JPH11274243A - Tape with reinforcing plate, tape carrier with reinforcing plate and semiconductor device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a tape carrier, with which warp of a substrate can be prevented after dividing of a tape BGA prepared through a reel-to-reel process and handling operation in the case of carriage or assembly in a mounting process can be easily performed. SOLUTION: While using a reinforcing plate 5 prepared from a material compositing a crystalized carbon graphite fiber equipped with an opening at the center with non-directional carbon and a compound material laminating metal foil on these materials and a resin film having sprocket holes 2 for reel-to- reel carriage at both terminals and a semiconductor chip loading part at the center while forming a wiring pattern 4, the semiconductor chip loading part of the said resin film and the opening part of the said reinforcing plate are stuck while matching their positions so as to be located on the same central axis. In this case, the resin film forming the wiring pattern 4 can use the conventional TAB tape or resin film base material for flexible printed wiring board. While using such a tape with reinforcing plate, the semiconductor device is assembled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a tape carrier for a semiconductor device.

[0002]

2. Description of the Related Art In recent years, as electronic devices represented by personal computers and the like have been increased in density, reduced in size, and reduced in weight, semiconductor packages have also been required to have higher density, smaller size, and lighter weight. In order to meet these requirements, a ball grid array (BGA) type semiconductor package which can cope with more terminals than the conventional QFP type is beginning to be widely used.

At present, a plastic BGA using a printed circuit board as a base material is mainly used as the BGA. However,
A BGA tape that has the advantages that the semiconductor chip can be connected to the narrow-pitch inner leads by a wire bonding method, and that the reel-to-reel process can be used in mounting the semiconductor chip and the cost can be reduced. BGA is increasing. This tape BGA uses a flexible substrate in which a conductive layer is provided on a resin film as a base material.

More specifically, for example, a wiring pattern is formed on one side, and a sprocket hole for transporting in a reel-to-reel system is provided at both ends thereof, and a device hole for mounting a semiconductor chip is provided at the center thereof. A resin film substrate is used.

Using this resin film substrate as a tape BG
To manufacture A, first, a semiconductor chip is mounted in a device hole by a mounter, and one end of a wiring provided in the device hole is connected to an electrode of the semiconductor chip. Thereafter, the semiconductor chip is molded with a resin, and a solder ball is bonded to the other end of the wiring electrically connected to the electrode of the semiconductor chip.

Then, a continuous tape BGA on the resin film is cut using a punching die, and each tape BGA is cut.
Get GA.

In order to mount the tape BGA obtained as described above on a circuit board, the tape BGA is positioned so that the solder ball comes on the electrode portion of the circuit board, and reflowed.

However, such a tape BGA
However, when the tape is divided individually after mounting the semiconductor chip, the tape itself has no rigidity. Therefore, if it is used as it is, it becomes difficult to perform a handling operation at the time of transportation for mounting on a circuit board or at the time of assembly. Therefore, it is necessary to hold it with a holder or the like.

In addition, the tape is warped due to heat during solder reflow for mounting on a circuit board, and a portion where the solder ball and the wiring pattern of the circuit board do not sufficiently adhere to each other occurs. As a result, the tape BGA and the circuit A problem that an electrical signal cannot be exchanged with a wiring pattern on a substrate, that is, a so-called open failure occurs easily occurs.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to prevent a warp after individually dividing a tape BGA produced by a reel-to-reel process. An object of the present invention is to provide a tape with a reinforcing plate, a tape carrier with a reinforcing plate, a tape with a reinforcing plate BGA, and the like, which are made possible and can easily perform a handling operation when transported or assembled in a mounting process.

[0011]

A first aspect of the present invention for solving the above-mentioned problems is to provide a material in which a crystallized carbon graphite fiber having an opening at the center is made of non-directional carbon, and A reinforcing plate made of any of the composite materials laminated with foil, a wiring pattern is formed, a resin film having a sprocket hole for reel-to-reel transport at both ends, and a semiconductor chip mounting portion at the center, is used. A tape with a reinforcing plate, which is attached and positioned such that the semiconductor chip mounting portion of the resin film and the opening of the reinforcing plate are coaxial. In addition,
The resin film on which the wiring pattern is formed is a conventional T
AB tapes and resin film substrates for flexible printed wiring boards can be used. Further, as metals that can be made into a composite material, gold, silver, platinum, copper, iron, nickel, cobalt,
Molybdenum, titanium, and the like, and alloys thereof can be used.

Further, the second invention is a tape carrier with an individual reinforcing plate divided from the tape with a reinforcing plate of the first invention, and the third invention is a tape carrier with a reinforcing plate of the first invention. A semiconductor device assembled using a tape or a tape carrier with a reinforcing plate according to the second invention.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION The tape with a reinforcing plate of the present invention uses a flexible tape having a wiring pattern formed on one surface of a resin film and having sprocket holes at both ends for transporting the tape in a reel-to-reel process. Depending on the mounting method of the semiconductor chip, the tape has a device hole in the center and the connection with the semiconductor chip is performed by the lead of the wiring part formed on the tape, or the semiconductor chip is mounted on the tape and the semiconductor chip is mounted. Can be used by wire bonding between the electrode pads of the above and the pads and leads of the wiring portion provided on the tape. And such a tape can be obtained according to a conventional method.

Next, a reinforcing plate made of a material obtained by compositing a crystallized carbon graphite fiber having an opening in the center with non-directional carbon and a composite material obtained by laminating a metal foil on the material is used as a tape. The semiconductor chip mounting portion and the opening of the reinforcing plate are aligned so as to be on a concentric axis, and are attached with an adhesive. The adhesive may be any of a cold bonding type, a thermosetting type, or a thermoplastic type. Further, the adhesive may be formed in advance on the bonding surface side of the reinforcing plate or the resin film substrate.

The size and shape of the reinforcing plate may be appropriately designed according to the size and shape of the semiconductor chip to be mounted.
The thickness of the reinforcing plate can be arbitrarily selected. However, since it is desirable to keep the height of the entire package low, a thickness of 50 to 100 μm is usually used.

The tape with a reinforcing plate of the present invention is prepared in this manner. When the tape with a reinforcing plate is used, a reel-to-reel system is used in the same manner as in the method of mounting a semiconductor chip using a normal TAB tape. It is performed according to.

The tape carrier with a reinforcing plate of the present invention can be obtained by individually dividing the tape with a reinforcing plate. It is effective to use the tape carrier with a reinforcing plate of the present invention depending on the semiconductor mounting device.

A feature of the present invention is a material in which crystallized carbon graphite fibers are composited with non-directional carbon,
In addition, a reinforcing plate made of a composite material or the like obtained by laminating a metal foil on these materials is used, so that good thermal conductivity can be secured.

[0019]

Next, the present invention will be further described with reference to examples.

(Example 1) FIG. 1 shows that a resin film substrate is made of T
It is an example of the tape with a reinforcing plate of the present invention using an AB tape. FIG. 2 is a sectional view taken along line AA of FIG. FIG. 3 is a sectional view of a tape BGA prepared using the tape with a reinforcing plate of FIG.

This resin film substrate has a plurality of sprocket holes 2 and device holes 3 provided at predetermined intervals along a longitudinal direction on a long cine film-like polyimide film 1 having a width of 70 mm and a thickness of 75 microns. I have.

On the resin film 1, there is provided a wiring pattern 4 formed by etching a copper foil having a thickness of 25 microns.

A reinforcing plate 5 made of a composite material made of non-directional carbon and having a width of 35 mm, a thickness of 0.5 mm, and an opening at the center thereof is provided on the surface of the resin film substrate opposite to the wiring pattern. It is attached via an adhesive 6.

The tape with the reinforcing plate was obtained by positioning the tape using a sprocket hole while transporting the tape in a reel-to-reel system, and thermocompression bonding the reinforcing plate with an adhesive thereto. At the time of this bonding, a thermosetting adhesive is used at a temperature of 100 degrees and a pressure of 10 kg / c.
The bonding was performed under the conditions of m ² and bonding time of 1 second.

Using the obtained tape with a reinforcing plate, a semiconductor chip 7 is mounted by a reel-to-reel method, sealed with a resin 8, and then a solder ball 9 is mounted on a wiring pattern, and finally divided into individual pieces. Thus, a tape BGA was obtained.

The tape BGA thus obtained is fixed to a wiring pattern on a circuit board using a mounter.
Perform solder reflow at 230 ° C. to melt solder balls 9,
Mounted on a printed wiring board. At this time, the tape BGA had sufficient strength due to the effect of the reinforcing plate, and good handling was possible. Further, the tape did not warp due to the heat at the time of melting, and a good mounting state without open due to poor contact between the semiconductor device and the wiring pattern on the circuit board was obtained.

(Example 2) A tape with a reinforcing plate was prepared in the same manner as in Example 1 except that the reinforcing plate was made of a composite material in which crystallized carbon graphite fibers were composited with non-directional carbon and laminated with a stainless steel plate. .

A semiconductor chip is mounted on the tape with the reinforcing plate, and the electrode pads of the semiconductor chip and the leads of the corresponding wiring pattern are bonded by wire bonding and then resin-sealed. A BGA was created.

The tape BGA thus obtained is fixed to a wiring pattern on a circuit board using a mounter.
Solder reflow was performed at 230 ° C. to melt the solder balls and mounted on a printed wiring board. At this time, the tape BGA had sufficient strength due to the effect of the reinforcing plate, and good handling was possible. Further, the tape did not warp due to the heat at the time of melting, and a good mounting state without open due to poor contact between the semiconductor device and the wiring pattern on the circuit board was obtained.

(Example 3) A tape with a reinforcing plate was prepared in the same manner as in Example 1 except that the reinforcing plate was made of a composite material in which crystallized carbon graphite fibers were composited with non-directional carbon and laminated with a molybdenum plate. .

A semiconductor chip is mounted on the tape with the reinforcing plate, and the electrode pads of the semiconductor chip and the leads of the corresponding wiring patterns are bonded by wire bonding and then resin-sealed. A BGA was created.

The tape BGA thus obtained is fixed to a wiring pattern on a circuit board using a mounter.
Solder reflow was performed at 230 ° C. to melt the solder balls and mounted on a printed wiring board. At this time, the tape BGA had sufficient strength due to the effect of the reinforcing plate, and good handling was possible. Further, the tape did not warp due to the heat at the time of melting, and a good mounting state without open due to poor contact between the semiconductor device and the wiring pattern on the circuit board was obtained.

Example 4 A tape with a reinforcing plate was prepared in the same manner as in Example 1 except that the reinforcing plate was made of a composite material in which crystallized carbon graphite fibers were composited with non-directional carbon and laminated with a nickel plate. .

A semiconductor chip is mounted on the tape with the reinforcing plate, and the electrode pads of the semiconductor chip and the leads of the corresponding wiring patterns are bonded by wire bonding and then resin-sealed. A BGA was created.

The tape BGA thus obtained is fixed to a wiring pattern on a circuit board using a mounter.
Solder reflow was performed at 230 ° C. to melt the solder balls and mounted on a printed wiring board. At this time, the tape BGA had sufficient strength due to the effect of the reinforcing plate, and good handling was possible. Further, the tape did not warp due to the heat at the time of melting, and a good mounting state without open due to poor contact between the semiconductor device and the wiring pattern on the circuit board was obtained.

Example 5 A tape carrier with a reinforcing plate was prepared in the same manner as in Example 1 except that the reinforcing plate was made of a composite material in which crystallized carbon graphite fibers were composited with non-directional carbon and gold foil was laminated on both sides. Created.

A semiconductor chip is mounted on this tape carrier with a reinforcing plate, and the electrode pads of the semiconductor chip and the leads of the corresponding wiring pattern are bonded by wire bonding and then resin-sealed. Tape BG
A was created.

The tape BGA thus obtained is fixed to a wiring pattern on a circuit board using a mounter.
Solder reflow was performed at 230 ° C. to melt the solder balls and mounted on a printed wiring board. At this time, the tape BGA had sufficient strength due to the effect of the reinforcing plate, and good handling was possible. Further, the tape did not warp due to the heat at the time of melting, and a good mounting state without open due to poor contact between the semiconductor device and the wiring pattern on the circuit board was obtained.

Example 6 A tape with a reinforcing plate was prepared in the same manner as in Example 1. After that, cut into 100 pieces
Zero tape carriers with a reinforcing plate were obtained.

Positioning is performed using the wiring portion of the tape carrier with the reinforcing plate, a semiconductor chip is mounted in a device hole in the center, and each electrode of the semiconductor chip and a lead of the wiring portion protruding into the device hole. Were bonded with a resin and sealed with a resin, and then a solder ball was mounted on the wiring pattern to obtain a tape BGA.

The tape BGA thus obtained is fixed to a wiring pattern on a circuit board using a mounter.
Solder reflow was performed at 230 ° C. to melt the solder balls and mounted on a printed wiring board. During the production of the tape BGA, of course, sufficient strength was obtained due to the effect of the reinforcing plate during mounting on the printed wiring board, and good handling was possible. Further, the tape did not warp due to the heat at the time of melting, and a good mounting state without open due to poor contact between the semiconductor device and the wiring pattern on the circuit board was obtained.

[0042]

According to the tape carrier with a reinforcing plate of the present invention, a sufficient strength can be obtained in the film carrier by the effect of the reinforcing plate. Therefore, when the tape carrier on which the semiconductor chip is mounted is divided individually, a special holder is required. It is not necessary to hold and transport the device, and it is possible to prevent an open defect due to heat before mounting on a circuit board.

In addition, a material in which the crystallized carbon graphite fiber used is composited with non-directional carbon,
In addition, a composite material or the like obtained by laminating a metal foil on these materials has good thermal conductivity and can efficiently radiate heat generated by the semiconductor chip.

[Brief description of the drawings]

FIG. 1 is an example of a tape carrier with a reinforcing plate of the present invention using a TAB tape as a resin film base.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a sectional view of a tape BGA produced using the tape carrier with a reinforcing plate of FIG. 2;

[Explanation of symbols]

 1 ---- Polyimide film 2--Sprocket hole 3--Device hole 4--Wiring pattern 5--Reinforcing plate 6 ---- Adhesive 7 ---- Semiconductor chip 8 ---- Resin 9- -Solder ball

Claims (3)

[Claims] 1. A reinforcing plate made of a material obtained by compositing a crystallized carbon graphite fiber having an opening in the center with non-directional carbon, and a composite material obtained by laminating a metal foil on the material. A resin film having a wiring pattern formed thereon, a sprocket hole for reel-to-reel conveyance at both ends, and a resin film having a semiconductor chip mounting portion in the center, and a semiconductor chip mounting portion of the resin film and an opening of the reinforcing plate. Is a tape with a reinforcing plate that is attached and positioned so that it is on a concentric axis. 2. A tape carrier with a reinforcing plate, obtained by dividing the tape with a reinforcing plate according to claim 1. 3. A semiconductor device assembled using the tape with a reinforcing plate according to claim 1 or the tape carrier with a reinforcing plate according to claim 2.