JPH11271546A - Optical transmission and reception device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce crosstalk between a light emitting element and a photodetector mounted in a hybrid state on the same substrate by providing conductive resin applied over the substrate between the light emitting element and photodetector. SOLUTION: On the substrate 4 of Si, etc., an insulating layer 6 is formed. On a conductor pattern 8 formed on the insulating layer 6, a laser diode 12 is mounted and on the conductor pattern 16, a laser diode 20 is mounted. In the insulating layer 6, optical waveguide cores 24 and 26 are embedded. One end of the optical waveguide core 24 is coupled with the laser diode 12 and the other end is connected to an output port. One end of the optical waveguide core 26 is optically coupled with the photodiode 20 and the other end is coupled with an input port. On the insulating layer 6, an electrode 28 is formed and further grounded. The electrode 28 is coated with conductive resin 30 such as silver silicone, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical transmitting and receiving device in which a light emitting element and a light receiving element are mounted on the same substrate.

In recent years, the development of optical devices for the opticalization of subscriber systems has been actively promoted. Bidirectional optical subscriber system using wavelength division multiplexing technology such as STM-PON (Synchronous Transfer Mode-Passive Optical Network) and ATM-PON (Asynchronous Transfer Mode-Passive Optical Network) Is being developed, and it is extremely important to reduce the cost of optical devices including wavelength filters.

In order to realize such a bidirectional optical subscriber system, a compact optical device having a small number of components is required, and a light emitting element, a light receiving element, a wavelength filter, and the like are hybrid mounted on one substrate. The expected device form is expected.

In a system such as an ATM-PON in which a transmitting unit and a receiving unit operate asynchronously, it is necessary that crosstalk from the transmitting unit to the receiving unit in the optical module be sufficiently small.
The present invention provides a structure for suppressing crosstalk between transmission and reception in an optical transmitting and receiving device in which a light emitting element and a light receiving element are hybridly mounted.

[0005]

2. Description of the Related Art In recent years, planar lightwave circuit platforms (PLC platforms) have been developed.
A small optical transmitting / receiving device has been developed in which a light emitting element, a light receiving element, and a wavelength selection filter are hybrid-mounted on a substrate with a waveguide called “waveguide”.

[0006] However, this optical transmitting / receiving device is a time-compression time-divided transmission time and a reception time.
The application is limited to a multiplexing (TCM) transmission system. The reason is that it is difficult to suppress crosstalk from the transmitting unit to the receiving unit.

[0007] In the transmitting section, to drive the light emitting element,
While a current of 0 mA flows, a small receiving current of the order of μA or less flows in the receiving section. Therefore, the current flowing to the receiving unit due to the crosstalk from the transmitting unit is 10 nA.
It must be an order.

[0008]

Since the conventional PLC module is a small module in which the transmitting unit and the receiving unit are integrated on the same substrate, no shield is formed between the transmitting unit and the receiving unit. Therefore, it has been difficult to realize sufficiently small crosstalk due to stray capacitance between the transmission and reception wirings.

In order to realize the miniaturization of the optical device for the ATM-PON, the light emitting element, the light receiving element and the wavelength selection filter are hybrid mounted on the same substrate,
It is necessary to reduce crosstalk between transmission and reception.

Accordingly, an object of the present invention is to provide an optical transmitting and receiving device capable of reducing crosstalk between a light emitting element and a light receiving element hybrid-mounted on the same substrate.

[0011]

According to the present invention, there is provided an optical transmitting and receiving device, comprising: a substrate; an insulating layer formed on the substrate; and first insulating layers formed on the insulating layer adjacent to each other.
And third and fourth conductor patterns formed adjacent to each other on the insulating layer; a light emitting element mounted on the first conductor pattern; and the light emitting element and the second conductor A first wire connecting the pattern; a light receiving element mounted on the third conductor pattern; a second wire connecting the light receiving element and the fourth conductor pattern; An optical transmitting and receiving device comprising: a conductive resin applied on the substrate; and an electrode having a constant potential connected to the conductive resin.

Preferably, there are provided a first optical waveguide having one end optically coupled to the light emitting element and a second optical waveguide having one end optically coupled to the light receiving element. Preferably, the electrodes are grounded.

According to another aspect of the present invention, there is provided an optical transmitting / receiving device, comprising: a substrate; an insulating layer formed on the substrate; and first and second layers formed adjacent to each other on the insulating layer. Third and fourth conductive patterns formed adjacent to each other on the insulating layer; a light emitting element mounted on the first conductive pattern; connecting the light emitting element and the second conductive pattern A first wire to be connected; a light receiving element mounted on the third conductor pattern; a second wire connecting the light receiving element to the fourth conductor pattern; and the substrate such that one end is optically coupled to the light emitting element. A first optical waveguide formed thereon; a second optical waveguide formed on the substrate such that one end is optically coupled to the light receiving element; and a light emitting element, and light emitted from the light emitting element and the first optical waveguide. Coupling part and the first and second conductors An optical transmission / reception device comprising: a transparent insulating resin covering a part of a turn; a conductive resin covering the transparent insulating resin; and a constant potential electrode connected to the conductive resin. A device is provided.

According to still another aspect of the present invention, there is provided an optical transmitting / receiving device, comprising: a substrate; an insulating layer formed on the substrate; and first and second layers formed adjacent to each other on the insulating layer. A second conductor pattern; third and fourth conductor patterns formed adjacent to each other on the insulating layer; a light emitting element mounted on the first conductor pattern; and a light emitting element and the second conductor pattern. A first wire to be connected;
A light receiving element mounted on a conductor pattern; a second wire connecting the light receiving element and the fourth conductor pattern; a first optical waveguide formed on the substrate such that one end is optically coupled to the light emitting element. A second optical waveguide formed on the substrate such that one end is optically coupled to the light receiving element; an optical coupling portion between the light receiving element, the light receiving element and the second optical waveguide, and the third and fourth optical waveguides; A transparent insulating resin covering a part of the conductive pattern; a conductive resin covering the transparent insulating resin;
An electrode having a constant potential connected to the conductive resin;

According to still another aspect of the present invention, there is provided an optical transmitting and receiving device, comprising: a substrate; an insulating layer formed on the substrate; and first and second layers formed adjacent to each other on the insulating layer. A second conductor pattern; third and fourth conductor patterns formed adjacent to each other on the insulating layer; a light emitting element mounted on the first conductor pattern; and a light emitting element and the second conductor pattern. A first wire to be connected;
A light receiving element mounted on a conductor pattern; a second wire connecting the light receiving element and the fourth conductor pattern; a wavelength selection filter mounted substantially vertically on the substrate; the light emitting element and the wavelength selection A first optical waveguide formed on the substrate for optically coupling a filter; a second optical waveguide formed on the substrate for optically coupling the light receiving element and the wavelength selection filter; A third optical waveguide formed on the substrate between the wavelength selection filter and the optical input / output port so as to optically couple light propagating through the two optical waveguides; the light emitting element, the light emitting element and the third optical waveguide; A transparent insulating resin covering an optical coupling portion of one optical waveguide and a part of the first and second conductive patterns; a conductive resin covering the transparent insulating resin; and a potential connected to the conductive resin. A certain electrode; Optical transceiver device, characterized in that there is provided.

Preferably, the substrate is a conductive substrate, and electrodes are directly formed on the substrate. The conductive resin is electrically connected to the conductive substrate via the electrode. Preferably, the conductive substrate is grounded.

According to still another aspect of the present invention, there is provided an optical transmitting / receiving device, comprising: a substrate; an insulating layer formed on the substrate; and first and second layers formed adjacent to each other on the insulating layer. A second conductor pattern; third and fourth conductor patterns formed adjacent to each other on the insulating layer; a light emitting element mounted on the first conductor pattern; and a light emitting element and the second conductor pattern. A first wire to be connected;
A light receiving element mounted on a conductor pattern; a second wire connecting the light receiving element and the fourth conductor pattern; a wavelength selection filter mounted substantially vertically on the substrate; the light emitting element and the wavelength selection A first optical waveguide formed on the substrate for optically coupling a filter; a second optical waveguide formed on the substrate for optically coupling the light receiving element and the wavelength selection filter; A third optical waveguide formed on the substrate between the wavelength selection filter and the optical input / output port so as to optically couple light propagating through the two optical waveguides; the light receiving element; the light receiving element; A transparent insulating resin covering the optical coupling portion of the three optical waveguides and a part of the third and fourth conductor patterns; a conductive resin covering the transparent insulating resin; and a potential connected to the conductive resin. A certain electrode; Optical transceiver device, characterized in that there is provided.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A number of embodiments of the present invention will be described below with reference to the drawings. In the description of each embodiment, substantially the same components will be denoted by the same reference numerals.

Referring to FIG. 1, there is shown a sectional view of an optical transmitting / receiving device 2A according to a first preferred embodiment of the present invention. An insulating layer 6 is formed on a substrate 4 such as a Si substrate. Substrate 4
Is formed of silicon, the insulating layer 6 is made of SiO.
Formed from _two .

A pair of conductor patterns 8 and 10 are formed on the left side of the insulating layer 6, and another pair of conductor patterns 16 and 18 are formed on the right side. A laser diode 12 is mounted on the conductor pattern 8, and the laser diode 12 and the conductor pattern 10 are connected by bonding with gold wires 14. A photodiode 20 is mounted on the conductor pattern 16, and the photodiode 20 and the conductor pattern 18 are connected by bonding with gold wires 22.

In the insulating layer 6, two optical waveguide cores 24,
26 are buried. One end of the optical waveguide core 24 is disposed so as to be optically coupled to the laser diode 12,
The other end is connected to an output port (not shown). One end of the optical waveguide core 26 is disposed so as to be optically coupled to the photodiode 20, and the other end is connected to an input port (not shown).

An electrode 28 is formed on the insulating layer 6, and the electrode 28 is grounded. A conductive resin 30 such as silver silicone is applied on the electrode 28. Electrode 28
May be connected to a power supply having a constant potential, for example, 3 V, 5 V, or the like.

According to this embodiment, the laser diode 1
Since the conductive resin 30 is provided between the laser diode 2 and the photodiode 20, crosstalk between the laser diode 12 and the photodiode 20 can be reduced.

Referring to FIG. 2, there is shown a sectional view of an optical transmitting / receiving device 2B according to a second preferred embodiment of the present invention. In this embodiment, a transparent insulating resin 32 such as a silicone resin is applied around the laser diode 12.

The transparent insulating resin 32 is a laser diode 1
2 and a part of the optical coupling portion between the optical waveguide core 24, the wire 14 and the conductor patterns 8 and 10. The transparent insulating resin 32 secures an optical path to the optical waveguide core 24 and also forms a conductive pattern 8,
10 has a role of preventing short circuit.

On the transparent insulating resin 32, a conductive resin 34 such as silver silicone is applied. The conductive resin 34 is connected to a grounded electrode 36. Instead of grounding the electrode 36, it may be connected to a power supply having a constant potential.

According to the present embodiment, the laser diode 1
Since 2 is covered with the transparent insulating resin 32 and the conductive resin 34, crosstalk from the laser diode 12 to other circuit components such as the photodiode 20 can be reduced.

Referring to FIG. 3, there is shown a sectional view of an optical transmitting / receiving device 2C according to a third preferred embodiment of the present invention. In the present embodiment, a transparent insulating resin 38 such as a silicone resin is applied around the photodiode 20. The transparent insulating resin 38 includes the photodiode 20 and the optical waveguide core 26.
Optical coupling portion, wire 22, and conductor patterns 16, 18
Cover part of.

On the transparent insulating resin 38, a conductive resin 40 such as silver silicone is applied. The conductive resin 40 is connected to the grounded electrode 42. Instead of the electrode 42 being grounded, it may be connected to a power supply having a constant potential.

The transparent insulating resin 38 has a role of securing an optical path from the waveguide core 26 to the photodiode 20 and preventing a short circuit of the conductive patterns 16 and 18 due to the applied conductive resin 40.

According to the present embodiment, the laser diode 1
In addition to effectively blocking the crosstalk from the photodiode 2 to the photodiode 20, an effect of blocking external noise such as a driving IC provided outside can be expected.

Referring to FIG. 4, there is shown a sectional view of an optical transceiver 2D according to a fourth preferred embodiment of the present invention. FIG. 5 shows a plan view of the fourth embodiment. In this embodiment,
The periphery of the laser diode 12 is covered with a transparent insulating resin 32 such as silicone resin, and the transparent insulating resin 32 is covered with a conductive resin 34 such as silver silicone.

The periphery of the photodiode 20 is also covered with a transparent insulating resin 38 such as silicone resin, and the transparent insulating resin 38 is covered with a conductive resin 40 such as silver silicone.

Further, in this embodiment, the grooves 4 are formed in the Si substrate 4.
The wavelength selection filter 48 is inserted into the groove 46 and fixed with a transparent adhesive 50. As shown in FIG. 5, on the Si substrate 4, a first optical waveguide core 54 for optically coupling the laser diode 12 and the wavelength selection filter 48, and a second optical waveguide core for optically coupling the photodiode 20 and the wavelength selection filter 48 are provided. An optical waveguide core 56 is formed.

On the Si substrate 4, light propagating through the first and second optical waveguide cores 54 and 56 is further optically coupled.
A third optical waveguide core 58 is formed between the wavelength selection filter 48 and the optical input / output port 59.

The periphery of the wavelength selection filter 48 is covered with a conductive resin 52 such as silver silicone. Substrate contact electrodes 64, 66, 68, 70 are directly formed on the Si substrate 4.

On the back surface of the Si substrate 4, a back electrode 72 is formed. The back electrode 72 is grounded. Instead of grounding the back electrode 72, it may be connected to a power supply having a constant potential.

Since the Si substrate 4 is conductive, the conductive resin 34 is grounded via the substrate contact electrode 64, the Si substrate 4, and the back electrode 72. Similarly, the conductive resin 40 includes the substrate contact electrode 66, the Si substrate 4, and the back surface electrode 72.
Grounded. Further, the conductive resin 52 is grounded via the substrate contact electrodes 68, 70, the Si substrate 4, and the back surface electrode 72.

According to this embodiment, the laser diode 1
2 is covered with a conductive resin 34 via a transparent insulating resin 32, and the photodiode 20 is covered with a conductive resin 40 via a transparent insulating resin 38. Further, a conductive resin 52 is provided between the laser diode 12 and the photodiode 20.
Is provided.

Therefore, crosstalk between the laser diode 12 and the photodiode 20 can be effectively cut off or reduced, and external noise such as a driving IC provided outside can be cut off or reduced effectively. As a result, it is possible to realize a small-sized optical transmitting / receiving device that can operate asynchronously.

Hereinafter, the manufacturing process of the optical transceiver 2D according to the fourth embodiment will be described with reference to the drawings. First, as shown in FIG. 6A, an SiO ₂ film 76 having a thickness of about 1 μm is formed on a Si (100) substrate 74 by, for example, thermal oxidation.

Next, patterning is performed by photolithography to remove the SiO ₂ film (oxide film) 76 other than the region where the terrace 78 is formed. Soak in KOH solution,
_The region where the _second film 76 has been removed is etched. The depth of this etching is about the thickness of the under cladding of the waveguide, that is, about 20 μm.

Next, as shown in FIG. 6B, SiO _{2 serving} as the first under cladding 80 is deposited on the entire surface of the substrate to a depth etched by a flame deposition method or the like. Next, as shown in FIG. 6C, polishing and flattening are performed until the upper surface of the terrace 78 is exposed.

As shown in FIG. 7D, SiO _{2 serving} as the second under cladding 82 is deposited on the entire surface of the substrate 74 to a thickness determined by the following equation. Deposition thickness = (conductor pattern thickness) + (solder thickness) + (active layer height of laser diode) This deposition thickness is about 20 μm. Next, a core layer 84 doped with an impurity such as germanium (Ge) that increases the refractive index is deposited, and unnecessary regions other than the waveguide are removed by patterning by photolithography to form a waveguide core. Next, SiO ₂ is deposited on the entire surface of the substrate at a thickness similar to that of the under claddings 80 and 82 to form an over cladding 86.

Next, as shown in FIG. 7E, the region including the optical element mounting portion and the conductor pattern forming portion is etched by reactive ion etching (RIE) to form waveguide end faces 90 and 92. . The etching depth is set so that the upper surface of the terrace 78 is just exposed.

Similarly, the holes 9 were etched by RIE.
1, 93, 95, 97 are formed, and substrate contact electrodes 64, 66, 6 for conducting with the Si substrate 74 are formed in these holes.
8, 70 are formed. 88 is a resist.

Then, as shown in FIGS. 8 and 9, a thin SiO 2 layer of about 0.5 μm is formed on the terrace 78 by thermal oxidation.
_{(2) An} insulating film 6 is formed. Further, a dicing saw is used to form a groove 94 which crosses the point where the waveguide cores 54, 56, 58 meet.

Next, Ti, Ni, and Au are sequentially deposited on the entire surface of the substrate, and a resist is applied. Conductor pattern 6,
The resist is removed by a photolithography technique except for portions 8, 16, and 18, and etching is performed.

The etching may be performed by RIE, or the substrate may be immersed in an etchant. A nitric acid-based etchant is used for Ti and Ni, and a gold etchant is used for Au. As an alternative, the conductor patterns 6, 8, 16, 18 can also be formed by a lift-off method. Similarly, the back surface electrode 72 is formed on the back surface of the substrate 74.

Next, for example, a polyimide resin is applied to the entire upper surface of the substrate by a spinner, and further a resist is applied. The resist is patterned by a photolithography technique and further immersed in a solvent, and the polyimide resin is removed so that at least the optical element mounting portion, the wire bonding pad portion, and the waveguide end surface are exposed.

As a result, as shown in FIG. 10, a part of the conductor patterning 8, 10 is covered with the polyimide insulating layer 96, and a part of the conductor patterning 16, 18 is covered with the polyimide insulating layer 98. Then, S
The i-substrate 74 is cut into each PLC platform.

Next, as shown in FIG. 11, the laser diode 12 and the photodiode 20 are mounted at predetermined positions by bonding. This bonding is the optical element 1
It may be performed by forming solder bumps on the 2, 20 side,
A solder bump may be provided on the PLC platform side.

After mounting the laser diode 12 and the photodiode 20, the laser diode 12 and the conductor pattern 10 are bonded and connected by the gold wire 14, and the photodiode 20 and the conductor pattern 18 are bonded and connected by the gold wire 22. Further, the wavelength selection filter 48 is inserted into the groove 94, and the wavelength selection filter 48 is fixed to the PLC platform (substrate) 4 with a transparent adhesive 50.

Next, as shown in FIGS. 4 and 5, transparent insulating resins 32 and 38 such as silicone resin are potted around the laser diode 12 and the photodiode 20 and cured.

If necessary, a high-viscosity silicone resin mixed with a filler such as silica is applied around the laser diode 12 and the photodiode 20 in a dam shape.
It may be used as a flow stopper for transparent silicone resin.

Further, the outside of the transparent insulating resins 32 and 38 and the periphery of the wavelength selection filter 48 are covered with conductive resins 34, 40 and 52 such as silver silicone resin. At this time, the conductive resins 34, 40, 52 are
6, 68 and 70. Finally, the conductive resins 34, 40, and 52 are cured.

The optical transmitting / receiving device 2D of the fourth embodiment thus formed is shown in FIGS. Further, although not particularly shown, the optical transmitting / receiving device 2D is packaged by a plastic mold or the like.

[0058]

As described above, according to the present invention,
An optical transmitting and receiving device capable of reducing crosstalk between a light emitting element and a light receiving element hybrid-mounted on the same substrate can be provided. Further, it is possible to provide an optical transmitting and receiving device that is compact and can operate asynchronously, which can contribute to the spread of optical subscriber systems.

[Brief description of the drawings]

FIG. 1 is a sectional view of a first embodiment of the present invention.

FIG. 2 is a sectional view of a second embodiment of the present invention.

FIG. 3 is a sectional view of a third embodiment of the present invention.

FIG. 4 is a sectional view of a fourth embodiment of the present invention.

FIG. 5 is a plan view of a fourth embodiment.

FIG. 6 is a diagram showing a manufacturing process.

FIG. 7 is a diagram showing a manufacturing process.

FIG. 8 is a diagram showing a manufacturing process.

FIG. 9 is a diagram showing a manufacturing process.

FIG. 10 is a diagram showing a manufacturing process.

FIG. 11 is a diagram showing a manufacturing process.

[Explanation of symbols]

 4 Substrate 8, 10, 16, 18 Conductive pattern 12 Light emitting element 20 Light receiving element 24, 26 Optical waveguide 28, 36, 42 Electrode 30, 34, 40, 52 Conductive resin 32, 38 Transparent insulating resin 64, 66, 68 , 70 substrate contact electrode

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H04B 10/18

Claims (19)

[Claims] 1. An optical transmitting / receiving device, comprising: a substrate; an insulating layer formed on the substrate; first and second conductor patterns formed adjacent to each other on the insulating layer; Third and fourth conductive patterns formed adjacent to each other on the light emitting element; a light emitting element mounted on the first conductive pattern; a first wire connecting the light emitting element and the second conductive pattern; A light receiving element mounted on a third conductive pattern; a second wire connecting the light receiving element and the fourth conductive pattern; a conductive resin applied on the substrate between the light emitting element and the light receiving element And an electrode having a constant potential connected to the conductive resin. A first optical waveguide formed on the substrate such that one end is optically coupled to the light emitting element; and a second optical waveguide formed on the substrate such that one end is optically coupled to the light receiving element.
The optical transmitting and receiving device according to claim 1, further comprising an optical waveguide. 3. The optical transmitting and receiving device according to claim 2, wherein the electrode is grounded. 4. An optical transmitting and receiving device, comprising: a substrate; an insulating layer formed on the substrate; first and second conductor patterns formed adjacent to each other on the insulating layer; Third and fourth conductive patterns formed adjacent to each other on the light emitting element; a light emitting element mounted on the first conductive pattern; a first wire connecting the light emitting element and the second conductive pattern; A light-receiving element mounted on a third conductor pattern; a second wire connecting the light-receiving element and the fourth conductor pattern; a first wire formed on the substrate such that one end is optically coupled to the light-emitting element. An optical waveguide; a second optical waveguide formed on the substrate such that one end is optically coupled to the light receiving element; an optical coupling part of the light emitting element, the light emitting element and the first optical waveguide; Second
A light, comprising: a transparent insulating resin covering a part of a conductive pattern; a conductive resin covering the transparent insulating resin; and a constant potential electrode connected to the conductive resin. Transmitting and receiving devices. 5. The optical transmitting and receiving device according to claim 4, wherein the electrode is grounded. 6. An optical transmitting and receiving device, comprising: a substrate; an insulating layer formed on the substrate; first and second conductor patterns formed adjacent to each other on the insulating layer; Third and fourth conductive patterns formed adjacent to each other on the light emitting element; a light emitting element mounted on the first conductive pattern; a first wire connecting the light emitting element and the second conductive pattern; A light-receiving element mounted on a third conductor pattern; a second wire connecting the light-receiving element and the fourth conductor pattern; a first wire formed on the substrate such that one end is optically coupled to the light-emitting element. An optical waveguide; a second optical waveguide formed on the substrate such that one end is optically coupled to the light receiving element; an optical coupling portion between the light receiving element, the light receiving element and the second optical waveguide; 4th
A light, comprising: a transparent insulating resin covering a part of a conductive pattern; a conductive resin covering the transparent insulating resin; and a constant potential electrode connected to the conductive resin. Transmitting and receiving devices. 7. The optical transmitting and receiving device according to claim 6, wherein the electrode is grounded. 8. An optical transmitting and receiving device, comprising: a substrate; an insulating layer formed on the substrate; first and second conductor patterns formed adjacent to each other on the insulating layer; Third and fourth conductive patterns formed adjacent to each other on the light emitting element; a light emitting element mounted on the first conductive pattern; a first wire connecting the light emitting element and the second conductive pattern; A light receiving element mounted on a third conductive pattern; a second wire connecting the light receiving element and the fourth conductive pattern; a wavelength selection filter mounted substantially vertically on the substrate; A first optical waveguide formed on the substrate for optically coupling a wavelength selection filter; a second optical waveguide formed on the substrate for optically coupling the light receiving element and the wavelength selection filter; And second optical waveguide A third optical waveguide formed on the substrate between the wavelength selection filter and the optical input / output port so as to optically couple the propagating light; and a light-emitting element, and a light-emitting element and the first optical waveguide. A transparent insulating resin covering the optical coupling portion and a part of the first and second conductive patterns; a conductive resin covering the transparent insulating resin; and a constant potential electrode connected to the conductive resin. An optical transmitting and receiving device comprising: 9. The substrate is a conductive substrate, the electrode is formed directly on the conductive substrate, and the conductive resin and the conductive substrate are electrically connected via the electrode. The optical transmitting and receiving device according to claim 8, wherein 10. The optical transceiver according to claim 9, wherein the conductive substrate is grounded. 11. An optical transmitting / receiving device, comprising: a substrate; an insulating layer formed on the substrate; first and second conductor patterns formed adjacent to each other on the insulating layer; Third and fourth conductive patterns formed adjacent to each other on the light emitting element; a light emitting element mounted on the first conductive pattern; a first wire connecting the light emitting element and the second conductive pattern; A light receiving element mounted on a third conductive pattern; a second wire connecting the light receiving element and the fourth conductive pattern; a wavelength selection filter mounted substantially vertically on the substrate; A first optical waveguide formed on the substrate for optically coupling a wavelength selection filter; a second optical waveguide formed on the substrate for optically coupling the light receiving element and the wavelength selection filter; And the second optical waveguide A third optical waveguide formed on the substrate between the wavelength selection filter and the optical input / output port so as to optically couple light propagating through the light receiving element; the light receiving element; the light receiving element; and the second optical waveguide A transparent insulating resin covering a part of the optical coupling portion and the third and fourth conductive patterns; a conductive resin covering the transparent insulating resin; and a constant potential electrode connected to the conductive resin. And an optical transmitting / receiving device comprising: 12. The conductive substrate, wherein the substrate is a conductive substrate, the electrode is formed directly on the conductive substrate, and the conductive resin is electrically connected to the conductive substrate via the electrode. The optical transmitting and receiving device according to claim 11, wherein 13. The optical transceiver according to claim 12, wherein the conductive substrate is grounded. 14. An optical transmitting and receiving device, comprising: a substrate; an insulating layer formed on the substrate; first and second conductor patterns formed adjacent to each other on the insulating layer; Third and fourth conductive patterns formed adjacent to each other on the light emitting element; a light emitting element mounted on the first conductive pattern; a first wire connecting the light emitting element and the second conductive pattern; A light receiving element mounted on a third conductive pattern; a second wire connecting the light receiving element and the fourth conductive pattern; a wavelength selection filter mounted substantially vertically on the substrate; A first optical waveguide formed on the substrate for optically coupling a wavelength selection filter; a second optical waveguide formed on the substrate for optically coupling the light receiving element and the wavelength selection filter; And the second optical waveguide A third optical waveguide formed on the substrate between the wavelength selection filter and the optical input / output port so as to optically couple light propagating through the optical waveguide; and light of the first, second, and third optical waveguides A transparent adhesive for fixing the wavelength selection filter to the substrate so as to cover the joint;
An optical transmission / reception device, comprising: a conductive resin covering the wavelength selection filter; and an electrode having a constant potential connected to the conductive resin. 15. The method according to claim 15, wherein the substrate is a conductive substrate, the electrode is formed directly on the conductive substrate, and the conductive resin is electrically connected to the conductive substrate via the electrode. The optical transmission / reception device according to claim 14, wherein 16. The optical transmitting and receiving device according to claim 15, wherein the conductive substrate is grounded. 17. An optical transmitting and receiving device, comprising: a substrate; an insulating layer formed on the substrate; first and second conductor patterns formed adjacent to each other on the insulating layer; Third and fourth conductive patterns formed adjacent to each other on the light emitting element; a light emitting element mounted on the first conductive pattern; a first wire connecting the light emitting element and the second conductive pattern; A light receiving element mounted on a third conductive pattern; a second wire connecting the light receiving element and the fourth conductive pattern; a wavelength selection filter mounted substantially vertically on the substrate; A first optical waveguide formed on the substrate for optically coupling a wavelength selection filter; a second optical waveguide formed on the substrate for optically coupling the light receiving element and the wavelength selection filter; And the second optical waveguide A third optical waveguide formed on the substrate between the wavelength selection filter and the optical input / output port so as to optically couple light propagating through the light emitting device; the light emitting element; the light emitting element; and the first optical waveguide A transparent insulating first resin covering a part of the optical coupling portion and the first and second conductive patterns; a conductive second resin covering the transparent insulating first resin; and the conductive second resin A first electrode having a constant potential connected to the light-receiving element, a transparent insulating third resin covering a part of the light-receiving element, an optical coupling portion of the light-receiving element and the second optical waveguide, and a part of the third and fourth conductor patterns And the transparent insulating third
A conductive fourth resin covering the resin; a second electrode having a constant potential connected to the conductive fourth resin; and an optical coupling portion between the first, second, and third optical waveguides. A transparent adhesive for fixing the wavelength selective filter to the substrate;
An optical transmission / reception device, comprising: a conductive fifth resin covering the wavelength selection filter; and a third electrode having a constant potential connected to the conductive fifth resin. 18. The method according to claim 18, wherein the substrate is a conductive substrate, the first, second, and third electrodes are formed directly on the conductive substrate, and the second conductive resin, the fourth conductive resin, The optical transmitting and receiving device according to claim 17, wherein the fifth conductive resin is electrically connected to the conductive substrate via the first, second, and third electrodes, respectively. 19. The optical transceiver according to claim 18, wherein the conductive substrate is grounded.