JPH11248751A - Contact probe and probe device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a contact probe in which the root part of a contact pin adjacent to a pin lacking part is not bent and in which the height position of the tip of the contact pin is not changed even when an overdriving operation is repeated. SOLUTION: In a contact probe 1, a plurality of pattern interconnections 3 are formed on films 2, respective tip parts of the pattern interconnections 3 are arranged in a state that they protrude from tip parts of the films 2 so as to be used as contact pins 3a. In the contact probe 1, the films 2 are used partly as pin lacking parts 104a to 104d according to the arrangement of terminal electrodes P of an object I to be measured, and cut lines 105a, 105b are formed respectively nearly in parallel to the contact pins 3a on both ends in the arrangement direction of the contact pins 3a at the respective pin lacking parts 104a to 104d. In an overdriving operation, the tension of the pin lacking parts 104a to 104d which are hard to bend is cut off completely by the cut lines 105a, 105b on both ends of them so as not to be transmitted to root parts K of the adjacent contact pins 3a, and the parts K are not bent.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact probe for performing an electrical test by bringing a contact pin into contact with each terminal of a semiconductor IC chip, a liquid crystal device or the like.
And a probe device (probe card) provided with the contact probe.

[0002]

2. Description of the Related Art In general, a probe device is used to make an electrical test by contacting a semiconductor chip such as an IC chip or an LSI chip or each terminal of an LCD (liquid crystal display). This probe device generally has the configuration shown in FIG.
As shown in FIG. 12, a plurality of pattern wirings 3 are formed on the film 2, and the respective tips of the pattern wirings 3 are arranged so as to protrude from the film 2 to form contact pins 3 a ( In this example, two contact probes 100 and 101 are incorporated in mechanical parts (not shown). More specifically, this mechanical part includes a mounting base, a top clamp, and a bottom clamp. First, a top clamp is mounted on a printed circuit board, and then, a mounting in which a plurality of contact probes 100 and 101 are mounted. Attach the base to the top clamp. Then, by holding down the contact probes 100 and 101 with the bottom clamp, the pattern wiring 3 can be kept in a constant inclined state.

As shown in FIGS. 11 and 12, for example, in a probe device provided with two contact probes 100 and 101, each contact pin 3a of one contact probe 100 is connected to an object I to be measured (for example, I
C), the contact pins 3a of the other contact probe 101 are in contact with the plurality of terminal electrodes P1 on the other side, and the contact pins 3a of the other contact probe 101 are in contact with the plurality of terminal electrodes P2 on the other side. is there. The probe device is positioned with respect to the object to be measured I and lowered to apply overdrive (contact pin 3a is connected to terminal electrodes P1, P2).
P2 and then pull it down further) so that the terminal electrodes P1,
The oxide film on the surface of P2 can be rubbed to expose the aluminum inside. Such an operation is called scrub.

Then, each contact probe 100, 1
The number 01 is specific to the arrangement of the terminal electrodes P1 and P2 of the measured object I. That is, the measured object I
On one side, the terminal electrodes P1 are arranged at an equal pitch, and on the other side, the terminal electrodes P2 are partially absent and arranged at an unequal pitch. The contact probe 100 in which the pins 3a are arranged at equal pitches, and the pin missing portion 104 in which a part of the leading end of the film 2 has no contact pin.
a to 104d, and includes a contact probe 101 in which the contact pins 3a are arranged at unequal pitches. In this example, the pin missing portions 104b, 10b
Reference numerals 4c and 104d denote one missing one contact pin, respectively, and a pin missing portion 104b denotes a missing two contact pin. In addition, the pin missing portion 104a is, when it is assumed that a contact pin is present in the pin missing portion 104, between the contact pin and an intermediate portion between one adjacent contact pin and the intermediate portion between the contact pin and the other adjacent contact pin. Means the portion of the film 2 between.

[0005]

By the way, as shown in FIGS. 11 and 12, during overdrive,
The tip of the film 2 and each contact pin 3a are slightly bent, and the root of each contact pin 3a receives a force from the tip of the film 2. However, in the contact probe 100 having the pin missing portions 104a to 104d, the pin missing portion is used. Because the contact pins 104a to 104d lack the contact pins, a large force is applied to the root K of the contact pin 3a adjacent to the pin missing portions 104a to 104d, so that the contact pin 3a may be bent at the root K. There is.

For example, in a pin lacking portion 104a where one contact pin is missing, a force that the root portion of the contact pin originally lacking receives from the pin lacking portion 104a is adjacent to the pin missing portion 104. The two contact pins 3a receive one half at a time, and the root K of the two contact pins 3a receives 1.5 times the normal force. As described above, when the needle pressures of the plurality of contact pins 3a are different from each other, the load applied to the contact probe 100 is biased, and as a result, uniform contact cannot be achieved. Further, the above-described bending phenomenon becomes remarkable as the overdrive of the contact probe 101 is repeated, the height position of the tip of the contact pin 3a changes, and the position of the contact pin 3a shifts during contact. (Displacement of the needle mark)
There is a problem that it is difficult to make a good contact with the terminal electrode P2.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and the root of a contact pin adjacent to a pin lacking portion does not bend, and even if overdrive is repeated, this contact pin is not removed. It is a first object of the present invention to provide a contact probe capable of making a contact pin satisfactorily contact a terminal electrode without changing the height position of a tip of the contact probe, and a probe device provided with the contact probe.

In general, since the rear end of the contact probe is sandwiched between the bottom clamp and the printed circuit board, the film 2 of the contact probe is easily warped as shown in FIG. Tip 2b
14 does not form a straight line, and the film 2 is viewed from the tip side of the contact pin 3a in FIG. 14 (arrow D in FIG. 13).
In the figure viewed from the direction, the leading end 2b of the film 2 is deformed so as to draw a substantially sinusoidal wave. That is, the film 2 is warped, and it is difficult to make the film 2 flat.
For this reason, the tip of the contact pin 3a is likely to be displaced in the two-dimensional direction (the surface direction of the film 2) or in the height direction (the thickness direction of the film 2). This makes it impossible to achieve the positional accuracy of the contact pin 3a in accordance with the accuracy of the contact probe, so that the tip of each contact pin 3a cannot be brought into good contact with the terminal electrode of the object to be measured. In FIG. 14, the symbol H indicates the inflection point of the sine wave.

A second object of the present invention is to prevent the film from warping and to prevent the tip of each contact pin from being displaced, and to properly connect the tip of each contact pin to a terminal electrode of an object to be measured. An object of the present invention is to provide a contact probe that can be brought into contact and a probe device provided with the contact probe.

[0010]

According to the present invention, in order to achieve the first object, a plurality of pattern wirings are formed on a film, and the leading ends of these pattern wirings project from the leading end of the film. In the contact probe which is arranged as a contact pin, a cut is formed in at least one of a plurality of portions of the film between two adjacent pattern wirings so as to extend substantially in parallel with the pattern wiring. It is characterized by the following. Here, corresponding to the arrangement of the terminal electrodes of the object to be measured, a part of the leading end of the film is a pin missing portion where the contact pin does not exist, and the cut is formed in the pin missing portion. ing.

According to the present invention, in the contact probe in which a part of the leading end of the film has a pin missing portion, the notch is formed in the pin missing portion. The tension of the portion is less likely to be transmitted to the root of the adjacent contact pin due to the cut, so that the force applied to this root is reduced.

Here, by forming the cuts at both ends in the width direction of the pin missing portion, the tension of the pin missing portion is completely interrupted by the cuts at both ends and transmitted to the root of the adjacent contact pin. However, as a result, the force acting on one contact pin from the film becomes uniform, as in the case where the contact pins are arranged at an equal pitch.
Further, instead of forming the cuts, by removing the pin missing portions of the film, even if the heights of two contact pins adjacent to each other across the pin missing portions are different, one of the contact pins is first removed. At the same time that one contact pin contacts the DUT, the other contact pin does not lift up significantly, so that the other contact pin can be reliably contacted and the timing of this contact is greater than that of the previous contact. There is no delay.

A probe device according to the present invention is a probe device in which a plurality of contact probes including at least one of the above-mentioned contact probes according to the present invention are incorporated in a mechanical part. Therefore, it is sufficient that the cuts and the removal portions are formed at a portion of the leading end of the film that protrudes from a mounting base of the mechanical part.

According to the present invention for achieving the second object, the notch is formed at an inflection point of the film when the contact probe is viewed from a tip end of the contact pin. It is a feature. In the present invention, the film tension is cut off at the cut portion, and the warpage of the film is reduced. Therefore, when assembling the contact probe between the bottom clamp and the printed circuit board, the contact probe can be flattened, and as a result, the position accuracy of the contact pin can be achieved according to the accuracy of the contact probe. Can be.

Here, in another probe device of the present invention, a plurality of the contact probes are incorporated in a mechanical part, and the cut is formed in a portion of the film protruding from a bottom clamp of the mechanical part. Is enough.

[0016]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of a main part (near a contact pin) of an embodiment of a probe device according to the present invention.

As shown in FIG. 1, in the probe device of the present embodiment, one of the plurality (two in this example) of contact probes 1a is one of the contact probes 1a shown in FIG. As well as 30
Zero contact pins 3a are formed at the same pitch, and the other contact probe 1 has a film 2 similar to the contact probe 101 shown in FIG.
In addition, there are pin missing portions 104a to 104d in which the contact pins 3a do not exist partially, and 30 contact pins 3a are formed at an irregular pitch.

Each of the pin missing portions 104a to 104d
The cutting lines (slits) 105a and 105b (the widths of which are minute) are formed at both ends in the arrangement direction of the contact pins 3a by, for example, a cutter (not shown). Score line 105a,
105b is formed substantially parallel to the contact pin 3a, but is not limited thereto, and may be formed slightly oblique to the contact pin 3a. In addition, the probe device is 2
The present invention is not limited to the one provided with one contact probe 1a, and may be provided with another plurality (for example, four contact probes described later).

Each contact probe 100, 101
The film 2 is mounted on a mechanical part (jig), which will be described later, on a mounting base 30 of the mechanical part (jig).
(See FIG. 9) Since the cut lines 105a and 105b are formed in the protruding portion T, which is a portion where the film 2 bends at the time of overdrive, it is sufficient to be incorporated in a more protruding form. In addition, the film 2 of the present example is shown in FIG.
And a metal film (copper foil) as shown in FIG.
And a two-layer film of polyimide resin PI. The cut lines 105a and 105b can be formed, for example, by irradiating the film 2 with a laser beam after manufacturing the contact probe. Instead of the cut line, a cut groove having a larger width dimension than the cut line may be formed. Other configurations are the same as those shown in FIG. The form of the film 2 is not limited to the one shown in FIG. 6A, and the polyimide resin PI is longer than the metal film (copper foil) 500 as shown in FIG. It may be of a projecting form. The cut lines 105a and 105b are formed together with the metal film 500 and the polyimide resin PI, or
Since the polyimide resin PI is soft and easily bent, the cut lines 105a and 105b may be formed only in the metal film 500. In this case, the entire deflection of the contact probe 1 can be prevented.

Therefore, in the contact probe 1 of the first embodiment, when the contact pins 3a are pressed against the respective terminal electrodes P2 of the object I to be measured, the pin missing portions 104a to 104d are overdriven.
Is completely interrupted by the cut lines 105a and 105b at both ends thereof and is not transmitted to the root K of the adjacent contact pin 3a. As a result, the force acting on the root K of each contact pin 3a from the film 2 Is uniform, as in the case where the contact pins are arranged at an equal pitch. Therefore,
Since the root K of the contact pin 3a adjacent to the pin missing portions 104a to 104d does not bend as in the related art,
Even if overdrive is repeated, contact pin 3a
The height position of the tip of the contact pin 3a does not change, and the contact pin 3a can be brought into good contact with the terminal electrode P2.

In the first embodiment, the pin missing portion is
The cut lines are formed at both ends in the arrangement direction of the contact pins. However, the present invention is not limited to this. For example, the cut lines may be formed at the center of the pin missing portion in the width direction. In this case, at the time of overdrive, the tension of the pin missing portion is less likely to be transmitted to the adjacent contact pin by the cut line, so that the force applied to the root of the contact pin adjacent to the pin missing portion is reduced. This makes it difficult for the contact pin adjacent to the pin lacking portion to be bent at the root K thereof.

FIG. 2 is a diagram showing a second embodiment of the present invention. In this embodiment, instead of forming a score line,
The pin missing portions (see reference numeral 104 in FIG. 1) of the film 2 are removed to form rectangular removal portions 107, respectively. As an example of a method for forming the removing portion 107, the pin missing portion 10
4 is masked so as not to cover only the metal film (copper foil) of the pin missing portions 104a to 104d by etching.
The removed portions 107 can be formed by irradiating the polyimide resins 04a to 104d with a laser beam and burning them.
As another example of the method of forming the removed portion 107, a ground is formed by etching a metal film (copper foil) as described later, so that the pin missing portions 104a-1
Using the film 2 from which the polyimide resin of No. 04d has been removed, the pin missing portions 104a to
Removing the 104d metal film (copper foil). In this case, the removal part 107 can be formed during the manufacture of the contact probe.

In such a contact probe 1, as in the case of FIG. 1, when the overdrive is performed, in which each of the contact pins 3a is pressed against each of the terminal electrodes P2 of the object I to be measured, the removing section 107 Does not exert any force on the adjacent contact pin 3a, so that the root portion of the contact pin 3a does not bend as in the related art. Therefore, even if overdrive is repeated, the height position of the tip of the contact pin 3a is maintained. Does not change, and the contact pins 3a can be brought into good contact with the terminal electrodes P2, respectively.

Here, the detailed structure and manufacturing method of the contact probe according to the present invention will be described. First, FIG.
9 through 9, reference numeral 1 denotes a contact probe, reference numeral 2 denotes a film, and reference numeral 3 denotes a pattern wiring. As shown in FIG. 3, the contact probe 1 according to the present embodiment has a structure in which a pattern wiring 3 made of metal is attached to one surface of a film 2. The tip protrudes to form a contact pin 3a. Reference numeral 4 denotes an alignment hole described later.

With reference to FIGS. 4 to 6, the steps of manufacturing the contact probe 1 will be described in the order of steps. 4 is a sectional view of a main part showing a method of manufacturing the contact probe 1 in the order of steps, FIG. 5 is a plan view showing the contact probe 1, and FIG. 6 is a sectional view taken along line CC of FIG.

[Base Metal Layer Forming Step] First, FIG.
As shown in FIG. 1A, a base metal layer 6 having a thickness of, for example, 25 μm is formed on a supporting metal plate 5 made of stainless steel by Cu (copper) plating.

[Pattern Forming Step] After forming a photoresist layer (mask) 7 on the base metal layer 6,
As shown in FIG. 4B, a photomask 8 having a predetermined pattern is applied to the photoresist layer 7 by photolithography, and the photoresist layer 7 is exposed, and as shown in FIG. 4C, the photoresist layer 7 is developed. Then, an opening (unmasked portion) 7a is formed in the remaining photoresist layer 7 by removing the portion to be the pattern wiring 3. In the present embodiment, the photoresist layer 7 is formed of a negative photoresist, but a desired opening 7a may be formed using a positive photoresist.

[Electroplating Step] Then, as shown in FIG. 4D, a Ni or Ni alloy layer N to be the pattern wiring 3 is formed in the opening 7a by plating, and then, as shown in FIG. As shown in ()), the photoresist layer 7 is removed.

[Film Adhering Step] Next, FIG.
As shown in FIG. 3, the film 2 is bonded with an adhesive 2a on the Ni or Ni alloy layer N and other than the tip of the pattern wiring 3 shown in FIG. I do. This film 2
This is a two-layer tape in which a metal film (copper foil) 500 is integrally provided on a polyimide resin PI. Before this film deposition step, the metal film 500 of the two-layer tape
Then, a copper plate is etched using a photoengraving technique to form a ground plane, and in this film deposition step,
The polyimide resin PI of the two-layer tape is adhered to the Ni or Ni alloy layer N via the adhesive 2a. The metal film 500 may be made of Ni or Ni alloy in addition to the copper foil.

[Separation Step] Then, as shown in FIG. 4 (g), after the portion composed of the film 2, the pattern wiring 3 and the base metal layer 6 is separated from the supporting metal plate 5,
After the Cu etching, only the pattern wiring 3 is bonded to the film 2. [Gold coating step] Next, the exposed pattern wiring 3 is plated with Au as shown in FIG.
An Au plating layer A is formed on the surface. At this time, the contact pins 3a protruded from the film 2
An Au layer A is formed on the entire surface over the entire circumference.

FIG. 5 shows the contact probe 1 (1
FIG. 6A is a diagram showing an IC probe cut into a predetermined shape as an IC probe, and FIG. 6 is a cross-sectional view taken along line CC of FIG.
As shown in FIGS. 5 and 6, the resin film 2 of the contact probe 1 is provided with a hole 9 for fixing the contact probe 1 (1a).
A window 11 is provided for transmitting a signal obtained from the printed wiring board 10 to a printed circuit board 20 (see FIG. 8) via a lead wiring 10.

Next, with reference to FIGS. 7 to 9, a description will be given of a configuration in which the contact probe 1 (1a) is incorporated into a mechanical part 60 to form a probe device (probe card) 70. FIG. Note that the contact probe 1 (1a) according to the present embodiment functions as a flexible substrate when incorporated in a probe device because it is flexible and easily bent.

The mechanical part 60 includes a mounting base 30, a top clamp 40, and a bottom clamp 50. First, the top clamp 40 is mounted on the printed circuit board 20, and then the mounting base 30 to which a plurality of (four in this example) contact probes 1 (1 a) are mounted is bolted to the top clamp 40 and the bolt holes 41 to the bolt holes 41. Screw and attach (see FIG. 9). Then, by holding down the contact probe 1 with the bottom clamp 50, the pattern wiring 3 is maintained in a constant inclined state, and the contact pin 3a located at the tip of the pattern wiring 3 is pressed against the IC chip I.

FIG. 8 shows the probe device 70 after the assembly is completed. FIG. 9 is a sectional view taken along line EE of FIG. The distal end side of the resin film 2 is supported in a state in which the resin film 2 contacts the lower surface 32 and is inclined downward.
It is in contact with chip I.

The mounting base 30 is provided with a positioning pin 31 for adjusting the position of the contact probe 1. By inserting the positioning pin 31 into the positioning hole 4 of the contact probe 1, a pattern is formed. The pattern wiring 3 at the window 11 provided in the contact probe 1 capable of accurately positioning the wiring 3 and the IC chip I,
The elastic body 51 of the bottom clamp 50 is pressed to bring the lead-out wiring 10 into contact with the electrode 21 of the printed circuit board 20, and a signal obtained from the pattern wiring 3 can be transmitted to the outside through the electrode 21. .

The probe device 70 configured as described above
When a probe test or the like of the IC chip I is performed using the IC chip I, the probe device 70 is mounted on a prober and electrically connected to a tester, and a predetermined electric signal is transmitted from the contact pins 3a of the pattern wiring 3 to the IC on the wafer. By sending the signal to the chip I, the output signal from the IC chip I is transmitted from the contact pin 3a to the tester,
The electrical characteristics of chip I are measured.

FIG. 10 is a plan view of a third embodiment of the contact probe according to the present invention. This contact probe 1 is an improvement of the conventional example shown in FIG. 13 in which the contact pins 3a are arranged at an equal pitch, and one contact probe 1 is provided at a portion between a plurality of two adjacent pattern wirings 3 of the film 2. In addition, cuts 108a to 108f (cut lines) extending almost in parallel with the pattern wiring 3 are formed.

The locations where the cuts 108a to 108f are formed are preferably inflection points H shown in FIG. 14 in order to effectively eliminate the warpage of the film 2, but are shifted from the inflection points H. It may be a position. Also, the cut 108
As the forms of a to 108f, for example, reference numerals 108a,
There may be mentioned, for example, those having a simple straight line as shown by 108b and 108f, those having a broken line as shown by reference numerals 108d and 108e, and those having no cut formed at the leading end of the film 2 as shown by reference numeral 108c. it can. Here, the cut 108d is formed by arranging substantially circular small holes in a straight line, while the cut 108e is formed by arranging substantially rectangular small holes in a straight line. From the viewpoint of making it difficult for the film 2 to be torn from the small holes, it is more preferable that the film 108e is formed of small circular holes. In addition, the cut 1
08 a to 108 f can be formed after manufacturing the contact probe 1, or can be formed by patterning in the manufacturing process shown in FIG. 4.

This contact probe 1 is similar to that shown in FIG.
As shown in the figure, the bottom clamp 50 and the printed circuit board 2
0, the cut 10
It is sufficient that 8a to 108f are formed at portions projecting from the bottom clamp 50. And the cut 108
a to 108f are formed at every other portion between two adjacent pattern wirings 3. This is because the bending due to the cuts 108a to 108f does not spread to the entire contact probe 1 and the contact pins 3a This is to prevent the position from shifting. That is, the cuts 108a-
If the number of the contact probes 108 is too large, the entire contact probe 1 is easily bent.
１０８108f is set appropriately.

Further, the cuts 108a to 108f
May be formed with both the metal film 500 and the polyimide resin PI, and since the polyimide resin PI is soft and easily bent, the cuts 108a to 108f may be formed only on the metal film 500. In this case, the entire deflection of the contact probe 1 can be prevented.

In the third embodiment, the tension of the film 2 is cut off at the cuts 108a to 108f, and the warpage of the film 2 is reduced. For this reason,
The two-dimensional direction of the tip of the contact pin 3a (film 2
Of the contact pins 3a and the height of the film 2 (thickness direction of the film 2). Can be contacted. In addition, since the surface area of the film 2 is increased by the cuts 108a to 108f, the heat radiation effect of the film 2 is improved.

In the above embodiment, the contact probe 1 is connected to the probe device 70 which is a probe card.
However, the invention may be applied to other measurement jigs and the like. For example, an IC chip is held inside to protect
The present invention may be applied to an IC chip test socket or the like mounted on a chip burn-in test device or the like.

[0043]

Since the present invention is configured as described above, it has the following effects. According to the first and second aspects of the present invention, in the contact probe in which a part of the leading end of the film is a pin-missing portion, a cut line or a cut groove is formed in the pin-missing portion. In this case, the tension of the pin-deficient portion that is not easily bent is less likely to be transmitted to the adjacent contact pin due to the cut, so that the force applied to the root portion of the adjacent contact pin and the pin-defective portion is reduced. as a result,
The root portion of the contact pin is less likely to be bent, and even if overdrive is repeated, the height position of the tip of the contact pin does not change, and the contact pin can be brought into good contact with the terminal electrode.

Also, the film tends to expand and contract due to changes in temperature, humidity, etc., but the cut makes it difficult for the effect of expansion and contraction of the film in the pin missing portion to be exerted on contact pins adjacent to the pin missing portion. Thus, the displacement of the contact pin, particularly in the height direction, can be reduced. further,
Conventionally, when the height of the terminal electrode of the device under test is not uniform, the contact pin corresponding to the terminal electrode having a higher position was easily broken, but in the present invention, the film supporting the contact pin is easily deformed. , The damage can be prevented.

The third aspect of the present invention provides, in addition to the above effects,
By forming the cuts at both ends in the arrangement direction of the contact pins of the pin missing portions, the tension of the pin missing portions is completely interrupted by the cuts at both ends and does not transmit to the roots of the adjacent contact pins. As a result, the force acting on one contact pin from the film becomes uniform, and the root of the contact pin can be reliably prevented from being bent.

The invention described in claim 4 has the above-described effects,
Even if two contact pins adjacent to each other across the pin missing portion have different heights, one of the contact pins contacts the DUT first, and the other contact pin is largely lifted upward. That is, the other contact pin can be reliably contacted, and this contact does not lag much behind the previous contact. In the invention described in claim 5, the tension of the film is cut off at the cut portion, and the warpage of the film is reduced. For this reason, the displacement of the tip of the contact pin in the two-dimensional direction (the surface direction of the film) and the displacement in the height direction (the thickness direction of the film) are unlikely to occur. It is possible to satisfactorily bring the tip of each contact pin into contact with the terminal electrode of the object to be measured without adjusting. Further, since the surface area of the film is increased by the amount of the cut, the heat radiation effect of the film is improved.

According to a sixth aspect of the present invention, a probe device having the contact probe according to the first to fourth aspects can be provided. The invention described in claim 7 can provide a probe device provided with the contact probe described in claim 5.

[Brief description of the drawings]

FIG. 1 is a plan view of a main part (near a contact pin) of an embodiment of a probe device according to the present invention.

FIG. 2 is a plan view of a main part (near a contact pin) of another embodiment of the probe device of the present invention.

FIG. 3 is a perspective view of a main part showing a contact probe according to the present invention.

FIG. 4 is a fragmentary cross-sectional view showing a method for manufacturing a contact probe according to the present invention in the order of steps;

FIG. 5 is a plan view showing a contact probe according to the present invention.

FIG. 6 is a sectional view taken along line CC of FIG. 5;

FIG. 7 is an exploded perspective view showing an example of a probe device incorporating a contact probe according to the present invention.

FIG. 8 is a perspective view of an essential part showing an example of a probe device incorporating a contact probe according to the present invention.

FIG. 9 is a sectional view taken along line EE of FIG. 8;

FIG. 10 is a plan view of a third embodiment of the contact probe of the present invention.

FIG. 11 is a plan view of a main part (near a contact pin) for explaining a problem of a conventional contact probe.

FIG. 12 is a side view of FIG.

FIG. 13 is a plan view for explaining another problem of the conventional contact probe.

FIG. 14 is a view of the film shown in FIG. 13 as viewed from a tip end side of a contact pin.

[Explanation of symbols]

I Object to be measured (for example, IC) P1, P2 Terminal electrode PI Polyimide resin 1, 1a Contact probe 2 Film 3 Pattern wiring 3a Contact pin 5 Substrate layer (support metal plate) 6 First metal layer (base metal layer) 7 Mask (photoresist layer) 7a Unmasked portion (opening) 20 Substrate (printed circuit board) 30 Inclined holding member (mounting base) 40 Top clamp 50 Bottom clamp 60 Mechanical parts 70 Probe device (probe card) 104a to 104d Pin Missing part 105a, 105b, 108a-108f Cut line (cut) 107 Removal part 500 Metal film (copper foil)

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Hideaki Yoshida 12th of Techno Park, Mita City, Hyogo Prefecture Mitsubishi Materials Corporation Mita Plant

Claims (7)

[Claims] 1. A plurality of pattern wirings (3) are formed on a film (2), and each tip of the pattern wirings (3) is arranged so as to protrude from the tip of the film (2), and contact pins are formed. In the contact probe (1) referred to as (3a), at least one portion of the film (2) between a plurality of adjacent two pattern wirings (3) is substantially parallel to the pattern wiring (3). An extended notch (105
a, 105b, 108a to 108f) are formed. 2. The contact probe according to claim 1, wherein a part of a front end of said film (2) corresponds to said contact pin corresponding to an arrangement of a terminal electrode (P2) of an object to be measured (I). Pin missing portion (10) where (3a) does not exist
4a to 104d), and the pin missing portion (10
4a to 104d) and the cuts (105a, 105b)
A contact probe, wherein a contact probe is formed. 3. The contact probe according to claim 2, wherein the cuts (105a, 105b) are respectively formed at both ends of the pin missing portions (104a to 104d) in the arrangement direction of the contact pins (3a). A contact probe, characterized in that: 4. The contact probe (1) according to claim 2, wherein the cut (105a,
105. A contact probe characterized in that the pin missing portions (104a to 104d) of the film (2) are removed to form removed portions (107) instead of forming the film 105b). 5. The contact probe (1) according to claim 1, wherein the cuts (108a-108f).
Is formed at an inflection point (H) of the film (2) when the contact probe (1) is viewed from the tip side of the contact pin (3a). 6. A plurality of contact probes (1, 1a) including at least one of the contact probes (1) according to claim 1 are incorporated in a mechanical part (60), The cut (105
a, 105b) or the removing section (107) is provided at the leading end of the film (2).
A probe device (70) formed at a portion (T) protruding from a mounting base (30) of (0). 7. A plurality of the contact probes (1) according to claim 1 or 5 are incorporated in a mechanical part (60), and the cuts (108a to 108f) are formed in the mechanical part of the film (2). The probe device (70), wherein the probe device (70) is formed at a portion protruding from the bottom clamp (50) of (60).