JPH1126505A - Semiconductor device and manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent an inner lead from being cut during inner lead bonding. SOLUTION: A solder resist layer 27 is adhered to the main surface at the pellet side of an inner lead 24 prior to the inner lead bonding, an inner lead 24 is inner lead bonded to a pad 12 by a connecting portion 14 formed from a bump with a solder resist layer 27 being contacted to the main surface at the pad 12 side of a pellet 10. The inner lead 24 is reinforced by a solder resist layer 27, and the thickness of a contact portion 27b of the solder resist layer 27 becomes larger, and the inner lead 24 is not bent into S-shape, so that the breaking of the inner lead can be prevented. By so doing, the insulation of the inner lead is not degraded, even though it makes contact with the pellet and the solder resist layer is an insulation layer. The thickness of TCP-IC can be made much smaller, their quality and reliability can be enhanced, and the TCP-IC can be made thinner and integrated highly with a size reduced considerably.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing technique, and more particularly, to a tape carrier package (hereinafter referred to as T
Called CP. ) Regarding the manufacturing technology of the semiconductor device having
For example, the present invention relates to a device that is effective for use in manufacturing a semiconductor integrated circuit device (hereinafter, referred to as an IC).

[0002]

2. Description of the Related Art A semiconductor pellet (hereinafter simply referred to as a pellet) and a carrier tape are tape-automated bonding (Tape Au) as an IC having a thin shape and having a TCP for realizing good workability.
Some are mechanically and electrically connected by a bonded bonding (TAB), and a resin sealing body is formed by a potting method.

That is, a plurality of pads for taking out the circuit are formed on the first main surface of the pellet in which the semiconductor integrated circuit is formed and arranged on the outer peripheral portion thereof. The surface is provided with bumps made of a conductor such as gold, respectively. On the other hand, the carrier tape is formed by forming an inner lead and an outer lead group on a tape body made of an insulating resin such as polyimide. Then, the pellets are arranged on the carrier tape such that each bump is aligned with each inner lead, and the bumps and the inner leads are simultaneously subjected to inner lead bonding by a bonding tool,
Electrically and mechanically connected. Thereafter, a sealing resin is potted on the tape body so as to seal the pellets and the inner lead group, whereby a resin sealing body is formed.

[0004] Since it is possible to realize a thin mounting with good workability, an IC having a TCP (hereinafter referred to as a TCP / I
Called C. Is widely used as an IC for driving a liquid crystal panel. In general, a liquid crystal panel is required to have a large screen, and with this demand, an IC for driving the liquid crystal panel is required.
As for the TCP / IC, high integration and relatively miniaturization are required. Therefore, there has been proposed a TCP / IC in which the tape body of the carrier tape is mounted on the bump-side main surface of the pellet with the inner leads arranged on the upper side, and the inner leads are gang-bonded to the bumps.

[0005] Examples of the TCP using the TAB technology are described in "Introduction to TAB technology", P167-P183, published by the Industrial Research Institute on January 25, 1990.
There is.

[0006]

However, in the method of manufacturing a TCP / IC in which the tape body of the carrier tape is mounted on the main surface of the pellet and gang-bonded, the inner leads are separated from the bumps by the thickness of the tape body. The present inventor has clarified that there is a problem that the inner lead is bent into an S-shape at the time of bonding by moving away, so that the inner lead is easily cut.

An object of the present invention is to provide a technique for manufacturing a semiconductor device capable of preventing cutting of an inner lead.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0009]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, before the inner lead bonding, an insulating layer is applied to the pellet-side main surface of the inner lead, and the inner lead is bonded to the pad while the insulating layer is in contact with the pad-side main surface of the pellet. It is characterized by doing.

According to the above-described means, the inner lead is bonded to the pad while the insulating layer is in contact with the pad-side main surface of the pellet. Since the inner leads are reinforced, the inner leads are prevented from being cut.

[0012]

1 shows a TCP IC according to an embodiment of the present invention. FIG. 1 (a) is a partially cutaway plan view, and FIG. 1 (b) is a front sectional view partially omitted. is there. FIG. 2 et seq. Are explanatory diagrams showing the manufacturing method.

In the present embodiment, the semiconductor device according to the present invention is configured as a TCP IC. This TCP
The IC 29 includes the pellet 10 and the carrier tape 20 in which a semiconductor integrated circuit (not shown) for driving a liquid crystal panel is built. On the first main surface 11 on the active area side of the pellet 10, a plurality of pads 12 for taking out the semiconductor integrated circuit to the outside are formed. On the other hand, an inner lead 24 and an outer lead 25 are formed on the tape main body 21 of the carrier tape 20, and each pad 12 and each inner lead 24 are subjected to inner lead bonding via a connection portion 14 formed by a bump. As a result, the pellet 10 is
Are electrically and mechanically connected to The pellet 10 and the group of inner leads 24 are resin-sealed by a resin sealing body 28 formed by potting in a region of the pellet 10 in the tape body 21. A solder resist layer 2 as an insulating layer is provided on the inner lead 24 group.
7, the contact portion 27b, which is a part of the inner lead 24, is in contact with the first main surface 11 of the pellet 10. This TCP IC 29 is manufactured by the following manufacturing method.

Hereinafter, the TCP / IP system according to an embodiment of the present invention will be described.
A method for manufacturing an IC will be described. According to this description, T
Details of the configuration of the CP IC will be clarified.

[0015] As shown in FIG.
Is formed in a thin plate-shaped small piece having a rectangular shape in plan view. That is, in a so-called pre-process in an IC manufacturing process, after a semiconductor integrated circuit is formed for each pellet portion on a silicon wafer (not shown), the silicon wafer is diced for each pellet portion. 10 is formed in a thin plate-shaped small piece having a rectangular shape in plan view. A plurality of pads 12 are provided on the first main surface 11 of the pellet 10 and are arranged in a row on a center line parallel to the long side of the pellet 10 at intervals so as not to interfere with each other. Each bump 13 is formed in a substantially hemispherical shape using a gold (Au) -based material so as to slightly protrude from the first main surface 11 on each pad 12 formed on the first main surface 11 of the pellet 10. Have been.

The carrier tape 20 is configured as shown in FIG. That is, the carrier tape 20
Is configured so that the TCP / IC pellet 10 and the inner lead group can be mechanically and electrically connected to each other by tape automated bonding (TAB), and a tape body 21 as a carrier having an insulating property is provided. Have. The tape body 21 is formed integrally using an insulating resin such as polyimide so that the same pattern is continuous in the longitudinal direction. However, the description and illustration are given for only one unit. This is the same for the other components. Feed holes 22 for pitch feeding and the like are arranged at equal pitches on both side edges in the width direction of the tape body 21. Further, pellet accommodation holes 23 for accommodating the pellets 10 are arranged in a row at a uniform pitch in a central portion in the width direction of the tape body 21. Each pellet accommodating hole 23 is formed in a rectangular shape slightly similar to the outer shape of the pellet 10.

A plurality of inner leads 24 for electrically leading out the integrated circuit formed on the pellet 10 to the outside are provided on one main surface (hereinafter, referred to as a first main surface) of the tape body 21. It is wired on both long sides of the pellet accommodation hole 23. The inner lead 24 is formed by attaching a thin plate made of a conductive material such as a copper foil to the upper surface of the tape body 21 by an appropriate fixing means such as welding or bonding, and etching the thin plate into a desired pattern by lithography. Have been. The inner leads 24 are wired in such a manner that a plurality of the inner leads 24 are divided into both long sides of the pellet accommodating hole 23, and the tip of each inner lead 24 is protruded to a center line parallel to the long side of the pellet accommodating hole 23. I have. The inner leads 24 are formed so as to be electrically disconnected from each other. Furthermore, inner lead 2
4 are provided in the same number as the pads 12 of the pellet 10, and the tip of each inner lead 24 is arranged so as to match with each of the pads 12.

The outer leads 25 are integrally connected to the outer sides of the inner leads 24. The outer ends of the outer leads 25 are formed on the upper surface of the tape body 21 on both sides of the long side of the pellet accommodating hole 23. Are wired in an enlarged state. Rectangular long holes 26 are respectively formed outside both long sides of the pellet accommodating holes 23 in the tape main body 21, and each outer lead 25 is formed.
Crosses both slots 26, 26, respectively. The bumps 1 are provided on the surfaces of the inner leads 24 and the outer leads 25.
3, a tin plating film (not shown) for forming a connection portion described later is applied.

In this embodiment, a solder resist layer 27 as an insulating layer is applied on the first main surface of the tape body 21 so as to cover the outer leads 25.
The outer end of the solder resist layer 27 is blocked at the inner end of the elongated hole 26. The inner end of the solder resist layer 27 extends to the base end of each of the inner leads 24.
The extension 27a extending to the inner lead 24 in FIG. 1 wraps around a main surface opposite to the first main surface of the inner lead 24 (hereinafter, referred to as a second main surface) to form a contact portion 27b with the pellet 10 described later. It is in a state where it has been done.

As shown in FIG.
When the carrier tape 20 is inner-lead bonded to the carrier tape 20, the carrier tape 20 is stretched between sprockets (not shown) and is intermittently fed in one direction. In the bonding stage 31 provided in the middle of the stretched carrier tape 20, the pellets 10 are accommodated from below in the pellet accommodation holes 23, and the respective pads 12 are aligned with the respective inner leads 24. In this state, the contact portions 27b of the solder resist layer 27 are in contact with the upper edges of both long sides of the pellet 10.

Subsequently, when the bonding tool 32 is pressed onto the group of inner leads 24, the bonding tool 32
And the bonding stage 31, the bumps 13 are thermocompression-bonded to the tips of the inner leads 24, respectively, for gang bonding. That is, inner lead 2
Since a eutectic of gold-tin is formed between the tin plating film adhered on the surface of No. 4 and the bump 13 made of a gold-based material, the bump 13 of each pad 12 and the tip of each inner lead 24 are formed. Is in a state of being electrically and mechanically connected by the connection portion 14 composed of the bump 13.

At the time of this inner lead bonding, the inner leads 24 are thermocompression-bonded to the bumps 13 while the contact portions 27b of the solder resist layer 27 are in contact with the first main surface 11 of the pellet 10, so that Inner lead 2
4 is reinforced by the contact portion 27b, and
Since the thickness of the contact portion 27b of the solder resist layer 27 is small and the inner leads 24 are not bent into an S-shape, the cutting of each inner lead 24 is prevented. Further, since the contact portion 27b is formed by the solder resist layer 27 which is an insulating layer, even if the contact portion 27b contacts the pellet 10, the insulating property of the inner lead 24 is not impaired.

A resin sealing body 28 made by potting an insulating resin such as an epoxy phenol resin is formed around the pellet 10 and the inner leads 24 on which the tape automated bonding has been performed. The group is molded so as to be resin-sealed.
That is, as shown in FIG. 5, the sealing resin 33 is supplied from above the carrier tape 20 by the potting device 34 so as to be uniformly applied around the pellet accommodating holes 23. The sealing resin 33 thus potted goes around the lower surface of the tape main body 21 through the gap between the inner peripheral surface of the pellet accommodating hole 23 and the outer peripheral surface of the pellet 10, and the pellet 10, the inner leads 24, and the solder Since the whole of the resist layer 27 is surrounded, the resin sealing body 28 for sealing the pellet 10, the inner leads 24, and the solder resist layer 27 with resin is formed over the upper and lower surfaces of the tape body 21. Become.

As described above, the TCP.
This means that the IC 29 has been manufactured. Then, the TCP / IC 29 in which the resin sealing body 28 is formed is the carrier tape 2.
0, or in a state where it is cut at a predetermined position and separated individually from the carrier tape 20, the outer lead 25 is disposed at a predetermined position of the liquid crystal panel, the terminal on the panel side and the liquid crystal panel. An outer lead bonding is performed with a controller (neither is shown) for electrical connection.

According to the above embodiment, the following effects can be obtained. (1) Solder resist is applied to the pellet-side main surface of the inner lead before the inner lead bonding, and the inner lead is bonded to the bump with the solder resist layer in contact with the bump-side main surface of the pellet. Therefore, at the time of inner lead bonding, the inner leads are reinforced by the solder resist layer,
Further, since the thickness of the contact portion of the solder resist layer is small and the inner lead is not bent into an S-shape, it is possible to prevent the inner lead from being cut.

(2) Since the solder resist layer is an insulating layer, it is possible to prevent the inner lead from being damaged even if it comes into contact with the pellet.

(3) According to the above (1) and (2),
Not only can the thickness of the TCP / IC be further reduced, but also the quality and reliability thereof can be improved, and the thinning, high integration and miniaturization of the TCP / IC can be further promoted. Can be.

(4) Thin TCP / IC capable of realizing mounting with good workability By promoting thinning, high integration and miniaturization of TCP / IC, this is a TCP / IC for driving a liquid crystal panel. When used as, a liquid crystal panel can be made larger.

FIG. 6 is a diagram showing a TCP / IP system according to the second embodiment of the present invention.
3A shows an IC, and FIG.
(B) is a partially omitted front sectional view.

The second embodiment is different from the first embodiment in that the solder resist layer 27 on the first main surface side of the carrier tape 20 is in contact with the first main surface 11 of the pellet 10 and each inner Lead 24 is connected to pad 12 at connection 1
4 is that the inner lead bonding is performed.

Also in the second embodiment, at the time of inner lead bonding, the inner leads 24 are reinforced by the solder resist
Since the thickness of 7 is thin, it is possible to prevent the inner lead 24 from being cut.

FIG. 7 is a view illustrating a TCP / IP system according to the third embodiment of the present invention.
3A shows an IC, and FIG.
(B) is a partially omitted front sectional view.

The third embodiment is different from the first embodiment in that the pellet accommodating hole 23 of the tape body 21 is
0, and the solder resist layer 27 on the first main surface side of the carrier tape 20 has the pellet 1
In this state, the inner leads 24 are bonded to the pads 12 via the connection portions 14 in the state where the inner leads 24 are in contact with the first main surface 11.

Also in the third embodiment, the inner lead 24 is reinforced by the solder resist layer 27 and the solder resist layer 2
Since the thickness of 7 is thin, it is possible to prevent the inner lead 24 from being cut.

The invention made by the inventor has been specifically described based on the embodiment. However, the invention is not limited to the embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.

For example, the insulating layer is not limited to being formed of the solder resist layer, but may be formed of another insulating material.

The bump for bonding the pad and the inner lead to the inner lead is not limited to the protrusion on the pad side, but may be provided on the inner lead side. The bumps are not limited to being formed of a gold-based material, but may be formed of a material such as a solder material that can electrically and mechanically connect a pad and an inner lead.

In the above description, the case where the invention made by the present inventor is mainly applied to a TCP / IC for driving a liquid crystal panel, which is a background application, has been described. However, the present invention is not limited to this. The present invention can be applied to all semiconductor devices including TCP such as TCP / IC having a support ring.

[0039]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

Before the inner lead bonding, an insulating layer is applied to the pellet-side main surface of the inner lead, and the inner lead is bonded to the pad while the insulating layer is in contact with the pad-side main surface of the pellet. In the case of inner lead bonding, the inner lead is reinforced by the insulating layer, and the thickness of the contact portion of the insulating layer is so thin that the inner lead is not bent into an S shape, thereby preventing the inner lead from being cut. can do.

[Brief description of the drawings]

FIGS. 1A and 1B show a TCP / IC according to an embodiment of the present invention, wherein FIG. 1A is a partially cutaway plan view with a part omitted, and FIG.

FIGS. 2A and 2B show a pellet used in a method for manufacturing a TCP / IC according to an embodiment of the present invention, wherein FIG. 2A is a plan view and FIG.

3A and 3B also show a carrier tape, wherein FIG. 3A is a partially omitted plan view, and FIG. 3B is a cross-sectional view taken along line bb of FIG. 3A.

4A and 4B also show an inner lead bonding step, wherein FIG. 4A is a partially omitted plan view, and FIG.
It is sectional drawing which follows the b line.

FIG. 5 is a longitudinal sectional view showing a packaging step.

6A and 6B show a TCP IC according to a second embodiment of the present invention, wherein FIG. 6A is a partially cutaway plan view with a part omitted, and FIG. 6B is a front sectional view with a part omitted.

7A and 7B show a TCP / IC according to a third embodiment of the present invention, in which FIG. 7A is a partially cutaway plan view with a part omitted, and FIG. 7B is a front sectional view with a part omitted.

[Explanation of symbols]

10: pellet, 11: first main surface, 12: pad, 13
... bumps, 14 ... connection parts, 20 ... carrier tape, 21
... Tape body, 22 ... Feed hole, 23 ... Pellet accommodation hole,
Reference numeral 24: inner lead, 25: outer lead, 26: elongated hole, 27: solder resist layer (insulating layer), 27a: extended portion, 27b: contact portion, 28: resin sealing body, 29: TCP
・ IC (semiconductor device), 31 ... bonding stage,
32: bonding tool, 33: sealing resin, 34: potting device.

Claims (10)

[Claims] 1. A plurality of pads for electrically taking out an electronic circuit are formed on a first main surface of a semiconductor pellet in which an electronic circuit is formed, and a plurality of pads are formed on a tape body of a carrier tape. Inner leads and outer leads are formed, each pad and each inner lead are subjected to inner lead bonding, and the pellet is electrically and mechanically connected to the carrier tape. In a semiconductor device resin-sealed by a resin sealing body formed in a region, an insulating layer is applied to at least a main surface on a pellet side of at least a part of the inner lead group. Is in contact with the main surface of the pellet. 2. The semiconductor device according to claim 1, wherein an insulating layer is applied to all of the inner leads. 3. An insulating layer is applied only to a necessary one of the inner lead group.
3. The semiconductor device according to claim 1. 4. The semiconductor device according to claim 1, wherein the tape main body is disposed closer to the pellet than the inner lead group. 5. The semiconductor device according to claim 1, wherein the tape main body is disposed on the opposite side of the inner lead group from the pellet. 6. The semiconductor device according to claim 1, wherein said insulating layer is formed by a solder resist layer.
Or the semiconductor device according to 5. 7. The method for manufacturing a semiconductor device according to claim 1, wherein the insulating layer is applied to the inner lead before the inner lead bonding, and the insulating layer contacts a main surface of the pellet. A method for manufacturing a semiconductor device, wherein inner lead bonding is performed in a state of being performed. 8. The semiconductor according to claim 7, wherein the carrier tape and the pellet are subjected to inner lead bonding in a state where the tape main body is disposed on the pellet side with respect to the inner lead group. Device manufacturing method. 9. The carrier tape and the pellet are subjected to inner lead bonding in a state where the tape main body is disposed on the opposite side of the pellet with respect to the inner lead group. The manufacturing method of the semiconductor device described in the above. 10. The method according to claim 7, wherein the insulating layer is formed by a solder resist layer.