JPH11245113A - Lead wire cutter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cut lead wires suited to various types of printed circuit boards and electronic parts. SOLUTION: In this device, a moving unit is disposed, which includes a mount 9 capable of moving inside a space defined by at least three directions on the rear surface side of a printed circuit board whose electronic parts are fitted. A cutter unit 10 is fitted, which has a structure capable of cutting the lead wire of an electronic part protruding from the rear surface of the printed circuit board, on the mount 9 of the moving unit. The cutter unit 10 is constructed so as to be capable of turning by a turning unit 50.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead wire cutter device for mounting electronic components such as ICs and LSI chips on a printed circuit board and cutting off a large number of lead wires of these chips implanted on the board. Things.

[0002]

2. Description of the Related Art Conventionally, a lead wire cutter device which has been widely widely used is shown in FIG. Reference numeral 100 denotes a substrate supply conveyor for supplying the printed circuit board upward to a desired position and positioning and fixing the printed circuit board at that position, and also serves to position and fix the printed circuit board. Below the board supply conveyor 100, a cutter unit 110 for cutting a lead wire of an electronic component protruding from the back surface of the printed board is arranged. The cutter unit 110 is attached to a portal arm 130 on a base 120 and is attached to a mounting base 150 at the tip of a movable unit 140 which is movable in the X-axis and Y-axis directions on a horizontal plane.
It is fixed to. Reference numeral 160 denotes a lead wire discharge conveyor for discharging the cut lead wire.

[0003]

However, a printed circuit board is mounted on the lead wire cutter device, and a large number of lead lines projecting from the back surface of the printed circuit board at a predetermined position are sequentially cut off. In such a case, there are problems such as the inability to cope with a printed circuit board having a different thickness or a projection such as an auxiliary component attached to the back surface. Also, the types of electronic components are various on one board, and the amount of solder and the cutting length of the lead wire are different for each,
The above-mentioned conventional lead wire cutter device cannot cope with such types of electronic components, and the lead wires are cut off more than necessary, or the lead wires are soldered to the printed circuit board. A problem has occurred in that it interferes and separates it from the substrate.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a lead wire cutter device capable of cutting lead wires according to various printed circuit boards and electronic components. And In order to achieve this object, the present invention provides a moving unit having a mounting base movable in a space defined by at least three directions on the back side of a printed circuit board on which electronic components are mounted, and mounting the moving unit. A cutter unit having a configuration capable of cutting a lead wire of an electronic component protruding from the back surface of the printed board is attached to the base. Further, the present invention provides a printed circuit board to which at least three electronic components are attached.
A moving unit having a mounting base movable in a space defined by the direction is arranged, and a cutter unit is arranged on the mounting base of the moving unit, and a turning unit for turning the cutter unit is provided. May be used.

[0005]

Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1 to FIG. 7, reference numeral 1 denotes a lead wire cutter device, which has a moving unit 6 composed of a rectangular coordinate robot attached to a base 2. The moving unit 6 is configured such that a mounting table 9 disposed at the tip can move in a space on the back side of a printed circuit board defined by three directions of X, Y, and Z by operation of a ball screw mechanism or the like. A cutter unit 10 for cutting a lead wire is rotatably supported and attached to the mount 9.

Reference numeral 11 denotes an elevating cylinder constituting the cutter unit 10. An operating cylinder 21 for operating an action rod 20 which slides in the cylinder 11 in the axial direction is fixed to a rear portion of the elevating cylinder 11. . A taper hole 22 is formed in the operation rod 20, and the front and rear movements of the operation rod 20 open and close the tips of a pair of cutter members 30 that can swing and mesh with each other about a support shaft 31. It has become. The cutter member 30 is elastically biased by a cutter spring 34 in a direction in which the tip is always closed. Further, tooth portions 32 are formed at the ends of the cutter members 30 which are opposed to each other at the tip of the elevating cylinder 11 and which are swingably supported by the support shaft 31, respectively.

On the other hand, the elevating cylinder 11 is inserted through a sleeve 13 inserted in a through hole 12 formed in the cutter base 7, and constitutes a piston cylinder mechanism with the sleeve 13. ing. The through hole 12 communicates with a first air hole 7a formed in the cutter base 7 via an air hose (not shown). The air hole 7a is connected around a lower portion of the cutter base 7. It communicates with a first annular groove 41 formed in the member 40. The first annular groove 41 is connected to a first air supply unit (not shown) provided outside, and the cutter table 7 is rotatable with respect to the connection member 40. An adjusting ring 14 is attached to the rear part of the lifting cylinder 11 so as to adjust the position. A lifting spring 15 is compression-wound between the adjusting ring 14 and the rear part of the cutter base 7 to compress the lifting cylinder 11. It is always elastic so as to retreat.

Reference numeral 50 denotes a turning unit for turning the cutter unit 10 with respect to the mounting base and the connecting member, and a driving motor 51 mounted on the side of the mounting base 9.
The worm 5 is integrated with the rotating shaft 52 that rotates by the drive of
3 is integrally fastened, and the worm 53 is meshed with a worm wheel 54 inside the mounting base 9 and integrally connected to a lower portion of the cutter unit 10. Thereby, the direction of the cutter unit 10 with respect to the lead wire 3a of the electronic component 3 can be freely changed, and the lead wire can be cut off while avoiding protrusions such as auxiliary components provided on the back surface of the printed circuit board 2.

Further, the operating cylinder 21 is an air hoe.
And a second air hole (not shown) formed in the cutter base 7 through a slot 23, and the connection member rotatably attached to a lower portion of the cutter base 7 in the second air hole. A second annular groove 42 formed inside of 40 communicates. The second annular groove 42 is connected to a second air supply unit (not shown). A push rod 6 that operates to push up the printed circuit board 2 from below is provided above the cutter table 7.
A pushing unit 60 composed of a pushing cylinder 61 having a two is mounted. The cylinder 6 of this unit 60
1 is also connected to a third air supply source (not shown) via the third air hole 7c.

A suction unit 80 connected to a cylinder mechanism 70 is provided on the opposite side of the printed circuit board 2 within the working range of the cutter member 30, ie, above the printed circuit board 2.
Is arranged. In the suction unit 80, a support table 81 is fixed to the lower end of a moving table 71 connected to the cylinder mechanism 70, a support arm 82 extending on the printed circuit board 2 is attached to the support table 81, and a suction end is attached to the tip of the support arm 82. The sleeve 83 is fixed. On the support table 81, a clamp 90 in which a screw shaft 92 is integrally formed is arranged below the handle 91, while the clamp 90 is
A long hole 82a through which the screw shaft is inserted is formed. Also,
Below the support table 81, a clamp plate 93 with which the screw shaft 92 is screwed is arranged. By operating the handle 91, the support arm 82 can be supported between the support table 81 and the support table 81. It has become.

The suction sleeve 83 of the suction unit 80
A hollow connecting sleeve 84 is fixed to the support arm 82, and an internal hollow nozzle 85 having a rubber pad 85a at its tip is connected to the connecting sleeve 84, and an ejector, a vacuum pump, or the like is connected to the nozzle 85. A flexible tube (not shown) extending from an air suction device (not shown) is connected, and a pointer 95 for irradiating a laser beam to a front suction point of the pad 85a is provided on the connection sleeve 84. It is supported and attached to the bracket 95a.

In the above configuration, after the printed circuit board 2 is positioned and held at a predetermined position, first, the clamp 90 is loosened and the support arm 82 is operated, and the suction sleeve 83 is moved above the empty position of the printed circuit board 2, that is, printed. The board 2 is positioned above a position where electronic components such as ICs and LSIs are not arranged. At this time, by turning on the power of the pointer 95 and irradiating the laser beam to illuminate the suction point of the nozzle 85, the suction point can be confirmed, and the suction sleeve 83 can be quickly and reliably positioned at an appropriate position. It is. In this case, if the amount of bending of the printed circuit board 2 is large, the laser light of the pointer 95 is irradiated to a position different from that when the printed circuit board 2 is flat. It is preferable to prepare a model or the like in advance and use this to perform positioning of the suction unit 80.

When the start signal is input after the positioning of the suction unit 80 is completed as described above, the moving unit 6 and the turning unit 50 first move the cutter unit 10 to a preset position. Subsequently, air enters from the third air source, and the pushing unit 60 operates. As a result, the push rod 62 extends toward the printed circuit board 2, and the tip contacts the back surface of the printed circuit board 2 to push it up. At the same time, the suction unit 80 is operated, and the pad 85a at the tip of the nozzle 85 adjusted to the optimum position.
To a position where it comes into contact with the surface of the printed circuit board 2,
The printed circuit board 2 whose deflection has been corrected by being pushed up by the pushing unit 60 is sucked to the tip of the nozzle 85.

Thereafter, the pushing unit 60 moves back,
Since the printed board 2 is attracted to the tip of the nozzle 85, the printed board 2 does not bend again due to the weight of the IC, LSI chip, or the like. When the moving unit 6 and the turning unit 50 move and reach a preset position, air is supplied from the first air supply unit to the first air hole 7.
a, and is supplied to the through hole 12. For this reason, since the lifting cylinder 11 rises against the lifting spring 15, the cutter unit 1 rises with respect to the lead wire 3 a of the electronic component 3 which is set in advance, and the cutter unit 1 is positioned at a position sandwiching the lead wire 3 a. Move the part. When air is supplied through the second air hole and the operating cylinder 21 extends the operating rod 20, the teeth 32 of the cutter member 30 are closed, so that the lead wire 3a of the electronic component 3 has a predetermined length. Can be removed and left alone. Thereafter, since the moving unit 6 and the turning unit 50 sequentially move the cutter unit 10 to the position where teaching has been performed in advance, the above-described operation can be repeated, and the lead wire at each position can be cut off.

[0015]

As described above, according to the lead wire cutter of the present invention, the moving unit allows the cutter unit to move in the rectangular coordinate system.
Since the cutter unit can be turned by the turning unit, the direction of the cutter unit when cutting the lead wire or the moving path to the lead wire can be finely taught, and the lead according to various printed circuit boards and electronic components can be obtained. There are advantages such as the ability to cut the line.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of a cutter unit acting on a lead wire.

FIG. 2 is an enlarged partial cutaway sectional view of a main part of the cutter unit.

FIG. 3 is a partially cutaway front view of the lead wire cutter device according to the present invention.

FIG. 4 is an enlarged partial cutaway sectional view of a main part of the suction unit.

FIG. 5 is an explanatory diagram of the operation when positioning the suction unit.

FIG. 6 is an enlarged plan view showing an operation range of the suction unit.

FIG. 7 is an operation explanatory view of the lead wire cutter device of the present invention.

FIG. 8 is an explanatory diagram of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead wire cutter device 6 Moving unit 9 Mounting stand 10 Cutter unit 11 Elevating cylinder 21 Operating cylinder 30 Cutter member 50 Rotating unit 60 Pushing unit 70 Cylinder mechanism 80 Suction unit 95 Pointer

Claims (2)

[Claims] 1. A moving unit having a mounting base movable in a space defined by at least three directions on a back surface side of a printed circuit board on which an electronic component is mounted, and the printed circuit board is mounted on the mounting base of the moving unit. And a cutter unit configured to cut a lead wire of an electronic component protruding from a back surface of the lead wire cutter. 2. A moving unit having a mounting base movable in a space defined by at least three directions on a back surface side of a printed circuit board on which an electronic component is mounted, and a cutter unit is mounted on the mounting base of the moving unit. A lead wire cutter device having a turning unit for disposing and turning the cutter unit.