JPH11283814A - Electronic part checking device - Google Patents

Electronic part checking device

Info

Publication number
JPH11283814A
JPH11283814A JP10085227A JP8522798A JPH11283814A JP H11283814 A JPH11283814 A JP H11283814A JP 10085227 A JP10085227 A JP 10085227A JP 8522798 A JP8522798 A JP 8522798A JP H11283814 A JPH11283814 A JP H11283814A
Authority
JP
Japan
Prior art keywords
index table
defective product
electronic component
electronic part
rotation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10085227A
Other languages
Japanese (ja)
Inventor
Yoichi Okumura
陽一 奥村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP10085227A priority Critical patent/JPH11283814A/en
Publication of JPH11283814A publication Critical patent/JPH11283814A/en
Pending legal-status Critical Current

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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Specific Conveyance Elements (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PROBLEM TO BE SOLVED: To eliminate a time lag by automatically eliminating an electronic part which has come just to an improper part rejecting portion and by restarting a rotation of an index table in the case of the index table being obstructed. SOLUTION: When rotating obstruction of an index table 40 is generated, operation of an electronic part checking device is temporalily stopped and a discharge mistake electronic part is removed from a first and a second improper part discharge portions 60 and 61. After recognition of the rejection, the mistaken supply electronic part at an insert guiding part 32 is removed, and the rejection is conformed. After that in the case an aperture of a notch gap 42 locates at the position of correctly facing a transfer gap 31, the index table 40 is rotated a pitch, and a rotating condition is monitored. If there is no rotating obstruction, operation of the electronic part checking device is started. During the rotating obstruction the electronic part checking device is maintained under an operation stopping condition, an alarming is generated, and checking and repairing by a manual work are performed. Thereby productivity is largely enhanced.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、電子部品検査装
置に関する。
The present invention relates to an electronic component inspection device.

【0002】[0002]

【従来の技術】従来、製造工程が終了したチップ型の電
子部品を、個別的に外形及び電気的な規格等に適合して
いるか否かの良否判別を行い、不良品を排除し、良品の
みを次の包装工程に送る電子部品検査装置があり、同電
子部品検査装置は、多数の切欠溝を形成したインデック
ステーブルを具備して、同切欠溝に電子部品を一個づつ
着脱自在に挿入して、外形及び電気的な規格等に適合し
ているか否かの良否判別を行い、不良品を排除し、良品
のみを包装工程に送るようにしている。
2. Description of the Related Art Conventionally, a chip-type electronic component, whose manufacturing process has been completed, is individually judged as to whether or not it conforms to the external shape and electrical standards. There is an electronic component inspection device that sends the next packaging process, the electronic component inspection device is equipped with an index table formed with a number of notched grooves, electronic components are inserted into the notched grooves detachably one by one. In addition, it is determined whether or not the product conforms to the external shape and the electrical standard, so that defective products are eliminated and only non-defective products are sent to the packaging process.

【0003】即ち、製造工程を経た電子部品は、まずパ
ーツフィーダに投入され、同パーツフィーダで一列に整
列させ、挿入ガイド部を介してインデックステーブルの
外周に形成した切欠溝に一個づつ挿入する。この際、割
れやメッキカス付着や寸法不揃い等の外形的な不良品が
あると、この不良品は、パーツフィーダの終端に設けた
挿入ガイド部で除去されて、爾後の作業に支障のないよ
うにしている。
That is, the electronic components that have undergone the manufacturing process are first put into a parts feeder, aligned in a line with the parts feeder, and inserted one by one into a cutout groove formed on the outer periphery of the index table via an insertion guide. At this time, if there are external defects such as cracks, adhesion of plating residue, irregular dimensions, etc., these defects are removed by the insertion guide provided at the end of the parts feeder so that subsequent operations will not be hindered. ing.

【0004】また、インデックステーブルの外周縁近傍
には、上流側に電子部品の電気的特性が規格に適合して
いるか否かを判別する良否判別部を配設し、下流側に不
良品排出部を配設しており、良否判別部で検出された不
良品は、不良品排出部にさしかかった際に、それまで切
欠溝中に電子部品を保持するために作用させていた負圧
をブローに切換えて、切欠溝から排出・除去するように
している。
[0004] In the vicinity of the outer peripheral edge of the index table, a pass / fail judging section for judging whether or not the electric characteristics of the electronic component conforms to the standard is disposed on the upstream side, and a defective product discharging section is located on the downstream side. When the defective product detected by the pass / fail determination unit reaches the defective product discharge unit, the negative pressure that had been applied to hold the electronic components in the notched groove was blown. It is switched so that it is discharged and removed from the notch groove.

【0005】[0005]

【発明が解決しようとする課題】ところが、上述した不
良品の排出等が円滑に行われない場合は、図9で示すよ
うに、インデックステーブルaと不良品排出部の部材b
との間に電子部品tが挟まって、インデックステーブル
aの回転が阻止されて作業が中断し、作業を再開するに
は、手作業で挟まった電子部品tを排除せねばならず、
作業能率が低下するばかりでなく、多くの人手を要する
という問題があった。
However, if the above-described defective product is not discharged smoothly, as shown in FIG. 9, the index table a and the member b of the defective product discharge section are used.
The electronic component t is caught in between, the rotation of the index table a is prevented, the work is interrupted, and in order to resume the work, the electronic component t caught by hand must be removed.
There is a problem that not only the work efficiency is reduced but also a large amount of labor is required.

【0006】特に、前述したように、電子部品tの排出
・除去が負圧とブローの切換えによって行われるので、
一旦、不良品の排出・除去のためにブローを行うと、電
子部品を保持するための負圧が作用するまでのタイムラ
グがあり、次に不良品排出部にさしかかった電子部品の
位置及び姿勢が不安定になり、インデックステーブルの
回転阻止が起こりやすいという問題がある。
In particular, as described above, the discharge and removal of the electronic component t is performed by switching between negative pressure and blow.
Once a blow is performed to discharge and remove defective products, there is a time lag until negative pressure is applied to hold the electronic components, and then the position and attitude of the electronic components approaching the defective product discharge section There is a problem that it becomes unstable and the rotation of the index table is likely to be prevented.

【0007】[0007]

【課題を解決するための手段】この発明では、電子部品
を一個づつ収納可能の切欠溝を多数形成したインデック
ステーブルを具備し、同インデックステーブルの回転に
より、切欠溝に収納した電子部品を搬送しながら、この
電子部品が規格に適合しているか否かを判別し、不良品
が不良品排出部にさしかかった際に、同不良品を上記切
欠溝から除去すべく構成した電子部品検査装置におい
て、上記インデックステーブルの回転が阻止された場
合、上記不良品排出部にさしかかった電子部品を自動的
に除去して、インデックステーブルの回転を再開すべく
構成したことを特徴とする電子部品検査装置を提供せん
とするものである。
According to the present invention, there is provided an index table in which a plurality of notch grooves capable of storing electronic components one by one are formed, and the electronic components stored in the notch grooves are conveyed by rotating the index table. Meanwhile, in the electronic component inspection device configured to determine whether or not this electronic component conforms to the standard, and to remove the defective product from the cutout groove when the defective product reaches the defective product discharge portion, When the rotation of the index table is stopped, an electronic component that has reached the defective product discharge section is automatically removed, and the rotation of the index table is restarted. It is something you want to do.

【0008】[0008]

【発明の実施の形態】本実施の形態では、上述したイン
デックステーブルの回転阻止状態を検出すると、不良品
排出部にさしかかった電子部品を切欠溝からブローによ
って排出し、インデックステーブルを1ピッチ回転させ
て、排出ワークの除去確認ができ、かつ、インデックス
テーブルの原点(定位置)を確認できれば、インデック
ステーブルを回転可能として作業を再開し、上記障害除
去が確実に行われていない場合は、警報を発して、この
旨をオペレータに報知し、手作業による修復を促すよう
にしており、このようにしたことで、インデックステー
ブルの回転が阻止された際、約50%が自動的に復旧し
て作業を継続することができ、生産性と省力化を大幅に
向上させることができる。
DESCRIPTION OF THE PREFERRED EMBODIMENTS In this embodiment, when the above-mentioned rotation preventing state of the index table is detected, the electronic component approaching the defective product discharging section is discharged from the notch groove by blowing, and the index table is rotated by one pitch. If the removal of the discharge work can be confirmed and the origin (fixed position) of the index table can be confirmed, the index table can be rotated and the operation resumed. If the obstacle has not been removed reliably, an alarm is issued. The operator is notified of this and prompts the operator to perform a manual repair. By doing so, when the rotation of the index table is stopped, about 50% of the work is automatically restored. Can be continued, and productivity and labor saving can be greatly improved.

【0009】[0009]

【実施例】この発明の実施例を図面にもとづき詳説す
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in detail with reference to the drawings.

【0010】図1において、Aは製造工程から搬送され
てきた電子部品Tをテーピングするテーピング包装装置
である。Bは電子部品Tを包装したテープの編集を行う
編集装置である。Dは電子部品検査装置であって、テー
ピング包装装置A中に組込まれており、上記完成電子部
品をテーピング包装する前に、予め不良部品を除去し
て、不良品が出荷されないようにしておくものである。
Cは上記各装置A,B,D の作動を制御するためのコンピュ
ータを内蔵した制御装置である。
In FIG. 1, reference numeral A denotes a taping and packaging apparatus for taping an electronic component T transported from a manufacturing process. B is an editing device for editing a tape wrapping the electronic component T. D is an electronic component inspection device that is incorporated in the taping and packaging device A and that removes defective components in advance before taping and packaging the completed electronic component so that defective products are not shipped. It is.
C is a control device having a built-in computer for controlling the operation of each of the devices A, B, and D.

【0011】テーピング包装装置Aは、図1〜図3で示
すように、パーツフィーダ1と、電子部品検査装置Dと
テーピング包装部2とに接続しており、パーツフィーダ
1は中央部に配設したターンテーブル11の周縁に沿って
ギャラリ12を配置し、同ギャラリ12の終端に、搬送溝31
を形成した搬送樋30の始端を接続して、ターンテーブル
11上に投入された多数の電子部品Tを一定姿勢で一列に
整列させて、次工程の電子部品検査装置Dに搬送するよ
うにしている。図1中、13はターンテーブル11に電子部
品Tを供給するためのホッパである。
As shown in FIGS. 1 to 3, the taping and packaging apparatus A is connected to a parts feeder 1, an electronic component inspection apparatus D and a taping and packaging section 2, and the parts feeder 1 is disposed at the center. The gallery 12 is arranged along the periphery of the turntable 11 and the transport groove 31 is provided at the end of the gallery 12.
Connect the start end of the transfer gutter 30 with the
A large number of electronic components T loaded on 11 are arranged in a line in a fixed posture, and are conveyed to an electronic component inspection device D in the next step. In FIG. 1, reference numeral 13 denotes a hopper for supplying an electronic component T to the turntable 11.

【0012】搬送樋30の終端には、後述するインデック
ステーブル40の周縁に臨ませて配置した挿入ガイド部32
を連設しており、同挿入ガイド部32は、搬送溝31の終端
部を形成する終端ガイド壁33の一方を横方向にスライド
可能とし、挿入ガイド部32の底壁に、終端ガイド壁33の
スライドにより開閉する不良品吸入孔63を設け、同不良
品吸入孔63を吸引ホース64を介して不良品回収装置(図
示せず)を介して真空ポンプ(図示せず)に接続して、
同挿入ガイド部32に、割れ、寸法不揃い、メッキカス付
着等の外形的不良品T1がさしかかった際に、終端ガイド
壁33をスライドさせて外形的不良品T1の挟持を緩め、真
空ポンプからの負圧により不良品吸入孔63から外形的不
良品T1を排除して、切欠溝42に供給しないようにしてい
る。
At the end of the transport gutter 30, an insertion guide portion 32 arranged facing a peripheral edge of an index table 40 described later.
The insertion guide portion 32 allows one of the end guide walls 33 forming the end portion of the transport groove 31 to be slidable in the horizontal direction, and the bottom end wall of the insertion guide portion 32 has A defective product suction hole 63 that is opened and closed by sliding is provided, and the defective product suction hole 63 is connected to a vacuum pump (not shown) through a suction hose 64 via a defective product collection device (not shown),
When an externally defective product T1 such as a crack, irregular dimensions, or adhesion of plating residue is approaching the insertion guide portion 32, the terminal guide wall 33 is slid to loosen the externally defective product T1, and the negative pressure from the vacuum pump is reduced. The externally defective T1 is removed from the defective product suction hole 63 by the pressure so as not to be supplied to the notch groove.

【0013】インデックステーブル40は、図2〜図5で
示すように、テーブル本体41の周縁部に電子部品Tを1
個だけ収納できる切欠溝42を多数形成し、間欠回転する
インデックステーブル40の一時停止時に、同切欠溝42の
開口部を前記搬送溝31に正対させ、搬送溝31からの電子
部品Tを切欠溝42中に収納するようにしている。
As shown in FIGS. 2 to 5, the index table 40 includes one electronic component T at the periphery of the table body 41.
A large number of notch grooves 42 that can be stored therein are formed, and when the index table 40 intermittently rotates, the opening of the notch groove 42 is directly opposed to the transfer groove 31 so that the electronic component T from the transfer groove 31 is cut out. It is stored in the groove 42.

【0014】また、インデックステーブル40の周縁に
は、図3で示すように、回転方向に従って、第1電気的
良否判別部50、第2電気的良否判別部51、第1不良品排
出部60、確認部52、第2不良品排出部61及びテーピング
包装部2の良品排出部21を、上記の順で配設しており、
第1・第2電気的良否判別部50,51 で検出した電気的不
良品T2を第1不良品排出部60から排出し、更に確認部52
で検出した電気的不良品T2を第2不良品排出部61から排
出して、良品のみを良品排出部21を介し、テーピング包
装部2中を走行するテープ22上に落下させ、テーピング
包装して編集装置Bに送るようにしている。
On the periphery of the index table 40, as shown in FIG. 3, according to the direction of rotation, a first electrical good / bad determining unit 50, a second electrical good / bad determining unit 51, a first defective product discharging unit 60, The checking unit 52, the second defective product discharging unit 61, and the non-defective product discharging unit 21 of the taping and packaging unit 2 are arranged in the above order.
The electrically defective product T2 detected by the first and second electrical acceptability determining units 50 and 51 is discharged from the first defective product discharging unit 60, and furthermore, the checking unit 52
The electrically defective product T2 detected in step 2 is discharged from the second defective product discharge unit 61, and only the non-defective product is dropped onto the tape 22 running in the taping packaging unit 2 via the non-defective product discharge unit 21, and the tape is wrapped. It is sent to the editing device B.

【0015】第1・第2不良品排出部60,61 は、図4及
び図5で示すように、インデックステーブル40の周縁部
下面に摺接した底壁66の切欠溝42の通過軌跡の直下位置
に、下方向に延出した不良品排出孔65を形成すると共
に、インデックステーブル40の周縁部上面に摺接した上
壁67の切欠溝42の通過軌跡の直上位置に吸排気口68を開
口させ、同吸排気口68を二又状に分岐した吸排気孔69を
介して真空ポンプ(図示せず)とコンプレッサ(図示せ
ず)とに連通させている。
As shown in FIGS. 4 and 5, the first and second defective product discharging portions 60 and 61 are located immediately below the locus of passage of the cutout groove 42 of the bottom wall 66 slidably contacting the lower surface of the peripheral portion of the index table 40. A defective product discharge hole 65 extending downward is formed at the position, and an intake / exhaust port 68 is opened at a position immediately above the passage locus of the notch groove 42 of the upper wall 67 slidably contacting the upper surface of the peripheral portion of the index table 40. The suction / exhaust port 68 communicates with a vacuum pump (not shown) and a compressor (not shown) through a bifurcated intake / exhaust hole 69.

【0016】そして、電気的不良品T2が各不良品排出部
60,61 にさしかかった際に、それまで電子部品Tを保持
するために吸排気口68に作用させていた真空ポンプから
の負圧を、コンプレッサからのブローに切換えて、切欠
溝42から不良品排出孔65を介し外部に排出・除去するよ
うにしている。
Then, the electrically defective product T2 is output to each defective product discharging section.
When approaching 60, 61, the vacuum pressure from the vacuum pump, which had been acting on the intake / exhaust port 68 to hold the electronic component T, was switched to blow from the compressor, and the defective It is discharged and removed to the outside through the discharge hole 65.

【0017】図5及び図6は、各不良品排出部60,61 の
他の実施例を示しており、前記不良品排出孔65をインデ
ックステーブル40の周縁からやや離隔した位置の底壁66
に形成し、吸排気孔69を切欠溝42の通過軌跡の直下位置
の底壁66に開口させて、電気的不良品T2が各不良品排出
部60,61 にさしかかった際に、それまで電子部品Tを保
持するために吸排気口68に作用させていた真空ポンプか
らの負圧を、コンプレッサからのブローに切換えて、切
欠溝42から不良品排出孔65を介し外部に排出・除去する
ようにしている。
FIGS. 5 and 6 show another embodiment of the defective product discharging portions 60 and 61. The defective product discharging hole 65 is located at a position slightly away from the periphery of the index table 40 at the bottom wall 66.
When the electrically defective product T2 reaches each of the defective product discharge portions 60 and 61, the electronic component is not opened until the intake / exhaust hole 69 is opened in the bottom wall 66 immediately below the passage locus of the cutout groove 42. The negative pressure from the vacuum pump acting on the suction / exhaust port 68 to maintain T is switched to the blow from the compressor, and is discharged and removed from the notch groove 42 to the outside through the defective product discharge hole 65. ing.

【0018】このように、電気的不良品T2の排除が負圧
からブローへの切換えによって行われるので、ある程度
の確率で不良品除去動作が完璧に行われないことがあ
り、また、電子部品Tの保持が上記とは逆の切換えによ
って行われるので、次の電子部品Tの切欠溝42に対する
位置及び姿勢が不安定になり、切欠溝42と隣接部材との
間に電子部品Tが挟まって、インデックステーブル40の
回転が阻止されることがある。
As described above, since the rejection of the electrically defective product T2 is performed by switching from the negative pressure to the blow, the operation of removing the defective product may not be perfectly performed with a certain probability. Is carried out by switching opposite to the above, the position and posture of the next electronic component T with respect to the notch groove 42 become unstable, and the electronic component T is sandwiched between the notch groove 42 and the adjacent member. The rotation of the index table 40 may be prevented.

【0019】しかし、前述した不良品除去動作と全く同
一の障害除去動作を行うだけで、インデックステーブル
40の回転阻止状態が、高い確率で解消されることが実験
により確認されている。
However, only by performing the same fault removal operation as the above-described defective product removal operation, the index table
It has been experimentally confirmed that 40 rotation inhibition states are eliminated with high probability.

【0020】そこで、本実施例では、制御装置C中のコ
ンピュータに、図6のフローチャートで示す障害除去サ
ブルーチンを設定して、電子部品検査装置Dの作動を制
御するようにしている。
Therefore, in the present embodiment, the operation of the electronic component inspection apparatus D is controlled by setting a failure removal subroutine shown in the flowchart of FIG.

【0021】即ち、電子部品検査装置Dの作動を制御す
るメインルーチン中に、インデックステーブル40の回転
状態を監視する条件分岐を設け、インデックステーブル
40の回転阻止が発生すると(101) 、電子部品検査装置D
の作動を一時停止し(102) 、第1・第2不良品排出部6
0,61 から排出ミス電子部品の除去を行い(103) 、除去
が確認されると(104Y)、挿入ガイド部32の供給ミス電子
部品の除去を行い(105)、この除去が確認されると(106
Y)、インデックステーブル40が原点、即ち、切欠溝42の
開口部が前記搬送溝31に正確に対向した位置にある場合
は(107Y)、インデックステーブル40を1ピッチだけ回転
させ(108) 、インデックステーブル40の回転状態を監視
し(109) 、回転阻止がなければ(109N)、電子部品検査装
置Dの作動を開始して(110) 、メインルーチンにリター
ンする。
That is, in the main routine for controlling the operation of the electronic component inspection apparatus D, a conditional branch for monitoring the rotation state of the index table 40 is provided.
When rotation inhibition of 40 occurs (101), the electronic component inspection device D
Is temporarily stopped (102), and the first and second defective product discharging units 6 are stopped.
At 0,61, the electronic component with the wrong ejection is removed (103), and when the removal is confirmed (104Y), the electronic component with the wrong supply of the insertion guide portion 32 is removed (105), and when the removal is confirmed. (106
Y), when the index table 40 is at the origin, that is, when the opening of the notch groove 42 is at a position exactly facing the conveyance groove 31 (107Y), the index table 40 is rotated by one pitch (108), The rotation state of the table 40 is monitored (109), and if there is no rotation inhibition (109N), the operation of the electronic component inspection device D is started (110), and the process returns to the main routine.

【0022】また、ステップ(104)(106)において障害電
子部品の除去が確認されなかった場合(104N)(106N)、ス
テップ(107) においてインデックステーブル40が原点に
ない場合は(107N)、及びステップ(109) において回転が
阻止されていれば(109Y)、電子部品検査装置Dの作動停
止状態を保持すると共に警報を作動させて(111) 、手作
業による点検と修復を待つようにしている。
In steps (104) and (106), if removal of the failed electronic component is not confirmed (104N) (106N), in step (107), if the index table 40 is not at the origin (107N), and If the rotation is stopped in step (109) (109Y), the electronic component inspection apparatus D is kept in an operation stop state and an alarm is activated (111) to wait for manual inspection and repair. .

【0023】このように、インデックステーブル40の回
転阻止を常時監視し、回転阻止が発生した場合は、電子
部品検査装置Dの作動を停止して、インデックステーブ
ル40回転の障害となる電子部品を除去し、この除去状態
とインデックステーブル40の停止位置とを確認して、正
常であれば、自動的に作業を再開し、正常でなければ、
警報を作動させるようにしているので、生産性を大幅に
高めることができ、しかも、手作業による点検・修復作
業を大幅に省力化できる。
As described above, the prevention of the rotation of the index table 40 is constantly monitored, and when the rotation is prevented, the operation of the electronic component inspection device D is stopped to remove the electronic components that hinder the rotation of the index table 40. Then, the removal state and the stop position of the index table 40 are checked, and if normal, the operation is automatically resumed.
Since the alarm is activated, the productivity can be greatly increased, and the manual inspection and repair work can be greatly reduced.

【0024】[0024]

【発明の効果】本発明によれば次のような効果を得るこ
とができる。
According to the present invention, the following effects can be obtained.

【0025】請求項1記載の発明では、電子部品を一個
づつ収納可能の切欠溝を多数形成したインデックステー
ブルを具備し、同インデックステーブルの回転により、
切欠溝に収納した電子部品を搬送しながら、この電子部
品が規格に適合しているか否かを判別し、不良品が不良
品排出部にさしかかった際に、同不良品を上記切欠溝か
ら除去すべく構成した電子部品検査装置において、上記
インデックステーブルの回転が阻止された場合、上記不
良品排出部にさしかかった電子部品を自動的に除去し
て、インデックステーブルの回転を再開すべく構成した
ことによって、作業再開に要する時間を大幅に短縮して
生産性が向上し、手作業による修復を要しないことか
ら、大幅な省力化を図ることができる。
According to the first aspect of the present invention, there is provided an index table having a large number of notched grooves capable of accommodating electronic components one by one, and by rotating the index table,
While transporting the electronic components stored in the notch groove, it is determined whether this electronic component conforms to the standard, and when the defective product reaches the defective product discharge section, the defective product is removed from the notch groove In the electronic component inspection device configured to be configured, when the rotation of the index table is prevented, the electronic component approaching the defective product discharge unit is automatically removed, and the rotation of the index table is restarted. Accordingly, the time required for resuming the work is greatly reduced, the productivity is improved, and the need for manual repair is eliminated, so that significant labor savings can be achieved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る電子部品検査装置を具備するテー
ピング包装及び編集装置の全体図。
FIG. 1 is an overall view of a taping packaging and editing device including an electronic component inspection device according to the present invention.

【図2】電子部品供給装置の構成を示す斜視説明図。FIG. 2 is a perspective explanatory view showing a configuration of an electronic component supply device.

【図3】インデックステーブル回りの配置を示す平面説
明図。
FIG. 3 is an explanatory plan view showing an arrangement around an index table.

【図4】第1・第2不良品排出部の構成を示す一部断面
平面図。
FIG. 4 is a partial cross-sectional plan view illustrating a configuration of first and second defective product discharge units.

【図5】第1・第2不良品排出部の構成を示す一部断面
側面図。
FIG. 5 is a partial cross-sectional side view showing a configuration of first and second defective product discharge units.

【図6】第1・第2不良品排出部の構成を示す一部断面
平面図(他実施例)。
FIG. 6 is a partial cross-sectional plan view showing another configuration of the first and second defective product discharge units (other examples).

【図7】第1・第2不良品排出部の構成を示す一部断面
側面図(他実施例)。
FIG. 7 is a partial cross-sectional side view showing a configuration of first and second defective product discharge units (another embodiment).

【図8】障害除去動作のフローチャート。FIG. 8 is a flowchart of a failure removal operation.

【図9】インデックステーブルの回転阻止状態を示す平
面説明図。
FIG. 9 is an explanatory plan view showing a rotation preventing state of the index table.

【符号の説明】[Explanation of symbols]

D 電子部品検査装置 T 電子部品 T2 電気的不良品 40 インデックステーブル 42 切欠溝 60,61 不良品排出部 D Electronic component inspection device T Electronic component T2 Electrically defective product 40 Index table 42 Notch groove 60,61 Defective product discharge section

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 電子部品を一個づつ収納可能の切欠溝を
多数形成したインデックステーブルを具備し、同インデ
ックステーブルの回転により、切欠溝に収納した電子部
品を搬送しながら、この電子部品が規格に適合している
か否かを判別し、不良品が不良品排出部にさしかかった
際に、同不良品を上記切欠溝から除去すべく構成した電
子部品検査装置において、 上記インデックステーブルの回転が阻止された場合、上
記不良品排出部にさしかかった電子部品を自動的に除去
して、インデックステーブルの回転を再開すべく構成し
たことを特徴とする電子部品検査装置。
An index table having a plurality of notch grooves capable of accommodating electronic components one by one is provided. By rotating the index table, the electronic components accommodated in the notch grooves are conveyed to a standard. In the electronic component inspection device configured to determine whether or not the defective product is defective and to remove the defective product from the cutout groove when the defective product reaches the defective product discharge unit, the rotation of the index table is prevented. An electronic component inspection device configured to automatically remove the electronic component approaching the defective product discharge section and restart the rotation of the index table.
JP10085227A 1998-03-31 1998-03-31 Electronic part checking device Pending JPH11283814A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10085227A JPH11283814A (en) 1998-03-31 1998-03-31 Electronic part checking device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10085227A JPH11283814A (en) 1998-03-31 1998-03-31 Electronic part checking device

Publications (1)

Publication Number Publication Date
JPH11283814A true JPH11283814A (en) 1999-10-15

Family

ID=13852692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10085227A Pending JPH11283814A (en) 1998-03-31 1998-03-31 Electronic part checking device

Country Status (1)

Country Link
JP (1) JPH11283814A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100460523B1 (en) * 2002-03-08 2004-12-08 김광렬 chip examination method
JP2007161464A (en) * 2005-12-16 2007-06-28 Tokyo Weld Co Ltd Work carrying device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100460523B1 (en) * 2002-03-08 2004-12-08 김광렬 chip examination method
JP2007161464A (en) * 2005-12-16 2007-06-28 Tokyo Weld Co Ltd Work carrying device

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