JP2006297407A - Ultrasonic welding method - Google Patents

Ultrasonic welding method Download PDF

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JP2006297407A
JP2006297407A JP2005118557A JP2005118557A JP2006297407A JP 2006297407 A JP2006297407 A JP 2006297407A JP 2005118557 A JP2005118557 A JP 2005118557A JP 2005118557 A JP2005118557 A JP 2005118557A JP 2006297407 A JP2006297407 A JP 2006297407A
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horn
anvil
electrode tab
joined
contact
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JP4609169B2 (en
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Akira Shimizu
明 清水
Hidenobu Matsuyama
秀信 松山
Hitoshi Marukuni
等 丸國
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Nissan Motor Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a ultrasonic welding method that causes no crack on a workpiece during welding and that causes no crack or fracture either when a tension load or vibration is imparted to the workpiece to be welded. <P>SOLUTION: Electrode tabs 210A, 210B are clamped between an anvil 110 and a horn tip 150 in a manner that the tab 210A is in contact with the anvil 110 and that the tab 210B formed of a material harder than that of the tab 210A comes in contact with the horn tip 150, and after that, the tabs 210A and 210B are pressurized and vibrated by the horn tip 150 so as to weld them. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、アンビルと、当該アンビルに対向して配置されるホーンとを用いた超音波接合方法に関する。   The present invention relates to an ultrasonic bonding method using an anvil and a horn arranged to face the anvil.

超音波接合方法は、重ね合わせられた例えば２枚の金属板（同種または異種）を、表面に突起が設けられたアンビルおよびホーンと呼ばれる接合工具で挟み、所定の加圧力（把持力）を与えながら、ホーンを超音波振動により往復直線運動させて接合するものである（特許文献１および２参照）。   In the ultrasonic bonding method, for example, two stacked metal plates (same or different) are sandwiched between bonding tools called anvils and horns provided with protrusions on the surface, and given pressure (gripping force) is applied. However, the horn is joined by reciprocating linear motion by ultrasonic vibration (see Patent Documents 1 and 2).

超音波接合が施される際には、２枚の金属板の接触面が擦られることにより、酸化膜等の不純物が除去されて、金属の綺麗な面同士が相互に接触させられ、発生する摩擦熱により固相接合が行われる。
特開平９−２３９５６７号公報 特開平１０−２２５７７９号公報 When ultrasonic bonding is performed, the contact surfaces of the two metal plates are rubbed so that impurities such as oxide films are removed and the clean surfaces of the metal are brought into contact with each other. Solid phase bonding is performed by frictional heat.
JP-A-9-239567 Japanese Patent Laid-Open No. 10-225779

ところで、上記の超音波接合において、接合工具と金属板とを相互に固定すべく一体化させるために、アンビルとホーンに設けられた突起が金属板に加圧されて食い込ませられる。そして、ホーンの振動が金属材料へ効率よく伝達されるために、上記の２枚の金属板のうち柔らかい材料により形成された金属板がホーンに接触するように、アンビルとホーンとで２枚の金属板を挟み込むのが一般的である。   By the way, in the ultrasonic bonding described above, in order to integrate the bonding tool and the metal plate so as to be fixed to each other, the protrusions provided on the anvil and the horn are pressed against the metal plate and bite. Then, in order to efficiently transmit the vibration of the horn to the metal material, the anvil and the horn have two sheets so that the metal plate formed of a soft material out of the two metal sheets contacts the horn. It is common to sandwich a metal plate.

しかしながら、金属板を振動させる間、突起が金属板に加圧されたままの状態で加振させられるため、突起がさらに金属板に食い込んでいく現象により、接合工具の端面に沿った金属板の巻き上がりが生じ得る。この巻き上げられた金属板の湾曲した頂点部では、振動時の共振により接合中に亀裂が生じやすい。また、同じく上記の食い込みの現象により、突起周辺の金属板の板厚が薄くなり、接合が施された金属板の接合部に引張荷重や振動が加わると接合部に亀裂が発生し、場合によっては破断する虞がある。   However, while the metal plate is vibrated, the protrusions are vibrated while being pressed against the metal plate. Therefore, due to the phenomenon that the protrusions further bite into the metal plate, the metal plate along the end face of the welding tool Rolling up can occur. At the curved apex portion of the rolled up metal plate, cracks are likely to occur during joining due to resonance during vibration. Also, due to the above biting phenomenon, the thickness of the metal plate around the protrusion becomes thin, and if a tensile load or vibration is applied to the bonded portion of the bonded metal plate, a crack occurs in the bonded portion. May break.

本発明は、上記した課題を解決するためになされたものであり、本発明の目的は、接合中において被接合物に亀裂が生じることがなく、また、接合が施された被接合物に引張荷重や振動が加わったとしても亀裂や破断が生じることのない超音波接合方法を提供する。   The present invention has been made in order to solve the above-described problems. The object of the present invention is to prevent the object to be bonded from being cracked during bonding and to pull the object to be bonded. Provided is an ultrasonic bonding method that does not cause cracking or breaking even when a load or vibration is applied.

本発明の上記目的は、第１の被接合物をセットする第１のセット段階と、第１の被接合物よりも硬い材料により形成された第２の被接合物をセットする第２のセット段階と、前記第１の被接合物がアンビルに接触し、かつ前記第２の被接合物がホーンに接触するように、前記第１および第２の接合物を前記アンビルとホーンとで挟み込む挟み込み段階と、前記第１および第２の被接合物をホーンで加圧および加振することによって、前記第１と第２の被接合物とを接合する接合段階とを有する超音波接合方法によって達成される。   The object of the present invention is to set a first set stage for setting a first workpiece and a second set for setting a second workpiece formed of a material harder than the first workpiece. And sandwiching the first and second objects between the anvil and the horn so that the first object is in contact with the anvil and the second object is in contact with the horn. Achieved by an ultrasonic bonding method comprising: a step of bonding the first and second objects to be bonded by pressing and vibrating the first and second objects to be bonded with a horn. Is done.

本発明によれば、第１の被接合物よりも硬い材料により形成された第２の被接合物をホーンに接触するように、第１の被接合物および第２の被接合物をアンビルとホーンで挟み込んで超音波接合を行なう。これにより、ホーンが第２の被接合物に食い込むことがなく、被接合物に巻き上がりや板厚の減少が生じることが防止される。したがって、接合中において被接合物に亀裂が生じることがなく、また、接合が施された被接合物に引張荷重や振動が加わったとしても亀裂や破断が生じることがない。   According to the present invention, the first workpiece and the second workpiece are anvils so that the second workpiece formed of a material harder than the first workpiece is in contact with the horn. Ultrasonic bonding is performed by sandwiching with a horn. Thereby, the horn does not bite into the second object to be joined, and it is prevented that the object to be joined is rolled up or the plate thickness is reduced. Therefore, cracks do not occur in the objects to be bonded during bonding, and cracks and breaks do not occur even if a tensile load or vibration is applied to the objects to be bonded.

以下、本発明の実施の形態を、図面を参照して詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図１は、本発明の実施形態にかかる超音波接合装置の概略構成図であり、図２は、被接合物となる扁平形単電池の概略構成図であり、図３は、図１に示されるアンビルの平面図であり、図４は、図１に示されるホーンチップの平面図であり、図５は、本実施形態にかかる超音波接合装置で単電池の電極タブを接合している状態を示す図である。   FIG. 1 is a schematic configuration diagram of an ultrasonic bonding apparatus according to an embodiment of the present invention, FIG. 2 is a schematic configuration diagram of a flat unit cell to be bonded, and FIG. 3 is shown in FIG. 4 is a plan view of the horn chip shown in FIG. 1, and FIG. 5 is a state in which the electrode tabs of the unit cells are joined by the ultrasonic joining apparatus according to the present embodiment. FIG.

単電池２００は、図２に示すような矩形状の扁平形積層二次電池であり、少なくとも正極層と負極層を順に積層した積層型の電池要素２２０を含んでおり、例えば、特開２００３−０５９４８６号公報に開示されているような構造を持つものである。単電池２００はその外装材としてラミネートフィルムが用いられ、内蔵されている電池要素２２０は単電池２００の周縁部が熱融着接合されることで封止される。   The unit cell 200 is a rectangular flat stacked secondary battery as shown in FIG. 2 and includes a stacked battery element 220 in which at least a positive electrode layer and a negative electrode layer are sequentially stacked. It has a structure as disclosed in Japanese Patent No. 059486. The unit cell 200 uses a laminate film as an exterior material, and the built-in battery element 220 is sealed by heat-sealing the peripheral portion of the unit cell 200.

単電池２００の長手方向両側面からは電極タブ２１０Ａ（第１の被接合物）、電極タブ２１０Ｂ（第２の被接合物）が引き出されており、電極タブ２１０Ａは＋の電極タブでありアルミニウム箔で構成されている。一方、電極タブ２１０Ｂは−の電極タブであり、アルミニウム箔よりも硬い材料である銅箔で構成されている。   An electrode tab 210A (first object to be joined) and an electrode tab 210B (second object to be joined) are drawn out from both side surfaces of the unit cell 200 in the longitudinal direction. The electrode tab 210A is a positive electrode tab and is made of aluminum. Consists of foil. On the other hand, the electrode tab 210B is a negative electrode tab, and is made of a copper foil which is a material harder than the aluminum foil.

本実施形態においては、単電池を２個背中合わせ（両単電池の電池要素による膨出部が外側に向くように合わせる）にし、それぞれの単電池の片方の＋の電極タブ２１０Ａと−の電極タブ２１０Ｂとを超音波接合する。   In this embodiment, two unit cells are back-to-back (matching so that the bulging portions of the unit cells of both unit cells face outward), and the positive electrode tab 210A and the negative electrode tab on one side of each unit cell. 210B is ultrasonically bonded.

図１に示すように、本実施形態における超音波接合装置１００は、被接合物である電極タブ２１０Ａ，２１０Ｂを載置するアンビル１１０と、下部に着脱自在に取り付けられたホーンチップ１５０を、電極タブ２１０Ａ，２１０Ｂを介在させた状態でアンビル１１０上に図示Ｃ方向に加圧させ、加圧させたままホーンチップ１５０を図示Ａ−Ｂ方向に超音波振動させるホーン１４０とを備えている。   As shown in FIG. 1, an ultrasonic bonding apparatus 100 according to this embodiment includes an anvil 110 on which electrode tabs 210A and 210B, which are objects to be bonded, and a horn chip 150, which is detachably attached to the lower part, A horn 140 is provided that pressurizes the anvil 110 in the direction C in the figure with the tabs 210A and 210B interposed therebetween, and causes the horn chip 150 to ultrasonically vibrate in the direction AB in the figure while being pressurized.

アンビル１１０は、冶具ベース１６０に取り付けられている。また、アンビル１１０の表面には、電極タブ２１０Ｂに接触し得る第１の面１１１が形成され、さらに図３および図５に示すように、第１の面１１１には複数の突起１１２，１１３が設けられる。   The anvil 110 is attached to the jig base 160. Further, a first surface 111 capable of contacting the electrode tab 210B is formed on the surface of the anvil 110, and a plurality of protrusions 112 and 113 are formed on the first surface 111 as shown in FIGS. Provided.

ホーンチップ１５０の表面には、電極タブ２１０Ｂに接触し得る第１の面１１１よりも小さな面積を有する第２の面１５１が形成される。さらに第２の面１５１には、図４および図５に示すように電極タブ２１０Ａに接触可能な複数の突起１５２，１５３が設けられる。   On the surface of the horn chip 150, a second surface 151 having an area smaller than that of the first surface 111 capable of contacting the electrode tab 210B is formed. Furthermore, as shown in FIGS. 4 and 5, the second surface 151 is provided with a plurality of protrusions 152 and 153 that can contact the electrode tab 210 </ b> A.

図２に示す×印は、アンビル１１０およびホーンチップ１５０の突起が当接される箇所を示している。これらの突起が被接合物である電極タブ２１０Ａ，２１０Ｂに加圧されて食い込むことにより、アンビル１１０およびホーンチップ１５０と電極タブ２１０Ａ、２１０Ｂとをそれぞれ相互に固定して一体化させることができる。   The crosses shown in FIG. 2 indicate the locations where the projections of the anvil 110 and the horn chip 150 are in contact. These protrusions are pressed into the electrode tabs 210A and 210B, which are objects to be joined, so that the anvil 110 and the horn chip 150 and the electrode tabs 210A and 210B can be fixed and integrated with each other.

また、本実施形態では、上述したホーン１４０の加圧および振動時において、アンビル１１０およびホーンチップ１５０による電極タブ２１０Ａ，２１０Ｂに対する把持領域の外周部における把持力が、当該把持領域の内側部における把持力よりも小さく設定される。この設定を可能とする構成について、以下に具体的に述べる。   In the present embodiment, when the horn 140 is pressed and vibrated as described above, the gripping force at the outer peripheral portion of the gripping region with respect to the electrode tabs 210A and 210B by the anvil 110 and the horn chip 150 is gripped at the inner portion of the gripping region. Set smaller than force. The configuration that enables this setting will be specifically described below.

図３に示すように、アンビル１１０の第１の面１１１に設けられる複数の突起のうち、外周部の突起１１２の形成間隔が、内側部の突起１１３の形成間隔よりも大きく設定される。そして、図５に示すように、突起１１２は例えば三角錐形状を呈し、突起１１３は例えば四角錐形状を呈する。   As shown in FIG. 3, among the plurality of protrusions provided on the first surface 111 of the anvil 110, the formation interval of the protrusions 112 on the outer peripheral portion is set larger than the formation interval of the protrusions 113 on the inner portion. As shown in FIG. 5, the protrusion 112 has a triangular pyramid shape, for example, and the protrusion 113 has a quadrangular pyramid shape, for example.

また、ホーンチップ１５０についても、図４に示すように、ホーンチップ１５０の第２の面１５１に設けられる複数の突起のうち、外周部の突起１５２の形成間隔が、内側部の突起１５３の形成間隔よりも大きく設定される。そして、図５に示すように、突起１５２は例えば三角錐形状を呈し、突起１５３は例えば四角錐形状を呈する。   As for the horn chip 150, as shown in FIG. 4, among the plurality of protrusions provided on the second surface 151 of the horn chip 150, the interval between the protrusions 152 on the outer peripheral portion is the formation of the protrusion 153 on the inner portion. It is set larger than the interval. As shown in FIG. 5, the protrusion 152 has a triangular pyramid shape, for example, and the protrusion 153 has a quadrangular pyramid shape, for example.

ただし、第１の面１１１および第２の面１５１のいずれか一方の外周部の突起の形成間隔が、内側部の突起の形成間隔よりも大きく設定されていてもよい。また、外周部の突起の形成間隔の寸法は任意であり、図３および４に示すように突起１個分の間隔に限定されるものではない。   However, the formation interval of the protrusions on the outer periphery of either the first surface 111 or the second surface 151 may be set larger than the formation interval of the protrusions on the inner side. Moreover, the dimension of the formation interval of the protrusions on the outer peripheral portion is arbitrary, and is not limited to the interval of one protrusion as shown in FIGS.

次に、超音波接合装置１００を使用して、２個の単電池を超音波接合する場合について説明する。   Next, the case where two unit cells are ultrasonically bonded using the ultrasonic bonding apparatus 100 will be described.

まず、図２に示すように、単電池２００の＋の電極タブ２１０Ａと、別の単電池２００の−の電極タブ２１０Ｂとが重ねられるようにセットされる。次に、図５に示すように、電極タブ２１０Ａがアンビル１１０に接触し、かつ電極タブ２１０Ｂがホーンチップ１５０に接触するように、電極タブ２１０Ａ，２１０Ｂをアンビル１１０とホーンチップ１５０とで挟み込む。より具体的には、電極タブ２１０Ａおよび電極タブ２１０Ｂが、第１の面１１１および第２の面１５１にそれぞれ接触し、かつ第１の面１１１をホーンチップ１５０が配置される方向へ投影した領域内に第２の面１５１が位置するように、電極タブ２１０Ａおよび電極タブ２１０Ｂをアンビル１１０とホーンチップ１５０とで挟み込む。   First, as shown in FIG. 2, the positive electrode tab 210A of the unit cell 200 and the negative electrode tab 210B of another unit cell 200 are set so as to overlap each other. Next, as shown in FIG. 5, the electrode tabs 210 </ b> A and 210 </ b> B are sandwiched between the anvil 110 and the horn tip 150 so that the electrode tab 210 </ b> A contacts the anvil 110 and the electrode tab 210 </ b> B contacts the horn tip 150. More specifically, the electrode tab 210A and the electrode tab 210B are in contact with the first surface 111 and the second surface 151, respectively, and the first surface 111 is projected in the direction in which the horn chip 150 is disposed. The electrode tab 210A and the electrode tab 210B are sandwiched between the anvil 110 and the horn chip 150 so that the second surface 151 is located inside.

上記のように挟み込んだ後、ホーンチップ１５０により、電極タブ２１０Ｂの上から垂直下方の加圧力が与えられる。また、この加圧力を調整することによって、ホーンチップ１５０の振動は電極タブ２１０Ａ，２１０Ｂに効率よく伝達される。   After sandwiching as described above, the horn chip 150 applies a vertically downward pressing force from above the electrode tab 210B. Further, by adjusting the pressure, the vibration of the horn tip 150 is efficiently transmitted to the electrode tabs 210A and 210B.

続いて、垂直下方の加圧力が与えられながら、ホーンチップ１５０が図示のＡ−Ｂ方向に超音波振動させられる。そして、超音波振動により発生する摩擦熱によって、電極タブ２１０Ａと電極タブ２１０Ｂとが固相接合される。   Subsequently, the horn tip 150 is ultrasonically vibrated in the AB direction shown in the drawing while a vertical downward pressure is applied. The electrode tab 210A and the electrode tab 210B are solid-phase bonded by frictional heat generated by ultrasonic vibration.

以上のように、本実施形態によれば、電極タブ２１０Ａよりも硬い材料から形成された電極タブ２１０Ｂをホーンチップ１５０と接触するように電極タブ２１０Ａ，２１０Ｂをホーンチップ１５０とアンビル１１０とで挟み込んだ状態で、電極タブ２１０Ａと２１０Ｂとを接合する。これにより、ホーンチップ１５０は、硬く食い込み難い部材である電極タブ２１０Ｂと接触しながら振動するため、ホーンチップ１５０が電極タブ２１０Ｂに食い込むことがなく、電極タブ２１０Ａ，２１０Ｂに巻き上がりや板厚の減少が生じることが防止される。したがって、接合中において電極タブ２１０Ａ，２１０Ｂに亀裂が生じることがなく、また、接合が施された電極タブ２１０Ａ，２１０Ｂに引張荷重や振動が加わったとしても亀裂や破断が生じることがない。   As described above, according to the present embodiment, the electrode tabs 210A and 210B are sandwiched between the horn tip 150 and the anvil 110 so that the electrode tab 210B formed of a material harder than the electrode tab 210A contacts the horn tip 150. In this state, the electrode tabs 210A and 210B are joined. As a result, the horn tip 150 vibrates while being in contact with the electrode tab 210B, which is a hard and hard to bite member, so that the horn tip 150 does not bite into the electrode tab 210B, and the electrode tabs 210A and 210B roll up or have a plate thickness. Reduction is prevented from occurring. Therefore, the electrode tabs 210A and 210B are not cracked during joining, and even if a tensile load or vibration is applied to the joined electrode tabs 210A and 210B, no cracks or breaks occur.

また、上記のように硬い材料から形成された電極タブ２１０Ｂがホーンチップ１５０と接触する状態で接合を行なったとしても、第１の面１１１と第２の面１５１とが同一の形状である場合には、電極タブ２１０Ａがホーン１４０からの圧力によりアンビル１１０の周辺から下側に垂れ下がるように伸びる現象が生じ得る。かかる現象が生じたときには、電極タブ２１０Ａの板厚が薄くなり、接合中に電極タブ２１０Ａに亀裂が生じ得る。さらに、上記の現象が生じた状態で接合が施された電極タブ２１０Ａと電極タブ２１０Ｂとの接合部に引張荷重や振動が加わると、当該接合部に亀裂や破断が生じ得る。これに対して、本実施形態では、上述したように第１の面１１１および第２の面１５１について面積や接合中の位置を調整することによって、電極タブ２１０Ａは、電極タブ２１０Ｂとアンビル１１０とに挟まれた状態で電極タブ２１０Ｂに接合される。これにより、電極タブ２１０Ａが垂れ下がるように伸びることは防止されて、接合中における電極タブ２１０Ａに亀裂が生じることや、接合が施された電極タブ２１０Ａと電極タブ２１０Ｂとの接合部に亀裂や破断が生じることは防止される。   In addition, even when the electrode tab 210B formed of a hard material as described above is bonded in a state where the electrode tab 210B is in contact with the horn chip 150, the first surface 111 and the second surface 151 have the same shape. In this case, a phenomenon may occur in which the electrode tab 210 </ b> A extends so as to hang down from the periphery of the anvil 110 due to pressure from the horn 140. When such a phenomenon occurs, the plate thickness of the electrode tab 210A decreases, and the electrode tab 210A may crack during bonding. Further, when a tensile load or vibration is applied to the joint between the electrode tab 210A and the electrode tab 210B that are joined in the state where the above phenomenon occurs, the joint may be cracked or broken. On the other hand, in the present embodiment, as described above, by adjusting the area and the position during bonding with respect to the first surface 111 and the second surface 151, the electrode tab 210A has the electrode tab 210B, the anvil 110, and the like. The electrode tab 210B is bonded to the electrode tab 210B. Accordingly, the electrode tab 210A is prevented from extending so as to hang down, and the electrode tab 210A is cracked during bonding, or the bonded portion between the electrode tab 210A and the electrode tab 210B that has been bonded is cracked or broken. Is prevented from occurring.

また、接合が施された電極タブ２１０Ａと電極タブ２１０Ｂとの接合部に引張荷重や振動等による外力が加わった場合、まず当該接合部の最外周の部分に外力が集中して作用する。しかし、本実施形態によれば、ホーンチップ１５０の加圧および振動時において、アンビル１１０およびホーンチップ１５０による電極タブ２１０Ａ，２１０Ｂに対する把持領域の外周部における把持力は、当該把持領域の内側部における把持力よりも小さく設定される。これにより、ホーンチップ１５０の加圧による応力は内側部よりも外周部で小さくなる。この結果、前記把持領域における外周部の板厚の減少量を内側部の板厚の減少量よりも低く抑えることができ、外力が集中する部分の板厚を適切に確保することができる。したがって、外力が集中する部分に発生する応力は小さくなり、接合部全体の強度を従来よりも向上させることができる。特に低荷重の繰り返し入力などに対する疲労強度の向上に効果的である。また、突起により形成される圧痕同士の間隔が外周部では大きくなるため、隣接する圧痕に破断現象が連鎖的に繋がって発生する虞も防止可能となる。   Further, when an external force due to a tensile load, vibration, or the like is applied to the joint between the electrode tab 210A and the electrode tab 210B that have been joined, the external force first acts on the outermost peripheral portion of the joint. However, according to the present embodiment, when the horn tip 150 is pressurized and vibrated, the gripping force in the outer peripheral portion of the grip region with respect to the electrode tabs 210A and 210B by the anvil 110 and the horn tip 150 is the inner portion of the grip region. It is set smaller than the gripping force. Thereby, the stress by pressurization of the horn chip 150 becomes smaller in the outer peripheral portion than in the inner portion. As a result, the amount of decrease in the thickness of the outer peripheral portion in the gripping region can be suppressed to be lower than the amount of decrease in the thickness of the inner portion, and the thickness of the portion where the external force is concentrated can be appropriately ensured. Therefore, the stress generated in the portion where the external force is concentrated is reduced, and the strength of the entire joint can be improved as compared with the conventional case. In particular, it is effective for improving fatigue strength against repeated input of low load. In addition, since the interval between the indentations formed by the protrusions is increased at the outer peripheral portion, it is possible to prevent the possibility that the breaking phenomenon is connected to adjacent indentations in a chained manner.

本発明は、上記した実施形態のみに限定されるものではなく、特許請求の範囲内において、種々改変することができる。   The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims.

たとえば、上記実施形態において、被溶接物の例として単電池の電極タブを挙げたが、被溶接物はこれに限られるものではない。また、アンビルおよびホーンのホーンチップに設けられる突起の形状も、図面に示したものに限られず任意の形状を呈し得る。さらに、上記した複数の実施形態における突起の構成のいずれか２つ以上を組み合わせて実施することも可能である。   For example, in the above-described embodiment, the electrode tab of the unit cell is given as an example of the workpiece, but the workpiece is not limited to this. Further, the shape of the protrusion provided on the horn tip of the anvil and the horn is not limited to that shown in the drawings, and may take an arbitrary shape. Furthermore, any two or more of the configurations of the protrusions in the plurality of embodiments described above can be combined.

本発明の実施形態にかかる超音波接合装置の概略構成図である。1 is a schematic configuration diagram of an ultrasonic bonding apparatus according to an embodiment of the present invention. 被接合物となる扁平形単電池の概略構成図である。It is a schematic block diagram of the flat unit cell used as a to-be-joined object. 図１に示されるアンビルの平面図である。It is a top view of the anvil shown by FIG. 図１に示されるホーンチップの平面図である。It is a top view of the horn chip | tip shown by FIG. 本実施形態にかかる超音波接合装置で単電池の電極タブを接合している状態を示す図である。It is a figure which shows the state which has joined the electrode tab of the cell with the ultrasonic bonding apparatus concerning this embodiment.

符号の説明Explanation of symbols

１１０ アンビル、
１１１ 第１の面、
１１２，１５２，１１３，１５３ 突起、
１４０ ホーン、
１５０ ホーンチップ、
１５１ 第２の面、
２１０Ａ，２１０Ｂ 電極タブ。 110 Anvil,
111 the first surface,
112, 152, 113, 153 protrusions,
140 horn,
150 horn chips,
151 second side,
210A, 210B Electrode tab.

Claims (4)

第１の被接合物をセットする第１のセット段階と、
第１の被接合物よりも硬い材料により形成された第２の被接合物をセットする第２のセット段階と、
前記第１の被接合物がアンビルに接触し、かつ前記第２の被接合物がホーンに接触するように、前記第１および第２の接合物を前記アンビルとホーンとで挟み込む挟み込み段階と、
前記第１および第２の被接合物をホーンで加圧および加振することによって、前記第１と第２の被接合物とを接合する接合段階と、
を有する超音波接合方法。 A first setting stage for setting a first object to be joined;
A second setting step of setting a second workpiece formed of a material harder than the first workpiece;
A sandwiching step of sandwiching the first and second joints between the anvil and the horn so that the first joint is in contact with the anvil and the second joint is in contact with the horn;
A joining step of joining the first and second objects to be joined by pressurizing and vibrating the first and second objects to be joined with a horn;
An ultrasonic bonding method. 前記アンビルの表面には第１の被接合物に接触し得る第１の面が形成され、前記ホーンの表面には第２の被接合物に接触し得る第１の面よりも小さな面積を有する第２の面が形成され、
前記挟み込み段階において、前記第１および第２の被接合物が第１および第２の面にそれぞれ接触し、かつ前記第２の面を前記ホーンが配置される方向へ投影した領域内に前記第１の面が位置するように、前記第１および第２の接合物を前記アンビルとホーンとで挟み込むことを特徴とする請求項１に記載の超音波接合方法。 A first surface that can contact a first object to be bonded is formed on the surface of the anvil, and the surface of the horn has a smaller area than the first surface that can contact a second object to be bonded. A second surface is formed,
In the sandwiching step, the first and second objects to be joined are in contact with the first and second surfaces, respectively, and the second surface is projected in a region in which the horn is disposed. The ultrasonic bonding method according to claim 1, wherein the first and second bonded objects are sandwiched between the anvil and the horn so that the first surface is located. 前記接合段階において、前記アンビルおよび前記ホーンによる前記第１および第２の被接合物に対する把持領域の外周部における把持力を、当該把持領域の内側部における把持力よりも小さく設定したことを特徴とする請求項１または２に記載の超音波接合方法。   In the joining step, the gripping force at the outer peripheral portion of the gripping area for the first and second objects to be joined by the anvil and the horn is set to be smaller than the gripping force at the inner part of the gripping area. The ultrasonic bonding method according to claim 1 or 2. 前記第１の面および前記第２の面には、被接合物に接触可能な複数の突起がそれぞれ設けられ、
前記第１の面と前記第２の面との少なくとも一方に設けられる複数の突起のうち、外周部の突起の形成間隔を、内側部の突起の形成間隔よりも大きく設定したことを特徴とする請求項３に記載の超音波接合方法。 The first surface and the second surface are each provided with a plurality of protrusions that can contact an object to be joined,
Of the plurality of protrusions provided on at least one of the first surface and the second surface, the formation interval of the protrusions on the outer peripheral portion is set larger than the formation interval of the protrusions on the inner side portion. The ultrasonic bonding method according to claim 3.
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