengthened worldwide, and among those regulations, there is an imminent regulation that defines the degree of influence of external electromagnetic waves on electronic devices. Those that have been defined include the international standard CISPR20 and the European standard E
N55020 and the like.

[0005] The solid-state image pickup device constituting the above-mentioned solid-state image pickup device, particularly a CCD solid-state image pickup device, performs horizontal transfer and vertical transfer at a high speed, and thus is easily affected by a magnetic field due to its characteristics. Because it outputs, it can be said that it is a device with very poor immunity characteristics. However, as described above, no effective measures have conventionally been taken to improve the immunity characteristics.

[0006] Electronic devices incorporating a solid-state imaging device,
For example, the entire device such as a video camera, a surveillance camera, a still camera, and a personal computer is sometimes shielded with metal.However, in such a case, electronic devices such as a video camera are required. This is not preferable because miniaturization and weight reduction are often hindered. Therefore, it is necessary to take measures to improve the immunity characteristics of the solid-state imaging device itself.

The present invention has been made to solve such a problem, and an object of the present invention is to provide a solid-state imaging device having high immunity characteristics.

[0008]

According to a first aspect of the present invention, there is provided a solid-state imaging device comprising a conductor which surrounds the solid-state imaging device at least around a package accommodating the solid-state imaging device or a lens mounting member surrounding the package. A multi-turn loop is formed.

Therefore, according to the solid-state imaging device of the first aspect, a demagnetizing field with respect to an external magnetic field can be formed by one or a plurality of turns of a loop by a conductor, and the external magnetic field is canceled by the demagnetizing field. be able to. Therefore, it is possible to prevent the generation of a magnetic field due to the influence from the outside, and it is possible to remarkably improve the immunity characteristic.

That is, as shown in FIG. 2, when a magnetic field b is applied to a one-turn loop a made of a conductor by an external factor, a current c is induced in the loop (conductor) a. A magnetic field d is generated, and the magnetic field d becomes a magnetic field in a direction opposite to the magnetic field b due to the external factor in the loop a. That is, the magnetic field d becomes a demagnetizing field with respect to the magnetic field b in the loop a, and cancels the demagnetizing field. Thus, there is no magnetic field in the loop a. Therefore, if a loop made of a conductor surrounding the solid-state imaging device is formed on the periphery of the package accommodating the solid-state imaging device or on the lens attachment member surrounding the package, the solid-state imaging device existing in the loop is subjected to an external magnetic field. Can be protected magnetically from Therefore, the immunity characteristics of the solid-state imaging device can be improved.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The solid-state imaging device according to the present invention comprises a conductor mounted on at least the periphery of a package accommodating a solid-state imaging device or a lens mounting member (barrel) surrounding the package.
Alternatively, a solid-state image sensor is formed by forming a loop of a plurality of turns. As a solid-state image sensor, a CCD solid-state image sensor is generally used. Various packages such as a package using a ceramic and a package sealed with a resin can be included in the package.

The number of turns of the loop formed by the conductor may be one, but may be plural, and the number of turns is not particularly limited. Conductive materials with lower specific resistance are better, but it is not necessary to use expensive materials. Any material that can be used as a wiring material may be used. For example, copper, aluminum, etc. are extremely suitable materials. However, the present invention is not necessarily limited to this. And a loop may be formed around the package with a thick film by, for example, vapor deposition,
Other methods, such as winding a conductive wire to form a loop, or forming a loop in advance, passing a package through the package, and then fixing it, if the solid-state imaging device can be surrounded by a loop made of a conductor, the mode is as follows. It doesn't matter.

When the package is mounted on the lens mounting member (barrel), a loop made of a conductor is formed on the outer peripheral surface or inner peripheral surface of the portion of the lens mounting member (barrel) surrounding the package. Is also good. The solid-state imaging device according to the present invention includes a solid-state imaging device housed in a package, a solid-state imaging device housed in a package, and a lens attached thereto via a mounting member such as a lens barrel. Is also included.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the illustrated embodiments. 1A to 1C show a first embodiment of a solid-state imaging device according to the present invention, wherein FIG. 1A is a plan view, FIG. 1B is a left side view, and FIG. 1C is a front view. In the drawing, 1 is C
The CD solid-state imaging device 2 is a package that houses the CCD solid-state imaging device, and is made of, for example, ceramic. Reference numeral 3 denotes a transparent plate made of, for example, glass, which seals the CCD solid-state imaging device 1 housed in the package 2, and terminals (leads) 4.

Reference numeral 5 denotes a one-turn loop formed of a conductor formed on the outer peripheral surface of the package 2 and its position is set so as to surround the solid-state imaging device 1, and its width is slightly larger than the thickness of the solid-state imaging device 1. The solid-state imaging device 1 is formed so as not to protrude from the loop 5 when viewed from the side (of course, when viewed through). The loop 5 made of this conductor is made of a material having a low specific resistance, for example, a material such as copper. The formation of the loop 5 on the outer peripheral surface of the package 2 is as follows.
A method in which a conductor material such as copper is formed in a loop shape in advance, and the package 2 is passed therethrough and positioned and then fixed, or the masking of the package 2 is appropriately performed, and the conductor material is vapor-deposited And then masking.

According to such a solid-state imaging device, FIG.
When a magnetic field b is applied to a one-turn loop a by an external factor, a current c is induced in the loop (conductor) a, and a magnetic field d due to the induced current c is generated in the loop a. A demagnetizing field is generated in the opposite direction to the magnetic field b due to the external factor, and is canceled. Therefore, the magnetic field can be eliminated in the loop a. The influence can be eliminated, and thus the immunity characteristic can be remarkably improved, and the regulation on the immunity characteristic can be easily cleared.

FIGS. 3A and 3B show a second embodiment of the solid-state imaging device according to the present invention, wherein FIG. 3A is a bottom view and FIG.
FIG. 4 is a cross-sectional view showing a package mounting portion of a lens barrel to which a package is mounted. In the present embodiment, a lens mounting member (lens barrel) for mounting a lens that does not appear in the drawing assembled with the package 3 instead of forming a loop 5 made of a conductor in the package 3 housing the CCD solid-state imaging device 1.
A loop 5 is formed on the outer peripheral surface of the reference numeral 6. The width of the loop 5 is wider than the thickness of the solid-state imaging device 1, and the formation position is such that the solid-state imaging device 1 does not protrude from the loop 5 when viewed from the side (of course, as viewed through). It is set to be.

In this embodiment as well, just as in the first embodiment, the immunity characteristic can be remarkably improved by the principle shown in FIG.

[0019]

According to the solid-state imaging device of the present invention, a demagnetizing field with respect to an external magnetic field can be formed in the loop by a loop of one or more turns by a conductor. It can be canceled by a magnetic field. Therefore, it is possible to prevent the generation of a magnetic field due to the influence from the outside, and it is possible to remarkably improve the immunity characteristic.

[Brief description of the drawings]

FIGS. 1A to 1C show a first embodiment of a solid-state imaging device according to the present invention, in which FIG. 1A is a plan view, FIG. 1B is a left side view, and FIG. is there.

FIG. 2 is an explanatory diagram of a basic principle of the present invention.

3A and 3B show a second embodiment of the solid-state imaging device of the present invention, wherein FIG. 3A is a bottom view, and FIG. 3B is a package mounting portion of a lens barrel to which a package is mounted. FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Solid-state image sensor, 2 ... Package, 5 ...
Loop consisting of conductors.

Claims (1)

[Claims] 1. A lens mounting member that surrounds at least a package in which a solid-state imaging device is stored or a lens mounting member that surrounds the package.
A solid-state imaging device comprising a loop formed of one or more turns of a conductor surrounding a solid-state imaging device.