JPH11268333A - Optical print head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize this optical print head, to improve reliability of connection of wiring and to reduce manufacturing processes in terms of the print head utilizing a light emitting diode in relation to dynamic driving. SOLUTION: This optical print head is equipped with a driving circuit device 54 that comprises a driving circuit section 55 for divisionally driving a plurality of light emitting diodes 51, a matrix wiring section 56 which is a wiring section of the output side of the driving circuit section 55 and includes a matrix pattern for connecting the light emitting diodes 51, and a wiring region 57 connected to each of the wiring patterns of the matrix wiring section 56 which are integrally formed with a semiconductor device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an optical print head using light emitting diodes for dynamic driving.

[0002]

2. Description of the Related Art Light emitting diodes (light emitting diodes)
e: LED) element emits bright light,
It has been widely used as a display device in the past because of low driving voltage and easy peripheral circuits.

[0003] Optical print heads using light-emitting diodes have been actively studied for the purpose of application to light sources and the like of optical printers and the like employing electrophotography.

An optical printer using a self-light emitting type light emitting diode as a light source emits each dot of the light emitting diode in accordance with an image signal, and exposes the photosensitive drum with a 1: 1 image forming element such as a distributed refractive index lens. To form an electrostatic latent image,
After the toner is selectively adhered by a developing device, printing is performed by transferring the toner adhered to plain paper or the like.

A head using a light emitting diode is described in (1)
Since there are no moving parts and there are few components, it is possible to reduce the size. (2) It is easy to increase the length by connecting an array chip.

A driving method for driving a light emitting diode includes:
There are static drive in which a light emitting diode and each output terminal of a drive element are connected in a one-to-one manner and drive, and dynamic drive (time-division drive) in which a plurality of light-emitting diodes are driven by one drive element by time division. Optical printers are required to have high resolution and high speed as well as low cost. In general, a static drive system capable of high speed has been adopted. However, a dynamic drive method that can reduce the number of components has been attracting attention again in order to respond to the demand for further cost reduction, and studies on dynamic drive have been promoted due to the improvement in drum sensitivity and the luminous efficiency of light-emitting diodes. ing.

In the case of performing dynamic driving, there are the following issues to be considered.

That is, (1) it is necessary to provide a large number of vertical and horizontal matrix wirings to connect a plurality of light emitting diodes and a driving element, and to devise a connection method to prevent a short circuit accident. In addition, since it is necessary to provide a large number of vertical and horizontal matrix wirings, the substrate on which the wiring portions are provided becomes large,
It is difficult to reduce the size.

(2) In addition, the width of each wiring is reduced to increase the wiring density, and the contact resistance of the connection portion in the matrix wiring is increased, and the luminance is reduced due to the voltage drop and the luminance is varied due to the variation in the contact resistance. Occurs.
Therefore, the present applicant has previously proposed a method of wiring such that there is no luminance reduction or luminance variation as Japanese Patent Application Laid-Open No. H5-155063.

FIG. 6 is a plan view of the optical print head described in the above publication, and FIG. 7 is a sectional view taken along the line AA 'of FIG.

In these figures, the optical print head comprises a light emitting diode 2 having a plurality of aligned light emitting regions 3 and its electrodes 4, a driving element 8 for dynamically driving the light emitting diode 2, and a light emitting diode 2. The bridge wiring 17 on the surface of the base 15 is disposed between the
And a wiring element 14 which is selectively connected to the wide portion 18 of the semiconductor device and has lead wirings 20 and 21 provided partially above the bridging wiring 17 and having a partially wide connecting region 22. The drive element 8 is connected to the electrode 22 of the light emitting region 3 and the lead wires 20 and 21 respectively.

According to this method, it is possible to secure a wide connection portion and reduce the contact resistance, and it is possible to reduce the luminance reduction and the luminance variation of the light emitting diode.

[0013]

According to the method of connection using the wiring element 14, since the wiring chip is used for wiring instead of wiring on the substrate, downsizing can be achieved and processing accuracy is good. Therefore, there is an advantage that the above-described effects can be obtained. However, since the bonding for connecting the elements is the same as the conventional wiring method on a substrate, no improvement can be made in this part. For example, as shown in FIGS. 6 and 7, the electrode 4 of the light emitting region 3 and the wiring element 14,
In addition, the wiring element 14 and the driving element 8 must be wire-bonded, and high-density connection by wire bonding is required.

SUMMARY OF THE INVENTION An object of the present invention is to solve the conventional problems described above, and to reduce the size and improve the reliability of wiring connection in an optical print head using light emitting diodes for dynamic driving. It is another object of the present invention to provide an optical print head capable of reducing a manufacturing process.

[0015]

SUMMARY OF THE INVENTION An optical print head according to the present invention comprises a plurality of light emitting diodes which are divided and driven, a driving circuit element which drives each light emitting diode in a divided manner, and an electric connection between each light emitting diode and the driving circuit element. An optical print head comprising: a driving circuit element for driving a plurality of light-emitting diodes in a divided manner; and a driving circuit element connected to an output side of the driving circuit section, the driving circuit element comprising: And a matrix wiring section for matrix-wiring the output of the circuit section to each light-emitting diode.

The drive circuit element may include a common drive circuit section for driving a common electrode of a plurality of light emitting diodes, and the drive circuit element is formed by an element using a semiconductor substrate. It may be something.

Further, the connection means may connect the light emitting diode and the drive circuit element by bonding using a thin metal wire.

Further, the light emitting diode has a plurality of aligned light emitting regions, and individual electrodes connected to the light emitting regions via electrode wiring, and the driving circuit element is connected to the individual electrodes of the light emitting diode. Connection electrodes may be provided so as to face each other and connected to each matrix wiring.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Before describing an embodiment of an optical print head according to the present invention, a basic structure of the optical print head according to the embodiment will be described.

FIGS. 1 and 2 are plan views schematically showing the basic structure of an optical print head according to the present invention. FIG. 3 is a diagram for explaining the basic structure of the optical print head in comparison with a conventional example. FIG. 9 is a plan view showing the structure of a conventional optical print head.

First, in the conventional example shown in FIG. 3, reference numeral 31 denotes a plurality of light emitting diodes having a common electrode, 32 denotes a driving IC (driving element) for dynamically driving the light emitting diode 31, and 33 denotes a connection between the light emitting diode 31 and the driving IC 32. , And a matrix wiring chip on which a predetermined matrix wiring is formed. The light emitting diode 31 and the driving IC 32 are connected by wire bonding via the matrix wiring chip 33. Further, the common electrode of each light emitting diode 31 is, for example, a common wiring 34 (common 1
3) to the common drive circuit 35.
Therefore, the electrodes of the light emitting diode 31 and the matrix wiring chip 33, and the matrix wiring chip 33 and the driving I
Two locations of C32 must be wire-bonded, and two high-density connections by wire bonding are required.

Therefore, in the present invention, a matrix wiring is incorporated in the wiring on the output side of the driving element, and the light emitting diode is driven by the driving element incorporating the matrix wiring.

Specifically, in FIG. 1, the present optical print head includes a plurality of light emitting diodes 31 having a common electrode.
And a driving IC (drive element) 41 for dynamically driving the light emitting diode 31 by taking in the matrix wiring 40 in the wiring on the output side of the driving IC.
1 and the drive IC 41 are connected by wire bonding. Therefore, the light emitting diode 31 and the driving IC 41
It is only necessary to perform wire bonding at one position, and the bonding can be halved. In addition, since the matrix wiring 40 is incorporated into the drive IC 41 and is integrated, a significant reduction in size can be realized. Here, in the present optical print head, the number of time divisions of the dynamic drive is suppressed to about two to three so that no extreme speed reduction occurs. Also, because of this degree of division, the matrix wiring 40
Can be easily taken into the wiring on the output side of the driving IC 41, and even if the matrix wiring 40 is integrated into the driving IC portion, the matrix wiring 40 can be housed in a size (area) smaller than or equal to that of the matrix wiring chip 33 (FIG. 3). Can be.

Further, according to the present invention, the matrix wiring is incorporated in the wiring on the output side of the driving element, the common drive circuit is incorporated in the driving element, and the light emitting diode is driven by the driving element incorporating the matrix wiring and the common drive circuit. Drive it.

For example, referring to FIG. 2, the optical print head includes a plurality of light emitting diodes 42 having a common electrode,
A drive IC (drive element) 44 for driving the light-emitting diode 42 dynamically by incorporating the matrix wiring 40 into the wiring on the output side of the drive IC and also incorporating the common drive circuit 43 into the drive element. Also,
The drive IC 44 has a through hole 45 formed therein. The common electrode of each light emitting diode 42 is connected to a common printed pattern 46, and is connected to the common drive circuit 43 built in the driving IC 44 through the through hole 45 by the common printed pattern 46. Further, the light emitting region electrode of the light emitting diode 42 and the driving IC 44
Are connected by wire bonding. Therefore, further downsizing can be realized. First Embodiment FIG. 4 is a plan view showing the structure of an optical print head according to a first embodiment of the present invention based on the above basic concept. This optical print head is an example of a four-division dynamic drive. is there.

In FIG. 4, reference numeral 51 denotes a plurality (four) of light-emitting diodes arranged in a straight line.
And the electrode wiring 53 connected to the light emitting region 52, and a common electrode (not shown) on the entire back surface. The electrode wiring 53 is connected to the light emitting region 52 by ohmic contact, and the other end is arranged in a line as an electrode wiring pad 53a for wire bonding of an individual electrode (anode electrode). When the light-emitting diodes 51 are assembled as an optical printer head, the light-emitting regions 52 are arranged at equal intervals and with good linearity even at the joints of the light-emitting diodes.

The drive circuit element 54 includes a drive circuit section 55 for driving a plurality of (four) light-emitting diodes 51 in a divided manner, and a matrix in which the output-side wiring of the drive circuit section 55 incorporates a matrix wiring for connecting the light-emitting diodes 51. Wiring part 5
6 and a wiring area 57 (connection electrode) connected to each wiring of the matrix wiring section 56, and has a structure in which the drive circuit section 55 and the matrix wiring section 56 are integrated. The drive circuit element 54 is formed of a glass substrate or a semiconductor substrate such as silicon, and is arranged in parallel along the direction in which the plurality of light emitting diodes 51 are arranged.

The drive circuit section 55 is a data driver including, for example, a serial input parallel output shift register, a latch register, a driver array and the like. The drive circuit section 55 may be arranged in the drive circuit element 54, and may have any shape and arrangement. Further, since the drive circuit section 55 can be formed in a range extending over the plurality of light emitting diodes 51, the circuit area can be expanded in the lateral direction of the drive circuit element 54 (the arrangement direction of the light emitting diodes 51). (The direction orthogonal to the arrangement direction of the light emitting diodes 51) can be reduced.

The matrix wiring section 56 includes the driving circuit section 5
5 is a matrix wiring in which wiring on the output side of No. 5 is respectively connected to a plurality of light-emitting diodes 51 that are driven separately.
There is a cross-linked wiring 56a crossing the surface of the semiconductor substrate.
A wiring region 57 serving as a bonding electrode is connected to each matrix wiring.

The wiring region 57 is formed to be linearly aligned so as to face each electrode wiring pad 53a of the light emitting diode 51.

The bridging wiring 5 of the matrix wiring section 56
6 a and the wiring region 57 are patterns obtained by translating the same pattern by the number of light emitting diodes 51.

The electrode wiring 53 connected to the light emitting area 52 of the light emitting diode 51 and the wiring area 57 of the drive circuit element 54
Are electrically connected by thin metal wires (bonding wires) 58 such as gold wires by a wire bonding method. Therefore, the light emitting diode 51 and the drive circuit element 54
The connection is made electrically by wire bonding at the location.

As described above, in the present optical print head, the drive circuit element 54 composed of a semiconductor element is
A driving circuit unit 55 for dividing and driving the driving circuit 1, a matrix wiring unit 56 connected to the output side wiring of the driving circuit unit 55, and matrix-wiring the output of the driving circuit unit 55 to each light emitting diode 51; And a wiring region 57 of each light emitting diode 51 and a wiring region 57 of the drive circuit element 54 are wire-bonded with a thin metal wire 58.

Further, a configuration may be adopted in which a common drive circuit is incorporated in the drive circuit element 54, and the light emitting diodes are driven by the drive circuit element incorporating the matrix wiring and the common drive circuit. This common drive circuit
A power driver having a suction-type output, which is arranged on a printed pattern on the back surface of the substrate of the drive circuit element 54;
A connection is made to the common electrode by a flexible substrate (not shown), or a through-hole is provided in the substrate of the drive circuit element 54, and the connection is made to the common electrode through this through-hole. As described above, if the common drive circuit is built in the drive circuit element 54, the size can be further reduced. This example will be described later in a second embodiment.

As described above, in the optical print head according to the first embodiment, the drive circuit unit 55 that drives the plurality of light emitting diodes 51 in a divided manner, and the light emitting diodes 51 are connected to the output side wiring of the drive circuit unit 55 And a wiring area 57 connected to each wiring of the matrix wiring section 56, and a driving circuit element 54 integrally formed by a semiconductor element. Since the light emitting diodes 51 are arranged in parallel along the arrangement direction and are connected to the light emitting diodes 51 by wire bonding, the driving IC and the wiring chip as described in the conventional example can be combined alone. In comparison, the size (area) can be significantly reduced, and the bonding can be reduced by half. Therefore, in addition to reducing the area of the drive circuit element 54, the bonding between the drive IC and the wiring chip is eliminated, so that the area of this portion can be reduced, and the optical print head can be downsized as a whole.

Further, since the drive circuit element 54 is integrally formed of a semiconductor element, it is possible to obtain a highly reliable wiring similar to that of the conventional example with high processing accuracy and of course, the above-mentioned bonding can be performed. This eliminates connection failures and the like in this bonding, thereby improving the reliability of the optical print head.

Further, since the drive circuit section 55, the matrix wiring section 56, and the wiring area 57 can be simultaneously formed in the process of forming the semiconductor element, the semiconductor element forming process is more complicated than the case where the drive IC and the wiring chip are formed and bonded. And the bonding process itself can be reduced. In particular, since the bridge wiring 56a in the matrix wiring section 56 can be formed by the process of forming the drive circuit element 54, the number of processes does not increase by adding the bridge wiring 56a. Further, since the drive circuit element 54 can be simultaneously formed in the process of forming the semiconductor element, the inspection process after the formation of the semiconductor element can be simplified. For example, the inspection in the drive circuit unit 55 and the inspection in the matrix wiring unit 56 can be inspected at once after the drive circuit element 54 is formed. Second Embodiment FIG. 5 is a plan view showing the structure of an optical print head according to a second embodiment of the present invention based on the above basic concept. This optical print head is an example of a four-division dynamic drive. is there. In describing the structure of the optical print head according to the present embodiment, the same components as those in FIG. 4 are denoted by the same reference numerals.

In FIG. 5, reference numeral 61 denotes a plurality of (four) light emitting diodes arranged in a straight line. Connected electrode wiring 63,
A common electrode wiring 64 is provided, and a common electrode (not shown) is provided on the entire back surface. The common electrode of each light emitting diode 61 is connected to a common electrode wiring 64 through a through hole (not shown). The electrode wiring 63 is connected to the light emitting region 62 by ohmic contact, and the other end is arranged in a line as an electrode wiring 63 for wire bonding of an individual electrode (anode electrode).
When the light-emitting diodes 61 are assembled as an optical printer head, the light-emitting regions 62 are arranged at regular intervals and with good linearity even at the joints of the light-emitting diodes.

The drive circuit element 65 includes a drive circuit section 55 for driving a plurality of (four) light emitting diodes 61 in a divided manner, a common drive circuit 66 for driving a common electrode of the light emitting diodes 61 (common drive circuit section), A matrix wiring section 67 in which a matrix wiring for connecting the light emitting diode 61 and a wiring for connecting the common electrode are incorporated into the wiring on the output side of the circuit section 55, and a wiring area 68 (connection electrode) connected to each matrix wiring of the matrix wiring section 67 ) And the common electrode wiring area 6 connected to the common electrode connection wiring
9 having a structure in which the drive circuit unit 55 and the matrix wiring unit 67 are integrated. The drive circuit element 65 is formed of a glass substrate or a semiconductor substrate such as silicon, and is arranged in parallel along the direction in which the plurality of light emitting diodes 61 are arranged.

The drive circuit section 55 is a data driver including, for example, a serial input parallel output shift register, a latch register, a driver array and the like. The drive circuit section 55 may be arranged in the drive circuit element 65 and may have any shape and arrangement. Further, since the drive circuit section 55 can be formed in a range extending over the plurality of light emitting diodes 61, the circuit area can be expanded in the lateral direction of the drive circuit element 65 (the arrangement direction of the light emitting diodes 61). (The direction orthogonal to the arrangement direction of the light emitting diodes 61) can be reduced.

The common drive circuit 66 is a power driver having a suction type output, is arranged on the substrate of the drive circuit element 65, and is connected to the common electrode wiring area 69 by the common electrode connection wiring.

The matrix wiring section 67 includes the driving circuit section 5
5 is connected to the plurality of light emitting diodes 61 that are driven separately, and the common electrode connection wiring from the common drive circuit 66 is connected to the light emitting diode 6.
This is a matrix wiring for wiring to one common electrode wiring 64, and has a bridging wiring 67a crossing the surface of the semiconductor substrate. A wiring region 68 serving as a bonding electrode is connected to each matrix wiring, and a common electrode wiring region 69 serving as a common electrode wiring connecting electrode is connected to the common electrode connection wiring.

The wiring region 68 faces each electrode wiring 63 of the light emitting diode 61 and has a common electrode wiring region 69.
Are formed with good linearity so as to face the common electrode wiring 64 of the light emitting diode 61.

The bridging wiring 6 of the matrix wiring part 67
The portion 7 a and the wiring regions 68 and 69 are patterns obtained by translating the same pattern by the number of light emitting diodes 61 in parallel.

The electrode wiring 63 connected to the light emitting area 62 of the light emitting diode 61 and the wiring area 68 of the drive circuit element 65
Are electrically connected by a thin metal wire (bonding wire) 70 such as a gold wire by a wire bonding method.
The common electrode wiring 64 connected to the common electrode of the light emitting diode 61 and the common wiring area 69 of the drive circuit element 65
Are electrically connected by a thin metal wire 71 such as a gold wire by a wire bonding method. Therefore, the light emitting diode 61
And the drive circuit element 65 are electrically connected by one wire bonding.

As described above, in the optical print head according to the second embodiment, the drive circuit element 65 composed of a semiconductor element drives the drive circuit section 55 for driving the light emitting diodes 61 in a divided manner and the common electrode. The common drive circuit 66 is connected to the wiring on the output side of the drive circuit unit 55 and the output of the drive circuit unit 55 and the common drive circuit 66.
A matrix wiring section 67 for matrix-wiring the output of each of the light-emitting diodes 61 to each light-emitting diode 61, a wiring area 68 connected to each matrix wiring, and a common wiring area 69,
A thin metal wire 70 is provided between each electrode wiring 63 of each light emitting diode 61 and the wiring region 68 of the driving circuit element 65 and between the common electrode wiring 64 and the common wiring region 69 of the driving circuit element 65.
Since the common drive circuit 66 is integrated with the common drive circuit 66, the area can be further reduced, and the effect of the first embodiment can be further enhanced.

In the present embodiment, the electrode wiring 63 and the common electrode wiring 64 of each light emitting diode 61 and the wiring area 68 and the common wiring area 69 of the drive circuit element 65 are connected by one thin metal wire 70, 71. Since it can be realized by a bonding process, the time required for bonding can be reduced as a whole.

As described above, in the optical print head using the light emitting diode for the dynamic driving, the miniaturization and the improvement of the connection reliability of the wiring can be achieved, and the manufacturing process is reduced to reduce the cost. be able to.

Here, in the optical print head of each of the above-described embodiments, the case where the four light emitting diodes 51 and 61 are divided and driven has been described as an example. Configuration may be used.
That is, the number of divisions is 2 depending on the specifications of the optical print head.
One or more arbitrary numbers can be selected, but increasing the number of divisions shortens the time for turning on each light-emitting diode, so the appropriate number of divisions is determined based on the energy required to expose the drum and the printing speed of the printer. It is decided naturally.

Also, a dedicated driving circuit element (I
If C) is manufactured, the manufacturing cost increases. So the first
In the second embodiment, the drive circuit unit 55 is shared, the bridging wiring 56a and the wiring area 57 of the matrix wiring unit 56 are formed as one block, and this block is added or selected. In the second embodiment, The drive circuit section 55 and the common drive circuit 66 are shared, and the bridge wiring 67a, the wiring area 68 and the common wiring area 69 of the matrix wiring section 67 are made into one block, and this block is added or selected. Specifically, a plurality of types of photomasks are prepared in a process of manufacturing a driving circuit element (IC), and a plurality of types of driving elements can be manufactured at low cost by selecting and using the corresponding photomask. Further, it is possible to cope with light emitting diodes having different resolutions. In this case, in order to easily change the number of divisions in the above process, the number of light-emitting diodes to be divided and driven is preferably a multiple of two.

In the optical print head of the first embodiment, the light emitting diode 51 has twelve light emitting regions 52 and its electrodes 53. However, this is merely an example, and any structure may be used. These may be arranged in any manner.

Further, the present optical print head is, for example, 60
The present invention can be applied to a print head equivalent to 0 dpi, but is naturally applicable to an array having a higher density, for example, 1200 dpi.

Further, in each of the above-described embodiments, a thin metal wire (usually Au) is used as a connecting means by wire bonding. However, the present invention is not limited to this. For example, ultrasonic bonding capable of high-density connection or TAB ( Tape Automat
ed Bonding).

The optical print head according to each of the above embodiments may have any structure as long as it has the above-described structure. The manufacturing process, the type of substrate, the number and size of electrodes, etc., The arrangement state including the number of arrangement rows is not limited to the above embodiment.

[0055]

According to the optical print head of the present invention, a drive circuit element is connected to an output side of the drive circuit for driving a plurality of light emitting diodes in a divided manner. It is equipped with a matrix wiring section that outputs the output to each light emitting diode in a matrix, so that it is possible to reduce the size, improve the connection reliability of the wiring, and reduce the manufacturing process to reduce costs. Can be planned.

In the optical print head according to the present invention, the drive circuit element is further provided with a common drive circuit section for driving the common electrodes of the plurality of light emitting diodes. The connection reliability of the wiring can be improved, and the manufacturing process can be reduced as a whole, and the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing a basic structure of an optical print head according to the present invention.

FIG. 2 is a plan view schematically showing the basic structure of the optical print head according to the present invention.

FIG. 3 is a plan view showing the structure of a conventional optical print head for explaining the optical print head according to the present invention.

FIG. 4 is a plan view showing the structure of the optical print head according to the first embodiment to which the present invention is applied.

FIG. 5 is a plan view showing a structure of an optical print head according to a second embodiment to which the present invention is applied.

FIG. 6 is a plan view showing a conventional optical print head.

FIG. 7 is a sectional view taken along the line A-A 'of FIG.

[Explanation of symbols]

51, 61 light emitting diodes, 52, 62 light emitting areas,
53, 63 electrode wiring, 53a electrode wiring pad, 5
4,65 drive circuit element, 55 drive circuit section, 56,6
7 Matrix wiring section, 56a, 67a Bridged wiring,
57, 68 wiring area, 58, 70, 71 metal thin wire (bonding wire), 66 common drive circuit (common drive circuit section), 69 common wiring area,

Claims (5)

[Claims] A plurality of light-emitting diodes that are divided and driven; a driving circuit element that drives each light-emitting diode in a divided manner;
An optical print head comprising: a connection unit for electrically connecting each light emitting diode and the driving circuit element; wherein the driving circuit element includes: a driving circuit unit for dividing and driving the plurality of light emitting diodes; An optical print head, comprising: a matrix wiring portion connected to an output side of the driving circuit portion, and matrix-wiring an output of the driving circuit portion to each light emitting diode in a matrix. 2. An optical print comprising: a plurality of light-emitting diodes having a common electrode; drive circuit elements for driving each light-emitting diode in a divided manner; and connection means for electrically connecting each light-emitting diode to the drive circuit element. A head, wherein the drive circuit element includes a drive circuit unit for driving the plurality of light emitting diodes in a divided manner; a common drive circuit unit for driving a common electrode of the plurality of light emitting diodes; and the drive circuit unit. And a matrix wiring section connected to the output side of the light emitting diode and matrix-wiring the output of the drive circuit section to each light emitting diode. 3. The optical print head according to claim 1, wherein the drive circuit element is constituted by an element using a semiconductor substrate. 4. The optical print head according to claim 1, wherein the connection unit connects the light emitting diode and the drive circuit element by bonding using a thin metal wire. 5. The light emitting diode includes a plurality of aligned light emitting regions, and individual electrodes connected to the light emitting regions via electrode wiring, wherein the driving circuit element includes an individual electrode of the light emitting diode. And a connection electrode connected to each of the matrix wirings.
The optical print head according to any one of items 3 and 4.