JPH11240096A - Element for forming barrier rib and manufacture of barrier rib using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an element for forming a barrier rib and a manufacturing method thereof, which can reduce manufacturing processes of the barrier rib for a plasma display panel, and can form the barrier rib having an excellent shape. SOLUTION: An element for forming a barrier rib has a resin composition layer for forming the barrier rib on a substrate film, and a base is provided with two or more relief patterns capable of removing, wherein the element for forming a barrier rib is laminated so that the resin composition layer for forming the barrier rib is contacted with the base. Next, the resin composition layer for forming the barrier rib is embedded in gaps of the two or more relief patterns. And the relief patterns are removed thereafter, and a pattern composed of the resin composition layer for forming the barrier rib is formed on the base, and the pattern is calcined.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a barrier rib forming element suitable for forming a barrier rib of a plasma display panel, and a method for manufacturing a barrier rib using the same.

[0002]

2. Description of the Related Art In general, barrier ribs of a plasma display panel are disclosed in, for example, IEICE Technical Report Vol.89 No.377 P.69, IEICE Technical Report Vol.91 No.407 P.49, JP-A-2-301934 and the like. As described in the above, it is formed by a thick film screen printing method or a sand blast method.

However, in the case of the screen printing method,
In order to form a large screen panel of 40 inches or more, which is expected as a market share of a plasma display panel, a large number of times of repeated printing are required to obtain a high barrier of 100 μm or more. There are problems such as a decrease in accuracy and difficulty in increasing the pixel density.

[0004] On the other hand, in the sand blast method, a resist pattern is formed on a barrier layer uniformly formed on a base material, and a blast material is sprayed on the upper surface of the base material to cut out portions other than the resist pattern covering portion to form a barrier rib. To form For this reason, the pixel density depends on the resolution of the resist pattern, and high definition can be achieved. However, the cost is extremely high because the expensive barrier material is scraped and discarded. The barrier material generally contains a lead compound, and there is an environmental pollution due to the disposal of the scraped barrier material. In the case of (1), there is a problem that the bottom of the barrier expands and it is difficult to obtain a rectangular barrier.

Therefore, in order to solve the above-mentioned problem,
As an approach different from the above, an additive method (photo embedding method) has been proposed in which a thick film relief pattern is manufactured, and a barrier rib is manufactured by embedding a barrier rib material serving as a barrier in a gap therebetween. In the case of this manufacturing method,
The position accuracy of the barrier ribs is excellent, the shape of the barrier ribs is excellent, and the extra barrier rib material is extremely small, so that it is possible to have features such as low cost and low pollution.

However, in the case of the photo embedding method,
In order to embed the barrier rib material in the gap between the relief patterns, it is necessary to make the barrier rib material into a paste and use a screen printing method. Therefore, it is necessary to sufficiently stir the barrier rib material before embedding and to confirm the dispersibility of each component contained in the barrier rib material, and the barrier rib of the plasma display panel has a thickness of 100 μm or less.
Since the film must be 250 μm thick, it is necessary to repeat the screen printing process several times. In some cases, when removing the relief pattern, it is necessary to remove unnecessary barrier rib material on the relief pattern by polishing or the like. Therefore, there is a problem that the process is complicated and long.

[0007]

SUMMARY OF THE INVENTION The first and second aspects of the present invention provide a barrier rib forming element capable of shortening a barrier rib manufacturing process of a plasma display panel and forming a barrier rib having an excellent shape.
The third aspect of the present invention is to provide a method for manufacturing a barrier rib, which can shorten a barrier rib manufacturing process of a plasma display panel and can form a barrier rib having an excellent shape.

[0008]

SUMMARY OF THE INVENTION The present invention relates to a barrier rib forming element having a barrier rib forming resin composition layer on a support film. Also, the present invention
The present invention relates to the barrier rib-forming element, wherein the barrier rib-forming resin composition layer contains an inorganic material and an organic binder. In addition, the present invention provides a method for manufacturing a semiconductor device, comprising: laminating the barrier rib forming element on a substrate provided with a plurality of removable relief patterns such that a barrier rib forming resin composition layer is in contact with the substrate; After embedding the barrier rib forming resin composition layer in the gap between the patterns, the relief pattern is removed to form a pattern made of the barrier rib forming resin composition on the substrate, and the pattern is fired. A method for producing the same.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The barrier rib forming element of the present invention has a barrier rib forming resin composition layer on a support film. The element for forming a barrier rib in the present invention is obtained by applying a solution (barrier rib forming resin composition solution) in which the components constituting the barrier rib forming resin composition layer are uniformly dissolved or dispersed in an organic solvent, on a support film, It is obtained by drying and forming a resin composition layer for forming a barrier rib.

The support film is, for example, made of polyethylene terephthalate, polycarbonate, polyethylene, polypropylene or the like and has a thickness of 5 to 100 μm.
Degree of film. As the coating method,
Known methods can be used, and examples thereof include a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, and a curtain coating method. The drying temperature is preferably 60 to 130 ° C., and the drying time is preferably 3 minutes to 1 hour. In the barrier rib forming element having the support film and the barrier rib forming resin composition layer, a cover film may be further laminated on the barrier rib forming resin composition layer. Such a cover film has a thickness of 5 made of polyethylene, polypropylene, polyethylene terephthalate, polycarbonate or the like.
And a film having a thickness of about 100 μm. The barrier rib forming element thus obtained can be stored in a roll or stored or used.

The thickness of the resin composition layer for forming a barrier rib is as follows:
The thickness of the barrier rib forming resin composition layer covering the upper surface of the relief pattern can be made extremely thin as 1 μm or less, and the barrier rib forming resin composition layer covering the upper surface of the relief pattern can be removed in a later step before removing the relief pattern. The relief pattern per unit area of the substrate provided with the relief pattern, the volume (V2) of the void of the relief pattern, and the resin composition for forming the barrier rib per unit area, from the point that they can be unnecessary or can be easily removed. The ratio ((V1) / (V2)) of the volume (V1) of the material layer is 1
The thickness is preferably in the range of 1.0 to 1.2, more preferably in the range of 1.02 to 1.18, and more preferably in the range of 1.05 to 1.15. It is particularly preferred that the thickness be as small as possible. Here, (V
If 1) / (V2) is less than 1, the resin composition for forming a barrier rib tends not to be sufficiently embedded in the gap between the relief patterns.
When 1) / (V2) exceeds 2, the thickness of the unnecessary resin composition layer for barrier rib formation that covers the upper surface of the relief pattern tends to be large. Considering the above points, the thickness of the barrier rib-forming resin composition layer is generally from 10 to 200.
μm.

The barrier rib-forming resin composition layer has a thickness of 100
The viscosity at ° C. is preferably 1 to 1 × 10 ⁷ Pa · sec, more preferably 2 to 1 × 10 ⁶ Pa · sec,
It is particularly preferably ⁵ to 1 × 10 ⁵ Pa · sec.
It is extremely preferable that the pressure be about 1 × 10 ⁴ Pa · sec. When the viscosity at 100 ° C. is less than 1 Pa · sec, the viscosity at room temperature becomes too low, and when used as a barrier rib forming element, the resin composition layer for forming a barrier rib tends to bleed from an end portion by flow. , There is a tendency for film formability to decrease. If it exceeds 1 × 10 ⁷ Pa · sec, the embedding property of the resin composition layer for forming a barrier rib into the gap between the relief patterns tends to decrease.

The resin composition solution for forming a barrier rib used for manufacturing the element for forming a barrier rib of the present invention contains an inorganic material, an organic binder, an organic solvent and the like. As the inorganic material, glass powder, alumina (Al
₂ O ₃ ), titanium oxide, zinc oxide, barium oxide, potassium oxide, sodium oxide, calcium oxide, zirconium oxide, cadmium oxide, copper oxide, magnesium oxide,
Metal oxides such as manganese oxide and bismuth oxide, pigments and the like are used. As the glass composition of the glass powder,
PbO.B ₂ O ₃ .SiO ₂ , PbO.B ₂ O ₃ , ZnO.
B ₂ O ₃ .SiO _{2 and the} like. The softening point of these inorganic materials is 350 to 1,000 ° C., and the particle size is 0.1 to 30.
It is preferable that the thickness be μm in terms of workability, barrier strength, and the like. In the inorganic material, the content of the glass powder is 30 to 75 in view of the strength of the formed barrier and the shape retention during firing.
It is preferable to set the weight%.

The organic binder is used for the purpose of maintaining the shape of the via-rib-forming resin composition formed into a pattern before firing, and is composed of known polymers, oligomers, monomers and the like. These organic binders may be a non-curing type, and in the case of a curing type, may be either a thermosetting type or a photo-curing type. As the polymer, for example, polymethyl acrylate, polymethyl methacrylate, polystyrene, polyethylene, polyvinyl acetate, a copolymer of ethylene and vinyl acetate, a copolymer of ethylene and acrylate, vinyl chloride and vinyl acetate And copolymers of styrene and acrylate or methacrylate, and copolymers of vinyl toluene and acrylate or methacrylate. Examples of the oligomer include ethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, and the like. As the monomer, for example, glycidyl methacrylate,
Butyl acrylate and the like.

The organic binder includes a catalyst or a curing agent for making an organic binder such as 2-heptadecyl imidazole, benzoyl peroxide, diaminodiphenylmethane or the like a curing system; a plasticizer such as polyethylene glycol diacetate or polypropylene glycol diacetate; γ-
A silane coupling agent such as glycidyloxypropyltrimethoxysilane and γ-glycidoxypropylmethyldiethoxysilane can also be added. The amount of the organic binder used is preferably 10 to 300 parts by weight based on 100 parts by weight of the total amount of the inorganic material. If the content is less than 10 parts, it tends to be difficult to form the resin composition for via-rib formation in a pattern. If it exceeds 300 parts by weight, the organic material in the resin composition for via-rib formation is fired. In the process of thermal decomposition and disappearance, the fluidity tends to be excessive in the melting stage before the thermal decomposition and disappearance, and the shape retention of the resin composition for forming via ribs tends to be inferior.

Examples of the organic solvent include toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, γ-butyrolactone, N-methylpyrrolidone, dimethylformamide, tetramethyl sulfone, ethylene glycol monomethyl ether, diethylene glycol dimethyl ether. , Diethylene glycol monobutyl ether, chloroform, methylene chloride, methyl alcohol, ethyl alcohol and the like. These are used alone or in combination of two or more. The amount of the organic solvent used is such that the viscosity of the resin composition solution for forming via ribs is 20 to 200.
It is preferable that the amount be a poise. Such an amount is generally 10 to 10 parts by weight of the inorganic material.
It is about 100 parts by weight. If the amount of the organic solvent is less than 10 parts by weight, the viscosity of the resin composition solution for forming via ribs tends to be too large, and the coating property tends to be reduced. It tends to be difficult to obtain a film thickness.

The barrier rib is formed by laminating a barrier rib forming element on a substrate provided with a plurality of removable relief patterns so that the barrier rib forming resin composition layer is in contact with the substrate, and forming a gap between the plurality of relief patterns. After embedding the barrier rib forming resin composition layer in,
It can be manufactured by removing the relief pattern, forming a pattern made of the resin composition for forming a barrier rib on a substrate, and baking this pattern.

Examples of the substrate include a ceramic plate, a plastic plate, and a glass plate. On this substrate, an insulating layer, an electrode, a protective layer, and the like may be provided.

The method of forming a relief pattern on a substrate can be performed by using a predetermined resin composition and applying a printing method or a photographic method, but from the viewpoint of the precision of the relief pattern, the photographic method is not suitable. preferable. The photographic method is a method in which a photosensitive resin composition layer is formed on a substrate, the photosensitive resin composition layer is exposed in a pattern, and developed to form a relief pattern on the substrate.

As a method of forming a photosensitive resin composition layer on a substrate, the photosensitive resin composition is directly applied on the substrate,
There is a method of drying the photosensitive resin layer on the substrate by laminating the photosensitive resin layer of the photosensitive film on the substrate by a laminator using a photosensitive film, a method of drying the photosensitive resin layer if necessary, and the like. From the viewpoint that the thickness (height) of the relief pattern can be increased, the latter method using a photosensitive film is preferable. The photosensitive film has a support film and a photosensitive resin layer, for example, on a support film such as a polyethylene terephthalate film,
It is manufactured by applying a photosensitive resin composition and drying it as necessary to form a photosensitive resin composition layer. Known photosensitive resin compositions can be used without particular limitation, and examples thereof include a negative photosensitive resin composition and a positive photosensitive resin composition. As the positive photosensitive resin composition, known ones can be used without particular limitation. For example, a 1,2-naphthoquinonediazide compound,
Examples thereof include a photo-soluble group-forming composition using an o-nitrobenzyl-based compound and the like, and a photo-acid generating / acid-decomposing type composition using an onium salt and the like.

As the negative photosensitive resin composition, known ones can be used without particular limitation. Examples thereof include (a) an ethylenically unsaturated compound, (b) a carboxyl group-containing film-imparting polymer, and (c) photopolymerization initiation. Examples of the photopolymerizable composition include an agent as an essential component and, if necessary, a (d) dye or pigment (e) and other additives (f) an organic solvent. The photosensitive resin composition layer formed on the substrate using such a photosensitive resin composition is exposed to a pattern by irradiating actinic rays through a negative mask having a predetermined pattern, and is heated as necessary. After that, the photosensitive resin composition layer is selectively removed by development to form a plurality of relief patterns on the substrate. The developing method is not particularly limited, and examples thereof include wet development and dry development. In the case of wet development, a developer corresponding to the photosensitive resin composition is used. Examples of the developer include a weak alkaline dilute aqueous solution such as sodium carbonate and potassium carbonate, and examples of the development method include an immersion method and a spray method. Also, the relief pattern formed on the substrate after development, for the purpose of improving strength, solvent resistance, etc.,
It may be heated and / or exposed. The thickness (height) of the obtained relief pattern is about 50 to 250 μm,
In the case of a striped or rectangular relief pattern, its width is 50 to 250 μm.

The barrier rib forming element is laminated on the substrate having the relief pattern formed as described above. When the cover film is present on the barrier rib forming element, the cover film is removed and the relief pattern is removed. In such a manner that the barrier rib-forming resin composition layer is in contact with the surface provided with the above, pressure bonding is performed by a pressure roll using a laminator or the like.

The pressure roll may be provided with a heating means so as to be able to heat and pressure, and the heating temperature at the time of pressure bonding is preferably 10 to 150 ° C., and preferably 20 to 150 ° C.
The temperature is more preferably set to 135 ° C, particularly preferably 30 to 130 ° C. If the heating temperature is lower than 10 ° C., the embedding property of the relief pattern of the resin composition layer for forming a barrier rib into the gap tends to decrease.
When the temperature exceeds ℃, the resin composition layer for forming a barrier rib tends to be thermally cured. In addition, the pressure at the time of crimping is 5
0 to 1 × 10 ⁵ N / m, preferably 2.5 × 10 ⁵ N / m
More preferably to ^{2 ~5 × 10 4 N / m} , 5 × 10 2
It is particularly preferable to set to ４4 × 10 ⁴ N / m. If the pressure is less than 50 N / m, the embedding property of the barrier rib-forming resin composition layer into the gap of the relief pattern tends to decrease. If the pressure exceeds 1 × 10 ⁵ N / m, the relief pattern is broken. Tend to

In order to improve the embedding property of the resin composition layer for forming the barrier rib into the gap of the relief pattern, the substrate provided with the relief pattern may be preheated at 30 to 140 ° C. for about 0.5 to 20 minutes. preferable. Further, for the same purpose, the surface of the pressure roll has a thickness of 20 mm.
It is also possible to use one made of a highly flexible material such as rubber or plastic of about 0 to 400 μm. In addition, for the same purpose, the above-described lamination operation by pressure bonding and heat compression can be performed under reduced pressure of 5 × 10 ⁴ Pa or less. After the lamination is completed, 30 to 200
In the range of ° C., it is also possible to heat for 1 to 120 minutes. At this time, if a support film is present on the barrier rib forming resin composition layer, the support film may be removed as necessary. Good.

The heating conditions, the pressure conditions, the preheating conditions of the substrate provided with the relief pattern, and the film thickness of the barrier rib forming resin composition of the barrier rib forming element of the present invention. The thickness of the barrier rib-forming resin composition layer covering the upper surface of the relief pattern can be extremely reduced to 1 μm or less by appropriately selecting the combination of the above.

The resin composition for forming barrier ribs is embedded in the gaps between the relief patterns on the substrate as described above, and the embedded resin composition for forming barrier ribs is cured by heating or exposing as necessary. Is removed. Before removing the relief pattern, an unnecessary resin composition for forming a barrier rib covering the upper surface of the relief pattern may be removed by a chemical solution treatment, polishing, or the like. The relief pattern can be removed by various methods. For example, when the removal of the relief pattern is performed using a stripping solution, the stripping solution to be used includes a 1 to 10% by weight aqueous solution of sodium hydroxide or potassium hydroxide. . This concentration is 1
If the amount is less than 10% by weight, the peeling effect tends to be too long because the effect of the peeling is small, and if it exceeds 10% by weight, the resin composition for forming a barrier rib tends to be damaged. The temperature of the stripping liquid is not particularly limited, and conditions for suitably stripping the relief pattern may be appropriately set. As the stripping method, any of the immersion method and the spray method is suitable, and the immersion method and the spray method May be used in combination. In addition, it is also possible to remove the relief pattern by firing it together with the barrier rib forming resin composition.

After the removal of the relief pattern, an organic substance such as a resin binder is removed from the patterned resin composition for forming a barrier rib remaining on the substrate to improve strength, gas impermeability and the like. The resin composition for forming a barrier rib is fired. The firing temperature and time are 350 to
580 ° C., about 1 to 20 hours. The thickness (height) of the barrier rib on the substrate manufactured in this manner is 50 to 50.
It is about 250 μm, and its width is about 20 to 150 μm.

[0028]

The present invention will be described below with reference to examples. Production Example 1 [Production of Barrier Rib Forming Element] The materials shown in Table 1 were mixed for 15 minutes using a raikai machine to prepare a solution (A-1) for a barrier rib forming resin composition layer.

[0029]

[Table 1]

The obtained solution (A-1) for forming a resin composition layer for forming a barrier rib is uniformly coated on a polyethylene terephthalate film having a thickness of 50 μm and dried with a hot air convection dryer at 110 ° C. for 10 minutes. Then, the solvent was removed to form a resin composition layer for forming a barrier rib. The thickness of the obtained resin composition layer for forming a barrier rib was 50 μm. Next, on the barrier rib forming resin composition layer,
A polyethylene film having a thickness of 25 μm was laminated as a cover film to prepare a barrier rib forming element (i).

Production Example 2 [Production of barrier rib forming element] The materials shown in Table 2 were mixed for 15 minutes using a raikai machine to prepare a solution (A-2) for a barrier rib forming resin composition layer.

[0032]

[Table 2]

The obtained solution (A-2) for forming a resin composition layer for forming a barrier rib is uniformly coated on a polyethylene terephthalate film having a thickness of 50 μm, and dried with a hot air convection dryer at 110 ° C. for 10 minutes. Then, the solvent was removed to form a resin composition layer for forming a barrier rib. The thickness of the obtained resin composition layer for forming a barrier rib was 50 μm. Next, on the barrier rib forming resin composition layer,
A polyethylene film having a thickness of 25 μm was laminated as a cover film to prepare a barrier rib forming element (ii).

Example 1 [Formation of relief pattern] Methyl methacrylate / ethyl acrylate / methacrylic acid copolymer (weight ratio 53/3)
137 g of a 41% by weight methylcellosolve / toluene (weight ratio 8: 2) solution of 0/17, weight average molecular weight 100,000)
(Solid content 55 g), 34 g of bisphenol A polyoxyethylene dimethacrylate, 11 g of γ-chloro-β-hydroxypropyl-β-methacryloyloxyethyl-O-phthalate, stabilizer (AW-500, manufactured by Kawaguchi Chemical Co., Ltd.) 0 0.1 g, tribromomethylphenylsulfone 1.2 g, silicone leveling agent (SH-193, manufactured by Toray Silicon Co., Ltd.) 0.04 g, 1,7 bis-
0.2 g of (9-acridinyl) heptane, 3 g of benzyldimethyl ketal, leuco crystal violet
0 g, malachite green 0.05 g, toluene 7 g,
13 g of methyl ethyl ketone and 3 g of methanol were blended to obtain a solution of the photosensitive resin composition.

The photosensitive resin composition solution was uniformly applied on a polyethylene terephthalate film having a thickness of 20 μm, and dried with a hot air convection dryer at 110 ° C. for about 10 minutes to obtain a photosensitive film. The film thickness of the photosensitive resin layer after drying was 50 μm. Next, the obtained photosensitive film was laminated on a substrate in three layers to form a photosensitive resin layer having a thickness of 150 μm. As a substrate, a glass plate (3.0 mm
Thickness). Lamination is performed at a laminating roll temperature of 13
The test was performed at 0 ° C., a roll pressure of 4.0 kgf / cm ² , and a speed of 1.0 m / min. Next, a negative mask is placed on the polyethylene terephthalate film, and a 3 kW high-pressure mercury lamp (HMW-
590, manufactured by Oak Manufacturing Co., Ltd.) at 80 mJ / cm ² . Heating was performed at 80 ° C. for 10 minutes within 5 minutes after exposure.

Next, after peeling off the polyethylene terephthalate film, the film was spray-developed with a 1% by weight aqueous sodium carbonate solution at 30 ° C. Next, immersion treatment is performed at 20 ° C. in a 0.5% by weight aqueous solution of hydrogen chloride, washed with water, drained,
After drying for 5 minutes with a 7KW metal halide lamp (HMW-6)
80, manufactured by Oak Manufacturing Co., Ltd.) at ² J / cm ² . Then
Heated at 150 ° C. for 100 minutes. Thus, a substrate having a rectangular cross-sectional shape and provided with a thick film relief pattern (sheet glass 3 mm thick, 10 cm long × 10 cm wide, line / space =
150/70 μm, relief thickness 150 μm).

[Formation of Barrier Rib] On the side of the substrate provided with such a relief pattern on which the relief pattern was formed, the polyethylene film of the barrier rib forming element (i) obtained in Production Example 1 was peeled off while the laminator ( HLM-1500, manufactured by Hitachi Chemical Co., Ltd.
), The laminating temperature is 100 ° C, the laminating speed is 0.5 m / min, and the pressing pressure (cylinder pressure) is 4 ×
A resin composition for forming a barrier rib through a polyethylene terephthalate film at a pressure of 10 ⁵ Pa (a substrate having a thickness of 3 mm and a length of 10 cm × a width of 10 cm was used, and the linear pressure at this time was 9.8 × 10 ³ N / m) The layers were pressed and laminated, and the barrier rib forming resin composition layer was embedded in the gaps of the relief pattern.
In this case, (V1) / (V2) was 1.05.

Next, the barrier rib forming element (i)
The polyethylene terephthalate film on the surface not in contact with the relief pattern was peeled off, and heated at 160 ° C. for 45 minutes to cure the barrier rib-forming resin composition. Next, immersion in a 5% by weight aqueous solution of sodium hydroxide at 45 ° C.
The relief pattern was peeled off and removed, and a pattern made of the resin composition for forming a barrier rib was formed on the substrate. Next, this pattern was fired in air using a muffle furnace to obtain a barrier rib. The firing conditions are from room temperature to 400 ° C.
The temperature is raised at a rate of 3 ° C./min, and maintained at 400 ° C. for 30 minutes. Further, the temperature is raised to 550 ° C. at a rate of 5 ° C./min, maintained at 550 ° C. for 30 minutes, and cooled to room temperature. It was taken. Above, the peeling time for peeling and removing the relief pattern was measured, and the cross section of the barrier rib was observed with a stereoscopic microscope and an electron microscope to evaluate the formation state. The results are shown in Table 3.

Example 2 Example 1 was repeated except that the barrier rib forming element (i) obtained in Production Example 1 was replaced with the barrier rib forming element (ii) obtained in Production Example 2. And the results are shown in Table 3.

Comparative Example 1 A substrate provided with a relief pattern was manufactured in the same manner as in Example 1, and a rib paste (product name TR-0994, manufactured by Taiyo Ink Manufacturing Co., Ltd.) as a barrier rib material was formed on the formed relief pattern. ) Was uniformly embedded in the gap of the relief pattern using a squeegee, defoamed under reduced pressure (5 Torr) for 3 minutes, and dried at 80 ° C. for 30 minutes. This rib paste embedding → defoaming under reduced pressure → drying step is performed two more times.
Repeated times. Next, the barrier rib material was cured by heating at 160 ° C. for 45 minutes. Next, it was immersed in a 5% by weight aqueous solution of sodium hydroxide at 45 ° C. to remove the relief pattern by removing it, but the removal was not possible. Table 3 shows the above results.

[0041]

[Table 3] In Table 3, good barrier rib shape means that a shape corresponding to the shape of the gap between the relief patterns is obtained.

From Table 3, it can be seen that Examples 1 and 2 using the element for forming a barrier rib have a good relief pattern without a polishing step for removing unnecessary barrier rib material on the relief pattern. It was found that the barrier rib could be peeled off and the shape of the obtained barrier rib was good. On the other hand, in Comparative Example 1 in which the barrier rib forming element was not used, it was found that the polishing pattern for removing unnecessary barrier rib material on the relief pattern was not performed, so that the relief pattern could not be peeled off. .

[0043]

According to the first and second aspects of the present invention, the barrier rib forming element of the plasma display panel can be shortened, and a barrier rib having an excellent shape can be formed. According to the third aspect of the present invention, a barrier rib manufacturing process of a plasma display panel can be shortened, and a barrier rib having an excellent shape can be formed.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuya Sato 4-3-1-1, Higashimachi, Hitachi City, Ibaraki Prefecture Inside the Ibaraki Research Laboratory, Hitachi Chemical Co., Ltd. (72) Inventor Naoki Kimura 4-13 Higashimachi, Hitachi City, Ibaraki Prefecture No. 1 Hitachi Chemical Co., Ltd.Ibaraki Research Laboratory (72) Inventor Mariko Shimamura 4-3-1 Higashicho, Hitachi City, Ibaraki Prefecture Hitachi Chemical Co., Ltd.Ibaraki Research Laboratory (72) Inventor Seiji Tai, Hitachi City, Ibaraki Prefecture 4-13-1, Higashicho, Ibaraki Research Laboratory, Hitachi Chemical Co., Ltd. (72) Inventor Yukiko Muramatsu 4-3-1-1, Higashicho, Hitachi City, Ibaraki Prefecture, Ibaraki Research Laboratory, Hitachi Chemical Co., Ltd. (72) Ikuo Muko, Inventor Hitachi Chemical Industry Co., Ltd. Yamazaki Factory

Claims (3)

[Claims] 1. A barrier rib forming element comprising a support film and a barrier rib forming resin composition layer. 2. The barrier rib forming element according to claim 1, wherein the barrier rib forming resin composition layer contains an inorganic material and an organic binder. 3. The barrier rib forming element according to claim 1 or 2 is laminated on a substrate provided with a plurality of removable relief patterns so that the barrier rib forming resin composition layer is in contact with the substrate. Next, after embedding the barrier rib forming resin composition layer in the gaps between the plurality of relief patterns, removing the relief pattern to form a pattern made of the barrier rib forming resin composition on the substrate, and firing the pattern. A method for producing a barrier rib, comprising: