JP3218748B2 - Ultrasonic bonding method for metal foil - Google Patents
Ultrasonic bonding method for metal foilInfo
- Publication number
- JP3218748B2 JP3218748B2 JP31347792A JP31347792A JP3218748B2 JP 3218748 B2 JP3218748 B2 JP 3218748B2 JP 31347792 A JP31347792 A JP 31347792A JP 31347792 A JP31347792 A JP 31347792A JP 3218748 B2 JP3218748 B2 JP 3218748B2
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- anvil
- ultrasonic
- metal
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/531—Electrode connections inside a battery casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/531—Electrode connections inside a battery casing
- H01M50/534—Electrode connections inside a battery casing characterised by the material of the leads or tabs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Connection Of Batteries Or Terminals (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えばリチウムイオン
二次電池における集電体箔とリードとの接合に適用して
好適な金属箔の超音波接合方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic bonding method for a metal foil which is suitable for bonding a current collector foil and a lead in, for example, a lithium ion secondary battery.
【０００２】[0002]
【従来の技術】従来、金属板同士の溶接方法としては、
超音波溶接法が広く用いられていた。これは、アンビル
の加工面上で金属板と金属板とを重ね、その上からこの
アンビルの加工面に対して略平行に振動する超音波ホー
ンの加工面を押し当てて、この金属板と金属板とを接合
する方法である。ここで、アンビルの加工面と超音波ホ
ーンの加工面はそれぞれは一定のピッチでピラミッド型
に加工された凹凸の面であり、金属板としては、それぞ
れの厚さが５０μｍ以上のものに応用されていた。2. Description of the Related Art Conventionally, as a method of welding metal sheets,
Ultrasonic welding was widely used. In this method, a metal plate and a metal plate are overlapped on the processing surface of the anvil, and the processing surface of the ultrasonic horn vibrating substantially parallel to the processing surface of the anvil is pressed from above on the metal plate and the metal plate. This is a method of joining with a board. Here, the machined surface of the anvil and the machined surface of the ultrasonic horn are uneven surfaces machined in a pyramid shape at a constant pitch, and are applied to metal plates having a thickness of 50 μm or more. I was
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上述し
た従来の金属板の超音波接合方法では、５０μｍ以下の
厚さの金属板を用いた場合、この金属板が破けてしま
い、使用に耐えるものを製造することができなかった。However, according to the above-mentioned conventional ultrasonic bonding method for metal plates, when a metal plate having a thickness of 50 μm or less is used, the metal plate is torn, and it is difficult to use the metal plate. Could not be manufactured.
【０００４】例えば，厚さが１０μｍの銅箔側より超音
波ホーンを押し当てると、この１０μｍの銅箔はホーン
に接触した点は接合するが、接合部の周囲で銅箔の破れ
が発生してしまう。また、アンビルにピラミッド型に加
工した面を用いると箔に孔が明きやすく接合の条件が容
易でないという問題があった。For example, when an ultrasonic horn is pressed from the side of a copper foil having a thickness of 10 μm, the copper foil having a thickness of 10 μm is joined at a point in contact with the horn, but the copper foil is torn around the joint. Would. Further, when a pyramid-shaped surface is used for the anvil, there is a problem that holes are easily formed in the foil and the joining conditions are not easy.
【０００５】本発明はこのような課題に鑑みてなされた
ものであり、金属箔に破れを生ずることなく接合をする
ことができる金属箔の超音波接合方法を得ることを目的
とする。[0005] The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for ultrasonically joining metal foils that can be joined without breaking the metal foils.
【０００６】[0006]
【課題を解決するための手段】本発明の金属箔の超音波
接合方法は、例えば図１に示すように、アンビル１の加
工面１ａ上で金属箔２を金属板３と重ね、その上からこ
のアンビル１の加工面１ａに対して略平行に振動する超
音波ホーン４の加工面４ａを押し当てて、この金属箔２
とこの金属板３とを接合する金属箔２の超音波接合方法
において、このアンビル１の加工面１ａはサンドブラス
ト処理された粗面であり、この超音波ホーン４の加工面
４ａは一定のピッチで加工された凹凸の面であり、この
金属箔２はアンビル１の加工面１ａに配されて金属板３
と重ねられ、金属板３の金属箔と接しない面側から超音
波ホーン４の加工面４ａで押し当てられる方法である。According to the ultrasonic bonding method of a metal foil of the present invention, for example, as shown in FIG. 1, a metal foil 2 is overlapped with a metal plate 3 on a processing surface 1a of an anvil 1, and the metal foil 3 The processing surface 4a of the ultrasonic horn 4 vibrating substantially parallel to the processing surface 1a of the anvil 1 is pressed against the metal foil 2
In the ultrasonic bonding method of the metal foil 2 for bonding the metal foil 3 and the metal plate 3, the processing surface 1a of the anvil 1 is a sandblasted rough surface, and the processing surface 4a of the ultrasonic horn 4 has a constant pitch. The metal foil 2 is disposed on the processing surface 1a of the anvil 1 and the metal plate 3
And the metal plate 3 is pressed against the processing surface 4a of the ultrasonic horn 4 from the side not in contact with the metal foil.
【０００７】また、本発明の金属箔の超音波接合方法
は、金属箔２の厚さは５μｍ〜３０μｍである上述構成
の超音波接合方法である。[0007] The ultrasonic bonding method of a metal foil according to the present invention is the ultrasonic bonding method described above, wherein the thickness of the metal foil 2 is 5 μm to 30 μm.
【０００８】[0008]
【作用】本発明の金属箔の超音波接合方法によれば、ア
ンビル１の加工面１ａ上で金属箔２を金属板３と重ね、
その上からこのアンビル１の加工面１ａに対して略平行
に振動する超音波ホーン４の加工面４ａを押し当てて、
この金属箔２とこの金属板３とを接合する金属箔２の超
音波接合方法において、このアンビル１の加工面１ａは
サンドブラスト処理された粗面であり、この超音波ホー
ン４の加工面４ａは一定のピッチで加工された凹凸の面
であり、この金属箔２はアンビル１の加工面１ａに配さ
れて金属板３と重ねられ、金属板３の金属箔と接しない
面側から超音波ホーン４の加工面４ａで押し当てられる
方法とすることにより、金属箔に切れや破れによる孔を
生ずることなく、金属箔の接合をすることができる。According to the ultrasonic bonding method for metal foil of the present invention, the metal foil 2 is overlapped with the metal plate 3 on the processing surface 1a of the anvil 1,
From above, the processing surface 4a of the ultrasonic horn 4 vibrating substantially parallel to the processing surface 1a of the anvil 1 is pressed.
In the ultrasonic bonding method of the metal foil 2 for bonding the metal foil 2 and the metal plate 3, the processing surface 1 a of the anvil 1 is a sandblasted rough surface, and the processing surface 4 a of the ultrasonic horn 4 is The metal foil 2 is arranged on the processing surface 1a of the anvil 1 and is superposed on the metal plate 3, and the ultrasonic horn is formed from the surface of the metal plate 3 which is not in contact with the metal foil. By using a method in which the metal foil is pressed against the processing surface 4a, the metal foil can be joined without generating a hole due to cutting or tearing in the metal foil.
【０００９】また、本発明の金属箔の超音波接合方法に
よれば、金属箔２の厚さが５μｍ〜３０μｍである上述
構成の超音波接合方法とすることにより、極薄い金属箔
においても、切れや破れによる孔を生ずることなく、金
属箔の接合をすることができる。According to the ultrasonic bonding method for a metal foil of the present invention, the ultrasonic bonding method having the above-described structure in which the thickness of the metal foil 2 is 5 μm to 30 μm enables the metal foil 2 to be used even in an extremely thin metal foil. The metal foil can be joined without generating holes due to cutting or tearing.
【００１０】[0010]
【実施例】以下、本発明金属箔の超音波接合方法の一実
施例について図１〜図５を参照しながら説明しよう。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the ultrasonic bonding method of a metal foil according to the present invention will be described below with reference to FIGS.
【００１１】図１は、本例金属箔の超音波接合方法に用
いる全体装置を示すものである。ここで、１はアンビル
を示し、このアンビル１の長手方向の各面の両側の側辺
には長方形の加工面１ａがそれぞれ設けてあり、各面の
ものを合計すると８面設けてある（図２参照）。この加
工面は、それぞれサンドブラスト処理がなされている。FIG. 1 shows an overall apparatus used for the ultrasonic bonding method of the metal foil of the present embodiment. Here, 1 indicates an anvil, and rectangular processing surfaces 1a are provided on both sides of each surface in the longitudinal direction of the anvil 1, and a total of eight processing surfaces are provided (FIG. 2). Each of the processed surfaces is subjected to a sand blast process.
【００１２】アンビル１の加工面１ａの上には、２で示
す金属箔と、３で示すリードが設置してあり、この場
合、金属箔２とリード３との接合しようとする部分がち
ょうど加工面１ａの範囲内に入るようにする必要があ
る。金属箔２としては銅箔（厚さは５μｍ〜３０μｍ）
またはアルミ箔（厚さは５μｍ〜３０μｍ）を用い、リ
ード３としてはニッケル板（厚さは５０μｍ〜１００μ
ｍ）またはアルミ板（厚さは１００μｍ〜２００μｍ）
を用いた。On the processing surface 1a of the anvil 1, a metal foil indicated by 2 and a lead indicated by 3 are provided. In this case, a portion to be joined between the metal foil 2 and the lead 3 is just processed. It is necessary to fall within the range of the surface 1a. Copper foil as metal foil 2 (thickness is 5 μm to 30 μm)
Alternatively, an aluminum foil (thickness: 5 μm to 30 μm) is used, and a nickel plate (thickness: 50 μm to 100 μm) is used as the lead 3.
m) or aluminum plate (thickness is 100μm ~ 200μm)
Was used.
【００１３】４は超音波ホーンを示し、この超音波ホー
ン４は中心軸方向に振動する超音波を発生するものであ
る。この超音波ホーン４の先端部近くには、中心軸を含
む水平面に対称に上面側及び下面側に加工面（群）４ａ
が設けられている（図３及び図４参照）。この加工面４
ａには、一定のピッチによりピラミッド型の凹凸を設け
てある。金属箔２とリード３とを接合させるためには、
この超音波ホーン４を鉛直方向に押し下げることによ
り、この超音波ホーン４の加工面４ａがリード３に押し
付けられるようにする。Reference numeral 4 denotes an ultrasonic horn, which generates ultrasonic waves vibrating in the direction of the central axis. Near the tip of the ultrasonic horn 4, a processing surface (group) 4a is formed on the upper surface side and the lower surface side symmetrically with respect to a horizontal plane including the central axis.
Is provided (see FIGS. 3 and 4). This processing surface 4
In a, pyramid-shaped irregularities are provided at a constant pitch. In order to join the metal foil 2 and the lead 3,
By pressing down the ultrasonic horn 4 in the vertical direction, the processing surface 4 a of the ultrasonic horn 4 is pressed against the lead 3.
【００１４】次に、本実施例において採用した種々の条
件について説明する。Next, various conditions employed in this embodiment will be described.
【００１５】金属箔とリードの重ね合わせる順序 図１に示すようにアンビル１側に金属箔２、超音波ホー
ン４側にリード３を配置し、リード３側から超音波ホー
ン４を押し当てて、超音波発振して接合する。As shown in FIG. 1, the metal foil 2 is placed on the anvil 1 side, the lead 3 is placed on the ultrasonic horn 4 side, and the ultrasonic horn 4 is pressed from the lead 3 side, as shown in FIG. Joining by ultrasonic oscillation.
【００１６】ここで、なぜ超音波ホーン４をリード３側
から押し当てるようにしたか、言い替えると、なぜ金属
箔２側から超音波ホーン４を押し当てるようにしないの
かの理由は以下に述べるとおりである。まず、金属箔２
にホーン目によるダメージが多く発生し、接合後のはが
し強度が低下してしまうことによる。銅箔２とニッケル
板３を同じ条件で接合させ、その後はがし強度を測定し
た場合（図５参照）、超音波ホーン４をニッケル板３側
より押し当てて接合した場合は、はがし強度Ｐ＝１ｋｇ
であるのに対して、銅箔２側より接合した場合は、Ｐ＝
０．３ｋｇであり、約３倍の強度が得られる。また、接
合後銅箔（厚さ１０μｍ）には孔が明き、ニッケルが露
出しやすくなる。これは、ショートの原因にもなるもの
である。またこの他、接合後の金属箔にしわが発生しや
すいことや、最適条件の範囲が狭いことによるものであ
る。Here, the reason why the ultrasonic horn 4 is pressed from the lead 3 side, in other words, the reason why the ultrasonic horn 4 is not pressed against the metal foil 2 side is as follows. It is. First, metal foil 2
This is due to the fact that a large number of damages are caused by the horn eyes, and the peel strength after bonding is reduced. When the copper foil 2 and the nickel plate 3 are bonded under the same conditions, and then the peel strength is measured (see FIG. 5), when the ultrasonic horn 4 is pressed from the nickel plate 3 side and bonded, the peel strength P = 1 kg
On the other hand, when joining from the copper foil 2 side, P =
0.3 kg, about three times the strength is obtained. In addition, a hole is made in the copper foil (thickness: 10 μm) after bonding, and nickel is easily exposed. This also causes a short circuit. In addition, wrinkles are likely to occur in the metal foil after bonding, and the range of optimum conditions is narrow.
【００１７】アンビルの加工面の表面荒さアンビルの加
工面はサンドブラスト処理を行い、その表面荒さはＲｍ
ａｘ＝１８〜２５μｍの範囲とした。表１には、アンビ
ル表面荒さと仕上げ方法と超音波接合時の結果を示し
た。The surface roughness of the processed surface of the anvil is subjected to sandblasting, and the surface roughness of the processed surface of the anvil is Rm.
ax = 18 to 25 μm. Table 1 shows the anvil surface roughness, the finishing method, and the results of ultrasonic bonding.
【００１８】[0018]
【表１】 [Table 1]
【００１９】表１の結果からもわかるように、サンプル
Ｃ及びサンプルＤ、すなわち表面荒さＲｍａｘ＝１８〜
２５μｍの範囲では、金属箔の滑りも発生せず良好な接
合結果が得られた。なお、アンビルの加工面の表面荒さ
Ｒｍａｘが８μｍ未満の場合は、接合時の金属箔のグリ
ップ力が低下し、接合後、金属箔にしわの発生が多くな
る。また、表面荒さＲｍａｘが２５μｍ以上の場合は、
接合後の銅箔に孔が明き、ニッケルが露出しやすく、接
合強度が低下する。また、アンビルの加工面をサンドブ
ラスト処理すると、接合後の銅箔に孔明きがないこと、
加工費用が安いこと、接合後に金属箔がアンビルに付着
がないことなどの利点がある。As can be seen from the results in Table 1, samples C and D, that is, surface roughness Rmax = 18 to
In the range of 25 μm, no slippage of the metal foil occurred, and good joining results were obtained. If the surface roughness Rmax of the processed surface of the anvil is less than 8 μm, the gripping force of the metal foil at the time of joining is reduced, and after joining, the metal foil is often wrinkled. When the surface roughness Rmax is 25 μm or more,
A hole is formed in the copper foil after bonding, nickel is easily exposed, and the bonding strength is reduced. Also, if the processed surface of the anvil is sandblasted, there is no hole in the copper foil after joining,
There are advantages such as low processing cost and no adhesion of metal foil to the anvil after joining.
【００２０】超音波ホーンの条件 超音波ホーンのホーン目の加工ピッチは０．３ｍｍ〜
０．７ｍｍの範囲とした。加工ピッチが０．３ｍｍ未満
の場合はホーンとリード（タブ）とのグリップ力が低下
し、接合後、金属箔にしわの発生が多くなる。一方、
０．７ｍｍを越える場合は接合面積が少なくなり、はが
し強度が低下してしまう。Condition of ultrasonic horn The processing pitch of the horn of the ultrasonic horn is 0.3 mm or more.
The range was 0.7 mm. If the processing pitch is less than 0.3 mm, the grip force between the horn and the lead (tab) is reduced, and after bonding, the metal foil is often wrinkled. on the other hand,
If it exceeds 0.7 mm, the bonding area is reduced, and the peeling strength is reduced.
【００２１】超音波ホーンの接触圧は、ニッケル板のリ
ードと銅箔との組み合わせ、及びアルミ板のリードとア
ルミ箔との組み合わせのそれぞれの場合において、表２
に示すような範囲とした。The contact pressure of the ultrasonic horn is shown in Table 2 for each of the combination of a nickel plate lead and a copper foil and the combination of an aluminum plate lead and an aluminum foil.
The range was as shown in FIG.
【００２２】[0022]
【表２】 [Table 2]
【００２３】接触圧が表２に示す範囲の下限値よりも低
い場合は、充分な接合強度が得られず、金属箔とリード
板にすべりが発生する。逆に、接触圧が表２に示す上限
値よりも高くなる場合は、超音波アクチュエータ内のダ
イヤフラムに焼き付き、ワレ等が発生するという不都合
がある。When the contact pressure is lower than the lower limit of the range shown in Table 2, sufficient bonding strength cannot be obtained, and slip occurs between the metal foil and the lead plate. On the other hand, when the contact pressure is higher than the upper limit shown in Table 2, there is a disadvantage that the diaphragm in the ultrasonic actuator is seized and cracks occur.
【００２４】超音波ホーンの端面振幅は、ニッケル板の
リードと銅箔との組み合わせ、及びアルミ板のリードと
アルミ箔との組み合わせのそれぞれの場合において、と
もに１０〜１５μｍの範囲とした。上述の範囲より振幅
が小さいと充分な接合強度が得られない。また、この範
囲より振幅が大きいと金属箔に孔明きが発生し、接合強
度が低下する結果となる。The amplitude of the end face of the ultrasonic horn was in the range of 10 to 15 μm for each of the combination of the nickel plate lead and the copper foil and the combination of the aluminum plate lead and the aluminum foil. If the amplitude is smaller than the above range, sufficient bonding strength cannot be obtained. On the other hand, if the amplitude is larger than this range, holes are generated in the metal foil, and the bonding strength is reduced.
【００２５】超音波ホーンの接合エネルギーは、ニッケ
ル板のリードと銅箔との組み合わせ、及びアルミ板のリ
ードとアルミ箔との組み合わせのそれぞれの場合におい
て、表３に示すような範囲とした。The bonding energies of the ultrasonic horn were in the ranges shown in Table 3 for each of the combination of a nickel plate lead and a copper foil and the combination of an aluminum plate lead and an aluminum foil.
【００２６】[0026]
【表３】 [Table 3]
【００２７】上述の範囲より接合エネルギーが小さいと
充分な接合強度が得られない。また、この範囲よりエネ
ルギーが大きいと（ニッケル板のリードと銅箔との組み
合わせの場合のみ）銅箔に孔明きが発生し、接合強度が
低下する結果となる。If the bonding energy is smaller than the above range, sufficient bonding strength cannot be obtained. On the other hand, if the energy is larger than this range (only in the case of the combination of the lead of the nickel plate and the copper foil), a hole is generated in the copper foil, and the bonding strength is reduced.
【００２８】以上のことから、本例によれば、金属箔に
切れや破れによる孔を生ずることなく、金属箔の接合を
することができる。従って、極薄シート同士の安定した
接合に有用であり、応用範囲が広い。また、接合後のは
がし強度を向上させることができるとともに、アンビル
への金属箔の付着、すなわち食い付きの発生を防止する
ことができる。また、接合時の条件の最適範囲（圧、接
合エネルギー、目の範囲など）が広く、条件を容易に設
定できる。As described above, according to the present embodiment, the metal foil can be joined without generating a hole due to cut or tear in the metal foil. Therefore, it is useful for stable joining of ultra-thin sheets, and has a wide range of applications. In addition, the peel strength after joining can be improved, and the adhesion of the metal foil to the anvil, that is, the occurrence of biting can be prevented. In addition, the optimum range of the conditions for bonding (pressure, bonding energy, range of eyes, etc.) is wide, and the conditions can be easily set.
【００２９】なお、本発明は上述の実施例に限らず本発
明の要旨を逸脱することなくその他種々の構成を採り得
ることはもちろんである。It should be noted that the present invention is not limited to the above-described embodiment, but can adopt various other configurations without departing from the gist of the present invention.
【００３０】[0030]
【発明の効果】以上説明したように、本発明によれば、
金属箔に切れや破れによる孔を生ずることなく、金属箔
の接合をすることができるので、極薄シート同士の安定
した接合に有用であり、応用範囲が広いものとすること
ができる。また、接合後のはがし強度を向上させること
ができるとともに、アンビルへの金属箔の付着、すなわ
ち食い付きの発生を防止することができる。また、接合
時の条件の最適範囲（圧、接合エネルギー、目の範囲な
ど）が広く、条件を容易に設定できる。As described above, according to the present invention,
Since the metal foil can be joined without generating holes due to cuts or tears in the metal foil, it is useful for stable joining of ultrathin sheets and can be applied in a wide range of applications. In addition, the peel strength after joining can be improved, and the adhesion of the metal foil to the anvil, that is, the occurrence of biting can be prevented. In addition, the optimum range of the conditions for bonding (pressure, bonding energy, range of eyes, etc.) is wide, and the conditions can be easily set.
【図１】本発明金属箔の超音波接合方法に用いる全体装
置を示す斜視図である。FIG. 1 is a perspective view showing an entire apparatus used for an ultrasonic bonding method of a metal foil of the present invention.
【図２】本発明金属箔の超音波接合方法に用いるアンビ
ルの構造図である。FIG. 2 is a structural view of an anvil used in the ultrasonic bonding method of the metal foil of the present invention.
【図３】本発明金属箔の超音波接合方法に用いるホーン
の構造図である。FIG. 3 is a structural diagram of a horn used in the ultrasonic bonding method of the metal foil of the present invention.
【図４】本発明金属箔の超音波接合方法に用いるホーン
の構造図である。FIG. 4 is a structural diagram of a horn used in the ultrasonic bonding method of the metal foil of the present invention.
【図５】はがし強度の測定方法を示す斜視図である。FIG. 5 is a perspective view showing a method for measuring peel strength.
１ アンビル １ａ 加工面 ２ 金属箔 ３ リード（タブ） ４ 超音波ホーン ４ａ 加工面 ５ 超音波接合アクチュエータ DESCRIPTION OF SYMBOLS 1 Anvil 1a Processing surface 2 Metal foil 3 Lead (tab) 4 Ultrasonic horn 4a Processing surface 5 Ultrasonic bonding actuator
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) B23K 20/10 H01M 2/26 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) B23K 20/10 H01M 2/26
Claims (2)
重ね、その上から該アンビルの加工面に対して略平行に
振動する超音波ホーンの加工面を押し当てて、上記金属
箔と上記金属板とを接合する金属箔の超音波接合方法に
おいて、 上記アンビルの加工面はサンドブラスト処理された粗面
であり、 上記超音波ホーンの加工面は一定のピッチで加工された
凹凸の面であり、 上記金属箔はアンビルの加工面に配されて金属板と重ね
られ、金属板の金属箔と接しない面側から超音波ホーン
の加工面で押し当てられることを特徴とする金属箔の超
音波接合方法。A metal foil is overlapped with a metal plate on a processing surface of an anvil, and a processing surface of an ultrasonic horn vibrating substantially parallel to the processing surface of the anvil is pressed from above on the metal foil so as to be in contact with the metal foil. In the ultrasonic bonding method of metal foil for bonding to the metal plate, the processed surface of the anvil is a rough surface subjected to sandblasting, and the processed surface of the ultrasonic horn is an uneven surface processed at a constant pitch. The metal foil is arranged on the processing surface of the anvil, overlaps with the metal plate, and is pressed against the processing surface of the ultrasonic horn from the side of the metal plate that does not contact the metal foil. Sonic bonding method.
ことを特徴とする請求項１記載の金属箔の超音波接合方
法。2. The method according to claim 1, wherein the thickness of the metal foil is 5 μm to 30 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31347792A JP3218748B2 (en) | 1992-11-24 | 1992-11-24 | Ultrasonic bonding method for metal foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31347792A JP3218748B2 (en) | 1992-11-24 | 1992-11-24 | Ultrasonic bonding method for metal foil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06155051A JPH06155051A (en) | 1994-06-03 |
| JP3218748B2 true JP3218748B2 (en) | 2001-10-15 |
Family
ID=18041781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31347792A Expired - Lifetime JP3218748B2 (en) | 1992-11-24 | 1992-11-24 | Ultrasonic bonding method for metal foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3218748B2 (en) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3003917B2 (en) * | 1995-04-28 | 2000-01-31 | 矢崎総業株式会社 | Ultrasonic welding method |
| JPH09206963A (en) * | 1996-01-29 | 1997-08-12 | Yazaki Corp | Ultrasonic welding method |
| JP3099942B2 (en) * | 1996-08-08 | 2000-10-16 | 株式会社アルテクス | Ultrasonic vibration bonding resonator |
| JP3473512B2 (en) * | 1999-07-23 | 2003-12-08 | 株式会社デンソー | Ultrasonic bonding method |
| JP2008027831A (en) * | 2006-07-25 | 2008-02-07 | Matsushita Electric Ind Co Ltd | Battery |
| JP2009022977A (en) * | 2007-07-19 | 2009-02-05 | Nec Tokin Corp | Ultrasonic welding apparatus, and manufacturing method of lithium ion secondary battery using the same |
| JP5270910B2 (en) * | 2007-11-30 | 2013-08-21 | 古河電池株式会社 | Ultrasonic welding method of positive electrode current collector and tab for storage battery |
| JP2010274296A (en) * | 2009-05-27 | 2010-12-09 | Nissan Motor Co Ltd | Ultrasonic welding apparatus |
| JP5472687B2 (en) * | 2009-06-04 | 2014-04-16 | トヨタ自動車株式会社 | Secondary battery and manufacturing method thereof |
| CN101850469A (en) * | 2010-05-21 | 2010-10-06 | 严锦璇 | Wear-resisting ultrasonic welding mould and manufacturing method thereof |
| US8403019B2 (en) * | 2010-05-24 | 2013-03-26 | Lg Chem, Ltd. | Ultrasonic welding assembly and method of attaching an anvil to a bracket of the assembly |
| JP2013018003A (en) * | 2011-07-07 | 2013-01-31 | Hitachi Ltd | Metal-bonded structure and method for manufacturing the same |
| US20130213552A1 (en) * | 2012-02-20 | 2013-08-22 | Branson Ultrasonics Corporation | Vibratory welder having low thermal conductivity tool |
| DE112012006588T5 (en) | 2012-06-28 | 2015-04-02 | Toyota Jidosha Kabushiki Kaisha | Method for producing a battery and a battery |
| US9505082B2 (en) | 2012-08-28 | 2016-11-29 | Gs Yuasa International, Ltd. | Manufacturing method of electric storage apparatus and electric storage apparatus |
| DE102017215483B4 (en) * | 2017-09-04 | 2019-03-28 | Schunk Sonosystems Gmbh | Ultrasonic welding device |
| CN107931820A (en) * | 2017-11-17 | 2018-04-20 | 中山市电赢科技有限公司 | A kind of lithium battery double-position ultrasonic spot welder |
| CN110125531B (en) * | 2019-06-18 | 2024-05-07 | 珠海格力电器股份有限公司 | Welding device |
| CN110640293A (en) * | 2019-09-27 | 2020-01-03 | 联动天翼新能源有限公司 | Welding base capable of quickly changing surface and welding device |
-
1992
- 1992-11-24 JP JP31347792A patent/JP3218748B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06155051A (en) | 1994-06-03 |
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