JPH11274189A - Method and apparatus for sealing mounted electronic component unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and apparatus for sealing a unit of mounted electronic components which is effective for uniformizing the resin charging rate. SOLUTION: First, this apparatus executes a resin coating step S10 of coating resin on one side face of an electronic component mounted on a substrate, resin heating step S12 of heating the coated resin, gap pressure reducing step S14 of reducing the pressure in the gap between the electronic component and substrate from a side face other than the resin coated face, and resin charging step S16 of filling the gap with a resin sucked by the reduced pressure.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a device for sealing an electronic component mounted body, and more particularly to a method and a device for sealing an electronic component mounted body which are effective for making the filling speed of resin uniform. It relates to a stop device.

[0002]

2. Description of the Related Art In flip-chip mounting in which a semiconductor chip is mounted on a substrate via bumps, a semiconductor chip is mounted on a substrate, and a gap between the semiconductor chip and the substrate is sealed with a resin to improve the reliability of mounting. Is increasing the character.

Conventionally, the following method is known as a method of sealing with this resin.

The first method is a method in which a resin is applied to one side surface of a mounted semiconductor chip, and the applied resin is heated and penetrated into a gap between the semiconductor chip and the substrate by a capillary phenomenon.

[0005] The second method is disclosed in Japanese Patent Application Laid-Open No. 8-241900,
As described in JP-A-8-264587 and JP-A-8-306717, a semiconductor chip mounting body is housed in a chamber, and resin is permeated under reduced pressure in the same manner as in the first method. .

A third method is disclosed in Japanese Unexamined Patent Publication (Kokai) No. 3-222338,
As described in JP-A-7-130794, JP-A-7-226420, JP-A-8-189129, and JP-A-3-81632, a through hole is formed in a semiconductor chip mounting surface of a substrate, and the through hole is formed. To reduce the pressure.

[0007]

However, the first method has a problem that a long time is required for filling and that the flow speed of the resin varies depending on the location. When the flow speed of the resin becomes non-uniform depending on the location, generation of bubbles and uneven distribution of the filler occur, and the reliability decreases.

In the second method, the filling time is slightly shorter than in the first method, but the flow speed of the resin becomes non-uniform as in the first method.

In the third method, an extra structure called a through hole must be provided in the substrate.

Accordingly, an object of the present invention is to provide a method and an apparatus for sealing an electronic component mounted body which are effective for making the filling speed of a resin uniform.

[0011]

According to a first aspect of the present invention, there is provided an electronic component in which an electronic component (16) having an external electrode (20) on a bottom surface is mounted on a substrate (22). In the method of sealing a mounted body, the electronic component (1
6) A resin application step of applying resin to one side surface (S1)
0), a resin heating step (S12) of heating the resin applied in the resin application step (S10), and the electronic component (16) and the substrate (22) from other sides of the electronic component (16). Is reduced, and the resin heating step (S1
The gap depressurizing step (S1) for sucking the resin heated in 2)
4) and a resin filling step (S16) of filling the gap between the electronic component (16) and the substrate (22) with the resin sucked in the gap depressurizing step (S14).

Further, the invention according to claim 2 is characterized in that, in the invention according to claim 1, the other side surface includes a surface facing the one side surface.

According to a third aspect of the present invention, in the second aspect of the invention, the other side surface further includes a surface adjacent to the one side surface, and the gap depressurizing step (S14)
Is characterized in that pressure is reduced from a surface adjacent to the one side surface at a pressure different from a pressure facing the one side surface and another pressure.

According to a fourth aspect of the present invention, in the first aspect of the present invention, the resin coating step (S10) is performed on one side of the plurality of electronic components (16). A resin is applied, and the gap depressurizing step (S14) includes:
The gap between the plurality of electronic components (16) and the substrate (22) is simultaneously reduced from another side surface of the plurality of electronic components (16).

According to a fifth aspect of the present invention, in the first aspect of the present invention, in the resin filling step (S16), the pressure reduced in the gap depressurizing step (S14) is reduced. It is characterized by being changed according to the filling state of the resin.

According to a sixth aspect of the present invention, the electronic component (16) having the external electrode (20) on the bottom surface is a substrate (22).
In an electronic component package sealing device for sealing an electronic component package mounted thereon, a resin application unit (10) for applying a resin to one side surface of the electronic component (16); (10) a resin heating means (14) for heating the resin applied, and the other side of the electronic component (16) reducing the pressure between the electronic component (16) and the substrate (22) by reducing the pressure. The heating means (14) is provided with a gap decompression means (12) for sucking the heated resin.

According to a seventh aspect of the present invention, in the sixth aspect of the invention, the other side surface includes a surface facing the one side surface.

According to an eighth aspect of the present invention, in the seventh aspect of the invention, the other side surface further includes a surface adjacent to the one side surface, and the gap decompression means (12) is
A first pressure reducing means (24) for reducing pressure from a surface facing the one side surface, and a second pressure reducing means (26) for reducing pressure from a surface adjacent to the one side surface.

According to a ninth aspect of the present invention, in any one of the sixth to eighth aspects, the resin coating means (10) is provided on one side of the plurality of electronic components (16). A resin is applied, and the gap decompressing means (12) simultaneously decompresses a gap between the plurality of electronic components (16) and the substrate (22) from another side surface of the plurality of electronic components (16). Means (28).

The invention according to claim 10 is the same as the invention according to claim 6.
The invention according to any one of claims 9 to 9, wherein the gap pressure reducing means (12) further includes a pressure varying means (30) for varying the pressure to be reduced.

[0021]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

(Summary of the Invention) FIG. 1 is a process diagram showing an execution procedure of a sealing process of a package according to a first embodiment of the present invention. As shown in the figure, the present invention first performs a resin application step S10 of applying a resin to one side surface of an electronic component mounted on a board, and then performs a resin heating step S12 of heating the applied resin. And then performing a gap depressurizing step S14 of reducing the gap between the electronic component and the substrate from another side other than the surface on which the resin is applied, and thereafter, the gap is reduced by the resin sucked by the reduced pressure. The problem described above is solved by executing the resin filling step S16 for filling.

Hereinafter, the contents of the present invention will be described in more detail.

(First Embodiment) A first embodiment of the present invention will be described below with reference to FIG.

The resin application step S10 is a step of applying a resin to the electronic component mounted body. The resin applied in this step is applied to one side of the electronic component in a state of low viscosity. The term “one side face” as used herein means at least one side face, and the resin may be applied to two or more side faces. The resin applied at this time is applied in an amount equal to or larger than the volume of the gap between the electronic component and the substrate.

The resin heating step S12 is a step of heating the resin applied in the resin applying step S10. The resin is heated by a heater or a hot plate to reduce the viscosity. At this time, care is taken that the temperature of the resin does not reach the curing temperature of the resin.

The gap depressurizing step S14 is a step of depressurizing the gap between the electronic component and the substrate from a surface other than the surface on which the resin is applied in the resin applying step S10. The process is
This is performed by suction means such as an aspirator or a vacuum pump, and in order to concentrate the pressure in the gap, a tube or a gas hose connected to the suction means may be brought close to the gap, or a decompression jig as shown in an embodiment described later. Use When the suction means is operated to pull the gas phase in the gap, the resin applied to the side surface of the electronic component is drawn in the suction direction.
At this time, the force for sucking the resin is adjusted according to the size of the gap between the electronic component and the substrate and the state of the wiring pattern existing in the resin-filled region.

Preferably, the pressure is reduced from the surface opposite to the surface on which the resin is applied. More preferably, the pressure is reduced not only from the opposite surface but also from the surface adjacent to the surface on which the resin is applied. At this time, the pressure for reducing the pressure between the opposed surface and the adjacent surface is changed. For example, the opposite surface, which is the surface farthest from the surface on which the resin is applied, is depressurized with a higher pressure, and the adjacent surface is depressurized with a lower pressure. Thereby, the resin is uniformly filled. Also,
When the shape of the gap is not constant, and particularly when there is a narrow convoluted portion, the pressure is reduced with a larger pressure from the side closest to the narrow convoluted portion.

In the gap depressurizing step S14, a plurality of mounted bodies may be depressurized simultaneously. This may be for a plurality of electronic components mounted on the same substrate, or may be for an electronic component mounted on each of the plurality of substrates.

The resin filling step S16 is a step of filling the gap between the electronic component and the substrate with the resin sucked in the gap depressurizing step S14. In the resin filling step S16, the resin filling state is controlled by measuring the pressure reduction time and the like, and the gap pressure reduction step S14 is performed until the gap is completely molded.
Is repeated. At this time, if necessary, the pressure reduced in the gap depressurizing step S14 is changed. This change in pressure may be made according to a pre-programmed algorithm.

As described above, according to the first embodiment of the present invention, since the gap between the electronic component and the substrate is intensively reduced, the filling speed of the resin can be improved.

In particular, when the pressure is reduced from the surface opposite to the surface on which the resin is applied, the filling speed increases toward the position farthest from the position where the resin is applied, so that the filling speed is made uniform.

By reducing the pressure from a plurality of surfaces at different pressures according to the shape of the gap, the filling speed can be made more uniform.

Further, by reducing the pressure of a plurality of mounting bodies at the same time, the processing efficiency can be improved.

Further, by changing the pressure according to the filling state, a more reliable sealed state can be formed.

(Second Embodiment) FIG. 2 shows a second embodiment of the present invention.
It is a key map showing the composition of the sealing device of the electronic parts mounting body concerning the embodiment. Hereinafter, the configuration of the second embodiment will be described for each block. In FIG.
6, the external electrode 20, the resin 18, and the substrate 22 show their structures from the side, and the resin applying means 10, the gap reducing means 12, and the resin heating means 14 are shown by blocks.

The electronic component 16 is a device having an external electrode 20 formed on the bottom surface, and includes various surface-mounted electronic components in addition to a semiconductor device such as a flip chip or a ball grid array.

The external electrode 20 connects the electronic component 16 to the substrate 22
A conductive medium connected to the upper wiring pattern, such as a metal bump or a solder ball, or an electronic component 16 such as a lead frame exposed from the package bottom surface of the electronic component 16.
In addition, a conductive member such as a conductive paste or a cream solder is applicable.

The resin 18 is a raw material for filling the gap between the electronic component 16 and the substrate 22, and is made of a thermosetting material such as an epoxy resin or an elastomer, or a thermoplastic material.
The resin 18 may be mixed with an inorganic material such as a filler.

The substrate 22 is a wiring board on which the electronic components 16 are mounted, and is made of ceramic, glass epoxy, or the like. If necessary, the surface of the substrate 22 may be coated with a solder resist to make the filling speed of the resin 18 as uniform as possible. Ingenious measures such as wiring are performed.

The resin applying means 10 is a means for applying the resin 18 to the side surface of the electronic component 16, and corresponds to injection using a dispenser, sliding application using a squeegee, or the like. The resin applying means 10 is preferably a means capable of applying the resin 18 and the electronic component 16 in a state in which they are in close contact with each other as much as possible.

The resin heating means 14 is a means for supplying heat to the resin 18. The resin heating means 14 directly heats the resin 18 by irradiation heat, or the substrate 22 by a heater or a hot plate.
Those that are heated every time correspond. This resin heating means 14
Heats the resin 18 applied to the side surface of the electronic component 16 to a temperature lower than the curing temperature of the resin 18 and lowering the viscosity of the resin.

The gap decompression means 12 is a means for decompressing the gap between the electronic component 16 and the substrate 22, and a gas passage or a tube provided near the gap is connected to a suction device such as an aspirator or a vacuum pump. It is composed. It is preferable that the gap decompression means 12 is configured to be sucked from a surface opposite to the surface on which the resin 18 is applied, as shown in FIG.

According to the second embodiment of the present invention configured as described above, since the gap between the electronic component 16 and the substrate 22 is reduced, the filling speed of the resin 18 can be made uniform.

(Third Embodiment) FIG. 3 shows a third embodiment of the present invention.
It is a key map showing the composition of the sealing device of the electronic parts mounting body concerning the embodiment. The sealing device shown in FIG.
In addition to the configuration of the sealing device according to the embodiment, a first decompression unit 24 and a second decompression unit 26 are provided.

As shown in FIG. 3, the first decompression means 24 is means for sucking a gap between the electronic component 16 and the substrate 22 from a surface opposite to the side surface on which the resin 18 is applied, and decompressing.
The second decompression unit 26 is a unit that suctions a gap between the electronic component 16 and the substrate 22 from a surface adjacent to the side surface on which the resin 18 is applied, and decompresses. Both of these pressure reducing means are configured similarly to the gap pressure reducing means 12 shown in FIG.

Preferably, the suction force of each of the pressure reducing means is determined according to the distance to the position where the resin is applied. For example, the suction force of the first decompression means 24 for sucking from the position farthest from the resin 18 is configured to be larger than the suction force of the second decompression means 26, and the filling speed is made uniform.

According to the third embodiment of the present invention configured as described above, since the gap between the electronic component 16 and the substrate 22 is sucked from multiple directions, the filling speed can be made more uniform.

(Fourth Embodiment) FIG. 4 shows a fourth embodiment of the present invention.
It is a key map showing the composition of the sealing device of the electronic parts mounting body concerning the embodiment. The sealing device according to the fourth embodiment is provided with a plurality of pressure reducing means 28 in addition to the configuration of the sealing device according to the second embodiment described above.

As shown in FIG. 4, the plurality of pressure reducing means 28 is for suctioning a gap between the plurality of mounting bodies and reducing the pressure.
The structure is the same as that of the gap pressure reducing means 12 shown in FIG. FIG.
In this example, an example is shown in which the gap between the two mounting bodies is sucked to reduce the pressure. However, the multiple pressure reducing means 28 sucks the gap between the plurality of electronic components 16 mounted on the same substrate 22. Is also good. In the fourth embodiment, as shown in the figure, the resin applying means 10 and the resin heating means 14 also act on a plurality of mounting bodies.

According to the fourth embodiment of the present invention configured as described above, since a plurality of mounting bodies are processed simultaneously, the filling efficiency is improved.

(Fifth Embodiment) FIG. 5 shows a fifth embodiment of the present invention.
It is a key map showing the composition of the sealing device of the electronic parts mounting body concerning the embodiment. The sealing device according to the fifth embodiment has a configuration in which a pressure varying unit 30 is provided in addition to the configuration of the sealing device according to the second embodiment described above.

The pressure varying means 30 is provided with the gap reducing means 1
2 is a means for controlling the suction force, as shown in FIG.
A control signal is output to the gap pressure reducing means 12. This control signal is a signal for designating the suction force of the gap pressure reducing means 12,
The pressure changing means 30 changes the control signal according to the filling state of the resin 18.

The pressure change by the pressure changing means 30 may be performed in a feedback manner while monitoring the state of filling of the resin, or may be changed according to a predetermined algorithm. For example, an algorithm that weakens the suction force over time is described as a program,
Means that are stored in the pressure varying means 30 are conceivable. When such an algorithm is formed, it is preferable to previously study a change profile in which a preferable filling state is obtained by experiment and to program the profile.

According to the fifth embodiment of the present invention configured as described above, the suction force is controlled according to the filling state of the resin, so that a more preferable filling state can be obtained.

[0056]

FIG. 6 is a top view showing the structure of a device for sealing an electronic component package according to a first embodiment of the present invention. As shown in the figure, in the sealing device according to the first embodiment, a dispenser 32 is disposed above the left side surface of the electronic component 16 mounted on the substrate 22, and the dispenser 32 causes the dispenser 32 to move to the left side of the electronic component 16. A resin 18 is applied to the surface.

On the other hand, a decompression jig 34 is in contact with the right side surface of the electronic component 16. Inside the decompression jig, there is formed a communication hole 36 that allows the gap between the electronic component 16 and the substrate 22 to communicate with the vacuum pump 40. The communication hole 36 and the vacuum pump 40 are connected by a tubular air passage 38. The opening length of the communication hole 36 is preferably formed to be substantially equal to the side length of the electronic component 16 as shown in FIG.

A sealing member made of an elastic material such as rubber is formed on the contact surface of the decompression jig 34 to improve airtightness, and the sealing member is in close contact with the side surface of the electronic component 16. It has a structure to do.

Further, the sealing device shown in the figure is provided with a stage 42 on which a package to be sealed is placed.

FIG. 7 is a side view showing the structure of the device for sealing the electronic component package shown in FIG. As shown in the drawing, a component-side electrode pad 44 is formed on the bottom surface of the electronic component 16, and a substrate-side electrode pad 48 is formed on the upper surface of the substrate 22.
Are formed. The conductive bumps 46 are interposed between the respective electrode pads, and the electronic component 16 and the substrate 22 are electrically connected.

The decompression jig 34 is formed higher than the mounting height of the electronic component 16, and the opening height of the communication hole 36 formed inside the decompression jig 34 is determined by the electronic component 16 and the substrate 22. It is formed higher than the gap.

A heater 50 for heating the resin 18 is embedded in the stage 42.
Is transmitted to the substrate 22 through the housing of the stage 42 and supplied to the resin 18.

Hereinafter, the operation of the sealing device configured as described above will be described.

First, the resin 18 is dispensed by the dispenser 32.
Is applied to the side surface of the electronic component 16. After that, heater 5
By operating 0, the applied resin 18 is heated to lower the viscosity of the resin 18.

Next, the vacuum pump 40 is operated to suck the gap, and the resin 18 penetrates into the gap. When the resin 18 has completely penetrated into the gap, the vacuum pump 40 is stopped, and the resin is heated and cured to obtain a resin-sealed package.

(Second Embodiment) FIG. 8 is a top view showing the structure of a device for sealing an electronic component package according to a second embodiment of the present invention. The sealing device shown in the figure reduces the gap between the electronic component 16 and the substrate 22 from three sides.

In this sealing device, the decompression jig 34 is formed so as to surround a surface other than the surface on which the resin is applied, and three communication holes 36 contacting the respective side surfaces are provided therein. The three communication holes 36 are connected to a vacuum pump A 40a, a vacuum pump B 40b, and a vacuum pump C 40c, respectively, via a ventilation path 38. Each of the vacuum pumps operates independently and sucks the gap with a unique pressure. The suction pressure is set so that the vacuum pump A40a is the strongest and the vacuum pump B40b and the vacuum pump C40c are the same. Other configurations are the same as those described in the first embodiment.

Hereinafter, the operation of the sealing device configured as described above will be described.

First, the resin 18 is dispensed by the dispenser 32.
Is applied to the side surface of the electronic component 16. After that, heater 5
By operating 0, the applied resin 18 is heated to lower the viscosity of the resin 18.

Next, the vacuum pump A 40a and the vacuum pump B
The gap is sucked from three directions by operating the vacuum pump 40C and the vacuum pump 40C at the same time, and the resin 18 penetrates into the gap.
When the resin 18 has completely penetrated the gap, the vacuum pump A40
a, The vacuum pump B40b and the vacuum pump C40c are stopped, and the resin is heated and cured to obtain a resin-sealed package.

(Third Embodiment) FIG. 9 is a top view showing the structure of a device for sealing an electronic component package according to a third embodiment of the present invention. The sealing device shown in FIG.
6 are configured to be processed simultaneously.

In the sealing device according to the third embodiment, the decompression jig 34 is formed in a shape surrounding the surfaces of the electronic components A16a, B16b, C16c and D16d other than the resin-coated surface. A communication hole A36a communicating with a surface adjacent to the resin application surface of each electronic component 16 and a communication hole B36b communicating with a surface opposite to the resin application surface are provided in a path as shown in FIG.

The communication hole A36a is connected to a vacuum pump A40a via a ventilation path A38a, and the communication hole B36b is connected to a vacuum pump B40b via a ventilation path B38b. The vacuum pump A40a and the vacuum pump B4
0b each operate independently and draw the gap with its own pressure. The suction pressure is set so that the vacuum pump A40a becomes stronger. Here, since the vacuum pump B40b is configured to suction from two side surfaces, the load may be larger than that of the vacuum pump A40a. In such a case, the pressure of the vacuum pump B40b is set to increase. Other configurations are the same as those described in the first embodiment.

Hereinafter, the operation of the sealing device configured as described above will be described.

First, the resin 18 is dispensed by the dispenser 32.
The electronic component A16a, the electronic component B16b, and the electronic component C1
6c and the side surface of the electronic component D16d. Thereafter, the heater 50 is operated to heat the applied resin 18, and the viscosity of the resin 18 is reduced.

Next, the vacuum pump A 40a and the vacuum pump B 40b are operated to suck the gap from three directions, and the resin 18 is made to permeate the gap. When the resin 18 has completely penetrated the gap, the vacuum pump A 40a and the vacuum pump B 40b
Is stopped and the resin is cured by heating to obtain a resin-sealed package.

The above-mentioned electronic components include not only semiconductor chips, but also BGAs (ball grid arrays), CSPs (chip size packages), and the like, which take the same sealing form.

[0078]

As described above, according to the present invention,
It is possible to provide a sealing method and a sealing device for an electronic component mounted body that are effective for making the filling speed of the resin uniform.

According to the first embodiment of the present invention,
Since the gap between the electronic component and the substrate is intensively reduced in pressure, the filling speed of the resin can be improved.

In particular, when the pressure is reduced from the surface opposite to the surface on which the resin is applied, the filling speed increases toward the position farthest from the position where the resin is applied, so that the filling speed is made uniform.

Further, by reducing the pressure at different pressures from a plurality of surfaces in accordance with the shape of the gap, the filling speed can be made more uniform.

Further, by reducing the pressure of a plurality of mounted bodies at the same time, the processing efficiency can be improved.

Further, by changing the pressure in accordance with the filling state, it is possible to form a more reliable sealing state.

According to the second embodiment of the present invention,
Since the gap between the electronic component 16 and the substrate 22 is reduced, the filling speed of the resin 18 can be made uniform.

According to the third embodiment of the present invention,
Since the gap between the electronic component 16 and the substrate 22 is sucked from multiple directions, the filling speed can be made more uniform.

According to the fourth embodiment of the present invention,
Since a plurality of mounting bodies are processed at the same time, the filling efficiency is improved.

According to the fifth embodiment of the present invention,
Since the suction force is controlled according to the filling state of the resin, a more preferable filling state can be obtained.

[Brief description of the drawings]

FIG. 1 is a process diagram showing an execution procedure of a sealing process of a package according to a first embodiment of the present invention.

FIG. 2 is a conceptual diagram showing a configuration of a sealing device for an electronic component mounted body according to a second embodiment of the present invention.

FIG. 3 is a conceptual diagram showing a configuration of a sealing device for an electronic component mounted body according to a third embodiment of the present invention.

FIG. 4 is a conceptual diagram illustrating a configuration of a sealing device for an electronic component mounted body according to a fourth embodiment of the present invention.

FIG. 5 is a conceptual diagram illustrating a configuration of a sealing device for an electronic component mounted body according to a fifth embodiment of the present invention.

FIG. 6 is a top view showing the structure of the sealing device for an electronic component mounted body according to the first embodiment of the present invention.

FIG. 7 is a side view showing the structure of the sealing device for the electronic component package shown in FIG. 6;

FIG. 8 is a top view showing a structure of a sealing device for an electronic component package according to a second embodiment of the present invention.

FIG. 9 is a top view showing the structure of a device for sealing an electronic component mounted body according to a third embodiment of the present invention.

[Explanation of symbols]

S10: Resin coating step, S12: Resin heating step, S14
... gap depressurizing step, S16 ... resin filling step, 10 ... resin applying means, 12 ... gap depressurizing means, 14 ... resin heating means, 1
6 ... Electronic component, 16a ... Electronic component A, 16b ... Electronic component B, 16c ... Electronic component C, 16d ... Electronic component D, 18 ...
Resin, 20 external electrodes, 22 substrate, 24 first pressure reducing means, 26 second pressure reducing means, 28 multiple pressure reducing means, 3
0: Pressure varying means, 32: Dispenser, 34: Decompression jig, 36: Communication hole, 36a: Communication hole A, 36b: Communication hole B, 38: Ventilation path, 38a: Ventilation path A, 38b: Ventilation path B, 40: vacuum pump, 40a: vacuum pump A, 40b
... Vacuum pump B, 40c ... Vacuum pump C, 42 ... Stage, 44 ... Part-side electrode pad, 46 ... Bump, 48 ... Board-side electrode pad, 50 ... Heater

Claims (10)

[Claims] 1. A method for sealing an electronic component mounted body in which an electronic component (16) having an external electrode (20) on a bottom surface is mounted on a substrate (22), wherein one side surface of the electronic component (16) is provided. A resin application step (S10) of applying a resin; a resin heating step (S12) of heating the resin applied in the resin application step (S10); and a second side of the electronic component (16). 1
6) a pressure reduction step (S14) for reducing the pressure between the substrate and the substrate (22) and sucking the resin heated in the resin heating step (S12); and the electronic component (16) and the substrate (22). A resin filling step (S16) of filling the gap with the resin sucked in the gap depressurizing step (S14). 2. The method according to claim 1, wherein the other side surface includes a surface facing the one side surface. 3. The other side surface further includes a surface adjacent to the one side surface, and the gap depressurizing step (S14) includes the step of reducing the pressure from a surface facing the one side surface by another pressure. The method according to claim 2, wherein the pressure is reduced from a surface adjacent to the one side surface. 4. The resin applying step (S10) includes applying a resin to one side surface of the plurality of electronic components (16), and the gap depressurizing step (S14) includes adding a resin to the other side of the plurality of electronic components (16). 4. The method according to claim 1, wherein the gap between the plurality of electronic components (16) and the substrate (22) is simultaneously reduced in pressure from the side surface. . 5. The resin filling step (S16), wherein a pressure to be reduced in the gap depressurizing step (S14) is changed according to a filling state of the resin. The method for sealing an electronic component mounted body according to any one of the above. 6. An electronic component package sealing device for sealing an electronic component package in which an electronic component (16) having an external electrode (20) on a bottom surface is mounted on a substrate (22). 16) a resin application unit (10) for applying a resin to one side surface, a resin heating unit (14) for heating the resin applied by the resin application unit (10), and the electronic component (16). From the side of the electronic component (1)
6) Sealing an electronic component mounted body, comprising: a pressure reducing means (12) for reducing the pressure between the substrate and the substrate (22) and sucking the resin heated by the resin heating means (14). apparatus. 7. The device according to claim 6, wherein the other side surface includes a surface facing the one side surface. 8. The other side surface further includes a surface adjacent to the one side surface, and the gap decompression unit (12) includes a first decompression unit (24) for decompressing a pressure from a surface facing the one side surface. The electronic device package sealing device according to claim 7, further comprising: a second pressure reducing means (26) for reducing pressure from a surface adjacent to the one side surface. 9. The resin application means (10) applies a resin to one side surface of a plurality of electronic components (16), and the gap decompression means (12) controls the other of the plurality of electronic components (16). 9. A plurality of decompression means (28) for simultaneously depressurizing a gap between the plurality of electronic components (16) and the substrate (22) from the side surface of the device. Method for sealing electronic component mounted bodies. 10. The electronic device according to claim 6, wherein the gap depressurizing means further includes a pressure varying means for varying the pressure for reducing the pressure. Component mounting device sealing device.