JPH11221682A - Method and device for ultrasonic joining of metallic foil - Google Patents
Method and device for ultrasonic joining of metallic foilInfo
- Publication number
- JPH11221682A JPH11221682A JP10026023A JP2602398A JPH11221682A JP H11221682 A JPH11221682 A JP H11221682A JP 10026023 A JP10026023 A JP 10026023A JP 2602398 A JP2602398 A JP 2602398A JP H11221682 A JPH11221682 A JP H11221682A
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- anvil
- ultrasonic
- metal
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/531—Electrode connections inside a battery casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M6/00—Primary cells; Manufacture thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、アンビルと超音波
ホーンにより金属箔と金属板を溶接するための金属箔の
超音波接合方法および装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for ultrasonically joining metal foils to a metal foil for welding a metal foil to a metal plate using an anvil and an ultrasonic horn.
【０００２】[0002]
【従来の技術】例えば、リチウムイオン電池のような二
次電池を製造する際、アルミニウム箔または銅箔等の金
属箔に活物質を設けることにより、正極板および負極板
（以下、集電体という）が形成された後、この集電体に
短冊状の金属リード（ニッケル板またはアルミニウム板
等）が溶接されている。2. Description of the Related Art For example, when a secondary battery such as a lithium ion battery is manufactured, a positive electrode plate and a negative electrode plate (hereinafter referred to as a current collector) are provided by providing an active material on a metal foil such as an aluminum foil or a copper foil. ) Is formed, a strip-shaped metal lead (a nickel plate, an aluminum plate, or the like) is welded to the current collector.
【０００３】この場合、集電体に金属リードを溶接する
ために、超音波ホーンが広範に使用されている。すなわ
ち、アンビルの加工面上に集電体と金属リードとを重ね
合わせて載置し、この集電体とこの金属リードとの重ね
合わせ部位を、超音波ホーンの加工面で加圧しながら超
音波振動を付与して溶接するものである。In this case, an ultrasonic horn is widely used for welding a metal lead to a current collector. That is, the current collector and the metal lead are placed on the processed surface of the anvil in a superposed manner, and the superposed portion of the current collector and the metal lead is pressed while being pressed by the ultrasonic horn processed surface. Welding is performed by applying vibration.
【０００４】ところで、金属リードが集電体上で滑り易
いため、超音波ホーンの加圧力が弱いと、前記金属リー
ドが前記集電体上で位置ずれを生じた状態で溶接されて
しまうという不具合がある。そこで、特開平７−１０５
９４６号公報に開示されているように、アンビルの加工
面に細かい凹凸部が多数設けられる一方、超音波ホーン
の加工面に、集電体の露出部分と合致する大きさの方形
であって複数の凸部が間隔をおいて一列に配置され、か
つその各凸部表面に細かい凹凸部が多数設けられ、前記
アンビルと前記超音波ホーンにより溶接を行う電池用極
板の製造方法が知られている。[0004] Incidentally, since the metal lead is easily slipped on the current collector, if the pressing force of the ultrasonic horn is weak, the metal lead is welded in a state where the metal lead is displaced on the current collector. There is. Therefore, Japanese Patent Laid-Open No. 7-105
As disclosed in Japanese Patent No. 946, a large number of fine irregularities are provided on the processing surface of the anvil, while the processing surface of the ultrasonic horn has a plurality of squares each having a size matching the exposed portion of the current collector. There is known a method of manufacturing a battery electrode plate in which a plurality of convex portions are arranged in a row at intervals, and a number of fine irregularities are provided on the surface of each convex portion, and welding is performed by the anvil and the ultrasonic horn. I have.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記の
従来技術では、特に５０μｍ以下の厚さの集電体が用い
られる際に、アンビルの加工面に設けられた凹凸部によ
り前記集電体に破損が惹起され易いという問題がある。However, according to the above-mentioned prior art, when a current collector having a thickness of 50 μm or less is used, the current collector may be damaged by uneven portions provided on a processed surface of the anvil. There is a problem that is easily caused.
【０００６】そこで、特開平６−１５５０５１号公報に
開示されているように、アンビルの加工面がサンドブラ
スト処理された粗面であり、超音波ホーンの加工面が一
定のピッチで加工された凹凸の面であり、前記アンビル
と前記超音波ホーンにより溶接を行う金属箔の超音波接
合方法が知られている。Therefore, as disclosed in Japanese Patent Application Laid-Open No. H6-155051, the processed surface of the anvil is a rough surface subjected to sandblasting, and the processed surface of the ultrasonic horn is formed of irregularities processed at a constant pitch. An ultrasonic bonding method of a metal foil, which is a surface and is welded by the anvil and the ultrasonic horn, is known.
【０００７】ところが、上記の従来技術では、サンドブ
ラスト処理された粗面が２００回〜３００回の溶接作業
により著しく摩耗してしまい、加工面が平滑化してい
く。これにより、溶接条件が溶接を重ねる毎に変化して
しまい、溶接条件範囲が変化する等、所望の溶接作業を
効率的に遂行することができないという問題が指摘され
ている。However, in the above-mentioned prior art, the sandblasted rough surface is significantly worn by 200 to 300 welding operations, and the processed surface is smoothed. As a result, a problem has been pointed out that a desired welding operation cannot be efficiently performed, such as a change in welding conditions every time welding is performed, and a change in the range of welding conditions.
【０００８】本発明は、この種の問題を解決するもので
あり、効率的かつ高品質な溶接作業が遂行されるととも
に、繰り返しの使用にも良好に適用可能な金属箔の超音
波接合方法および装置を提供することを目的とする。SUMMARY OF THE INVENTION The present invention solves this kind of problem, and realizes an ultrasonic bonding method of a metal foil, which can perform an efficient and high-quality welding operation and can be applied well to repeated use. It is intended to provide a device.
【０００９】[0009]
【課題を解決するための手段】前記の課題を解決するた
めに、本発明に係る金属箔の超音波接合方法および装置
では、アンビルの加工面が金属箔の厚さ以下の表面荒さ
を有する平滑加工面に設定されており、この平滑加工面
上に前記金属箔と金属板を重ね合わせて載置した状態
で、一定ピッチで凹凸面が形成された超音波ホーンの加
工面により、前記金属板側から前記アンビル上の該金属
板と前記金属箔との重ね合わせ部位を加圧しながら超音
波振動を付与して溶接する。このため、特に５０μｍ以
下の厚さの金属箔が使用される際にも、アンビルの平滑
加工面により前記金属箔が破損することを確実に阻止す
ることができる。In order to solve the above-mentioned problems, in the ultrasonic bonding method and apparatus for metal foil according to the present invention, the processed surface of the anvil has a smooth surface having a surface roughness equal to or less than the thickness of the metal foil. In the state where the metal foil and the metal plate are superimposed and placed on the smooth processing surface, the processing surface of the ultrasonic horn in which the uneven surface is formed at a constant pitch is set on the processing surface. Ultrasonic vibration is applied and welded while pressurizing the overlapping portion of the metal plate and the metal foil on the anvil from the side. Therefore, even when a metal foil having a thickness of 50 μm or less is used, it is possible to reliably prevent the metal foil from being damaged by the smooth processed surface of the anvil.
【００１０】さらに、アンビルの加工面に凹凸部やサン
ドブラスト面が設けられる場合に比べて、アンビルの平
滑加工面の表面状態が変化し難く、しかも超音波ホーン
の加工面に付与される圧力が均一化する。従って、溶接
条件範囲の変化を抑えるとともに、超音波ホーンやアン
ビルの偏摩耗を阻止し、安定した溶接作業および繰り返
しの使用に適する。また、平滑加工面を有するアンビル
では、製造コストが有効に削減され、設備費の高騰を抑
えることが可能になる。[0010] Furthermore, the surface condition of the smooth machined surface of the anvil is less likely to change and the pressure applied to the machined surface of the ultrasonic horn is uniform as compared with the case where the uneven surface or the sand blast surface is provided on the machined surface of the anvil. Become Therefore, while suppressing the change in the range of welding conditions, it prevents uneven wear of the ultrasonic horn and the anvil, and is suitable for stable welding work and repeated use. Further, in the case of an anvil having a smooth processed surface, manufacturing costs can be effectively reduced, and a rise in equipment costs can be suppressed.
【００１１】さらにまた、超音波ホーンにより金属板と
金属箔との重ね合わせ部位を加圧しながら超音波振動を
付与して溶接する際、前記金属箔を押圧保持する押さえ
部材を備えている。このため、アンビルの平滑加工面と
金属箔との滑りを確実に防止し、一層安定した溶接作業
が遂行される。Further, a pressing member is provided for pressing and holding the metal foil when welding is performed by applying ultrasonic vibration while applying pressure to the overlapped portion of the metal plate and the metal foil by the ultrasonic horn. Therefore, slippage between the smoothed surface of the anvil and the metal foil is reliably prevented, and a more stable welding operation is performed.
【００１２】[0012]
【発明の実施の形態】図１は、本発明の第１の実施形態
に係る金属箔の超音波接合方法を実施するための超音波
接合装置１０の概略斜視説明図である。この超音波接合
装置１０は、金属箔１２の所定の位置に金属リード（金
属板）１４を溶接するものであり、第１の実施形態で
は、前記金属箔１２が厚さ１７μｍの銅箔で構成され、
前記金属リード１４が厚さ１００μｍのニッケル板で構
成される。FIG. 1 is a schematic perspective explanatory view of an ultrasonic bonding apparatus 10 for performing an ultrasonic bonding method for metal foil according to a first embodiment of the present invention. The ultrasonic bonding apparatus 10 is configured to weld a metal lead (metal plate) 14 to a predetermined position of a metal foil 12. In the first embodiment, the metal foil 12 is formed of a copper foil having a thickness of 17 μm. And
The metal lead 14 is formed of a nickel plate having a thickness of 100 μm.
【００１３】超音波接合装置１０は、金属箔１２と金属
リード１４を重ね合わせて載置するアンビル１６と、前
記金属リード１４側から前記アンビル１６上の該金属リ
ード１４と前記金属箔１２との重ね合わせ部位を加圧し
ながら超音波振動を付与して溶接する超音波ホーン１８
とを備える。The ultrasonic bonding apparatus 10 includes an anvil 16 on which a metal foil 12 and a metal lead 14 are placed on top of each other, and a connection between the metal lead 14 and the metal foil 12 on the anvil 16 from the metal lead 14 side. Ultrasonic horn 18 for welding by applying ultrasonic vibration while pressurizing the overlapping portion
And
【００１４】アンビル１６はダイス鋼またはハイス鋼製
であり、図１および図２に示すように、このアンビル１
６の４つの面に平滑加工面２０ａ〜２０ｄが設定され
る。平滑加工面２０ａ〜２０ｄは、金属箔１２の厚さ以
下の表面荒さに研削加工されており、具体的には、前記
金属箔１２の厚さが１７μｍであるために、前記表面荒
さがＲMAX ＝８μｍに設定される。アンビル１６には、
このアンビル１６を固定するために複数の孔部２１が形
成されている。The anvil 16 is made of die steel or high-speed steel, and as shown in FIGS.
The smooth processing surfaces 20a to 20d are set on the four surfaces of No. 6. The smoothed surfaces 20a to 20d are ground to a surface roughness equal to or less than the thickness of the metal foil 12, and specifically, since the thickness of the metal foil 12 is 17 μm, the surface roughness is R MAX. = 8 μm. In the anvil 16,
A plurality of holes 21 are formed for fixing the anvil 16.
【００１５】図１、図３および図４に示すように、超音
波ホーン１８は、両面にそれぞれ第１および第２加工面
２２、２４を有する。図３に示すように、第１加工面２
２は、幅広な第１加圧部２６と、各第１加圧部２６同士
を連結する幅狭な第２加圧部２８とを有する。第１およ
び第２加圧部２６、２８には、第１加工面２２の長手方
向（矢印Ａ方向）および短手方向（矢印Ｂ方向）にそれ
ぞれ４５゜ずつ傾斜して所定のピッチ間隔で配列された
複数の細かい凹凸部３０が設けられる。なお、第２加工
面２４は第１加工面２２と同様に構成されており、同一
の構成要素には同一の参照符号を付して、その詳細な説
明は省略する。As shown in FIGS. 1, 3 and 4, the ultrasonic horn 18 has first and second processing surfaces 22, 24 on both surfaces, respectively. As shown in FIG.
2 has a wide first pressing part 26 and a narrow second pressing part 28 connecting the first pressing parts 26 to each other. The first and second pressing portions 26 and 28 are arranged at a predetermined pitch interval at an angle of 45 ° in the longitudinal direction (arrow A direction) and in the transverse direction (arrow B direction) of the first processing surface 22. A plurality of fine uneven portions 30 are provided. The second processing surface 24 has the same configuration as the first processing surface 22, and the same components are denoted by the same reference characters, and detailed description thereof will be omitted.
【００１６】このように構成される超音波接合装置１０
の動作について、第１の実施形態に係る超音波接合方法
との関連で、以下に説明する。The ultrasonic bonding apparatus 10 constructed as described above
The operation will be described below in relation to the ultrasonic bonding method according to the first embodiment.
【００１７】先ず、図１に示すように、アンビル１６の
平滑加工面２０ａ上に金属箔１２が載置された後、この
金属箔１２上に短冊状の金属リード１４が配置される。
次いで、金属箔１２と金属リード１４との重ね合わせ部
位を、前記金属リード１４側から超音波ホーン１８の第
１加工面２２で加圧しながら超音波振動を付与して溶接
する。なお、超音波ホーン１８では、第１加工面２２に
よる溶接が不能になった際、上下面が入れ替えられて第
２加工面２４により溶接作業が行われる。First, as shown in FIG. 1, after the metal foil 12 is placed on the smoothed surface 20a of the anvil 16, the strip-shaped metal leads 14 are arranged on the metal foil 12.
Next, the superposed portion of the metal foil 12 and the metal lead 14 is welded by applying ultrasonic vibration while applying pressure to the first processing surface 22 of the ultrasonic horn 18 from the metal lead 14 side. In the ultrasonic horn 18, when welding by the first processing surface 22 becomes impossible, the upper and lower surfaces are switched, and the welding operation is performed by the second processing surface 24.
【００１８】この場合、第１の実施形態では、アンビル
１６の平滑加工面２０ａが金属箔１２の厚さ（１７μ
ｍ）以下の表面荒さ（ＲMAX ＝８μｍ）に設定されてお
り、この平滑加工面２０ａ上に前記金属箔１２と金属リ
ード１４を重ね合わせて載置した状態で、超音波ホーン
１８の第１加工面２２で前記金属リード１４と前記金属
箔１２との重ね合わせ部位を溶接している。このため、
例えば、５０μｍ以下の厚さの金属箔１２が使用される
際にも、アンビル１６の平滑加工面２０ａにより前記金
属箔１２が破損することを確実に阻止することができる
という効果が得られる。In this case, in the first embodiment, the smooth processing surface 20a of the anvil 16 is
m) is set to the following surface roughness (R MAX = 8 μm), and in a state where the metal foil 12 and the metal lead 14 are superposed and placed on the smooth processing surface 20a, the first ultrasonic horn 18 The overlapping portion of the metal lead 14 and the metal foil 12 is welded on the processing surface 22. For this reason,
For example, even when the metal foil 12 having a thickness of 50 μm or less is used, an effect is obtained that the smooth processing surface 20 a of the anvil 16 can reliably prevent the metal foil 12 from being damaged.
【００１９】さらに、凹凸部やサンドブラスト面が設け
られた従来のアンビル加工面に比べて、アンビル１６の
平滑加工面２０ａの表面状態が変化し難く、しかも超音
波ホーン１８の第１および第２加工面２２、２４に付与
される圧力が均一化する。従って、溶接条件範囲の変化
を抑えるとともに、超音波ホーン１８やアンビル１６の
偏摩耗を阻止し、安定した溶接作業および繰り返しの使
用に適するという利点がある。また、平滑加工面２０ａ
を有するアンビル１６では、従来の凹凸部やサンドブラ
スト面に比べて製造コストが有効に削減され、設備費の
高騰を抑えることが可能になる。Further, the surface condition of the smooth processing surface 20a of the anvil 16 is less likely to change than that of the conventional anvil processing surface provided with the uneven portion and the sand blast surface, and the first and second processing of the ultrasonic horn 18 are also performed. The pressure applied to the surfaces 22, 24 becomes uniform. Therefore, there is an advantage that the change of the welding condition range is suppressed, the uneven horn 18 and the anvil 16 are prevented from being unevenly worn, and the welding is suitable for stable welding operation and repeated use. In addition, the smooth processing surface 20a
In the anvil 16 having the above, the manufacturing cost can be effectively reduced as compared with the conventional uneven portion and the sand blast surface, and it is possible to suppress the increase in the equipment cost.
【００２０】図５は、本発明の第２の実施形態に係る金
属箔の超音波接合方法を実施するための超音波接合装置
４０の概略斜視説明図である。なお、第１の実施形態に
係る超音波接合装置１０と同一の構成要素には同一の参
照符号を付して、その詳細な説明は省略する。FIG. 5 is a schematic perspective explanatory view of an ultrasonic bonding apparatus 40 for performing an ultrasonic bonding method of metal foil according to a second embodiment of the present invention. Note that the same components as those of the ultrasonic bonding apparatus 10 according to the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
【００２１】この超音波接合装置４０は、超音波ホーン
１８により金属リード１４と金属箔１２との重ね合わせ
部位を加圧しながら超音波振動を付与して溶接する際、
前記金属箔１２を押圧保持する押さえ部材４２を備え
る。押さえ部材４２は、略コ字状を有しており、アンビ
ル１６の平滑加工面２０ａ上に、超音波ホーン１８によ
り加圧される部分の周囲全体にわたって配置される。な
お、押さえ部材４２を、超音波ホーン１８により加圧さ
れる部分の周囲一部に配置されるように設定してもよ
い。This ultrasonic bonding apparatus 40 performs welding when applying ultrasonic vibration while applying pressure to the overlapping portion of the metal lead 14 and the metal foil 12 by the ultrasonic horn 18.
A holding member 42 for holding the metal foil 12 is provided. The pressing member 42 has a substantially U-shape, and is disposed on the smooth processing surface 20 a of the anvil 16 over the entire periphery of a portion pressed by the ultrasonic horn 18. Note that the pressing member 42 may be set so as to be disposed at a part around a part to be pressed by the ultrasonic horn 18.
【００２２】このように構成される超音波接合装置４０
では、アンビル１６の平滑加工面２０ａ上に金属箔１２
が載置された後、この金属箔１２上に短冊状の金属リー
ド１４が配置される。次いで、押さえ部材４２が超音波
ホーン１８により加圧される部分の周囲全体にわたって
金属箔１２を押圧保持した状態で、前記金属箔１２と金
属リード１４との重ね合わせ部位を前記超音波ホーン１
８の第１加工面２２で加圧しながら超音波振動を付与し
て溶接する。The ultrasonic bonding apparatus 40 constructed as described above
Then, the metal foil 12 is placed on the smoothed surface 20 a of the anvil 16.
Is placed, a strip-shaped metal lead 14 is arranged on the metal foil 12. Next, with the pressing member 42 pressing and holding the metal foil 12 over the entire periphery of the portion to be pressed by the ultrasonic horn 18, the overlapping portion of the metal foil 12 and the metal lead 14 is moved to the ultrasonic horn 1.
8 while applying ultrasonic pressure while applying pressure to the first processing surface 22 for welding.
【００２３】この場合、第２の実施形態では、特に金属
箔１２が押さえ部材４２により押圧保持されるため、こ
の金属箔１２が超音波ホーン１８により加圧される際、
アンビル１６の平滑加工面２０ａ〜２０ｄと前記金属箔
１２との滑りを確実に防止することができる。従って、
アンビル１６と超音波ホーン１８とによる溶接作業が一
層安定して高品質に遂行されるという効果が得られる。In this case, in the second embodiment, in particular, since the metal foil 12 is pressed and held by the pressing member 42, when the metal foil 12 is pressed by the ultrasonic horn 18,
Slip between the smoothed surfaces 20a to 20d of the anvil 16 and the metal foil 12 can be reliably prevented. Therefore,
The effect that the welding work by the anvil 16 and the ultrasonic horn 18 is performed more stably and with high quality can be obtained.
【００２４】[0024]
【発明の効果】本発明に係る金属箔の超音波接合方法お
よび装置では、アンビルの加工面が金属箔の厚さ以下の
表面荒さを有する平滑加工面に設定されるため、厚さの
薄い金属箔、例えば、５０μｍ以下の厚さの金属箔が使
用される際にも、前記金属箔が破損することを確実に阻
止することができる。In the method and apparatus for ultrasonically bonding metal foil according to the present invention, the processed surface of the anvil is set to a smooth processed surface having a surface roughness equal to or less than the thickness of the metal foil. Even when a foil, for example, a metal foil having a thickness of 50 μm or less is used, it is possible to reliably prevent the metal foil from being damaged.
【００２５】さらに、アンビルの平滑加工面の表面状態
が変化し難く、しかも超音波ホーンの加工面に付与され
る圧力が均一化するため、溶接条件範囲の変化を抑える
とともに、前記超音波ホーンや前記アンビルの偏摩耗を
阻止し、安定した溶接作業および繰り返しの使用に適す
る。また、平滑加工面を有するアンビルでは、製造コス
トが有効に削減され、設備費の高騰を抑えることが可能
になる。Further, since the surface condition of the smooth processed surface of the anvil is unlikely to change and the pressure applied to the processed surface of the ultrasonic horn is made uniform, the change in the welding condition range is suppressed, and the ultrasonic horn and It prevents uneven wear of the anvil and is suitable for stable welding operation and repeated use. Further, in the case of an anvil having a smooth processed surface, manufacturing costs can be effectively reduced, and a rise in equipment costs can be suppressed.
【図１】本発明の第１の実施形態に係る金属箔の超音波
接合方法を実施するための超音波接合装置の概略斜視説
明図である。FIG. 1 is a schematic perspective explanatory view of an ultrasonic bonding apparatus for performing an ultrasonic bonding method of metal foil according to a first embodiment of the present invention.
【図２】前記超音波接合装置を構成するアンビルの正面
説明図である。FIG. 2 is an explanatory front view of an anvil constituting the ultrasonic bonding apparatus.
【図３】前記超音波接合装置を構成する超音波ホーンの
平面説明図である。FIG. 3 is an explanatory plan view of an ultrasonic horn constituting the ultrasonic bonding apparatus.
【図４】前記超音波ホーンの側面説明図である。FIG. 4 is an explanatory side view of the ultrasonic horn.
【図５】本発明の第２の実施形態に係る金属箔の超音波
接合方法を実施するための超音波接合装置の概略斜視説
明図である。FIG. 5 is a schematic perspective explanatory view of an ultrasonic bonding apparatus for performing an ultrasonic bonding method of a metal foil according to a second embodiment of the present invention.
１０、４０…超音波接合装置 １２…金属箔 １４…金属リード １６…アンビル １８…超音波ホーン ２０ａ〜２０ｄ…平滑
加工面 ２２、２４…加工面 ４２…押さえ部材10, 40 ... ultrasonic bonding apparatus 12 ... metal foil 14 ... metal lead 16 ... anvil 18 ... ultrasonic horn 20a-20d ... smooth processing surface 22, 24 ... processing surface 42 ... holding member
Claims (4)
アンビルの平滑加工面上に、前記金属箔と金属板を重ね
合わせて載置する工程と、 一定ピッチで凹凸面が形成された超音波ホーンの加工面
で、前記金属板側から前記アンビル上の該金属板と前記
金属箔との重ね合わせ部位を加圧しながら超音波振動を
付与して溶接する工程と、 を有することを特徴とする金属箔の超音波接合方法。1. A step of superposing and placing said metal foil and a metal plate on a smooth-worked surface of an anvil set to a surface roughness equal to or less than the thickness of the metal foil; Applying ultrasonic vibration while pressurizing a superposed portion of the metal plate and the metal foil on the anvil from the metal plate side on the processed surface of the ultrasonic horn, and welding. Characteristic ultrasonic bonding method of metal foil.
前記アンビルの平滑加工面上に載置された前記金属箔を
押さえ部材により保持した状態で、前記超音波ホーンの
加工面によって前記金属板と前記金属箔との重ね合わせ
部位を加圧しながら超音波振動を付与して溶接すること
を特徴とする金属箔の超音波接合方法。2. The ultrasonic bonding method according to claim 1, wherein
While holding the metal foil placed on the smooth processing surface of the anvil by a holding member, the ultrasonic horn processing surface presses the superposed portion of the metal plate and the metal foil while applying ultrasonic waves. An ultrasonic bonding method of metal foil, wherein welding is performed by applying vibration.
工面が、前記金属箔の厚さ以下の表面荒さを有する平滑
加工面に設定されたアンビルと、 前記金属板側から前記アンビル上の該金属板と前記金属
箔との重ね合わせ部位を加圧しながら超音波振動を付与
して溶接するとともに、一定ピッチで凹凸面が形成され
た加工面を有する超音波ホーンと、 を備えることを特徴とする金属箔の超音波接合装置。3. An anvil in which a processing surface on which a metal foil and a metal plate are stacked and placed is a smooth processing surface having a surface roughness equal to or less than the thickness of the metal foil, and the anvil from the metal plate side. An ultrasonic horn having a processed surface on which irregularities are formed at a constant pitch while applying ultrasonic vibration and welding while applying pressure to the overlapping portion of the metal plate and the metal foil. Ultrasonic bonding apparatus for metal foils.
前記超音波ホーンにより前記金属板と前記金属箔との重
ね合わせ部位を加圧しながら超音波振動を付与して溶接
する際、前記金属箔を押圧保持する押さえ部材を備える
ことを特徴とする金属箔の超音波接合装置。4. The ultrasonic bonding apparatus according to claim 3, wherein
A metal foil, comprising: a pressing member that presses and holds the metal foil when welding is performed by applying ultrasonic vibration while applying pressure to the overlapping portion of the metal plate and the metal foil by the ultrasonic horn. Ultrasonic bonding equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10026023A JPH11221682A (en) | 1998-02-06 | 1998-02-06 | Method and device for ultrasonic joining of metallic foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10026023A JPH11221682A (en) | 1998-02-06 | 1998-02-06 | Method and device for ultrasonic joining of metallic foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11221682A true JPH11221682A (en) | 1999-08-17 |
Family
ID=12182115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10026023A Pending JPH11221682A (en) | 1998-02-06 | 1998-02-06 | Method and device for ultrasonic joining of metallic foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11221682A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001167751A (en) * | 1999-12-09 | 2001-06-22 | Matsushita Electric Ind Co Ltd | Method and apparatus of connecting lead wire of battery |
| JP2008027831A (en) * | 2006-07-25 | 2008-02-07 | Matsushita Electric Ind Co Ltd | Battery |
| JP2009241120A (en) * | 2008-03-31 | 2009-10-22 | Calsonic Kansei Corp | Ultrasonic metal bonding machine, metal sheet bonding method using the same, and bonded metal sheet obtained by using the ultrasonic metal bonding machine or the metal sheet bonding method |
| CN101850469A (en) * | 2010-05-21 | 2010-10-06 | 严锦璇 | Wear-resisting ultrasonic welding mould and manufacturing method thereof |
| JP2010282846A (en) * | 2009-06-04 | 2010-12-16 | Toyota Motor Corp | Secondary battery and method of manufacturing the same |
| CN102672338A (en) * | 2012-05-11 | 2012-09-19 | 江苏有能电力自动化有限公司 | Welding process of multilayer foil type coils of resonance-eliminating compensation transformation device |
| WO2013005555A1 (en) * | 2011-07-07 | 2013-01-10 | 株式会社日立製作所 | Metal-bonded structure and method for manufacturing same |
| CN105397272A (en) * | 2015-12-30 | 2016-03-16 | 苏州润昇精密机械有限公司 | Ultrasonic welding machine for lithium battery welding |
| WO2024190802A1 (en) * | 2023-03-14 | 2024-09-19 | 株式会社村田製作所 | Secondary battery |
-
1998
- 1998-02-06 JP JP10026023A patent/JPH11221682A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001167751A (en) * | 1999-12-09 | 2001-06-22 | Matsushita Electric Ind Co Ltd | Method and apparatus of connecting lead wire of battery |
| JP2008027831A (en) * | 2006-07-25 | 2008-02-07 | Matsushita Electric Ind Co Ltd | Battery |
| JP2009241120A (en) * | 2008-03-31 | 2009-10-22 | Calsonic Kansei Corp | Ultrasonic metal bonding machine, metal sheet bonding method using the same, and bonded metal sheet obtained by using the ultrasonic metal bonding machine or the metal sheet bonding method |
| JP2010282846A (en) * | 2009-06-04 | 2010-12-16 | Toyota Motor Corp | Secondary battery and method of manufacturing the same |
| CN101850469A (en) * | 2010-05-21 | 2010-10-06 | 严锦璇 | Wear-resisting ultrasonic welding mould and manufacturing method thereof |
| WO2013005555A1 (en) * | 2011-07-07 | 2013-01-10 | 株式会社日立製作所 | Metal-bonded structure and method for manufacturing same |
| JP2013018003A (en) * | 2011-07-07 | 2013-01-31 | Hitachi Ltd | Metal-bonded structure and method for manufacturing the same |
| CN102672338A (en) * | 2012-05-11 | 2012-09-19 | 江苏有能电力自动化有限公司 | Welding process of multilayer foil type coils of resonance-eliminating compensation transformation device |
| CN105397272A (en) * | 2015-12-30 | 2016-03-16 | 苏州润昇精密机械有限公司 | Ultrasonic welding machine for lithium battery welding |
| WO2024190802A1 (en) * | 2023-03-14 | 2024-09-19 | 株式会社村田製作所 | Secondary battery |
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