JPH11277531A - Prepreg and production of multilayer printed-wiring board using the prepreg - Google Patents
Prepreg and production of multilayer printed-wiring board using the prepregInfo
- Publication number
- JPH11277531A JPH11277531A JP8763098A JP8763098A JPH11277531A JP H11277531 A JPH11277531 A JP H11277531A JP 8763098 A JP8763098 A JP 8763098A JP 8763098 A JP8763098 A JP 8763098A JP H11277531 A JPH11277531 A JP H11277531A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- wiring board
- printed wiring
- multilayer printed
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000011347 resin Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 238000000465 moulding Methods 0.000 claims abstract description 13
- 239000000470 constituent Substances 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリプレグ及びこ
のプリプレグを用いる多層プリント配線板の製造方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a prepreg and a method for manufacturing a multilayer printed wiring board using the prepreg.
【０００２】[0002]
【従来の技術】プリント配線板は、それを搭載する機器
の小型化や高機能化などにより、近年では付加価値の高
いものが要求されている。その結果、従来主として産業
分野に使用されていた多層プリント配線板が民生分野で
も採用されており、その需要は今後も増加すると見込ま
れている。2. Description of the Related Art In recent years, printed wiring boards have been required to have high added value due to the miniaturization and high functionality of devices on which the printed wiring boards are mounted. As a result, multilayer printed wiring boards, which were conventionally used mainly in the industrial field, have been adopted in the consumer field, and demand for them is expected to increase in the future.
【０００３】多層プリント配線板は、回路を形成したプ
リント配線板を内層に有するプリント配線板であり、構
成材間にプリプレグを介して加熱加圧して製造される。
例えば、４層プリント配線板は、両面銅張積層板に回路
加工を施して製造された両面プリント配線板の両面にプ
リプレグを介して銅はくを重ね、加熱加圧し、最後に外
層の銅はくをエッチングして回路を形成して製造され
る。また、片面に回路加工を施した両面銅張積層板２枚
を、回路加工面を内側にしてプリプレグを介して重ね、
加熱加圧し、外側の銅はくをエッチングして回路を形成
する４層プリント配線板の製造方法も出現している。ま
た、加熱加圧成形は、構成材とプリプレグとを組み合わ
せた組み合わせ体の複数組をプレス熱盤間に装填するよ
うにしている。A multilayer printed wiring board is a printed wiring board having a printed wiring board on which a circuit is formed as an inner layer, and is manufactured by applying heat and pressure between constituent materials via a prepreg.
For example, for a four-layer printed wiring board, a copper foil is laminated via a prepreg on both sides of a double-sided printed wiring board manufactured by applying circuit processing to a double-sided copper-clad laminate, and heated and pressed. It is manufactured by etching a circuit to form a circuit. Also, two double-sided copper-clad laminates with circuit processing on one side are stacked via a prepreg with the circuit processing surface inside,
A method for manufacturing a four-layer printed wiring board has been developed in which a circuit is formed by heating and pressing and etching the outer copper foil. In the heat and pressure forming, a plurality of sets of a combination of components and prepregs are loaded between press hot plates.
【０００４】[0004]
【発明が解決しようとする課題】多層プリント配線板の
製造に使用されるプリプレグは、成形時に内層回路パタ
ーンの凹みを埋める必要があることから、加熱溶融時の
樹脂流れが必要である。ところが、プレス成形装置は、
溶融した樹脂が外周縁への流出を抑えるような構造とな
っていないため、溶融した樹脂の一部がはみ出して硬化
する。このはみ出しは、一般に辺の中央付近が最も大き
く４隅に近づくにつれて徐々に小さくなる凸円弧状とな
る。すなわち、プレス成形後の多層プリント配線板３は
図２に点線で示す形状ではなく、実線で示すように辺４
が凸円弧状となった形状となる。そして、このはみ出し
が大きくなると、上下の組み合わせ体同士が接合した
り、鏡板と接合して分離が困難になることがあった。ま
た、はみ出しが凸円弧状となるため、仕上げ工程で周縁
を切断するときに規定寸法通りに仕上げるための位置合
わせが困難となるという問題もあった。A prepreg used for manufacturing a multilayer printed wiring board needs to fill a recess of an inner circuit pattern at the time of molding, and therefore requires a resin flow during heating and melting. However, press forming equipment
Since the resin does not have a structure that suppresses the flow of the molten resin to the outer peripheral edge, a part of the molten resin protrudes and hardens. This protrusion generally has a convex arc shape that is largest near the center of the side and gradually decreases as approaching the four corners. That is, the multilayer printed wiring board 3 after press molding is not in the shape shown by the dotted line in FIG.
Has a convex arc shape. If the protrusion is large, the upper and lower combined bodies may be joined to each other or may be joined to the end plate to make separation difficult. Further, since the protrusion has a convex arc shape, there is also a problem that it is difficult to perform positioning for finishing to a specified size when cutting the peripheral edge in the finishing step.
【０００５】請求項１に記載の発明は、加熱成形時のは
み出しを少なくしたプリプレグを提供することを目的と
する。また、請求項２に記載の発明は、加熱成形時のは
み出し少なく、かつ、辺４が凸円弧状となることのない
多層プリント配線板３の製造方法を提供することを目的
とする。[0005] An object of the present invention is to provide a prepreg with less protrusion during heat molding. It is another object of the present invention to provide a method for manufacturing a multilayer printed wiring board 3 with less protrusion during heat molding and without the sides 4 having a convex arc shape.
【０００６】[0006]
【課題を解決するための手段】請求項１に記載の発明
は、成形時の樹脂流れにより変形して成形後の形状が長
方形状となるように辺１を凹円弧状に形成してなるプリ
プレグ２である（図１参照）。辺１を図１の実線で示す
ように凹円弧状に形成すると、成形後に点線で示すよう
に変形するから、はみ出しを少なくすることができる。According to a first aspect of the present invention, there is provided a prepreg in which a side 1 is formed in a concave arc shape so that the shape after molding is deformed by a resin flow at the time of molding and becomes a rectangular shape. 2 (see FIG. 1). If the side 1 is formed in a concave arc shape as shown by a solid line in FIG. 1, the side 1 is deformed as shown by a dotted line after molding, so that the protrusion can be reduced.
【０００７】また、請求項２に記載の発明は、請求項１
に記載のプリプレグを構成材間に介して加熱加圧するこ
とを特徴とする多層プリント配線板の製造方法である。[0007] The invention described in claim 2 is the first invention.
A method for producing a multilayer printed wiring board, characterized in that the prepreg described in (1) is heated and pressed between components.
【０００８】[0008]
【発明の実施の形態】プリプレグは、一般におよそ１０
００ｍｍ四方で供給されされており、通常、需要者が必
要な寸法に加工して使用する。本発明のプリプレグを原
反プリプレグをとして用い、辺１を凹円弧状に形成する
ことにより作製される。辺１を凹円弧状に形成する手段
としては、金型による打ち抜き、ルーター加工、カッタ
ーやはさみなどの切断工具による切断などによることが
でき、特に制限はない。なかでも、必要な寸法にして同
じに辺１を凹円弧状に形成できることから金型による打
ち抜きによるのが好ましい。使用できる原反プリプレグ
には特に制限はなく、多層プリント配線板の製造におい
て、構成材間の接着に用いられているガラス布基材エポ
キシ樹脂プリプレグ、ガラス布基材ポリイミド樹脂プリ
プレグなどを使用できる。DETAILED DESCRIPTION OF THE INVENTION The prepreg is generally about 10
It is supplied in a square of 00 mm, and is usually used after being processed to a required size by a customer. It is produced by using the prepreg of the present invention as a raw prepreg and forming the side 1 in a concave arc shape. Means for forming the side 1 in a concave arc shape can be punching with a die, router processing, cutting with a cutting tool such as a cutter or scissors, and the like, and is not particularly limited. Above all, it is preferable to perform punching using a mold because the side 1 can be formed in a concave arc shape with the required dimensions. The raw prepreg that can be used is not particularly limited, and a glass cloth base epoxy resin prepreg, a glass cloth base polyimide resin prepreg, or the like used for bonding between components in the production of a multilayer printed wiring board can be used.
【０００９】凹円弧状の深さｄは、加熱加圧したときに
ほぼ直角四辺形状となるようにするのが好ましい。直角
四辺形のプリプレグを用いて多層プリント配線板を製造
したときのはみ出しを打ち消す深さとするのが最も好ま
しい。はみ出しの大きさは、プリプレグの厚さ、樹脂
分、樹脂の性質などにより異なり、さらに、構成材間に
介するプリプレグの枚数によっても異なるから、これら
の製造条件毎に定める必要がある。また、強度的観点か
ら、内層回路パターンの上にはプリプレグを構成する繊
維基材が入っている必要があり、プリプレグを構成する
繊維基材が入っていない部分は切り落として製品とす
る。凹円弧状の深さｄが大きくなると切り落とす部分も
大きくなって材料の無駄が多くなる。凹円弧状の深さｄ
が３〜１０ｍｍ程度に収まるような製造条件とするのが
好ましい。It is preferable that the depth d of the concave arc is substantially a quadrangle when heated and pressed. Most preferably, the depth is set to a value that cancels out the protrusion when a multilayer printed wiring board is manufactured using a rectangular prepreg. The size of the protrusion depends on the thickness of the prepreg, the amount of the resin, the properties of the resin, and the like, and also depends on the number of prepregs interposed between the constituent materials. Further, from the viewpoint of strength, it is necessary that a fiber base material constituting the prepreg is contained on the inner layer circuit pattern, and a portion not containing the fiber base material constituting the prepreg is cut off to obtain a product. As the depth d of the concave arc increases, the cut-out portion also increases, and waste of material increases. Concave arc-shaped depth d
Is preferably set to a production condition such that is within about 3 to 10 mm.
【００１０】本発明において多層プリント配線板を製造
するときの加熱温度、加圧力及び成形時間などの成形条
件は、従来公知の条件によることができ、特に制限はな
い。In the present invention, molding conditions such as a heating temperature, a pressing force and a molding time for producing a multilayer printed wiring board can be based on conventionally known conditions and are not particularly limited.
【００１１】[0011]
【実施例】実施例１ ガラス布基材エポキシ樹脂プリプレグ（日立化成工業株
式会社製、ＧＥＡ−６７Ｎ（商品名）の厚さ０．２ｍ
ｍ、樹脂分４５重量％、硬化時間１３０秒、樹脂流れ２
８％のグレード品を使用）を原反プリプレグとして用
い、たて３４０ｍｍ、横５１０ｍｍで各辺が深さｄが３
ｍｍの凹円弧状となるように金型により打抜き加工して
プリプレグを作製した。なお、硬化時間及び樹脂流れは
ＪＩＳ Ｃ６５２１の規定に準拠して測定されたもので
ある。厚さ０．６ｍｍ、両面銅張エポキシ樹脂積層板
（日立化成工業株式会社製、ＭＣＬ−Ｅ−６７（商品
名）を使用）に回路加工を施して作製した、たて３４０
ｍｍ、よこ５１０ｍｍの長方形状の内層材を用い、この
内層材の両面に前記で作製したプリプレグ各２枚を介し
て厚さ１８μｍ、たて３６０ｍｍ、よこ５３０ｍｍの銅
はくを重ねて１組の組み合わせ体とした。この組み合わ
せ体１０組を熱盤間に装填し、温度１７５℃、圧力３Ｍ
Ｐａで９０分間加熱加圧して４層プリント配線板板を作
製した。Example 1 Glass cloth-based epoxy resin prepreg (GEA-67N (trade name), manufactured by Hitachi Chemical Co., Ltd., having a thickness of 0.2 m)
m, resin content 45% by weight, curing time 130 seconds, resin flow 2
8% grade product) as raw prepreg, 340 mm long, 510 mm wide, and each side has a depth d of 3
A prepreg was produced by punching with a mold so as to form a concave arc of mm. The curing time and the resin flow are measured in accordance with JIS C6521. 340 mm thick, prepared by applying circuit processing to a 0.6 mm thick, double-sided copper-clad epoxy resin laminate (MCL-E-67 (trade name) manufactured by Hitachi Chemical Co., Ltd.)
mm, a rectangular inner layer material of 510 mm wide, and a copper foil of 18 μm thick, 360 mm long, 530 mm wide is laminated on both surfaces of the inner layer material through each of the two prepregs prepared above. It was a combination. 10 sets of this combined body were loaded between hot plates, and the temperature was 175 ° C. and the pressure was 3M.
Heating and pressurization was performed at Pa for 90 minutes to produce a four-layer printed wiring board.
【００１２】実施例２ 凹円弧状の深さｄが５ｍｍとなるように加工し、内層材
と銅はくとの間に得られたプリプレグ３枚を介するよう
にしたほかは実施例１と同様にして４層プリント配線板
を作製した。Example 2 Same as Example 1 except that the concave arc-shaped depth d was processed to be 5 mm and three prepregs obtained between an inner layer material and a copper foil were interposed. To produce a four-layer printed wiring board.
【００１３】比較例１ たて３４０ｍｍ、横５１０ｍｍで各辺を直線状としたプ
リプレグを使用したほかは、実施例１と同様にして４層
プリント配線板を作製した。Comparative Example 1 A four-layer printed wiring board was produced in the same manner as in Example 1 except that a prepreg having a length of 340 mm and a width of 510 mm and each side being straight was used.
【００１４】比較例２ たて３４０ｍｍ、横５１０ｍｍで各辺を直線状としたプ
リプレグを使用したほかは、実施例２と同様にして４層
プリント配線板を作製した。Comparative Example 2 A four-layer printed wiring board was produced in the same manner as in Example 2 except that a prepreg having a length of 340 mm and a width of 510 mm and each side being straight was used.
【００１５】以上で作製した４層プリント配線板につい
て、組み合わせ体相互間の接合の有無を目視で調べ、ま
た、はみ出しの大きさを測定した。その結果を表１に示
す。With respect to the four-layer printed wiring board manufactured as described above, the presence or absence of bonding between the assembled bodies was visually inspected, and the size of the protrusion was measured. Table 1 shows the results.
【００１６】[0016]
【表１】 [Table 1]
【００１７】実施例３ 原反をガラス布基材エポキシ樹脂プリプレグを日立化成
工業株式会社製、ＧＥＡ−６７Ｎ（商品名）の厚さ０．
１ｍｍ、樹脂分５５重量％、硬化時間１２８秒、樹脂流
れ３７％のグレード品に変更し、凹円弧状の深さｄが５
ｍｍとなるように金型により打抜き加工し、内層材を２
枚に増加し、内層材の間にもプリプレグを介するように
したほかは実施例１と同様にして６層プリント配線板板
を作製した。EXAMPLE 3 An epoxy resin prepreg made of a glass cloth base material was used as a raw material, and the thickness of GEA-67N (trade name) manufactured by Hitachi Chemical Co., Ltd.
1mm, resin content 55% by weight, curing time 128 seconds, resin flow 37% changed to grade grade, concave arc-shaped depth d 5
mm, and the inner layer material is
A six-layer printed wiring board was produced in the same manner as in Example 1 except that the number of sheets was increased and the prepreg was also interposed between the inner layer materials.
【００１８】実施例４ 凹円弧状の深さｄが９ｍｍとなるようにし、内層材間及
び内層材と銅はくとの間にプリプレグ各３枚を介するよ
うにしたほかは実施例３と同様にして６層プリント配線
板板を作製した。Example 4 Same as Example 3 except that the depth d of the concave arc was 9 mm, and three prepregs were interposed between the inner layer materials and between the inner layer material and the copper foil. To produce a six-layer printed wiring board.
【００１９】比較例３ たて３４０ｍｍ、横５１０ｍｍで各辺を直線状としたプ
リプレグを使用したほかは実施例３と同様にして６層プ
リント配線板を作製した。Comparative Example 3 A six-layer printed wiring board was produced in the same manner as in Example 3 except that a prepreg having a length of 340 mm and a width of 510 mm and each side being straight was used.
【００２０】比較例４ たて３４０ｍｍ、横５１０ｍｍで各辺を直線状としたプ
リプレグを使用したほかは実施例４と同様にして６層プ
リント配線板を作製した。Comparative Example 4 A six-layer printed wiring board was produced in the same manner as in Example 4 except that a prepreg having a length of 340 mm and a width of 510 mm and each side being straight was used.
【００２１】以上で作製した６層プリント配線板につい
て、組み合わせ体相互間の接合の有無を目視で調べ、ま
た、はみ出しの大きさを測定した。その結果を表２に示
す。With respect to the six-layer printed wiring board produced as described above, the presence or absence of bonding between the assembled bodies was visually inspected, and the size of the protrusion was measured. Table 2 shows the results.
【００２２】[0022]
【表２】 [Table 2]
【００２３】表１及び表２から、辺を凹円弧状に形成し
てなるプリプレグを用いることにより、はみ出しの大き
さが小さくなり、組み合わせ体相互の接合もなくなって
いることが示される。From Tables 1 and 2, it is shown that the use of the prepreg having the sides formed in a concave arc shape reduces the size of the protrusion and eliminates the connection between the combined bodies.
【００２４】[0024]
【発明の効果】本発明によれば、加熱加圧後の多層プリ
ント配線板の組み合わせ体相互間の接合をなくすること
ができ、またはみ出しも小さくすることができることか
ら、製造工程上の作業性が改善される。According to the present invention, it is possible to eliminate the joining between the combined bodies of the multilayer printed wiring boards after the heating and pressurizing, or to reduce the protrusion, thereby improving the workability in the manufacturing process. Is improved.
【図１】本発明一実施例になるプリプレグの平面図であ
る。FIG. 1 is a plan view of a prepreg according to one embodiment of the present invention.
【図２】従来の製造方法によって製造された多層プリン
ト配線板の平面図である。FIG. 2 is a plan view of a multilayer printed wiring board manufactured by a conventional manufacturing method.
１ 辺 ２ プリプレグ ３ 多層プリント配線板 ４ 辺 1 side 2 prepreg 3 multilayer printed wiring board 4 side
Claims (2)
の形状が長方形状となるように辺を凹円弧状に形成して
なるプリプレグ。1. A prepreg having sides formed in a concave arc shape so that the shape after molding is deformed by a resin flow at the time of molding and becomes a rectangular shape.
に介して加熱加圧することを特徴とする多層プリント配
線板の製造方法。2. A method for manufacturing a multilayer printed wiring board, comprising heating and pressing the prepreg according to claim 1 between constituent members.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8763098A JPH11277531A (en) | 1998-03-31 | 1998-03-31 | Prepreg and production of multilayer printed-wiring board using the prepreg |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8763098A JPH11277531A (en) | 1998-03-31 | 1998-03-31 | Prepreg and production of multilayer printed-wiring board using the prepreg |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11277531A true JPH11277531A (en) | 1999-10-12 |
Family
ID=13920304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8763098A Pending JPH11277531A (en) | 1998-03-31 | 1998-03-31 | Prepreg and production of multilayer printed-wiring board using the prepreg |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11277531A (en) |
-
1998
- 1998-03-31 JP JP8763098A patent/JPH11277531A/en active Pending
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