JPH11251341A - Resin coating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the electronic component of excellent moisture resistance and high reliability capable of resin coating without the dispersion of the thickness of a void and resin. SOLUTION: This resin coating device is provided with a tape supporting part 7 for supporting a tape member 3 for which a rectangular resin coating scheduled part 1b is arrayed with a prescribed interval with the short diameter in a longitudinal direction, a mask 11 arranged on the tape supporting part 7 for covering the area including the resin coating scheduled part 1b of the tape member 3 and opening a rectangular coating window 11a corresponding to the resin coating scheduled part, and a squeegee 9 made to cross the coating window from an outer part position in the long diameter direction of the coating window 11a on the mask 11 for supplying fluidized resin 5 from the coating window 11a to the resin coating scheduled part 1b of the tape member 3. The opposing surface in the long diameter direction of the coating window 11a of the mask 11 is opened upwards.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a screen printing type resin coating apparatus.

[0002]

2. Description of the Related Art TAB semiconductor devices are generally used as thin and small electronic components. This example will be described with reference to FIG. In the figure, 1 is a long insulating tape in which feed holes 1a are formed at regular intervals along both sides, and rectangular through holes 1b are formed at predetermined intervals in the longitudinal direction at the middle in the width direction;
Reference numeral 2 denotes a conductive pattern formed by etching a conductive foil laminated on the insulating tape 1, and includes an inner lead 2a extending into the through hole 1b. The insulating tape 1 and the conductive pattern 2
Constitute a TAB tape 3. For example, in the case of a semiconductor device for driving a liquid crystal display device, the inner leads 2a are divided into an input side and an output side, and are arranged in the longitudinal direction of the through hole 1b so as to be opposed to each other. In the case where the number is significantly different, the lead interval of the larger number is made closer, and a part thereof is arranged in the minor axis direction as necessary. 4 is a through hole 1 of the TAB tape 3
The electrode 4a and the inner lead 2a are superimposed on the semiconductor pellet 4 disposed in a and are electrically connected by means such as thermocompression bonding. Reference numeral 5 denotes a resin that covers and protects the surface of the semiconductor pellet 4 and the connection between the electrode 4a and the inner lead 2a in the through hole 1b. The TAB type semiconductor device intermediate structure is used by cutting the TAB tape 3 into a predetermined shape and separating it into individual electronic components. The operation of applying the resin 5 for protecting the surface of the semiconductor pellet 4 including the electrical connection between the electrode 4a of the TAB type semiconductor device 6 and the inner lead 2a from external force or corrosive gas will be described with reference to FIGS. I do. In the figure, the same components as those in FIG. 2 are denoted by the same reference numerals, and redundant description will be omitted. In the figure, 7 is the TAB of the intermediate structure 6
A tape supporting portion 8 that guides the tape (tape member) 3 and positions it at a predetermined position, and 8 forms an application window 8a corresponding to the through-hole 1b (the portion to be coated with resin) of the TAB tape 3 and moves vertically above the tape supporting portion 7. TAB tape 3 moved and positioned
Reference numeral 9 denotes a squeegee that moves on the mask 8 by pressing the flowing resin 5 supplied onto the mask 8 from a resin supply nozzle (not shown). Thickness of mask 8 and through hole 1b
The opening diameter of the application window 8a determines the amount of resin to be applied and the application state. Further, a plurality of application windows 8a are formed in the mask 8 corresponding to the plurality of through holes 1b, and a squeegee 9 is disposed so as to be movable in the width direction of the TAB tape 8 corresponding to each of the application windows 8a, thereby improving work efficiency. Have improved. As a result, as shown in FIG. 5, the resin 5 supplied onto the semiconductor pellet 4 from the through hole 1b includes the surface of the semiconductor pellet 4, the connection portion between the electrode 4a and the inner lead 2a, The periphery of the through hole 1b is covered to improve the reliability of the electronic component.

[0003]

In the case where the semiconductor pellet 4 has a slender outer dimension of 20 mm.times.1.5 mm like a semiconductor pellet for driving a liquid crystal display device, the through hole 1b has a length of about 0.5 mm. Largely formed,
When this is coated with a resin, as shown in FIG. 6, a cavity 5a is formed in a part of the resin 5 in the through hole 1b, or this cavity is exposed on the outer surface, and the thickness of the resin is locally reduced, so that the moisture resistance is reduced. There was a problem of lowering. As a cause of this cavity, when the resin 5 is pressed and moved on the inclined surface of the squeegee 9, a force f in the moving direction acts on the resin 5 in contact with the inclined surface as shown in FIG. Is divided into a force f1 in a direction orthogonal to the direction of the arrow and an upward force f2 along the surface of the squeegee 9. The force component in the direction of pushing the resin 5 along the inner wall of the application window 8a is small. 8a
It is considered that the resin acts to peel off the resin from the inner wall. Further, the resin 5 is supplied onto the mask 8 so that the squeegee 9
8, the air 10 is confined between the squeegee 9 and the resin 5 as shown in FIG. 8, and the air 10 is compressed by the forward pressing force from the squeegee 9 and the backward pressing force from the resin 5. Also, it is considered that the compressed air 10 covers the resin 5 previously supplied at the position of the application window 8a of the mask 8 and strongly presses down the resin locally, which is also considered to be a cause of the cavity. Further observation of this state reveals that a gap is formed between the lower surface of the mask 8 and the lead by bending the middle of the inner lead 2a to form a step between the lead base and the free end. , The occurrence of cavities was remarkable. Such a variation in the thickness of the cavity and the resin lowers the moisture resistance of the electronic component and lowers the reliability.

[0004]

SUMMARY OF THE INVENTION The present invention has been proposed for solving the above-mentioned problems, and has a rectangular resin coating portion which supports a tape member having its short diameter arranged at predetermined intervals in the longitudinal direction. A tape support portion, a mask disposed on the tape support portion, covering a region including the resin coating planned portion of the tape member, and opening a rectangular application window corresponding to the resin coating planned portion; A squeegee for sliding the fluidized resin slidably across the application window from an outer position in the major axis direction of the application window and supplying the fluidized resin from the application window to the resin coating scheduled portion of the tape member; A resin coating apparatus characterized in that an opposing surface in the major axis direction of a window is expanded upward.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A resin coating apparatus according to the present invention is an apparatus for supplying a resin to a coating window by moving a squeegee across a longitudinal direction of a coating window on a mask having a rectangular coating window. Characterized in that the opposite surface of the coating window formed in the mask in the longitudinal direction is expanded upward.
As a tape member, a semiconductor pellet and an inner lead disposed in the through hole of a TAB tape in which a conductive pattern including an inner lead extending into the through hole is formed on an insulating tape having a rectangular through hole are electrically connected. Can be applied to an intermediate structure of a TAB type semiconductor device connected to a semiconductor device. In this case, the inner lead of the tape member is formed densely in the major axis direction of the through hole and coarsely formed in the minor axis direction, so that a step is formed between the inner lead base and the free end, and the coating window of the mask is formed. This is extremely effective when at least the major axis is formed to be smaller in diameter than the through hole of the TAB tape, and a gap is formed between the inner lead and the lower surface adjacent to the major surface of the application window in the longitudinal direction. In addition, a tapered surface or a convex curved surface can be used to expand the facing surface in the major diameter direction of the mask application window upward.

[0006]

FIG. 1 shows an embodiment of the present invention.
In the drawings, the same components as those in FIGS. 2 to 4 are denoted by the same reference numerals, and redundant description will be omitted. The resin coating apparatus according to the present invention is characterized by a mask denoted by reference numeral 11. In other words, the mask 11 has only a tapered surface 11b so that the inner surface of the coating window 11a facing the direction in which the squeegee 9 moves moves toward the upper side. The inclination angle of the tapered surface 11b is formed such that a surface Q orthogonal to the squeegee 9 intersects a plane P including the surface from above. By forming the tapered surface 11b in this way, a force f1 in a direction (plane Q direction) orthogonal to the squeegee 9 is applied to the resin 5 which is pushed and moved by the squeegee 9, and
1b while closely moving and approaching the through hole 1b to cover the surface of the semiconductor pellet 4. Therefore, the pressure from the squeegee 9 is continuously applied to the inner periphery of the application window 11a through the resin 5 and no cavity is formed. Also, if air is entrapped between the squeegee 9 and the resin 5, the air is compressed by receiving the pressure from the squeegee 9 and the pressure pushed back from the resin 5 at the same time. 1
When the squeegee 9 is separated from the squeegee 9 and reaches the portion 1b, the pressing force from the squeegee 9 does not reach and the resin 5 is pushed in the direction of the through-hole 1b to expand and the pressing force drops rapidly. The pressure due to the expansion of the air is blocked by the tapered surface 11b having a long creepage distance and does not reach below the mask 11. Therefore, no cavity is formed in the through hole 1b, and good resin coating can be performed. Further, in the resin coating apparatus using the mask 11, especially when there is a step between the base portion and the free end of the inner lead 2a and a gap is formed between the lower surface of the mask 11 and the inner lead 2a. However, since the resin 5 receives the force f1 and moves closely on the tapered surface 11b of the application window 11a, the force f1 also acts on the resin 5 moved from the tapered surface 11b to the inner lead 2a, and the resin 5 Sufficient resin can be fed into the gap by being spread on the inner lead 2a, and the resin is pushed into the entire surface of the through hole 1b from the entire surface of the application window 11a. Can be eliminated by coating with a resin. The present invention is not limited only to the above-described embodiment. For example, the present invention is applicable to a tape member not only for an intermediate structure of a TAB semiconductor device but also for a tape member having a rectangular resin coating scheduled portion. it can.
Further, in the above embodiment, the tapered surface 11b is formed in the application window 11a of the mask 11, but this tapered surface can be formed by electric discharge machining, etching, or the like. It can also be formed in a plane or step shape. In the case of forming a step-shaped coating window, a small-diameter rectangular flat plate may be attached to a mask having a large-diameter coating window.

[0007]

As described above, according to the present invention, it is possible to realize a highly reliable electronic component which can be coated with a resin without variation in the thickness of the cavity and the resin, and has a good moisture resistance.

[Brief description of the drawings]

FIG. 1 is a sectional side view of a main part showing an embodiment of the present invention.

FIG. 2 is a perspective view of a main part showing an intermediate structure of a TAB type semiconductor device as a tape member.

FIG. 3 is a front view of an apparatus for coating the tape member with a resin;

FIG. 4 is a side sectional view of the apparatus of FIG. 3;

5 is a side sectional view of a tape member coated with resin by the apparatus in FIG. 3;

FIG. 6 is a side sectional view of a tape member for explaining a problem caused by the apparatus in FIG. 3;

FIG. 7 is a sectional side view of a main part for explaining a force applied to a resin pressed by a squeegee

8 is a sectional side view of a main part showing another problem of the apparatus in FIG. 3;

[Explanation of symbols]

 1b Resin coating planned portion (through hole) 3 Tape member (TAB tape) 7 Tape support portion 9 Squeegee 11 Mask 11a Application window

Claims (5)

[Claims] 1. A tape supporting portion for supporting a tape member having a rectangular portion to be covered with a resin and a short diameter of which is arranged at predetermined intervals in a longitudinal direction, and a resin covering portion to be disposed on the tape supporting portion to cover the tape member. A mask that covers the area including the part and has a rectangular application window opened corresponding to the part to be coated with resin, and applies the fluidized resin across the application window from the outside of the application window in the major axis direction on the mask What is claimed is: 1. A resin coating apparatus comprising: a squeegee for supplying a resin coating portion of a tape member from a window; wherein a long-diameter facing surface of the coating window of the mask is expanded upward. . 2. A semiconductor pellet and an inner member disposed in a through hole of a TAB tape in which a tape member is formed on an insulating tape having a rectangular through hole and a conductive pattern including inner leads extending into the through hole. The resin coating apparatus according to claim 1, wherein the resin coating apparatus is a TAB type semiconductor device intermediate structure electrically connected to a lead. 3. The inner lead of the tape member is formed densely in the major axis direction of the through hole and coarsely formed in the minor axis direction, so that a step is formed between the inner lead base and the free end. 3. The coating window according to claim 2, wherein at least the longer diameter of the coating window is formed smaller than the diameter of the through hole of the TAB tape, and a gap is formed between the inner lead and the lower surface adjacent to the long diameter facing surface of the coating window. The resin coating device according to item 1. 4. The resin coating apparatus according to claim 1, wherein a surface facing the major axis direction of the mask application window is a tapered surface. 5. The resin coating apparatus according to claim 1, wherein the surface facing the major axis direction of the mask application window is a convex curved surface.