JPH11233921A - Electronic component packaged board device, its manufacture and gas meter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable formation of a humidity-resistant protective layer, even on a chip or a discrete component through the formation of a protective layer by impregnating a soft and resin permeable protective sheet with coating resin and hardening it on parts such as connecting terminals which are electrically connected to wiring patterns and which should be protected against a corrosive atmosphere. SOLUTION: Liquid coating resin is sprayed on a protective sheet 010, which covers chip components 08 and a discrete component 10 as a whole and is spread on a substrate 01 via the network of the protective sheet 010. Space among the protective sheet, the mounted components and the substrate 01 is filled with the coating resin by the capillarity and the surface tension of the resin. The protective sheet 010 is closely adhered to the substrate 01 and the components 08 and 010 by the viscosity of the coating resin. The protective sheet 010 is heated and dried to form a strong protective layer on the substrate 010. The size of the network of the protective sheet 010 is made smaller than the outer size of connecting terminals 10a so as not to allow the ends of them to jump out of the net.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a protective layer made of a coating resin on a portion to be protected from a corrosive atmosphere such as a wiring pattern of an electronic component mounting board and connection terminals electrically connected to the wiring pattern. The present invention relates to an electronic component mounting board device such as a gas meter or a water meter installed outdoors, a method of manufacturing the same, and a gas meter.

[0002]

2. Description of the Related Art Conventionally, a gas control device equipped with a microcomputer which constantly monitors a gas flow rate, detects a gas leak or abnormal use, and shuts off a gas is built in a gas meter having a shut-off function installed outdoors. Have been. In this gas control device, a microcomputer, a battery, a seismic device, and the like are mounted on an electronic component mounting board, and are electrically connected to each other by pattern wiring of the mounting board.

An example of this type of gas meter will be described below with reference to FIGS. FIG. 18 is a perspective view showing an example of a conventional gas meter, and FIG.
FIG. 20 is a block diagram showing a schematic function of the gas meter.

[0004] As shown in FIG. 18, a lower case 19 A made of aluminum die-casting having an opening formed at an upper end and a front end;
An upper case 19 made of aluminum die-casting, which is placed on the upper end of the lower case 19A and has openings at the lower end and front and rear ends.
B indicates that the outer box is airtight.

The lower case 19A houses therein a measuring function means 20 for measuring the flow rate of gas flowing through the inside and supplied to the customer, for example, a rotating magnet.
The front surface is sealed with 0a. On the front surface of the weighing function means 20, a metal lid 25A is hermetically attached.

On the other hand, on the front surface of the upper case 19B, a display unit 21 formed of, for example, a mechanical numeric wheel for displaying an integrated value of the gas flow rate measured by the measurement function means 20 is projected. Glass 25B is hermetically attached to the front end.

A lid (not shown) is also attached to the opening shown in the figure formed at the rear end of the upper case 19B. At the upper end of the upper case 19B, connecting portions 26A and 26B having a tapered male thread formed on the outer periphery are protruded, and female joints 27 are respectively formed at these connecting portions 26A and 26B as shown in the figure. Gas pipes 28A and 28B are connected via the gas pipes.

[0008] Of these, the gas pipe 28A on the left side of the figure is connected to a service pipe (not shown) buried in the site of the customer where the gas meter is installed, and the gas pipe 28B on the right side is connected to the gas appliance of the customer. It is connected.

Inside the upper case 19B, a control unit 24 including an electronic component mounting circuit board (hereinafter simply referred to as a board) 01 made of, for example, a printed board is housed in a central part, and is fixed with small screws 23. I have. A power supply unit 140 including a pressure sensor 6, a shutoff valve 22, a seismic sensor 8, and a battery such as a lithium battery 14 is fixed to the upper case 19B.

In this gas meter, a pressure sensor 6 and a seismic sensor 8 are used to detect a gas leak due to an earthquake or the like.
For example, a control device 24 that determines an abnormality from a pressure signal input from the pressure sensor 6 and outputs a signal for operating the shutoff valve 22 is included.

When the shutoff valve 22 operates, the supply of gas from the gas meter to the gas pipe 28B connected to the customer is stopped.

In order to maintain the insulating properties of the electronic components of the printed circuit board incorporated in the control device 24 for a long period of time, the mounting portion of the cover of the opening is hermetically sealed by a sealing material such as packing. I'm dripping.

FIG. 20 is a block diagram showing the overall configuration of the gas meter described above. Reference numeral 10 denotes a microcomputer (hereinafter referred to as a microcomputer), and reference numeral 21a denotes a display including a display element for displaying a gas shutoff event, for example, a light emitting diode 21a. Units 21 and 3 are test switches for testing the shut-off function, and 4 is an external alarm input circuit for outputting a signal from an external gas leak alarm to the microcomputer 10.
Is a pressure sensor input circuit for outputting a signal from the pressure sensor 6 to the microcomputer 10, 7 is a seismic sensor input circuit for outputting a signal from the seismic sensor 8 to the microcomputer 10, and 9 is a signal obtained from the rotating magnet 20. A flow rate pulse input circuit for converting a contact signal of a reed switch 11 for detecting the rotational movement magnetically in a non-contact manner into an electric pulse signal and outputting the signal to a microcomputer 10, and a shut-off valve 2 according to a command from the microcomputer 10.
A shut-off valve drive circuit that drives the power supply 2 and a lithium battery 14 that supplies power to each electric circuit including the microcomputer 10.

A voltage monitoring circuit 15 for detecting a voltage drop of the battery 14 and outputting a battery voltage drop signal to the microcomputer 10;
Reference numeral 18 denotes an oscillation circuit for supplying a clock signal to the microcomputer 10.

FIG. 22 shows a control device 2 for a conventional gas meter.
4 is a configuration diagram of FIG. In FIG. 22, reference numeral 40 denotes a circuit component mounting board on which a wiring pattern is formed on a plate made of glass epoxy or the like. 44 is a synthetic resin holder (holder) for attaching the substrate 40 to the gas meter main body.
And has a function of fixing to the gas meter. The holder 44 is formed with claws 44 a that fit into four square holes 40 a provided at four corners of the substrate 40.

The holder 44 is integrally formed with a mounting portion 35 having a screw insertion hole 35a formed therein for screwing the gas meter main body, and a lead of a flow detecting device mounted on the substrate 40. A square hole 44b for letting out the switch 36 is formed. A lead wire 4 for connecting to the lithium battery 14, the seismic sensor 8, the microcomputer 10, the reed switch 36 and the shut-off valve 22 of FIG.
2. A connection pin 41 for connecting the pressure sensor 6, a light emitting diode display (not shown), a test switch 3, and the like are mounted and connected by soldering.

Although not shown, circuit components necessary for operation, such as a resistor and a capacitor chip, are also mounted on the board and soldered. Note that the coating resin is applied to a required portion by spraying after assembling the circuit board. After that, a strong protective layer is formed on the substrate 40 through a drying process.

FIGS. 23 (a) and 23 (b) show a reed switch 36 of a conventional flow detecting device. FIG. 23 (a) is a perspective view thereof, and FIG. The reed switch 36 is inserted into the holder 45 from below. Although not shown here, after the reed switch 36 is inserted into the holder 45, a stopper including a claw 45a formed integrally with the holder 45 prevents the reed switch 36 from dropping. The holder 45 has two claw portions 45 a for attaching to the substrate 40. The lead portion 36b of the reed switch 36 is bent in the direction of the drawing in advance, and when the holder 45 is fitted to the substrate 40, the lead portion 36b is inserted into the corresponding through hole of the substrate 40, and then fixed by soldering. It has become.

[0019]

Conventionally, the substrate 01 of the control unit 24 of the gas meter having such a structure, specifically, FIG.
1, the wiring pattern (not shown) formed on the substrate 01, and the wiring pattern and the chip component 0
In order to protect the electrical connection part, for example, the soldered part, of the connection terminal 8 and the discrete component 8 of the connection terminal 10a of the microcomputer 10 from moisture, corrosive atmosphere and salt damage,
Since the resin coating is generally performed as follows, this description will be given with reference to FIG.

Here, the chip component 08 is a component having a flat connection terminal on the bottom surface such as a resistor and a capacitor, and can be directly electrically connected to a wiring pattern formed on the substrate 01. Is a generic name for the components configured in
The following description is all the same.

The discrete component is the aforementioned microcomputer 10, for example, a DIP type IC (integrated circuit),
A connection terminal 10 that penetrates the substrate 01 and is electrically connected to a wiring pattern formed on the substrate 01
It is a generic name of the parts having "a", and the following description is all the same.

In FIG. 21, reference numeral 09 denotes spray means.
Thereby, the coating resin is sprayed to a necessary portion, that is, a portion to be protected from a corrosive atmosphere or the like.

In order to spray the coating resin by the spray means 09, the chip component 08 and the discrete component 10 are mounted, and the connection terminals and the coating resin in a liquid state are soldered to the wiring pattern of the substrate 01. Was sprayed, and the coating resin was dried by heating, for example, to form a protective layer.

Specifically, a low-viscosity resin such as an epoxy resin is filled as a coating resin on the substrate 01 into a spray means 09, and after spraying the resin, the coating resin layer is cured by heating or ultraviolet rays to form a protective layer. It is a method of forming.

These methods are effective when the thickness of the chip component 08 or the like is constant and the thickness of the coating resin layer can be made sufficiently higher than that of the chip. However, when chip components 08 and discrete components 10 are mixed, the thickness of the coating resin layer is high because the height of the discrete components 10 is high and the viscosity of the coating resin is low because workability is intentionally considered. However, there was a problem that it could not be formed sufficiently high.

In particular, when coating to the tip of the connection terminal 10a of the discrete component 10, even if it is applied to the tip of the connection terminal 10a by a conventional spray method or the like, since the resin viscosity is low, the coating resin is low at the base of the lead. And the resin layer at the tip of the lead becomes thinner, so that it cannot be applied to a uniform thickness.

Therefore, for example, in a high humidity environment, rust is likely to be generated from the tip of the connection terminal 10a, and this rust gradually progresses and spreads to a portion under the protective layer made of the coating resin, thereby losing the coating effect early. There was such a problem.

For this reason, conventionally, a method such as applying a multilayer coating of a coating resin or using a coating resin having a high viscosity has been used. However, multi-layer coating requires repeated coating and drying processes many times, and the use of high-viscosity resin tends to clog spraying means, and brushing reduces work efficiency, such as poor workability. As a result, there was also a problem that it became expensive.

Further, the above-described gas meter control device has the following problem. Since this control device is attached to a portion of the gas meter main body that is in contact with the atmosphere other than the portion through which the gas passes, the control device is easily affected by temperature, humidity, corrosive atmosphere, and the like, and the leakage current of the substrate increases, and the battery 1
There were problems such as shortening the life of No. 4 and, in severe cases, corroding the wiring pattern.

Conventionally, a liquid coating resin such as an epoxy resin or an acrylic resin is applied to the circuit board 40,
By drying, a protective layer was formed on an important part. However, parts that cannot operate normally when the coating resin penetrates into the inside, such as seismic sensors, are mounted on the electronic component mounting board of the control device, so when applying the coating resin, avoid the parts mounting part The workability was very bad.

Also, even if the coating resin is low in clay, the coating resin may flow from the point of application even if it is avoided with great care. To prevent this flow, it is necessary to leave enough space around these parts. However, there is a drawback that the entire substrate is required to be large.

Further, since the viscosity of the coating resin is low, a protective layer formed by coating cannot be formed sufficiently thick.
Therefore, there is a problem that it is difficult to obtain a sufficient coating effect.

Therefore, the present invention has been made based on the above circumstances. A first object of the present invention is to form a protective layer on any chip component or discrete component without fail, and to provide a high-moisture component having excellent moisture resistance. An object of the present invention is to provide a method for manufacturing a reliable electronic component mounting board device and an electronic component mounting board device having good workability.

Further, the present invention has been made based on the above circumstances. A second object of the present invention is that the mounting substrate is a single-sided mounting type, the area can be reduced, and the rise of the power supply when a battery is mounted can be stabilized. An object of the present invention is to provide a gas meter capable of enhancing the moisture resistance of a mounting board.

[0035]

According to a first aspect of the present invention, there is provided an electronic component mounting board, comprising:
At least one of a chip component having a connection terminal and a discrete component having a connection terminal is mounted, and at least one connection terminal of the chip component and the discrete component is provided on a wiring pattern formed on the electronic component mounting board. In an electrically connected electronic component mounting board device, a flexible resin-permeable protection is provided at a portion to be protected from a corrosive atmosphere, such as the wiring pattern and a connection terminal electrically connected to the wiring pattern. An electronic component mounting board device comprising a sheet and a protective layer made of a coating resin obtained by impregnating and curing the protective sheet.

In order to achieve the above object, a second aspect of the present invention provides the protective sheet according to the first aspect, wherein the protective sheet is selected from glass fibers, ceramic fibers, and urethane fibers. Is urethane,
The electronic component mounting board device is selected from a rubber type and an acrylic type.

According to a third aspect of the present invention, there is provided a protective sheet according to the first aspect, wherein the protective sheet is selected from urethane-based, rubber-based, and acrylic-based sheets, and is used to form a large number of small holes. It is a sheet formed and formed such that the size of each hole is smaller than the external dimensions of the connection terminal of the component, and the coating resin is selected from urethane, rubber, and acrylic. This is an electronic component mounting board device.

According to a fourth aspect of the present invention, there is provided a protective sheet according to any one of the first to third aspects, wherein the protective sheet does not loosen when placed on the component. An electronic component mounting board device, wherein a notch is formed in a peripheral portion.

According to the invention as set forth in any one of claims 1 to 4, since the protective layer is formed of the protective sheet and the coating resin, the protective layer can be reliably formed on any chip component or discrete component. As a result, a highly reliable electronic component mounting board device can be obtained.

According to a fifth aspect of the present invention, there is provided a control device including at least a large-sized electronic component comprising a battery and comprising a plurality of electronic components for controlling a flow rate of a fluid. An electronic component mounting circuit board in which all of the electronic components except the electronic components are arranged on the component mounting surface, each component is electrically connected by a wiring pattern, and a lead wire can be inserted and electrically connected to the wiring pattern. When,
A box-shaped portion having a through hole capable of housing the circuit board and through which a lead wire can be inserted, a component mounting portion for mounting the large-sized electronic component, and a switch such as a reed switch for measuring the flow rate of the fluid A holder provided with a mounting portion for mounting an element on the bottom side of the box-shaped portion, a circuit board housed in the box-shaped portion of the holder, the switch element being mounted on the mounting portion, In a state where the lead wire is inserted into the circuit board through the through hole of the box-shaped portion and is welded to the circuit board, the molten coating resin is poured into the box-shaped portion, and the coating resin is cured. An electronic component mounting board device comprising a protective layer formed so as to surround the circuit board.

According to a sixth aspect of the present invention, there is provided a semiconductor device according to the sixth aspect, wherein pins are implanted on the circuit board in a state where a protective layer is not formed, and a lead is formed after the protective layer is formed. 6. The electronic component mounting board device according to claim 5, wherein the electrical connection between the circuit board and the large electronic component is performed by the pins without mounting a wire or a connector.

According to a seventh aspect of the present invention, in order to achieve the above object, the height of the box-shaped portion of the holder is determined by the height of the protective layer formed when all the electronic components are mounted on the circuit board. 6. The electronic component mounting board device according to claim 5, wherein the thickness is higher than the thickness.

In order to achieve the above object, an invention according to claim 8 is characterized in that the size of the through hole formed in the box-like portion of the holder is substantially equal to the diameter of the lead wire of the switch element. 6. The electronic component according to claim 5, wherein the diameter of the hole for inserting the lead wire of the switch element formed on the circuit board is slightly larger than the diameter of the lead wire of the switch element. This is a mounting board device.

According to a ninth aspect of the present invention, in order to achieve the above object, the holder is made of a synthetic resin or a metal material. The electronic component mounting board device according to claim 5, wherein a bush made of an object is mounted.

According to a tenth aspect of the present invention, there is provided a control device including at least a large-sized electronic component comprising a battery and comprising a plurality of electronic components for controlling a flow rate of a fluid. All of the electronic components except the electronic components were arranged on the component mounting surface, each component was electrically connected by a wiring pattern, and electrically connectable externally and electrically connected to the wiring pattern. An electronic component mounting circuit board having a lead member, a box-shaped portion capable of housing the circuit board and having a through hole through which the lead member can be inserted, and a component mounting portion for mounting the large-sized electronic component; A holder provided with a mounting portion for mounting a switch element such as a reed switch for measuring the flow rate of the fluid on the bottom surface side of the box-shaped portion, and the circuit board so as to surround the circuit board. The control device body with the protective layer formed by the coating resin is housed in the box-like portion of the holder, and the lead member is projected outside from the through hole of the box-like portion, and the lead of the switch element is provided. An electronic component mounting board device electrically connected to a wire.

According to the invention corresponding to claims 5 to 10,
An electronic component mounting board device capable of simply coating a circuit board with a simple structure. The electronic board has a small circuit board and a simple and economical coating operation, but has excellent moisture resistance. A component mounting board device can be provided.

In order to achieve the above object, an invention according to claim 11 is the invention wherein at least one of a chip component having connection terminals and a discrete component having connection terminals is mounted on an electronic component mounting board, and After electrically connecting at least one connection terminal of the chip component or the discrete component to a wiring pattern formed on a component mounting board, the wiring pattern, a connection terminal electrically connected to the wiring pattern, and the like. A coating resin is sprayed by a spray means on a portion to be protected from the corrosive atmosphere of the above with a flexible resin-permeable protective sheet, whereby the coating resin impregnated in the protective sheet and the electronic component mounting are sprayed. An electron in which a protective resin is formed by curing a coating resin attached to a substrate and the component. A method for producing a goods mounting board device.

According to a twelfth aspect of the present invention, at least one of a chip component having connection terminals and a discrete component having connection terminals is mounted on an electronic component mounting board. After electrically connecting at least one connection terminal of the chip component or the discrete component to a wiring pattern formed on a component mounting board, the wiring pattern, a connection terminal electrically connected to the wiring pattern, and the like. After previously impregnating a coating sheet with a flexible permeable protective sheet with a coating resin in a portion to be protected from the corrosive atmosphere of the above, after applying the protective sheet impregnated with or impregnated with the coating resin, impregnating the protective sheet Alternatively, a method for manufacturing an electronic component mounting board device in which a protective layer is formed by curing a permeated coating resin. .

According to a thirteenth aspect of the present invention, there is provided a method of manufacturing an electronic component mounting board device according to the eleventh or twelfth aspect, wherein a plurality of the protective sheets are stacked to form a protective layer.

In order to achieve the above object, the invention according to claim 14 is characterized in that the protective sheet is selected from glass fiber, ceramic fiber, and urethane fiber, and the coating resin is urethane, 12. A material selected from rubber and acrylic.
A method of manufacturing an electronic component mounting board device according to any one of the above-described items.

In order to achieve the above object, the invention according to claim 15 uses the protection sheet having a cut in a peripheral portion thereof so as not to be loosened when the component is put on the component. 15. The method according to claim 11, wherein:
It is a manufacturing method of the electronic component mounting board device as described in any one of the above.

In order to achieve the above object, an invention according to claim 16 is that the protective sheet is selected from urethane-based, rubber-based, and acrylic-based sheets, and is used to form a large number of small holes. The size of each said hole is formed so that it may become smaller than the external dimension of the connection terminal of the said parts, and the said coating resin is selected from urethane type, rubber type, acrylic type. (13) A method of manufacturing an electronic component mounting board device according to any one of (15) to (15).

According to the invention as set forth in any one of claims 11 to 16, since the coating resin is cured after the protective sheet is impregnated with the coating resin, the workability is good and the reliability is high. A high manufacturing method of the electronic component mounting board device can be obtained.

In order to achieve the above object, an invention according to claim 17 is that a circuit pattern is formed on a front surface which is one plate surface and a circuit pattern is formed on a back surface which is the other plate surface as a mounted circuit board. A battery constituting a power supply unit of a gas meter control device, a test switch and a display element for displaying a state are mounted on the back surface of the mounting circuit board, and these parts are mounted on the back of the circuit pattern. Electrically connected to the surface of the mounting circuit board, so that all the components of the configuration of the control device of the gas meter except the seismic sensor for detecting an earthquake are arranged in a predetermined manner, and the circuit pattern Electrically connected to the holder, the seismic sensor is mounted on a holder main body constituting a holder, and electrically connected to the circuit pattern, and the mounting circuit board is housed in the holder main body. Frame, and inserted into the frame such that the surface of the mounting circuit board on which the components are mounted faces inward, and is formed by the frame, the holder body, and the mounting circuit board. A gas meter in which a space is filled with a molten potting resin and the potting resin is cured to fix the holder and the mounting circuit board.

In order to achieve the above object, the invention according to claim 18 is directed to a circuit board in which a circuit pattern is formed on a front surface which is one plate surface and a circuit pattern is formed on a back surface which is the other plate surface. Using a thing that is not, on the surface, a reed switch and a flow rate input circuit for measuring the gas flow rate constituting a control device of the gas meter,
A circuit for measuring gas pressure, a circuit for shutting off gas flow, a circuit for generating an alarm when a gas leak occurs,
A circuit for inputting a signal from the seismic sensor, a voltage monitoring circuit for monitoring the voltage of the power supply unit, a microcomputer unit for controlling each of these circuits, a test switch unit for testing the microcomputer unit, and the gas meter A display unit for displaying the state of the control device is mounted so as to have a predetermined arrangement, and is electrically connected to the circuit pattern. A holder main body mounted on a switch and a display element for displaying a state, electrically connected to the circuit pattern on the surface, and having a flat shape and on which a seismic sensor for detecting an earthquake is mounted; and a holder main body. A holder comprising a frame disposed thereon, wherein each component mounted on a surface of the mounting circuit board is inserted into the frame, and the mounting circuit board is mounted in the frame. The potting resin melted in a space formed by a surface filling, by curing the potting resin, a gas meter which is fixed to the mounting circuit board and the holder.

According to the seventeenth aspect of the present invention, the board area of the mounted circuit board can be reduced to about の of the conventional device, the moisture resistance of the mounted circuit board is enhanced, and The mechanical strength of the circuit board and the electronic components mounted on the board is increased, and even in the case of automation, a series of work is completed, which is economically advantageous. No need to worry about corrosion.

To achieve the above object, an invention according to claim 19 is to connect a power switch section in series to a connection section between the electrode of the battery and a circuit pattern formed on the surface of the mounting circuit board. 19. The gas meter according to claim 17, wherein the power switch is turned on after the battery is connected to the circuit pattern.

According to the nineteenth aspect of the present invention, since the power switch unit is provided, the rise of the power when the battery is mounted is stabilized.

In order to achieve the above object, an invention according to claim 20 is that the reed switch is housed in a frame of the holder, a housing having a bottom is provided, and the reed switch is inserted into the housing. Filled with the molten potting resin in the state as described above, a plurality of insulating partition walls are formed in the frame of the holder, and a plurality of slits formed on the mounting circuit board are fitted into the respective insulating partition walls. 20. A conductive pin for electrically connecting an external device between said insulating partition walls and between said frame and said insulating partition walls, and said conductive pin is erected on said holder body.
8 is a gas meter according to 8.

In order to achieve the above object, the invention corresponding to claim 21 is the gas meter according to claim 20, wherein a potting resin is filled in a frame of the holder.

According to a second aspect of the present invention, in order to achieve the above object, the height of the frame of the holder is set to be larger than the thickness of a protective layer formed in a state where all the electronic components are mounted on the circuit board. 21. The gas meter according to claim 20, which is configured to be high.

According to a twenty-third aspect of the present invention, in order to achieve the above object, the holder is made of a synthetic resin or a metal material. 3. A bush comprising an object.
0 is a gas meter. According to the inventions corresponding to claims 20 to 23, since the spacing between the conductive pins (connection pins) is made larger than before, there is sufficient resistance to insulation deterioration, and the outer peripheral portion of the reed switch is made of potting resin. , There is no need to worry about corrosion of the terminal portion (lead wire portion) of the reed switch, which has conventionally been a problem.

[0063]

DESCRIPTION OF THE PREFERRED EMBODIMENTS <First to Seventh Embodiments>
An embodiment of the present invention will be described with reference to the drawings. First, FIG. 1 outlines the present invention. FIG.
In the figure, reference numeral 01 denotes an electronic component mounting circuit board on which a wiring pattern is formed, for example, made of the same printed circuit board made of glass epoxy or the like as the conventional one, and reference numeral 08 shows the same connection terminal for the same resistor, capacitor, etc. ), And 10 is the same connection terminal 10a as in the prior art.
And discrete components such as microcomputers having

Reference numeral 010 denotes a protective sheet selected from glass fibers, ceramic fibers, and urethane-based fibers having a soft resin permeability, or urethane-based fibers described later.
Either a protective sheet 017 (FIG. 8) formed of the same resin as the coating resin selected from rubber or acrylic is used.

As the coating resin for impregnating the protective sheets 010, 017, urethane-based, rubber-based,
Use a coating resin selected from acrylics. As described above, at least one of the chip component 08 having the connection terminal and the discrete component 10 having the connection terminal 10a is mounted on the substrate 01, and the chip component 08 and the discrete component are mounted on the wiring pattern formed on the substrate 01. In the electronic component mounting board device in which at least one of the connection terminals is electrically connected, a portion to be protected from a corrosive atmosphere such as the wiring pattern and the connection terminal electrically connected to the wiring pattern. And a protective sheet 010 or 017 and a protective layer made of a coating resin obtained by impregnating and curing the protective sheet 010 or 017.

In order to manufacture the electronic component mounting board device described above, for example, the protection sheet 010 is attached to the chip component 0 shown in FIG.
When the liquid coating resin is sprayed on the protective sheet 010 by a spray means (not shown) in a state where the protective resin 8 and the entire discrete component 10 are covered, the coating resin flows onto the substrate 01 through the protective sheet and the mesh of the protective sheet. The space between the protective sheet, the mounted components and the substrate 01 is filled by capillary action and the surface tension of the coating resin.

Then, as shown in FIG.
Reference numeral 10 denotes the viscosity of the coating resin, which is in close contact with the substrate 01 and the components 08 and 010. In this state, the protective sheet 0
By heating and drying the surface of 10, a strong protective layer can be formed on the substrate 01. This allows a much thicker protective layer 011 to be formed than without the protective sheet 010.

Further, as shown in FIG. 2, a feature is that even the tip of the connection terminal 10a of the discrete component 10 can be covered with the protective sheet 010 sufficiently impregnated with the coating resin 011. Further, since a coating resin having a low viscosity can be used, conventional coating equipment such as spraying means can be used as it is.

Of course, the protective sheet 01 used here
As 0, the size of the mesh of the protection sheet 010 is sufficiently smaller than the outer dimensions of the connection terminal 10a so that the tip of the connection terminal 10a does not protrude from the mesh of the protection sheet 010.

FIGS. 2A, 2B and 2C respectively show the discrete component 10 of the electronic component mounting board device of FIG.
FIG. 3 is a front sectional view, a plan view, and a side sectional view showing only the substrate and the substrate 01.

FIG. 2 does not show the chip component 08, but is entirely covered with a protective sheet 010 and a protective sheet 01.
Needless to say, the protective layer is formed by impregnating the coating resin 011 and hardening it.

FIG. 3 is a view for explaining a case where a protective layer is formed on the upper surface of the discrete component 10 of FIG. 1 in the same manner as described above. FIGS. 3 (a), (b) and (c) , Each of the discrete components 1 of the electronic component mounting board device of FIG.
FIG. 4 is a front sectional view, a plan view, and a side sectional view showing only a reference numeral 0 and a substrate 01. In this case, a notch 012a is formed at a peripheral portion of the protective sheet 012, for example, at a corner, and the cutout 012a is placed on the upper surface of the discrete component 10, so that the protective sheet 012 does not become slack even with a high component.

For this reason, tall parts can be economically and simply and reliably coated even by spraying the coating resin onto the protective sheet 012. Further, since a coating resin having a low viscosity can be used, conventional coating equipment such as spraying means can be used as it is.

Further, by covering the board-mounted components with the protective sheet 012 and impregnating a sufficient amount of the coating resin, there is also an advantage that the circuit components and the wiring pattern of the board can be protected against a slight impact or vibration. is there.

FIG. 4 is a diagram for explaining the relationship between the vibrator 17 and the substrate 01, which are examples of discrete components of the electronic component mounting board device of FIG.
(C) is a bottom view, a front sectional view, and a side sectional view.

In this case, the connection terminals 17 of the vibrator 17
The protective sheet 018 is placed only on the portion where a protrudes from the substrate 01 (the portion soldered to the wiring pattern of the substrate 01),
As described above, the protective sheet 018 is sprayed with the coating resin 011 by a spray means, and dried and cured to form a protective layer.

FIG. 5 shows a case of an electronic component mounting board device provided with a discrete component and a chip component 08 as shown in FIG. 1. In this case, the discrete component and the chip component 08 are covered with protective sheets 019 and 014, respectively. Holes (holes of the size equivalent to discrete parts) 0
13a is covered with the protective sheet 013 on which the protective resin 13a is formed.
FIG. 3 is a perspective view for explaining a state in which is heated and dried in a state where is sprayed on a spray means and impregnated. FIG.
For the entire discrete component 10 and chip component 08
Many identical protective sheets 015 are stacked, and each protective sheet 0
FIG. 15 is a side view for explaining that a coating resin 011 is sprayed by a spray means at 15 and then dried and cured to form a protective layer.

This case is suitable when the protective layer is to be made as thick as possible.

FIG. 7 is an enlarged view of the protective sheet 016 and shows an example of plain weave. Of course, the weave can be any kind of weave, such as a brocade or a satin weave, as long as the original function can be satisfied. The protective sheet is made of a material woven from fibers such as cloth, or a material that easily absorbs and retains the coating resin, such as paper or non-woven fabric. Although it is necessary to make the outer dimensions smaller than the above, there is no particular limitation.

FIG. 8 shows that the protective sheet 017 is selected from urethane type, rubber type and acrylic type, and is used to form a large number of small holes 017a.
FIG. 9 is a perspective view showing an example in which a component having a size smaller than the external dimensions of the connection terminal of the component is used. In this case, the coating resin is sprayed with a liquid of the same material as that of the protective sheet by a spray means, and the hole 0
17a is filled with a coating resin.

By forming a large number of small holes 017a in the protective sheet 017 in this manner, the coating resin flows to the substrate side through the holes 017a to obtain the same effect.

<Eighth Embodiment> An eighth embodiment will be described with reference to FIGS. Hereinafter, description will be made with reference to the drawings. FIG. 9 is an exploded perspective view showing a gas meter control device 24 according to an eighth embodiment of the present invention.
Denotes an electronic component mounting board (hereinafter simply referred to as a board),
Pins 32 for electrically connecting the microcomputer 10 and respective components described later are mounted on the board 31. Further, although not shown in FIG. 9, the vibrator 18 constituting the control unit 24 of FIG. , Voltage drop determination circuit 15, flow rate pulse input circuit 9, shutoff valve I / O circuit 12, seismic sensor input circuit 7,
Pressure sensor input circuit 5, light emitting diode (LED) 21
a, a test switch 3, and a gas leak alarm input circuit 4 are mounted. Further, two lead portion insertion holes 31a are formed in the substrate 31 so that a lead portion 36b of a reed switch 36 of the flow rate detection device described later can be inserted.
The size of the lead portion insertion hole 31a formed in the substrate 31 is slightly larger than the diameter of the lead portion 36b.

The reed switch 36 has a main body portion 36a comprising a contact for electrically contacting and separating and a container for accommodating the contact.
And left and right lead portions 36b electrically connected to the contact points.
It consists of

Reference numeral 33 denotes a holder (bracket) made of, for example, synthetic resin, a box-shaped portion 33A having a rectangular frame and a bottom plate for accommodating the substrate 31, and a large-sized portion on which the battery 14 and the seismic sensor 8 are mounted. Component mounting surface 33B and limit switch 3
6, a switch mounting portion 33C having a space so that most of the main body portion 36a and the lead portion 36b can be embedded, and a screw insertion hole 33D for mounting the entire device to a building.
The attachment part 33D in which a is formed is integrally formed. Two through holes 33Aa for penetrating the lead portion 36b of the reed switch 36 are formed in the bottom surface of the box-shaped portion 33A, and the inside bottom surface of the box-shaped portion 33A of the through hole 33Aa and the through hole 33Aa. A raised portion having a predetermined height is formed around the periphery.

FIG. 10 is a cross-sectional view for explaining the substrate 31 and the holder 33 described above, and FIG. 10A is a longitudinal cross-sectional view for explaining a disassembled state thereof. (B) is a longitudinal sectional view for explaining a state in which these are assembled. The diameter of the through hole 33 a for penetrating the lead portion 36 b of the reed switch 36 formed on the bottom surface of the holder 33 is substantially the same as the diameter of the lead portion 36 b of the reed switch 36. .

The substrate 31 having such a structure and the holder 33
In order to assemble the reed switch 36, the following may be performed. In the through hole of the substrate 31, the microcomputer 10
The terminal and the pin 32 are inserted as shown in FIG. 10 (a) and soldered to the circuit pattern. Further, all the parts except the battery 14, the seismic sensor 8 and the microcomputer 10 of the control device 24 shown in FIG. Each is mounted on the substrate 31.

Next, the large component mounting surface 33 of the holder 33
B, the battery 14 and the seismic sensor 8 are mounted. The board 31 on which the components are mounted as described above is inserted into the box-shaped portion 33A of the holder 33, and the board 31 is placed on the raised portion formed around the through hole 33Aa, Also, the lead switch 36 is inserted into the switch mounting portion 33C of the holder 33, and the lead portion 3 is inserted into the through hole 33Aa of the box-shaped portion 33A.
6a and the end of the lead portion 36a is
The lead 36a and the circuit pattern of the substrate 31 are fixed by soldering in a state of being inserted through the lead insertion hole 31a.

In this state, the previously melted coating resin is applied from above the substrate 31 to the box-like portion 33A of the holder 33.
, The coating resin flows into the space on the bottom side of the box-shaped portion 33A below the substrate 31 from the gap formed between the inner surface of the box-shaped portion 33A and the peripheral edge of the substrate 31. When the space on the bottom surface side is filled with the coating resin, and the upper portion of the substrate 31 is almost completely filled with the coating resin (the height at which the lid 38 is placed), the injection of the coating resin is stopped. The protective resin 37 is formed around the substrate 31 by hardening the coating resin using, for example, forced drying means or by natural drying. And FIG.
As shown in FIG. 1B, the cover 38 is placed from the upper surface of the protective layer 37, and the tips of the pins 32 project from pin holes (not shown) formed in the cover 38.

According to the eighth embodiment configured as described above, the following operation and effect can be obtained.

(1) Since the large components such as the battery 14 and the seismic sensor 8 are arranged outside the substrate 31, the size of the substrate 31 can be reduced. This is because, when a large component is mounted on the circuit board 31, other electronic components cannot be mounted on the mounting portion of the component, so that the mounting area can be effectively utilized by disposing the component separately.

(2) Since the entire substrate 31 is covered with the protective layer 37 made of a coating resin, the moisture resistance is remarkably improved as compared with the conventional gas meter control device, and the impact and vibration during transportation are improved. Also, the circuit components mounted on the substrate 31 and the wiring patterns formed on the substrate 31 can be protected.

(3) The diameter of the through hole 33a formed on the bottom surface of the holder 33 for penetrating the lead portion 36b of the reed switch 36 is substantially the same as the diameter of the lead portion of the reed switch 36, and The size of the lead insertion hole 31a formed in the substrate 31 is
Since the substrate 1 is formed slightly larger than the diameter thereof, the substrate 1 can be smoothly overlapped when the substrate 1 is stored in the holder 33, and even when the coating resin is poured into the holder 33, the lead insertion holes 31a are formed. The coating resin does not leak out of the holder 33 from the outside.

In addition, instead of connecting directly from the circuit board 31 to the shut-off valve and the pressure sensor by a lead wire as in the prior art, connection pins (lead members) are provided on the circuit board in order to improve coating workability. After coating, this pin may be connected to the battery and the seismic sensor by a lead wire after coating.

The present invention can provide a control device for a gas meter which has a simple structure as described above and can sufficiently exert a coating effect. Further, since the entire substrate 31 is surrounded by the protective layer formed of the coating resin, the material of the substrate can be changed from glass epoxy to an inexpensive material such as paper phenol, and the cost can be further reduced. Such an effect can also be obtained. Furthermore, by covering the board-mounted components and impregnating with a sufficient amount of the coating resin, there is an advantage that the circuit components and the board wiring pattern can be protected against shock and vibration during transportation.

<Ninth Embodiment> FIG. 11 is an exploded perspective view showing a ninth embodiment of a control device for a gas meter, which is different from the embodiments shown in FIGS.
1, a protective layer 38 is formed in advance with a coating resin or a mold resin, and the substrate 31 wrapped with the protective layer 38 is mounted on a holder 33.

At this time, a pin (or a lead member made of any of lead wires) set up on the circuit board portion in advance is different from the flow detection reed switch in the box-shaped portion 33A of the holder 33. Through hole 33Aa formed in bottom surface
, And electrically connected to the lead wire portion 36b of the reed switch 36 by soldering or the like.

In this case, although not shown, the box-shaped portion 33A may be provided with a lid for more securely holding the substrate 31.
This lid may be a small lid that does not allow the circuit board section to fall, or may be a large lid that covers the entire circuit board section.

Further, the material of the holder 33 is not limited to an insulating material such as a synthetic resin, but may be a metal made of aluminum die cast, for example. It is sufficient to provide an insulating bush or the like made of a synthetic resin only in a portion, and even in such a case, the same effect as in the above-described second embodiment can be obtained.

<Tenth Embodiment> FIGS. 12 to 18 are views for explaining a tenth embodiment, and FIG. 12 is an exploded perspective view showing only a main part of a control device of a gas meter. 13 to 15 are diagrams for explaining the arrangement of each electronic component mounted on the substrate of FIG. 12, FIG. 13 is a diagram showing the front surface of the substrate, FIG. 14 is a diagram showing the rear surface of the substrate, FIG. 15 is a side view of the substrate.

The mounting circuit board 50 is a single-sided mounting type paper phenolic board having a deformed trapezoidal shape, and a plurality of (three in this case) slits 50a are formed at one end in the longitudinal direction. A rectangular notch 50b is formed at each of the corners at both ends of the side edge, and a rectangular deformed edge is formed at the other edge in the longitudinal direction orthogonal to the end side where the slit 50a is formed. A large cutout portion 50c having a shape is formed.

On the mounting circuit board 50, a predetermined circuit pattern (not shown) is printed on the surface on which the electronic components are mounted. Each of the electronic components described below is mounted and electrically connected to the circuit pattern. I have. As shown in FIG. 13, a microcomputer 10a, a crystal oscillator 18a, a ceramic oscillator 18b, and a reed switch 11 are mounted at a substantially central position in the longitudinal direction of the plate surface, and resistors R1 to R1 are provided around these components.
7, diodes D1 and D2, capacitors C1 to C13,
The transistors Q1 to Q4 and the integrated circuits IC1 to IC5 are mounted.

Each of the electronic components described above constitutes each functional unit shown in the block diagram of FIG. The microcomputer unit 10 includes microcomputers 10a, IC3, IC4, IC
5, R13, R14, R15, R16, Q4, D2, C
12, C13. The external alarm input circuit 4 comprises R10 and C3. Pressure sensor input circuit 5
Consists of R8 and C1. The seismic sensor input circuit 7
R9 and C2. The shut-off valve driving circuit is R1,
R2, Q1, Q2, and D1. Oscillator 8
Are the quartz oscillator 8a, the ceramic oscillator 8b, R17,
C8, C9, C10, and C11. The flow pulse input circuit 9 includes R12 and C4. The display unit 21 includes light emitting diodes (LEDs) 21a and R11. The test switch circuit 3 includes a test switch. The power supply unit 140 includes the lithium battery 14,
C5, C6, C7, and C14. The voltage monitoring circuit 15 includes IC2, Q3, R3, R4, R5, R6, R
It consists of seven.

On the other hand, the conventional substrate 4 shown in FIG.
The electronic component is mounted on 0 as shown in FIGS. Specifically, FIGS. 16 and 17 are diagrams for explaining the arrangement configuration of each electronic component, and FIG.
0 shows the back surface, and FIG. 17 shows the front surface of the substrate 40. For comparison with the plate areas of FIGS.
3 to 15 are shown on substantially the same scale.

More specifically, a predetermined circuit pattern (not shown) is printed on the back surface of the substrate 40, and each electronic component is mounted and electrically connected to the circuit pattern as shown in FIG. A predetermined circuit pattern (not shown) is printed on the surface of the electronic component 40, and electronic components are mounted and electrically connected as shown in FIG.

A reed switch 11 in which a reed switch main body 11a is accommodated in a housing 11b is mounted on the rear surface of the substrate 40 at substantially the center of the plate surface. R1, R2, R4, R
5, R6, R10, R11, R12, R13, R14,
The microcomputer 10, the quartz oscillator 18a, and the ceramic oscillator 18 are located at substantially the center in the longitudinal direction of the plate surface including the R15, R16, R17, R18, R19 and the diode D1.
b, a reed switch 11 is mounted, and resistors R1 to R17, a diode D1, and a capacitor C1 to
C13 and transistors Q1 to Q9 are mounted.

Also, on the surface of the substrate 40, the battery 14, the microcomputer 10a, the seismic sensor 8, the crystal oscillator 18a, the aluminum electrolytic capacitor 60, the display unit 21 in which the display element such as the LED 21a is housed in the housing 21b, the test The switch 3 is mounted as shown in FIG.

Each of the conventional electronic components described above constitutes each functional unit shown in the block diagram of FIG. The microcomputer unit 10 includes a microcomputer 10a. The external alarm input circuit 4 includes R12, R13, R14, R1
5, C11, C14, and Q6. The pressure sensor input circuit 5 includes R16, R17, C12, and Q7. The seismic sensor input circuit 7 includes R18, R19, and C1.
3, Q8. Shut-off valve drive circuit R9, R1
0, R11, D1, Q3, Q4, and Q5.
The oscillating circuit includes the crystal oscillator 18a, C7, and C8. The flow pulse input circuit 9 is composed of C9.
The LED display unit 21 includes a light emitting diode (LED) 21
a, Q2 and R6. Test switch circuit 3
Consists of a test switch C10. Power supply unit 1
Reference numeral 40 includes a lithium battery 14, C1 to C6, and R1. The voltage monitoring circuit comprises R2, R4, R5, Q1, I
It consists of C2.

In the mounting circuit board 50, a through hole (not shown) is formed in the substrate 50 on the back surface on which the electronic component is not mounted so that a battery such as the lithium battery 14 can be mounted at the center position. The tabs of the battery 14 can be inserted therein and can be soldered to a circuit pattern on the surface of the substrate 50.

At a position close to the foot of the tab of the battery 14,
A power switch unit 55 is formed. The power switch unit 55 includes two pins 55a and 55b and a short-circuit member (not shown) that short-circuits the pins 55a and 55b after connecting the battery 14 to the substrate 50. The pins 55a and 55b are implanted on the substrate 50, of which the pins 55a are electrically connected to the tabs of the battery 14, and the remaining pins 55b are electrically connected to the circuit pattern.

Since the power switch unit 55 having such a configuration is provided, after the battery 14 is connected to the substrate 50, the pins 55a and 55b are short-circuited by a short-circuit member, so that the circuit power can be smoothly turned on. Can be.

On the back surface of the substrate 50, the slit 50a
A plurality (four in this case) of connection pins 51 are erected at regular intervals from each other at the end on the side where the connection pins 51 are formed, and a harness connector is provided near the connection pins 51. 52 is mounted, and is electrically connected to the reed switch 11.

The test switch 3 and the LED 21a having an L-shaped terminal are mounted on the back surface of the substrate 50, at the corner on the side where the notch 50b is formed and on the opposite side to the notch 50b. These terminals are electrically connected to a circuit pattern on the surface of the substrate 50.

The holder 53 has, for example, a mounting portion 53a for screwing into the upper case 19B shown in FIG.
It has a flat holder main body 53a for supporting the seismic sensor 8 and a frame (pan) 54 formed integrally with the holder main body 53a and for mounting and fixing the substrate 50 thereon, as described above. In addition, a substrate 50 having a shape in which two notches 50b and a large notch 50c are formed can be supported without any gap. The frame 54 has a plurality of insulating partition plates 54a so that a plurality of slits 50a formed at one end of the substrate 50 fit therein, and can accommodate the reed switch 11a and can be filled with a potting resin. A housing 54d having a bottom is provided. Further, a terminal supporting portion 54b for supporting an L-shaped terminal of the LED 21a is provided at an upper portion of the frame 54, and a cutout portion 50b of the substrate 50 is provided at one corner of the frame 54. Notch contact portions 54c, 54c and 54e with which 50c contacts are formed.

The potting resin is filled in the frame 54 of the holder 53, not only in the housing 54d in which the reed switch 11 is stored, but also in the other portion in which the front side of the substrate 50 is stored. .

The height of the frame 54 of the holder 53 is higher than the thickness of the protective layer formed in a state where the electronic components are all mounted on the circuit board 50.

Further, the holder 53 is made of a synthetic resin or a metal material. When the holder 53 is made of the metal material, a bush (not shown) made of an insulating material is provided at a portion required for electrical insulation.
Is to be installed.

According to the tenth embodiment described above, the following operation and effect can be obtained.

[0118] 1. A comparison between the mounted circuit board 50 of the present embodiment shown in FIGS. 13 to 15 and the conventional mounted circuit board 40 shown in FIGS. 16 and 17 shows that even if the mounted circuit board 50 is of a single-sided use type, For specific reasons, the board area can be reduced to about half that of the conventional device. This is apparent from a comparison of FIGS. 13 to 15 with FIGS.

(1) Since the vibration sensor 8 is arranged outside the mounting circuit board 50 and on the holder 53, a space for mounting components on the board 50 can be secured.

(2) The conventional example shown in FIG. 19 (a method in which the substrate 40 is attached to the holder 44) by placing the substrate 50 in a frame (dish) 54 of the holder 53 and bonding and fixing it with a potting material (not shown). Are formed in the square holes 40 a formed in the four corners of the substrate 40, and the claws 44 formed in the four corners of the holder 44.
(a method of inserting and engaging a) can provide more space for mounting components on the board 50.

(3) Test switch 3 and LED 21a
The reed switch 11 is directly mounted on a portion of the substrate 50 where the circuit pattern is not formed, specifically, on the back surface of the substrate 50 and on the front surface of the substrate 50 and the edge of the substrate 50. Therefore, a space for mounting components can be secured.

(4) Since the size of the chip component mounted on the surface of the substrate 50 can be reduced, the pad size for soldering the chip component formed on the surface of the substrate 50 can be reduced, so that As a result, more component mounting space can be secured.

(5) By eliminating test pads and through holes, more component mounting space can be secured.

[0124] 2. Since the mounting circuit board 50 of the present embodiment is of a single-sided use type, there is no need to form a through hole. Therefore, the dimensional accuracy of the board is not required as compared with the conventional double-sided use type. Instead, a paper phenol single-sided substrate can be used, and even in the case of automation, a series of operations is completed, which is economically advantageous.

[0125] 3. When the battery is mounted, the power supply rises to a stable state. That is, conventionally, the mounting circuit board 4
When the battery 14 is mounted on the battery 0, the tab of the battery 14
Are inserted into through holes formed in the substrate 40, and then soldering is performed. However, in this method, when the tab feet are first inserted, the tab feet dimensions do not make electrical contact due to the relationship of the circuit pattern dimensions and the like, resulting in an unstable state, so that the circuit power supply rises smoothly. Therefore, there was a problem that the circuit did not start well. On the other hand, in the present embodiment, the power switch unit 55 is provided in series with the battery 14,
By connecting this switch after the battery 14 is connected to the substrate 50, the circuit power supply can be smoothly turned on.

4. When assembling the control device of the gas meter, the moisture resistance of the mounted circuit board 50 is enhanced for the following reasons, the mechanical strength of the mounted circuit board 50 and the electronic components mounted on the board 50 are increased, and the reed switch is also mounted. There is no need to worry about corrosion of the terminal part (lead wire part).

(1) The component mounting surface (the side with the wiring pattern) of the substrate 50 is placed downward on the frame 54 of the holder 53, and the reed switch 11 is fixed in the frame 54 and in the housing 54d having a bottom. Then, the slit 50a formed in the substrate 50 is fitted into the insulating partition plate portion 54a formed in the frame 54, and a molten potting resin (not shown) is injected into the frame 54, and the potting resin is injected. The potting resin is cured so as to cover the upper portion of the substrate, and the potting resin is hardened. Therefore, the microcomputer 50 mounted on the substrate 50, the crystal oscillator, the ceramic oscillator, various capacitors, various resistors, etc., as well as the substrate 50
Since the frame 54 of the holder 53 is firmly fixed and the entire electronic component and the substrate 50 are surrounded by the potting resin, the moisture resistance is enhanced. With such a configuration, the fixing between the conventional substrate 40 and the holder 44 is performed by using the holder 44.
It is not necessary to insert and engage the plurality of claws 44a formed on the substrate 40 with the plurality of square holes 40a formed on the substrate 40, respectively.

(2) The connection pins 51 are formed between the insulating partition plates 54a formed in the frame 54 and are surrounded by the frame 54, and the connection pins 51 and the harness connector 52 are spaced from each other. (Dimension distance) is made larger than before, so that it has a sufficient resistance to insulation deterioration.

(3) Since the outer peripheral portion of the reed switch 11 is covered with the potting resin, there is no concern about corrosion of the terminal portion (lead wire portion) of the reed switch 11 which has conventionally been a problem.

<Modifications> The present invention is not limited to the above-described embodiment, and may be, for example, as follows. In the above-described embodiment, the case where the protective layer is formed in a state in which the components are mounted on the electronic component mounting board for each control unit of one electronic component mounting board device, for example, one gas meter has been described. The control means of a plurality of electronic component mounting board devices, for example, a gas meter, may be applied to an automatic manufacturing line for manufacturing at the same time, and the protective layer damage may be formed simultaneously for each of the plurality of control means.

Further, the control device of the gas meter has been described as an example of the electronic component mounting board device. However, the present invention is not limited to this, and the electronic component mounting board device for controlling the flow rate of the fluid having a portion to be protected from corrosive atmospheres It goes without saying that anything can be used.

Further, in the above-described embodiment, the case where the coating resin is impregnated into the protective sheet or the like by spraying has been described. However, a protective sheet impregnated with the coating resin is prepared in advance, and the protective sheet is impregnated with the substrate. 01 may be attached to a necessary portion and then dried.

When the gas meter is configured as shown in the block diagram of FIG. 20, the display unit 21, the test switch 3, the reed switch 11, the lithium battery 1
Except for the conventional method, the whole of the components mounted on the substrate 01 except for the above-described example 4 is covered with the above-described protective sheet, the protective sheet is impregnated with a coating resin, and the coating resin is cured to form a protective layer. A gas meter that can solve all the problems described in the technology can be obtained.

Further, in the above-mentioned embodiment, a material selected from urethane-based, rubber-based, and acrylic-based resins is used as the protection sheet, and the same material as the protection sheet is used as the coding resin. As described above, the protective sheet is selected from urethane-based, rubber-based, and acrylic-based resins, and the coding resin is selected from urethane-based, rubber-based, and acrylic-based resins different from the protective sheet. You may use what was chosen from.

Further, the reed switch for measuring the flow rate of the fluid in the above-described embodiment may use a Hall element as in the case of a water meter.

[0136]

According to the present invention described above, a high-reliability electronic component mounting board apparatus and a high-operability electronic component mounting board capable of reliably forming a protective layer on any chip component or discrete component. An apparatus manufacturing method can be provided. Further, according to the present invention, it is possible to provide a gas meter that is a single-sided mounting type as a mounting substrate, can reduce the area, can stabilize the rise of a power supply when mounting a battery, and can enhance the moisture resistance of the mounting substrate.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view for explaining an outline of the present invention.

FIG. 2 is a diagram for explaining the first embodiment of the present invention.

FIG. 3 is a diagram for explaining a second embodiment of the present invention.

FIG. 4 is a view for explaining a third embodiment of the present invention.

FIG. 5 is a diagram for explaining a fourth embodiment of the present invention.

FIG. 6 is a view for explaining a fifth embodiment of the present invention.

FIG. 7 is a view for explaining a sixth embodiment of the present invention.

FIG. 8 is a view for explaining a seventh embodiment of the present invention.

FIG. 9 is an exploded perspective view for explaining an eighth embodiment of the present invention.

FIG. 10 is a longitudinal sectional view for explaining the relationship among the reed switch, circuit board, and holder of FIG. 9;

FIG. 11 is an exploded perspective view for explaining a ninth embodiment of the present invention.

FIG. 12 is an exploded perspective view for explaining a tenth embodiment of the present invention.

FIG. 13 is a diagram illustrating a configuration of the upper surface of the substrate in FIG. 12;

FIG. 14 is a view for explaining the configuration of the lower surface of the substrate in FIG. 12;

FIG. 15 is a diagram illustrating a configuration of a side surface of the substrate of FIG. 12;

FIG. 16 is a view for explaining the upper surface of the conventional substrate of FIG. 22, and is shown on substantially the same scale as FIG. 13 for comparison with FIG. 13;

FIG. 17 is a view for explaining the lower surface of the conventional substrate of FIG. 22, and is shown on substantially the same scale as FIG. 13 for comparison with FIG. 13;

FIG. 18 is a perspective view showing a configuration of a gas meter to which the present invention is applied.

19 is an exploded perspective view of FIG.

FIG. 20 is a block diagram showing the overall configuration of the gas meter shown in FIG. 18;

FIG. 21 is a view for explaining a problem of a conventional electronic component mounting board device.

FIG. 22 is an exploded perspective view illustrating an example of a conventional gas meter control device.

FIG. 23 is a view for explaining the relationship among the reed switch, circuit board, and holder of FIG. 22;

[Explanation of symbols]

01: Electronic component mounting board 08: Chip component 10: Microcomputer (microcomputer) having connection terminal 10a 010: Protective sheet 011: Coating resin 31: Electronic component mounting circuit board 32: Pin 33: Holder 36: Reed switch

Claims (23)

[Claims] At least one of a chip component having connection terminals and a discrete component having connection terminals is mounted on an electronic component mounting board, and the chip component is mounted on a wiring pattern formed on the electronic component mounting substrate. In an electronic component mounting board device in which at least one connection terminal of a discrete component is electrically connected, the wiring pattern and a connection terminal electrically connected to the wiring pattern should be protected from corrosive atmosphere. In the part,
An electronic component mounting board device comprising: a protective sheet having a flexible resin permeability; and a protective layer made of a coating resin obtained by impregnating and curing the protective sheet. 2. The protection sheet is selected from glass fiber, ceramic fiber, and urethane fiber, and the coating resin is urethane, rubber,
2. The electronic component mounting board device according to claim 1, wherein the electronic component mounting board device is selected from acrylic. 3. The protection sheet is selected from urethane-based, rubber-based, and acrylic-based, and is used to form a large number of small holes. 2. The electronic component mounting board device according to claim 1, wherein the sheet is formed so as to be smaller than the outer dimensions of the electronic component mounting board, and the coating resin is selected from urethane, rubber, and acrylic. 4. The electronic component according to claim 1, wherein the protective sheet has a notch formed in a peripheral portion thereof so as not to be loosened when the component is placed on the component. Mounting board device. 5. A control device including at least a large electronic component comprising a battery and comprising a plurality of electronic components for controlling a flow rate of a fluid, wherein all of the electronic components except the large electronic component are mounted on a component mounting surface. An electronic component mounting circuit board that is arranged and electrically connected to each component by a wiring pattern, a lead wire can be inserted and electrically connected to the wiring pattern, and the circuit board can be housed and the lead wire is A box-shaped portion having a through hole that can be inserted, a component mounting portion for mounting the large-sized electronic component, and a switch element such as a reed switch for measuring the flow rate of the fluid are mounted on the bottom side of the box-shaped portion. A holder having a mounting part, the circuit board is housed in a box-shaped part of the holder, the switch element is mounted on the mounting part, and a lead wire of the switch element is inserted into a through hole of the box-shaped part. Through the times A protective layer formed so as to surround the circuit board by pouring a molten coating resin into the box-shaped portion in a state where the coating resin is welded to the circuit board by being inserted into the circuit board, and curing the coating resin. An electronic component mounting board device comprising: 6. A method according to claim 6, wherein pins are implanted on the circuit board in a state where no protective layer is formed, and after the protective layer is formed, the circuit board and the large-sized board are mounted without mounting a lead wire or a connector. 6. The electronic component mounting board device according to claim 5, wherein the electrical connection of the electronic component is performed by the pins. 7. The device according to claim 5, wherein the height of the box-shaped portion of the holder is higher than the thickness of a protective layer formed in a state where electronic components are all mounted on the circuit board. Electronic component mounting board device. 8. The size of a through hole formed in the box-shaped portion of the holder is substantially equal to the diameter of the lead wire of the switch element, and the lead wire of the switch element formed on the circuit board. 6. The electronic component mounting board device according to claim 5, wherein the diameter of the hole for inserting the through hole is slightly larger than the diameter of the lead wire of the switch element. 9. The holding tool is made of a synthetic resin or a metal material, and when the holding tool is made of a metal material, a bush made of an insulating material is attached to a portion required for electrical insulation. 6. The electronic component mounting board device according to 5. 10. A control device including at least a large electronic component comprising a battery and comprising a plurality of electronic components for controlling a flow rate of a fluid, wherein all of the electronic components except the large electronic component are mounted on a component mounting surface. An electronic component-mounted circuit board comprising a lead member that is arranged and electrically connected to each other by a wiring pattern, and is electrically connectable outside and electrically connected to the wiring pattern; A box-shaped portion capable of housing a circuit board and having a through hole through which the lead member can be inserted, a component mounting portion for mounting the large-sized electronic component, and a reed switch for measuring the flow rate of the fluid. A holder having a mounting portion for mounting the switch element on the bottom side of the box-shaped portion; and a state in which a protective layer is formed on the circuit board by a coating resin so as to surround the circuit board. The control device main body is housed in the box-shaped portion of the holder, and the lead member is protruded to the outside from the through hole of the box-shaped portion so as to be electrically connected to the lead wire of the switch element. An electronic component mounting board device characterized by the above-mentioned. 11. An electronic component mounting board on which at least one of a chip component having connection terminals and a discrete component having connection terminals is mounted, and wherein the chip component is provided on a wiring pattern formed on the electronic component mounting board. After electrically connecting at least one connection terminal of the discrete component, a flexible resin is applied to a portion to be protected from corrosive atmosphere such as the wiring pattern, a connection terminal electrically connected to the wiring pattern, or the like. In a state of being covered with the permeable protective sheet, the coating resin is sprayed by spraying means, thereby curing and protecting the coating resin impregnated in the protective sheet and the coating resin adhered to the electronic component mounting board and the component. A method for manufacturing an electronic component mounting board device in which a layer is formed. 12. At least one of a chip component having a connection terminal and a discrete component having a connection terminal is mounted on an electronic component mounting board, and the chip component is mounted on a wiring pattern formed on the electronic component mounting board. After electrically connecting at least one connection terminal of the discrete component, the wiring pattern, a connection terminal electrically connected to the wiring pattern, and the like to be protected from a corrosive atmosphere by a coating resin. Is impregnated into a flexible permeable protective sheet, and then a protective sheet impregnated or impregnated with the coating resin is applied, and then the coating resin impregnated or impregnated on the protective sheet is cured to form a protective layer. A method of manufacturing an electronic component mounting board device. 13. The method according to claim 11, wherein a plurality of the protective sheets are stacked to form a protective layer. 14. The protective sheet is selected from glass fiber, ceramic fiber, and urethane-based fiber, and the coating resin is urethane-based, rubber-based,
11. An acrylic resin selected from the group consisting of acrylics.
3. The method for manufacturing an electronic component mounting board device according to any one of 3. 15. The protective sheet according to claim 11, wherein a notch is formed in a peripheral portion of the protective sheet so that the protective sheet does not loosen when the component is put on the component. The manufacturing method of the electronic component mounting board device as described in the above. 16. The protection sheet is selected from urethane-based, rubber-based, and acrylic-based, and is used to form a large number of small holes. The electronic device according to any one of claims 11 to 13, wherein the coating resin is formed to be smaller than the external dimensions of the resin, and the coating resin is selected from urethane, rubber, and acrylic. A method for manufacturing a component mounting board device. 17. A mounting circuit board having a circuit pattern formed on a front surface which is one plate surface and having no circuit pattern formed on a back surface which is the other plate surface,
On the back surface of the mounting circuit board, a battery constituting a power supply unit of a gas meter control device, a test switch and a display element for displaying a state are mounted, and these parts are electrically connected to the circuit pattern, On the surface of the mounting circuit board, all components other than the seismic sensor for detecting an earthquake in the configuration of the control device of the gas meter are arranged in a predetermined arrangement, and electrically connected to the circuit pattern, The seismic device is mounted on a holder main body constituting a holder, and electrically connected to the circuit pattern, and a frame for housing the mounting circuit board is fixed to the holder main body. Insert the mounted circuit board on which each component is mounted so that the surface faces inward, and fill the space formed by the frame, the holder body and the mounted circuit board with molten potting resin, The By curing the potting resin, and to fix the mounting circuit board and the retainer gas meter. 18. A mounting circuit board having a circuit pattern formed on a front surface which is one plate surface and having no circuit pattern formed on a back surface which is the other plate surface,
On the surface, a reed switch and a flow rate input circuit for measuring a gas flow rate constituting a control device of the gas meter, a circuit for measuring a gas pressure, a circuit for shutting off a gas flow, and when a gas leak occurs A circuit for generating an alarm, a circuit for inputting a signal from the seismic sensor, a voltage monitoring circuit for monitoring the voltage of the power supply unit, a microcomputer unit for controlling these circuits, and a test for the microcomputer unit A test switch unit and a display unit for displaying the state of the control device of the gas meter are mounted in a predetermined arrangement, and are electrically connected to the circuit pattern. It is mounted on a battery and a test switch constituting a part and a display element for displaying a state, and is electrically connected to the circuit pattern on the surface, and has a flat plate shape. A holder comprising a holder main body on which a seismic sensor for detecting an earthquake is mounted, and a holder provided on the holder main body, wherein the holder is mounted on the surface of the mounting circuit board in the frame. Each component is inserted, and the space formed by the surface of the mounting circuit board in the frame is filled with a molten potting resin, and the potting resin is cured, so that the mounting circuit board and A gas meter fixed to the holder. 19. A power switch unit is connected in series to a connection between an electrode of the battery and a circuit pattern formed on the surface of the mounting circuit board, and the power switch is connected after the battery is connected to the circuit pattern. 19. The gas meter according to claim 17, wherein the section is made conductive. 20. A housing having the bottom in which the reed switch is housed in a frame of the holder, and the molten potting resin is filled in a state where the reed switch is inserted into the housing. In the frame of the holder,
A plurality of insulating partition walls are formed, and a plurality of slits formed on the mounting circuit board are fitted to the respective insulating partition walls, between the respective insulating partition walls and between the frame and the insulating partition wall. The conductive pin for electrically connecting to an external device is planted on the holder main body.
8. The gas meter according to 8. 21. The gas meter according to claim 20, wherein a potting resin is filled in a frame of the holder. 22. The gas meter according to claim 20, wherein a height of a frame of the holder is higher than a thickness of a protective layer formed in a state where electronic components are all mounted on the circuit board. 23. The holding tool is made of a synthetic resin or a metal material, and when the holding tool is made of a metal material, a bush made of an insulating material is attached to a portion required for electrical insulation. 20. The gas meter according to 20.