JPH11245161A - Abrasive material aqueous solution - Google Patents

Abrasive material aqueous solution

Info

Publication number
JPH11245161A
JPH11245161A JP6445598A JP6445598A JPH11245161A JP H11245161 A JPH11245161 A JP H11245161A JP 6445598 A JP6445598 A JP 6445598A JP 6445598 A JP6445598 A JP 6445598A JP H11245161 A JPH11245161 A JP H11245161A
Authority
JP
Japan
Prior art keywords
abrasive
polishing
solution
aqueous
value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6445598A
Other languages
Japanese (ja)
Inventor
Yukihiro Masuda
幸博 増田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Crystal Device Corp
Original Assignee
Kyocera Crystal Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Crystal Device Corp filed Critical Kyocera Crystal Device Corp
Priority to JP6445598A priority Critical patent/JPH11245161A/en
Publication of JPH11245161A publication Critical patent/JPH11245161A/en
Pending legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To improve the polishing efficiency by adding the alkali material to the abrasive material aqueous solution so as to increase the alkaline. SOLUTION: An alkali electrolyte or sodium carbonate are mixed in the abrasive material aqueous solution (formed by mixing the pure abrasive material and adding the preservative) so as to increase the alkaline (pH value) of the abrasive material aqueous solution. The alkali electrolyte having the pH value 12 is used, and the pH value is maintained at 12 by mixing the abrasive grains. Since the sodium carbonate is alkaline, it shows the pH value 12 equal to the alkali electrolyte by mixing the pure abrasive grains. Polishing efficiency is improved by increasing the pH value of the abrasive material aqueous solution to the alkaline (pH value 10-pH value 12).

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】回転式表面研磨装置に供給す
る研磨材水溶液の防錆効果、平面平行度、研磨加工効率
を高めた被加工物の研磨加工に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing method for a workpiece in which an aqueous solution of an abrasive supplied to a rotary surface polishing apparatus is improved in rust prevention effect, plane parallelism, and polishing efficiency.

【0002】[0002]

【従来の技術】従来から例えば圧電振動子の厚み調整加
工には研磨材水溶液と回転式研磨加工装置(研磨装置)
による加工方法が主流とされている。表面研磨加工と
は、圧電振動子の材料である圧電素材(水晶など)を大
方の厚み精度で切断した後、最終的な仕上がり厚み(圧
電振動子の場合には周波数に厚み換算して仕上がり厚み
精度を算出する)を得るものである。研磨加工に使用さ
れる研磨材としては一般的に酸化アルミナ系(Al
23)の微粒子が用いられ、その微粒子の粒径の大小に
より研磨精度や仕上がり表面粗さが変化するものであ
る。
2. Description of the Related Art Conventionally, for example, for adjusting the thickness of a piezoelectric vibrator, an aqueous abrasive solution and a rotary polishing apparatus (polishing apparatus) have been used.
Is mainly used. Surface polishing refers to cutting the piezoelectric material (crystal, etc.), which is the material of the piezoelectric vibrator, with the most precision of thickness, and then finishing the final thickness (in the case of a piezoelectric vibrator, converting the thickness to frequency (Calculate the precision). Abrasive materials used for polishing are generally alumina oxide (Al
Fine particles of 2 O 3 ) are used, and the polishing accuracy and the finished surface roughness vary depending on the size of the fine particles.

【0003】また、研磨装置については古くから継承さ
れる基本構造に上定盤、下定盤、中心ギア、インターナ
ルギアで構成されたいわゆる表面研磨装置(ラッピング
マシーン)が使用されており、その簡単な加工原理とし
ては研磨材水溶液を上定盤部に取り付けてあるパウダー
リングから供給し、上定盤と下定盤間にキャリアと称す
る圧電振動子の保持板を介して中心ギアとインターナル
ギアとの間でキャリアを回転させ、研磨材水溶液と、上
定盤の回転と自重、下定盤、中心ギア、インターナルギ
アによるキャリアの回転で、キャリアに保持された圧電
振動子の表面研磨を行うことで、圧電振動子の厚み研磨
加工を行うのである。
In addition, a so-called surface lapping machine (lapping machine) comprising an upper stool, a lower stool, a center gear and an internal gear is used for the basic structure inherited from ancient times. The working principle is that an aqueous abrasive solution is supplied from a powder ring attached to the upper platen, and between the upper gear and the lower platen, between the center gear and the internal gear via a piezoelectric vibrator holding plate called a carrier. The surface of the piezoelectric vibrator held by the carrier is polished by rotating the carrier with the abrasive aqueous solution, rotating the upper platen and rotating the carrier by its own weight, the lower platen, the center gear, and the internal gear. The thickness polishing of the vibrator is performed.

【0004】上記のとおり厚み研磨加工を行うには研磨
材水溶液は必要不可欠な存在ながら、前述するようにシ
リコン系の微粒子を純水で混合するものから、表面研磨
装置に対する防錆対策、砥粒分散を考慮する必要があ
り、対策については一般的に亜硝酸ソーダ・アミン系等
の薬品を混ぜることにより解消するものであり、それと
同時に、亜硝酸ソーダ・アミン系等の薬品を混ぜること
で研磨効率を向上させる能力も兼ね備えていることが知
られている。
[0004] As described above, an aqueous abrasive solution is indispensable for performing the thickness polishing process. However, as described above, a mixture of silicon-based fine particles with pure water is used. Dispersion must be taken into account, and measures are generally eliminated by mixing chemicals such as sodium nitrite and amine, and at the same time, polishing by mixing chemicals such as sodium nitrite and amine. It is known that it also has the ability to improve efficiency.

【0005】[0005]

【発明が解決しようとする課題】昨今電子機器は小型
化、軽量化、高機能化へと急激な展開を見せている。そ
の中でも移動体通信機器(携帯電話)や携帯用小型音響
緑再器は日常当然に携行し使用されている。このような
現状下ではこれらの機器を構成する部品にも小型、高精
度の要求が求められることになり、昨今の電子機器の殆
どがコンピュータ(CPU)制御で、その心臓部に当た
る圧電(水晶)振動子は大事なクロック源として重要な
位置にある。
In recent years, electronic devices have been rapidly developed to become smaller, lighter, and more sophisticated. Among them, mobile communication devices (mobile phones) and portable small acoustic green regenerators are naturally carried and used on a daily basis. Under these circumstances, the components that make up these devices are also required to be small and highly accurate, and most of the recent electronic devices are controlled by a computer (CPU), and a piezoelectric (crystal) that strikes the heart of the electronic devices is controlled by a computer (CPU). The oscillator is in an important position as an important clock source.

【0006】従って、圧電振動子の製造過程においても
従来にも増した加工精度が求められており、従来の技術
に記述する研磨材水溶液では表面研磨装置で加工する
際、研磨装置に供給する研磨材水溶液(研磨材)のうち
直接研磨作用に用いられる研磨材の割合は一般的に2〜
3%と言われており、研磨加工に要求される加工精度や
加工効率が悪いといった課題がある。
[0006] Therefore, the processing accuracy of the piezoelectric vibrator is required to be higher than ever before in the manufacturing process of the piezoelectric vibrator. In the case of the aqueous abrasive solution described in the prior art, the polishing to be supplied to the polishing device when the surface polishing device is used. The proportion of the abrasive used for the direct polishing action in the aqueous material solution (abrasive) is generally 2 to 2.
It is said to be 3%, and there is a problem that processing accuracy and processing efficiency required for polishing are poor.

【0007】[0007]

【課題を解決するための手段】本発明は従来の技術に記
述する研磨材水溶液より、加工精度と加工効率の向上を
目的としたもので、研磨材水溶液にアルカリ物質(アル
カリ電解水、炭酸ナトリウム)を添加し従来の研磨材水
溶液よりも更にアルカリ性を強くするものである。
SUMMARY OF THE INVENTION The present invention aims at improving the processing accuracy and processing efficiency over the aqueous abrasive solution described in the prior art, and uses an alkaline substance (alkali electrolyzed water, sodium carbonate) in the aqueous abrasive solution. ) Is added to further increase the alkalinity of the conventional aqueous solution of the abrasive.

【0008】発明者は本件について、従来から用いる研
磨材水溶液(純水に研磨材を混合し防錆処理剤を添加し
たもの)に対し、純水に代わってアルカリ電解水を用い
て研磨材を混合したものと、従来の研磨材水溶液に炭酸
ナトリウムを更に追加したもので研磨材水溶液を調合し
通常の表面研磨加工を行った実験を試みた。
The inventor of the present invention has proposed the use of an aqueous alkaline solution (a mixture of pure water and an abrasive to add a rust preventive agent) to a conventionally used abrasive aqueous solution by using alkaline electrolyzed water instead of pure water. An experiment was conducted in which an abrasive solution was prepared by mixing the mixture and a conventional abrasive solution to which sodium carbonate was further added, and ordinary surface polishing was performed.

【0009】実験を試みる上で各種方面から、研磨材水
溶液が弱アルカリ性のとき水晶の表面にマイナスの電位
が発生し、研磨材粒子にはプラスの電位が発生し、かつ
その電位はほぼ同電位であることから研磨材水溶液中で
は互いに引き寄せ合う状態にあることを知った。一方、
従来の研磨材水溶液(防錆効果を持つ)では水晶と砥粒
の周囲にアミン系皮膜が形成され吸着されるために、防
錆効果はあるものの水晶と砥粒との電位関係がアンバラ
ンスとなり、研磨材粒子間での反発力が小さく分散性は
悪く凝集から固着し再分散性が悪い状態になってしま
う。
In various experiments, when the aqueous solution of the abrasive is weakly alkaline, a negative potential is generated on the surface of the quartz crystal, a positive potential is generated in the abrasive particles, and the potential is substantially the same. Therefore, it was found that they were attracted to each other in the aqueous abrasive solution. on the other hand,
A conventional abrasive solution (having rust-preventing effect) forms an amine-based film around the quartz and abrasive grains and is adsorbed. Therefore, although there is a rust-preventing effect, the potential relationship between the quartz and the abrasive grains becomes unbalanced. In addition, the repulsive force between the abrasive particles is small, the dispersibility is poor, and the particles are fixed from agglomeration, resulting in poor redispersibility.

【0010】ところが、アルカリ電解水や炭酸ナトリウ
ムを添加するとpH値は上がり水晶と砥粒の表面電荷が
変化して、砥粒同士が反発し分散と防錆効果が向上す
る。特に炭酸ナトリウムのNa+が砥粒同士の反発力を
活発にさせ分散性が向上する。また、従来の研磨材水溶
液と違い凝集が起きないため固着せず再分散性が可能と
なった。
However, when alkaline electrolyzed water or sodium carbonate is added, the pH value rises and the surface charges of the quartz and the abrasive grains change, so that the abrasive grains repel each other and the dispersion and the rust prevention effect are improved. In particular, Na + of sodium carbonate activates the repulsive force between the abrasive grains to improve the dispersibility. Also, unlike the conventional abrasive aqueous solution, coagulation does not occur, so that re-dispersibility is possible without sticking.

【0011】前述する振動子と砥粒間の電位関係によ
り、圧電振動子の表面に対して研磨材水溶液の研磨材が
直接研磨作用する割合が適度に作用することで、研磨加
工効率を向上させ加工時間の短縮ができたことと、研磨
加工自体が均一に行えることにより研磨精度の向上、研
磨バラツキの減少も実現することができる。
According to the above-described potential relationship between the vibrator and the abrasive grains, the ratio at which the abrasive of the aqueous abrasive solution directly acts on the surface of the piezoelectric vibrator appropriately acts to improve the polishing efficiency. Since the processing time can be shortened and the polishing process itself can be performed uniformly, the polishing accuracy can be improved and the polishing variation can be reduced.

【0012】[0012]

【実施例】以下、添付図面に従ってこの発明の実施例を
説明する。本発明は従来から用いる研磨材水溶液(純水
に研磨材を混合し防錆処理剤を添加したもの)に対し、
純水に代わってアルカリ電解水あるいは炭酸ナトリウム
を更に混合することにより研磨材水溶液(pH値)のア
ルカリ性を強くするものである。
Embodiments of the present invention will be described below with reference to the accompanying drawings. The present invention relates to a conventionally used abrasive aqueous solution (a slurry obtained by mixing an abrasive in pure water and adding a rust preventive agent).
By further mixing alkaline electrolyzed water or sodium carbonate instead of pure water, the alkalinity of the aqueous abrasive solution (pH value) is strengthened.

【0013】本発明の出願者は次の条件で実験を行っ
た。実験については従来から使用する研磨材水溶液(研
磨材を純水で溶いたもの)、研磨材を溶く純水に代わり
アルカリ電解水を用いた研磨材水溶液、従来の研磨材水
溶液に炭酸ナトリウム(20%)を加えた研磨材水溶液
の3種類の研磨材水溶液を用いたときの表面研磨加工の
仕上がり(研磨時間、研磨精度、研磨バラツキなど)具
合について調査確認するものである。
The applicant of the present invention conducted an experiment under the following conditions. For the experiment, an aqueous abrasive solution conventionally used (the abrasive was dissolved in pure water), an aqueous abrasive solution using alkaline electrolyzed water instead of pure water in which the abrasive was dissolved, and a conventional aqueous sodium abrasive solution (20%) were used. %) Is used to investigate and confirm the finished state (polishing time, polishing accuracy, polishing variation, etc.) of the surface polishing process when using three types of aqueous abrasive solutions of the aqueous abrasive solution to which% is added.

【0014】研磨材はシリコン系の一般的に用いられる
微粒子(#4000程度)を純水、アルカリ電解
水、純水と炭酸ナトリウムの混合水とで溶かした研磨
材水溶液を用いたもので、研磨材水溶液そのもの自体だ
けでも研磨時間、研磨精度、研磨バラツキなどを向上さ
せることができるが、防錆対策と砥粒分散効果を必要す
るために添加する亜硝酸ソーダ・アミン系等の薬品を混
ぜることでさらに前述する効果を高めることができる。
また、表面研磨装置は通常使われる4ウェイ方式(上定
盤、下定盤、中心ギア、インターナルギアで構成し各々
が回転する機構を持つ表面研磨装置)の研磨装置を用い
たものである。
[0014] The abrasive is an abrasive aqueous solution obtained by dissolving generally used silicon-based fine particles (about # 4000) in pure water, alkaline electrolyzed water, and a mixed water of pure water and sodium carbonate. Polishing time, polishing accuracy, polishing dispersion, etc. can be improved by using the aqueous material solution itself. However, it is necessary to mix chemicals such as sodium nitrite and amine to add rust prevention measures and abrasive grain dispersion effect. Thus, the above-described effect can be further enhanced.
The surface polishing apparatus uses a commonly used 4-way polishing apparatus (a surface polishing apparatus having an upper surface plate, a lower surface plate, a center gear, and an internal gear and having a rotating mechanism).

【0015】図1と図2にその実験結果をまとめたグラ
フを示す。図1は研磨量(研磨加工推移)の変化を示し
たグラフで、図2は研磨厚みバラツキの推移を示したグ
ラフである。グラフからも分かるように、従来の研磨材
水溶液に比べ研磨量と研磨厚みバラツキを改善すること
に成功した。また図3と図4は、同一条件の研磨材水溶
液に防錆剤を添加したときの研磨効率(図3)と研磨バ
ラツキ(図4)の推移を示したグラフである。
FIGS. 1 and 2 show graphs summarizing the experimental results. FIG. 1 is a graph showing a change in polishing amount (transition of polishing process), and FIG. 2 is a graph showing a change in polishing thickness variation. As can be seen from the graph, the polishing amount and the polishing thickness variation were successfully improved as compared with the conventional abrasive aqueous solution. FIGS. 3 and 4 are graphs showing changes in polishing efficiency (FIG. 3) and polishing variations (FIG. 4) when a rust inhibitor is added to an aqueous abrasive solution under the same conditions.

【0016】従来の研磨材水溶液のpH値は純水がpH
値7、研磨材(砥粒)自体がアルカリ性のためこれら混
合することにより研磨材水溶液のpH値は約9となり、
それに更に防錆剤(pH値11)を添加することにより
研磨材水溶液全体としてpH値10程度となる。また、
アルカリ電解水はpH値12を使用し、砥粒を添加し混
合するとpH値はそのまま12となる。炭酸ナトリウム
はアルカリ性を持っているため、純水に砥粒を混合する
とアルカリ電解水と同等のpH値12を示す。
[0016] The pH value of the conventional aqueous solution of the abrasive is pure water.
Value 7, the pH value of the aqueous solution of the polishing material becomes about 9 by mixing these because the polishing material (abrasive) itself is alkaline,
By further adding a rust inhibitor (pH value 11), the pH value of the entire aqueous abrasive solution becomes about 10. Also,
The alkaline electrolyzed water has a pH value of 12. When the abrasive grains are added and mixed, the pH value becomes 12 as it is. Since sodium carbonate has alkalinity, when abrasive grains are mixed with pure water, it shows a pH value 12 equivalent to that of alkaline electrolyzed water.

【0017】上記のように従来の研磨材水溶液に対して
アルカリ性(pH値10〜pH値12)にpH値を上げ
ることにより、研磨効率は向上する。また、研磨厚みバ
ラツキについても従来の厚みバラツキ現象を改善するこ
とで、研磨時間が長くなってもバラツキ量を減少するこ
とができる。特に、炭酸ナトリウムではアルカリ電解水
よりも砥粒に対する分散が向上しているため、研磨(加
工)時間が長くなっても安定して研磨材水溶液を供給す
ることができる。なお、本実施例では単純に砥粒に混合
する水溶液に対しての研磨加工効率、バラツキ具合を記
述しているが、従来のように研磨材水溶液に対して防錆
剤を添加することにより、更に研磨加工効率とバラツキ
具合を改善することができることは言うまでもない。ま
た、本発明は圧電振動子の研磨を例に挙げたが、半導体
シリコンや単結晶、金属加工、ガラス等の表面研磨加工
においても有効である。
As described above, the polishing efficiency is improved by increasing the pH value to alkaline (pH value 10 to pH value 12) with respect to the conventional aqueous abrasive solution. Also, with respect to the polishing thickness variation, by improving the conventional thickness variation phenomenon, the variation amount can be reduced even if the polishing time becomes long. In particular, since sodium carbonate has a higher dispersion of abrasive grains than alkaline electrolyzed water, it is possible to stably supply an aqueous abrasive solution even when the polishing (processing) time is long. In the present embodiment, the polishing efficiency and the degree of dispersion are simply described for the aqueous solution mixed with the abrasive grains, but by adding a rust inhibitor to the abrasive aqueous solution as in the prior art, Needless to say, the polishing efficiency and the degree of variation can be further improved. Although the present invention has been described with reference to the example of polishing a piezoelectric vibrator, the present invention is also effective in surface polishing of semiconductor silicon, single crystal, metal processing, glass, and the like.

【0018】[0018]

【発明の効果】本発明により被加工物の表面に対して研
磨材水溶液の研磨材が直接研磨作用する割合が適度に作
用することで、研磨加工効率を向上させ加工時間の短縮
と、研磨加工の均一化が行えることにより製造工数の時
間短縮と歩留まりの向上を実現することができる。
According to the present invention, the ratio of the abrasive in the aqueous abrasive solution directly acting on the surface of the workpiece to be polished acts appropriately, thereby improving the polishing efficiency, shortening the processing time, and reducing the polishing time. It is possible to realize a reduction in the number of manufacturing steps and an improvement in the yield by performing the uniformity of the process.

【図面の簡単な説明】[Brief description of the drawings]

【図1】従来の研磨材水溶液、アルカリ電解水研磨材水
溶液、炭酸ナトリウムを添加した研磨材水溶液の研磨効
率を比較したグラフである。
FIG. 1 is a graph comparing the polishing efficiencies of a conventional aqueous abrasive solution, an aqueous alkaline electrolyzed abrasive solution, and an aqueous abrasive solution to which sodium carbonate is added.

【図2】従来の研磨材水溶液、アルカリ電解水研磨材水
溶液、炭酸ナトリウムを添加した研磨材水溶液の研磨バ
ラツキを比較したグラフである。
FIG. 2 is a graph comparing polishing variances of a conventional aqueous abrasive solution, an aqueous alkaline electrolyzed abrasive solution, and an aqueous abrasive solution to which sodium carbonate is added.

【図3】図1の比較に加えて防錆剤を添加しないとき
と、防錆剤を添加したときの研磨効率の推移を示すグラ
フである。
FIG. 3 is a graph showing a change in polishing efficiency when a rust inhibitor is not added and when a rust inhibitor is added in addition to the comparison of FIG.

【図4】図2の比較に加えて防錆剤を添加しないとき
と、防錆剤を添加したときの研磨バラツキの推移を示す
グラフである。
FIG. 4 is a graph showing a change in polishing variation when a rust inhibitor is not added and when a rust inhibitor is added in addition to the comparison of FIG. 2;

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 酸化アルミナ系の研磨砥粒を純水で溶か
した研磨材水溶液を用いた表面研磨加工において、 該研磨材水溶液中のpH値を10〜12の弱アルカリ性
にしたことを特徴とする研磨材水溶液。
1. A surface polishing process using an aqueous solution of an abrasive in which alumina oxide-based abrasive grains are dissolved in pure water, wherein the pH value in the aqueous solution of the abrasive is made weakly alkaline at 10 to 12. Abrasive solution.
【請求項2】 請求項1において、該研磨材水溶液のp
H値を弱アルカリ性にするために、アルカリ電解水を用
いたことを特徴とする研磨材水溶液。
2. The method according to claim 1, wherein
An aqueous abrasive solution characterized by using alkaline electrolyzed water to make the H value weakly alkaline.
【請求項3】 請求項1において、該研磨材水溶液のp
H値を弱アルカリ性にするために、炭酸ナトリウムを添
加したことを特徴とする研磨材水溶液。
3. The polishing agent aqueous solution according to claim 1, wherein
An aqueous abrasive solution characterized by adding sodium carbonate to make the H value weakly alkaline.
JP6445598A 1998-02-27 1998-02-27 Abrasive material aqueous solution Pending JPH11245161A (en)

Priority Applications (1)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6445598A JPH11245161A (en) 1998-02-27 1998-02-27 Abrasive material aqueous solution

Publications (1)

Publication Number Publication Date
JPH11245161A true JPH11245161A (en) 1999-09-14

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Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006312735A (en) * 2005-04-07 2006-11-16 Shinei Seisakusho:Kk Electrolyzed water solution for metal working
JP2007160496A (en) * 2005-11-15 2007-06-28 Shinshu Univ Workpiece polishing device, and workpiece polishing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006312735A (en) * 2005-04-07 2006-11-16 Shinei Seisakusho:Kk Electrolyzed water solution for metal working
JP2007160496A (en) * 2005-11-15 2007-06-28 Shinshu Univ Workpiece polishing device, and workpiece polishing method

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