JPH11251350A - Method and apparatus for forming bump - Google Patents

Method and apparatus for forming bump

Info

Publication number
JPH11251350A
JPH11251350A JP10064363A JP6436398A JPH11251350A JP H11251350 A JPH11251350 A JP H11251350A JP 10064363 A JP10064363 A JP 10064363A JP 6436398 A JP6436398 A JP 6436398A JP H11251350 A JPH11251350 A JP H11251350A
Authority
JP
Japan
Prior art keywords
wire
capillary
bump
bump forming
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10064363A
Other languages
Japanese (ja)
Other versions
JP3536650B2 (en
Inventor
Hidejiro Shifu
秀二郎 志風
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Business Innovation Corp
Original Assignee
Fuji Xerox Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Xerox Co Ltd filed Critical Fuji Xerox Co Ltd
Priority to JP06436398A priority Critical patent/JP3536650B2/en
Publication of JPH11251350A publication Critical patent/JPH11251350A/en
Application granted granted Critical
Publication of JP3536650B2 publication Critical patent/JP3536650B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
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    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
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Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for forming a bump into a desired shape in a stable manner by using a wire bonding technology. SOLUTION: A method for forming a bump includes the steps of opening a capillary 1 and pulling out a wire 2 from a wire hole 3 by a predetermined amount; closing the capillary 1 and a clamp 5 and making a cut on the wire 2 by using blade-shaped protrusions 4; bonding the top portion of the wire 2 onto an electrode pad 6; opening the capillary 1 and the clamp 5; raising the capillary 1 and further pulling out the wire 2; and closing the clamp 5 while the capillary 1 is open and further raising the capillary 1 so as to tear off the wire 2.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、電極パッド上にバ
ンプを形成するバンプ形成方法および装置に係り、特
に、所望形状のバンプを安定的に形成することができる
バンプ形成方法および装置に関する。The present invention relates to a method and an apparatus for forming a bump on an electrode pad, and more particularly to a method and an apparatus for forming a bump having a desired shape in a stable manner.

【０００２】[0002]

【従来の技術】図５は、従来の一般的な半導体装置の実
装状態における断面図である。半導体装置３２と回路基
板３３とは、半導体装置３２の裏面に予め形成された突
起電極（バンプ）３６を介して、電気的および機械的に
接続される。半導体装置３２とバンプ３６とは電極パッ
ド３４を介して接続され、回路基板３３と突起電極３６
とは電極パッド３５および半田フィレット３７を介して
接続される。2. Description of the Related Art FIG. 5 is a sectional view of a conventional general semiconductor device in a mounted state. The semiconductor device 32 and the circuit board 33 are electrically and mechanically connected via a bump electrode (bump) 36 formed on the back surface of the semiconductor device 32 in advance. The semiconductor device 32 and the bump 36 are connected via the electrode pad 34, and the circuit board 33 and the bump electrode 36 are connected.
Is connected via an electrode pad 35 and a solder fillet 37.

【０００３】この種のバンプ３６の形成方法として、例
えば特開平５−３２６５２３号公報では、ワイヤボンデ
ィング技術を利用し、バンプ形成用のＡｕ，Ｓｎ，Ａ
ｇ，Ｐｂ−Ｓｎ，Ａｌ，Ｃｕ等の金属からなるワイヤを
ボンディングワイヤとして用い、ボールボンド方式によ
りバンプを形成する技術が提案されている。As a method of forming this kind of bump 36, for example, in Japanese Patent Application Laid-Open No. 5-326523, a wire bonding technique is used to form Au, Sn, A for bump formation.
There has been proposed a technique of forming a bump by a ball bonding method using a wire made of a metal such as g, Pb-Sn, Al, or Cu as a bonding wire.

【０００４】図６は、上記した従来技術によるバンプ形
成方法を示した断面図であり、はじめに、予めキャピラ
リ５０に挿通されているワイヤ５１をワイヤホール５２
の先端から、所望のバンプ形状やサイズに応じた長さだ
け引き出す［同図(a) ］。次いで、ワイヤ５１の先端に
スパーク電流を流してイニシャルボール５１ａを形成す
る［同図(b) ］。次いで、イニシャルボール５１ａを電
極パッド３４上に移動し［同図(c) ］、このイニシャル
ボール５１ａをキャピラリ５０の先端で電極パッド５５
に押し付け、さらに超音波による振動を加えることでボ
ンディングする［同図(d) ］。次いで、キャピラリ５０
をワイヤ５１ごと引き上げ、ワイヤ５１を引き千切るよ
うに切断してバンプ３６を完成する。FIG. 6 is a cross-sectional view showing a bump forming method according to the above-mentioned prior art. First, a wire 51 previously inserted into a capillary 50 is inserted into a wire hole 52.
Is pulled out from the tip of the substrate by a length corresponding to a desired bump shape and size [FIG. Next, a spark current is applied to the tip of the wire 51 to form an initial ball 51a (FIG. 2B). Next, the initial ball 51a is moved onto the electrode pad 34 [FIG. 3 (c)], and the initial ball 51a is moved to the electrode pad 55 by the tip of the capillary 50.
And bonding by applying ultrasonic vibration [FIG. 3 (d)]. Next, the capillary 50
Is lifted together with the wire 51, and the wire 51 is cut so as to be torn apart to complete the bump 36.

【０００５】[0005]

【発明が解決しようとする課題】上記した従来技術で
は、イニシャルボールをボンディングした後にワイヤを
引き千切るように切断する際、その切断位置がばらつい
てバンプの高さが均一にならず、当該バンプを利用した
接合時に、未接合や隣接電極との短絡等が発生してしま
うという問題があった。また、このような切断位置のば
らつきは、ワイヤ径が太くなるほど顕著になるため、取
り扱いが容易な太ワイヤを利用してバンプを形成するこ
とができないという問題があった。In the prior art described above, when the wire is cut so as to be cut after bonding the initial ball, the cutting position varies and the bump height is not uniform, and the bump is not uniform. However, there is a problem that unbonding or short-circuiting with an adjacent electrode or the like occurs at the time of bonding using the method. Further, such a variation in the cutting position becomes more remarkable as the wire diameter becomes larger, so that there is a problem that a bump cannot be formed using a thick wire which is easy to handle.

【０００６】本発明の第１の目的は、上記した従来技術
の問題点を解決し、高さの均一なバンプを形成できるバ
ンプ形成方法および装置を提供することにある。本発明
の第２の目的は、上記した従来技術の問題点を解決し、
取り扱いの容易な太ワイヤを用いてバンプを形成できる
バンプ形成方法および装置を提供することにある。A first object of the present invention is to solve the above-mentioned problems of the prior art and to provide a bump forming method and apparatus capable of forming a bump having a uniform height. A second object of the present invention is to solve the above-mentioned problems of the prior art,
An object of the present invention is to provide a bump forming method and a bump forming method capable of forming a bump using a thick wire which is easy to handle.

【０００７】[0007]

【課題を解決するための手段】上記した目的を達成する
ために、本発明では、以下のような手段を講じた点に特
徴がある。 (1) 本発明のバンプ形成装置は、ワイヤホールを開閉可
能なキャピラリと、前記ワイヤホールに対してワイヤを
固定するクランパ手段と、前記ワイヤホールの出口から
所定の距離だけ離間された位置の内側に形成された刃状
突起とを具備し、前記刃状突起は、前記キャピラリが開
状態のときにはワイヤから離間され、前記開状態から閉
状態への移行動作に連動してワイヤに食い込むようにし
た。 (2) 本発明のバンプ形成方法は、キャピラリを開いてワ
イヤホールの先端から所定量のワイヤを引き出す工程
と、前記キャピラリを閉じて前記ワイヤに切れ目を入れ
る工程と、前記ワイヤの先端を被接合面に接合する工程
と、前記キャピラリおよびクランパ手段を開く工程と、
前記キャピラリを引き上げて、前記先端が被接合面に接
合された状態のワイヤをさらに引き出す工程と、前記キ
ャピラリを開いたまま前記クランパ手段を閉じ、前記キ
ャピラリをさらに引き上げて前記ワイヤを引き千切る工
程とを備えた。Means for Solving the Problems In order to achieve the above object, the present invention is characterized in that the following means are taken. (1) A bump forming apparatus according to the present invention includes a capillary capable of opening and closing a wire hole, a clamper for fixing a wire to the wire hole, and an inner side of a position separated by a predetermined distance from an outlet of the wire hole. And the blade-shaped projection is separated from the wire when the capillary is in the open state, and bites into the wire in conjunction with the transition from the open state to the closed state. . (2) In the bump forming method of the present invention, a step of opening a capillary and pulling out a predetermined amount of wire from the tip of a wire hole, a step of closing the capillary and making a cut in the wire, and joining the tip of the wire Joining to a surface, and opening the capillary and clamper means,
A step of pulling up the capillary to further pull out the wire with the tip joined to the surface to be bonded; a step of closing the clamper with the capillary open, further pulling up the capillary to cut the wire apart And with.

【０００８】上記した構成のバンプ形成方法および装置
によれば、ワイヤの所定位置に予め切れ目を入れること
ができるので、ワイヤを、その径の大小にかかわらず常
に所定位置で引き千切ることが可能になる。According to the bump forming method and apparatus having the above-described configuration, a predetermined position of the wire can be cut in advance, so that the wire can always be cut at the predetermined position regardless of its diameter. become.

【０００９】[0009]

【発明の実施の形態】以下、図面を参照して本発明を詳
細に説明する。図１、２は、本発明の一実施形態である
バンプ形成装置に固有の開閉式キャピラリの開閉機構を
示した断面図であり、図１は、開閉式キャピラリ１が開
いた状態での断面図、図２は、開閉式キャピラリ１が閉
じた状態での断面図であり、それぞれ(a) はワイヤホー
ル３に沿った断面図、(b) は(a) のＡ−Ａ線での断面図
である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIGS. 1 and 2 are cross-sectional views showing an opening / closing mechanism of an opening / closing capillary unique to a bump forming apparatus according to an embodiment of the present invention. FIG. 1 is a cross-sectional view in a state where the opening / closing capillary 1 is opened. 2A and 2B are cross-sectional views in a state where the open / close type capillary 1 is closed. FIG. 2A is a cross-sectional view along the wire hole 3, and FIG. It is.

【００１０】本実施形態の開閉式キャピラリ１は、その
ワイヤホール３に沿って分割された２つの口ばし状体１
ａ、１ｂによって構成されている。また、各口ばし状体
１ａ、１ｂのワイヤホール出口からワイヤホール３に沿
って所定の距離Ｌだけ離間された位置に、ワイヤホール
３内に挿通されたワイヤに切れ目を入れるための刃状突
起４を設けている。The openable capillary 1 according to the present embodiment has two flared bodies 1 divided along the wire holes 3.
a and 1b. Further, a blade-like shape for making a cut in the wire inserted into the wire hole 3 at a position separated by a predetermined distance L along the wire hole 3 from the wire hole exit of each of the beveled bodies 1a and 1b. The projection 4 is provided.

【００１１】前記各口ばし状体１ａ、１ｂ内には、それ
ぞれ先端に向かうほどワイヤホール３から離れるように
構成された一対のガイド溝１１ａ、１１ｂが、ワイヤホ
ール３に沿って対向配置されている。当該ガイド溝１１
ａ、１１ｂ内では、開閉レバー３０が移動可能な状態で
挿嵌されており、前記開閉レバー３０をガイド溝１１
ａ、１１ｂ内で上方に移動させると、図１に示したよう
に、各口ばし状体１ａ、１ｂの間隙が広がって開閉式キ
ャピラリ１が開き、下方に移動させると、図２に示した
ように、各口ばし状体１ａ、１ｂの間隙が狭まって開閉
式キャピラリ１が閉じる。A pair of guide grooves 11a and 11b, which are configured so as to move away from the wire hole 3 as they go toward the tip, are arranged in the respective edge-like bodies 1a and 1b so as to face each other along the wire hole 3. ing. The guide groove 11
a, 11b, the opening / closing lever 30 is inserted so as to be movable.
1 and 1b, the gap between the mouth-like bodies 1a and 1b is widened and the openable capillary 1 is opened as shown in FIG. 1, and as shown in FIG. As described above, the gap between each of the beveled bodies 1a and 1b is narrowed, and the openable capillary 1 is closed.

【００１２】前記刃状突起４の高さは、開閉式キャピラ
リ１が開状態のときには、ワイヤホール３内に挿通され
るワイヤ（図示せず）に先端が食い込まず、閉状態のと
きに食い込むように調整されている。The height of the blade-shaped projection 4 is such that the tip does not bite into a wire (not shown) inserted into the wire hole 3 when the openable capillary 1 is in an open state, but does bite when the capillary is closed. Has been adjusted.

【００１３】図３は、上記した本発明のバンプ形成装置
によるバンプ形成方法を示した断面図であり、前記と同
一の符号は同一または同等部分を表している。FIG. 3 is a sectional view showing a bump forming method by the above-described bump forming apparatus of the present invention, and the same reference numerals as those described above denote the same or equivalent parts.

【００１４】本実施形態には、はじめに、開閉式キャピ
ラリ１を開いた状態でクランパ５を開き、ワイヤ２を所
望のバンプ形状やサイズに応じた長さだけ開閉式キャピ
ラリ１の先端部から引き出す［同図(a) ］。次いで、ク
ランパ５を閉じてワイヤ２をワイヤホール３に対して固
定し、ワイヤ２の先端にスパーク電流を流してイニシャ
ルボール２ａを形成する［同図(b) ］。次いで、開閉式
キャピラリ１を閉じてイニシャルボール２ａを電極パッ
ド６上に移動し、開閉式キャピラリ１の先端でイニシャ
ルボール２ａを電極パッド６に押し付ける［同図(c)
］。このとき、ワイヤ２には前記刃状突起４が食い込
んで切れ目が入れられる。In this embodiment, first, the clamper 5 is opened with the openable capillary 1 open, and the wire 2 is pulled out from the tip of the openable capillary 1 by a length corresponding to a desired bump shape and size. FIG. Next, the clamper 5 is closed to fix the wire 2 to the wire hole 3, and a spark current is applied to the tip of the wire 2 to form an initial ball 2a (FIG. 2B). Next, the openable capillary 1 is closed, the initial ball 2a is moved onto the electrode pad 6, and the initial ball 2a is pressed against the electrode pad 6 at the tip of the openable capillary 1 [FIG.
]. At this time, the wire 2 is cut by the blade-shaped protrusion 4.

【００１５】次いで、超音波による振動を加えること
で、イニシャルボール２ａを電極パッド６にボンディン
グ［同図(d) ］する。ボンディングが終了すると、開閉
式キャピラリ１を開くと共にクランパ５を開く［同図
(e) ］。次いで、開閉式キャピラリ１を引き上げ、次の
イニシャルボールの形成に必要な長さだけワイヤ２が引
き出された時点でクランパ５を閉じる［同図(f) ］。次
いで、開閉式キャピラリ１をさらに引き上げることでワ
イヤ２を引き千切ってバンプ１０を完成する［同図(g)
］。Next, the initial ball 2a is bonded to the electrode pad 6 by applying vibration by ultrasonic waves [FIG. 2 (d)]. When the bonding is completed, the openable capillary 1 and the clamper 5 are opened [FIG.
(e)]. Next, the openable capillary 1 is pulled up, and the clamper 5 is closed when the wire 2 is pulled out by a length necessary for forming the next initial ball [FIG. Then, the wire 2 is cut apart by further pulling up the openable capillary 1 to complete the bump 10 [FIG.
].

【００１６】このとき、本実施形態では前記刃状突起４
によってワイヤ２に予め切れ目が入れられているので、
ワイヤ２は常に当該切れ目の位置で引き千切られること
になる。以上の動作を全ての電極パッドに対して繰り返
すことでバンプ形成を終了する。At this time, in the present embodiment, the blade-shaped projection 4
Since the wire 2 has been cut in advance,
The wire 2 is always cut at the position of the cut. By repeating the above operation for all the electrode pads, the bump formation is completed.

【００１７】このように、本実施形態によれば、キャピ
ラリ１を開閉式にすると共に当該開閉式キャピラリ１の
内側に刃状突起４を設け、開閉式キャピラリ１の開閉動
作によってワイヤ２の所定位置に切れ目が入れられるよ
うにしたので、ボンディング後のワイヤ２は必ず当該切
れ目で引き千切られることになる。したがって、バンプ
１０の高さを常に一定に保つことができる。As described above, according to the present embodiment, the capillary 1 is made openable and the blade-like projection 4 is provided inside the openable capillary 1, and the opening and closing operation of the openable capillary 1 causes the wire 2 to move to the predetermined position. The wire 2 after bonding is necessarily cut off at the cut. Therefore, the height of the bump 10 can always be kept constant.

【００１８】図４は、上記した本発明のバンプ形成装置
を利用して、イニシャルボールを形成することなくバン
プを形成する方法を示した断面図であり、前記と同一の
符号は同一または同等部分を表している。本実施形態で
は、外径がワイヤホール３の内径と略同一の太ワイヤ１
２を用いている。FIG. 4 is a sectional view showing a method of forming a bump without forming an initial ball by using the above-described bump forming apparatus of the present invention. Is represented. In the present embodiment, the thick wire 1 whose outer diameter is substantially the same as the inner diameter of the wire hole 3 is used.
2 is used.

【００１９】このような構成において、はじめに、開閉
式キャピラリ１およびクランパ５を開き、太ワイヤ１２
を所望のバンプ形状やサイズに応じた長さだけ開閉式キ
ャピラリ１の先端部から引き出す［同図(a) ］。次い
で、開閉式キャピラリ１およびクランパ５を閉じて太ワ
イヤ１２をワイヤホール３に対して固定する［同図
(b)］。このとき、太ワイヤ１２の所定位置には前記刃
状突起４が食い込んで切れ目が入れられる。In such a configuration, first, the openable capillary 1 and the clamper 5 are opened and the thick wire 12 is opened.
Is drawn out from the tip of the openable capillary 1 by a length corresponding to a desired bump shape and size [FIG. Next, the openable capillary 1 and the clamper 5 are closed to fix the thick wire 12 to the wire hole 3 [FIG.
(b)]. At this time, the edge-shaped projection 4 cuts into a predetermined position of the thick wire 12 to make a cut.

【００２０】次いで、太ワイヤ１２を電極パッド６上に
移動し、その先端端面を電極パッド６に圧接する［同図
(c) ］。さらに、超音波による振動を加えることで、太
ワイヤ１２の端面を電極パッド６に圧接接合する［同図
(d) ］。圧接接合が終了すると、開閉式キャピラリ１お
よびクランパ５を開く［同図(e) ］。次いで、開閉式キ
ャピラリ１を引き上げ、次のバンプ形成に必要な長さだ
け太ワイヤ１２が引き出された時点でクランパ５を閉じ
る［同図(f) ］。次いで、開閉式キャピラリ１をさらに
引き上げることで太ワイヤ１２を引き千切ってバンプ１
０を完成する［同図(g) ］。Next, the thick wire 12 is moved onto the electrode pad 6 and its front end face is pressed against the electrode pad 6 [FIG.
(c)]. Further, the end face of the thick wire 12 is press-welded to the electrode pad 6 by applying vibration by ultrasonic waves.
(d)]. When the pressure welding is completed, the openable capillary 1 and the clamper 5 are opened [FIG. Then, the openable capillary 1 is pulled up, and the clamper 5 is closed when the thick wire 12 is pulled out by a length necessary for the next bump formation [FIG. Next, the openable capillary 1 is further pulled up to tear the thick wire 12 apart to form the bump 1.
0 is completed [FIG. 7 (g)].

【００２１】このとき、本実施形態では前記刃状突起４
によって太ワイヤ１２に予め切れ目が入れられているの
で、太ワイヤ１２は常に当該切れ目の位置で引き千切ら
れることになる。At this time, in the present embodiment, the blade-shaped projection 4
Since the thick wire 12 is previously cut in the thick wire 12, the thick wire 12 is always cut at the position of the cut.

【００２２】このように、本実施形態によれば、キャピ
ラリ１を開閉式にすると共に当該開閉式キャピラリ１の
内側に刃状突起４を設け、開閉式キャピラリ１の開閉動
作によってワイヤ２の所定位置に切れ目が入れられるよ
うにしたので、ボンディング後のワイヤ２は必ず当該切
れ目で引き千切られることになる。したがって、ワイヤ
をその径の大小にかかわら常に所定位置で引き千切るこ
とが可能になる。As described above, according to the present embodiment, the capillary 1 is made openable and the blade-shaped projection 4 is provided inside the openable capillary 1, and the opening and closing operation of the openable capillary 1 causes the predetermined position of the wire 2. The wire 2 after bonding is necessarily cut off at the cut. Therefore, the wire can always be cut at a predetermined position regardless of the diameter.

【００２３】なお、上記した実施形態では、キャピラリ
１が２つの口ばし状体１ａ、１ｂに分割されるものとし
て説明したが、本発明はこれのみに限定されるものでは
なく、３分割あるは４分割等されるようにしても良い。In the above-described embodiment, the capillary 1 is described as being divided into the two flared bodies 1a and 1b. However, the present invention is not limited to this, and is divided into three. May be divided into four or the like.

【００２４】また、上記した実施形態では、刃状突起４
が口ばし状体１ａ、１ｂの開状態から閉状態への移行動
作に連動してワイヤに食い込むように構成したが、刃状
突起４のみを別途に駆動する適宜の駆動手段を設け、刃
状突起４を開閉動作とは無関係に適宜のタイミングで駆
動するようにしても良い。In the above-described embodiment, the blade-shaped projection 4
Is configured to bite into the wire in conjunction with the transition from the open state to the closed state of the beveled bodies 1a and 1b. However, an appropriate drive means for separately driving only the blade-shaped projections 4 is provided, The projection 4 may be driven at an appropriate timing irrespective of the opening / closing operation.

【００２５】[0025]

【発明の効果】上記したように、本発明によれば、ワイ
ヤボンディング技術を利用してバンプを形成する際に、
ワイヤの所定位置に予め切れ目を入れることができるの
で、ワイヤを、その径の大小にかかわらず常に所定位置
で引き千切ることができる。As described above, according to the present invention, when forming a bump using a wire bonding technique,
Since a cut can be made at a predetermined position of the wire in advance, the wire can always be cut at the predetermined position regardless of the diameter of the wire.

【図面の簡単な説明】[Brief description of the drawings]

【図１】開閉式キャピラリの開いた状態での断面図であ
る。FIG. 1 is a cross-sectional view of an openable capillary in an open state.

【図２】開閉式キャピラリの閉じた状態での断面図であ
る。FIG. 2 is a cross-sectional view of the openable capillary in a closed state.

【図３】細いワイヤを用いたバンプ形成方法を示した断
面図である。FIG. 3 is a sectional view showing a bump forming method using a thin wire.

【図４】太いワイヤを用いたバンプ形成方法を示した断
面図である。FIG. 4 is a cross-sectional view showing a bump forming method using a thick wire.

【図５】一般的な半導体装置の実装状態における構成を
示した断面図である。FIG. 5 is a cross-sectional view showing a configuration of a general semiconductor device in a mounted state.

【図６】従来のバンプ形成方法を示した断面図である。FIG. 6 is a cross-sectional view illustrating a conventional bump forming method.

【符号の説明】[Explanation of symbols]

１…キャピラリ、１ａ、１ｂ…口ばし状体、２…ワイ
ヤ、３…ワイヤホール、４…刃状突起、５…クランパ、
６…電極パッド、１０…バンプDESCRIPTION OF SYMBOLS 1 ... Capillary, 1a, 1b ... Mouth-like body, 2 ... Wire, 3 ... Wire hole, 4 ... Blade projection, 5 ... Clamper,
6 ... electrode pad, 10 ... bump

Claims (6)

【特許請求の範囲】[Claims] 【請求項１】 ワイヤボンディング技術を利用してバン
プを形成するバンプ形成装置において、 ワイヤホールを開閉可能なキャピラリと、 前記ワイヤホールに対してワイヤを固定するクランパ手
段と、 前記ワイヤホールの出口から所定の距離だけ離間された
位置の内側に形成された刃状突起とを具備し、 前記刃状突起は、前記キャピラリが開状態のときにはワ
イヤから離間され、前記開状態から閉状態への移行動作
に連動してワイヤに食い込むように構成されたことを特
徴とするバンプ形成装置。1. A bump forming apparatus for forming a bump using a wire bonding technique, comprising: a capillary capable of opening and closing a wire hole; a clamper means for fixing a wire to the wire hole; A blade-shaped projection formed inside a position separated by a predetermined distance, wherein the blade-shaped projection is separated from the wire when the capillary is in an open state, and a transition operation from the open state to a closed state is provided. A bump forming apparatus characterized in that it is configured to cut into a wire in conjunction with the above. 【請求項２】 前記キャピラリは、そのワイヤホールに
沿って分割された複数の開閉可能な口ばし状体によって
構成され、前記各口ばし状体の先端から所定の距離だけ
離間された位置の内側に前記刃状突起が設けられたこと
を特徴とする請求項１に記載のバンプ形成装置。2. The capillary according to claim 1, wherein said capillary is formed of a plurality of openable and closable edge-shaped members divided along a wire hole thereof, and is separated from a tip of each of said edge-shaped objects by a predetermined distance. The bump forming apparatus according to claim 1, wherein the blade-shaped projection is provided inside the bump. 【請求項３】 前記刃状突起は、前記キャピラリの各口
ばし状体が開状態のときにはワイヤから離間され、前記
開状態から閉状態への移行動作に連動してワイヤに食い
込むように構成されたことを特徴とする請求項２に記載
のバンプ形成装置。3. The blade-shaped projection is separated from the wire when each of the beveled bodies of the capillary is in an open state, and bites into the wire in conjunction with a transition from the open state to the closed state. The bump forming apparatus according to claim 2, wherein: 【請求項４】 前記請求項１ないし３に記載のバンプ形
成装置を用いたバンプ形成方法において、 キャピラリおよびクランパ手段を開いてワイヤホールの
出口から所定量のワイヤを引き出す工程と、 前記キャピラリを閉じてワイヤに刃状突起により切れ目
を入れる工程と、 前記ワイヤの先端を被接合面に接合する工程と、 前記キャピラリおよびクランパ手段を開く工程と、 前記キャピラリを引き上げて、前記先端が被接合面に接
合された状態のワイヤをワイヤホールの出口からさらに
引き出す工程と、 前記キャピラリを開いたまま前記クランパ手段を閉じ、
前記キャピラリをさらに引き上げて前記ワイヤを引き千
切る工程とからなることを特徴とするバンプ形成方法。4. A bump forming method using the bump forming apparatus according to claim 1, wherein a step of opening a capillary and a clamper means to draw out a predetermined amount of wire from an outlet of a wire hole, and closing the capillary. Cutting the wire with an edge-like projection, joining the tip of the wire to the surface to be joined, opening the capillary and clamper means, pulling up the capillary, and bringing the tip to the surface to be joined. A step of further pulling out the joined wire from the exit of the wire hole, and closing the clamper means while keeping the capillary open;
A step of further pulling up the capillary and breaking the wire apart. 【請求項５】 前記ワイヤの外径は前記ワイヤホールの
内径よりも十分に細く、前記接合工程では、前記ワイヤ
の先端にイニシャルボールが形成され、当該イニシャル
ボールが前記被接合面にボンディングされることを特徴
とする請求項４に記載のバンプ形成方法。5. An outer diameter of the wire is sufficiently smaller than an inner diameter of the wire hole. In the bonding step, an initial ball is formed at a tip of the wire, and the initial ball is bonded to the surface to be bonded. The bump forming method according to claim 4, wherein: 【請求項６】 前記ワイヤの外径は前記ワイヤホールの
内径と略同一であり、前記接合工程では、前記ワイヤの
先端が前記被接合面に圧接接合されることを特徴とする
請求項４に記載のバンプ形成方法。6. The wire according to claim 4, wherein an outer diameter of the wire is substantially the same as an inner diameter of the wire hole, and in the bonding step, a tip of the wire is pressure-welded to the surface to be bonded. The bump forming method according to the above.
JP06436398A 1998-02-27 1998-02-27 Bump forming method and apparatus Expired - Fee Related JP3536650B2 (en)

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