JPH11220057A - Bga package and temperature measuring method of semiconductor chip in package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to perform the electric measurement at an arbitrary position on a circuit substrate, by providing through holes reaching the conducting part of the circuit substrate through a fixing member from a cover plate. SOLUTION: A stiffener 19 is bonded to the upper surface of a polyimide tape at the surrounding part of a semiconductor chip 16 by insulating adhesive agent 18. Furthermore, a cover plate 21 is bonded on the upper surface of the stiffener 19 and the semiconductor chip 16e by insulating adhesive agent 20. Then, through holes 22 and 23 reaching a copper foil 14 of the stiffener 19 are formed on both sides of the semiconductor chip 16 through the stiffener 19 from the semiconductor chip 16s. In the TBGA package in this structure, contact is performed for parts P1 and P2 of the copper foil 14 of a polyimide tape 10, which is electrically connected to the semiconductor chip 16, by way of the through holes 22 and 23 with a needle-shaped measuring terminal from the upper side of the package. The potential measurement and the like of the arbitrary copper foil 14 on the polyimide tape 10 can be performed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a BGA package connected to a PCB substrate or the like via solder balls,
The present invention relates to a method for measuring a temperature of a semiconductor chip in a package for measuring a temperature of a chip in a C package.

[0002]

2. Description of the Related Art Conventionally, as a typical surface mount type package, a QFP (Quad Flat Packa) has been used.
ge) and the like, and in recent years, demands for lower price, smaller size and thinner, more pins, and higher heat radiation have led to fine pitch of package leads. However, it is difficult to mount a fine pitch QFP, and
The demand for a GA (Ball Grid Array) package is increasing.

[0003] The ease of mounting a BGA package is such that even if the package and the PCB board are slightly displaced, the package is automatically moved to the correct position if the solder balls are melted by applying heat during mounting (self-alignment). : Self Al
ignition) point.

[0004] The BGA package is made up of PBGA (plastic BGA), CB
GA (ceramic BGA) and TBGA (tape BG
A) and so on. Of these, PBGA and CBG
A is an IC chip and PC using wire bonding technology.
While connecting the B board or the ceramic board, TB
GA is TAB (Tape Automated Bo)
nding) technology. TBGA is TAB
By using the technology, it is possible to narrow a wiring interval drawn from a chip, to realize a small chip size and a multi-pin package, and to obtain a cost advantage by downsizing the chip.

FIGS. 8 (a), 8 (b) and 8 (c) show a conventional T
FIGS. 3A and 3B are diagrams showing the structure of a BGA package, wherein FIG. 3A is a cross-sectional view thereof, and FIGS.

As shown in FIG. 8A, a polyimide tape 110 is composed of a tape body 111 having copper foils 114 formed on both sides in a pattern, and resists 112 and 113. Solder balls are provided on the bottom surface of the polyimide tape 110. 11
5 is attached. A semiconductor chip 116 is mounted at the center of the upper surface of the polyimide tape 110. Further, a semiconductor chip 116 is molded with a resin 117 on the bottom surface side of the polyimide tape 110.

A stiffener 119 is adhered to the upper surface of the polyimide tape 110 around the semiconductor chip 116 by an adhesive 118, and a cover plate 121 is adhered to the stiffener 119 and the upper surface of the semiconductor chip 116 by an adhesive 120. .

[0008]

The above-mentioned conventional BGA package has the following problems.

(1) In the structure of the TBGA package, only one cover plate 121 and one stiffener 119 are connected with insulating adhesives 120 and 118, respectively.
Is in a floating state. Therefore, it is difficult to adjust the shielding effect and the characteristic impedance of the package.

(2) It is difficult to make electrical measurement because it is not possible to contact a portion electrically connected to the IC chip 116 from above the package.

(3) Since all the solder balls 115 are arranged on the bottom surface of the package, they cannot contact the pins of the package like QFP after mounting, and it is difficult to measure the potential.

In addition, the conventional IGA including the BGA package
For the C package, there was no effective way to directly measure the chip temperature inside the package.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a BGA package which enables electrical measurement of an arbitrary portion on a circuit board. is there. Another object is to make it easy to adjust the shielding effect and characteristic impedance by contacting an arbitrary part on the circuit board from above the package.
To provide a GA package. Still another object is to provide a method of measuring the temperature of a semiconductor chip in a package that can easily measure the temperature of the semiconductor chip in the IC package even after mounting.

[0014]

In order to achieve the above object, the first aspect of the BGA package according to the present invention is characterized in that a solder ball mounted for connection to an external circuit and a mounting surface of the solder ball opposite to the solder ball are provided. A circuit board for electrically connecting the semiconductor chip mounted on the side, a fixing plate member for fixing the circuit board by being adhered to the circuit board with an insulating adhesive, the semiconductor chip and the A cover plate adhered to the surface of the fixing plate member with an insulating adhesive, and the semiconductor chip is resin-sealed on the opposite side of the cover plate. And one or more through-holes reaching the conductive portion of the circuit board through the hole.

According to the first aspect, it is possible to make contact with the conductive portion on the circuit board electrically connected to the semiconductor chip through the through hole from above the package.

A feature of the BGA package according to the second invention is that a solder ball mounted for connection to an external circuit is electrically connected to a semiconductor chip mounted on a side opposite to a mounting surface of the solder ball. A circuit board to be fixed, a conductive fixing plate member bonded to the circuit board with an insulating adhesive to fix the circuit board, and an insulating adhesive on surfaces of the semiconductor chip and the fixing plate member. A BGA package in which the semiconductor chip is resin-sealed on the side opposite to the cover plate, wherein a hole reaching the fixing plate member is provided on the cover plate, and the fixing plate The member is provided with a convex portion that contacts the conductive portion of the circuit board.

According to the second aspect, the fixing plate member electrically connected to the conductive portion on the circuit board functions as an independent electrode, and the fixing plate member comes into contact with the fixing plate member from above the package. it can.

A feature of the BGA package according to the third invention is that a solder ball mounted for connection to an external circuit is electrically connected to a semiconductor chip mounted on a side opposite to a mounting surface of the solder ball. A circuit board to be fixed, a conductive fixing plate member bonded to the circuit board with an insulating adhesive to fix the circuit board, and an insulating adhesive on surfaces of the semiconductor chip and the fixing plate member. In a BGA package having a conductive cover plate adhered in the above, and the semiconductor chip is resin-sealed on the opposite side of the cover plate, the cover plate is provided with a convex portion abutting on the fixing plate. According to another aspect of the present invention, the fixing plate is provided with a convex portion that comes into contact with a conductive portion of the circuit board.

According to the third aspect, the cover plate electrically connected to the conductive portion on the circuit board can function as an independent electrode, and can contact the cover plate from above the package.

A feature of the BGA package according to the fourth invention is that a solder ball mounted for connection to an external circuit is electrically connected to a semiconductor chip mounted on a side opposite to a mounting surface of the solder ball. A circuit board to be fixed, a fixing plate member that is bonded on the circuit board with an insulating adhesive to fix the circuit board, and a semiconductor chip and a surface of the fixing plate member that are bonded to each other with an insulating adhesive. A BGA package in which the semiconductor chip is resin-sealed on the opposite side of the cover plate, wherein the fixing plate member has a through hole, and the cover plate has the through hole. There is provided a convex portion which passes through the hole and directly contacts the conductive portion of the circuit board.

According to the fourth aspect, the cover plate electrically connected to the conductive portion on the circuit board can function as an independent electrode, and can contact the cover plate from above the package.

A fifth aspect of the present invention is a method for measuring the temperature of a semiconductor chip in a package, wherein an IC package for sealing a semiconductor chip on a circuit board includes a semiconductor element for temperature measurement incorporated in the semiconductor chip. Providing at least two connection means for electrically connecting to a conductive portion on the circuit board from above the IC package, further setting a relationship between an ambient temperature and an electric resistance value of the semiconductor element, And measuring the electrical resistance of the semiconductor element via the connection means in a state where the device is operated.

According to the fifth aspect, the electric resistance of the semiconductor element for temperature measurement is measured by electrically connecting to the conductive portion on the circuit board from above the IC package via the connecting means. Accordingly, the temperature of the semiconductor chip in the IC package can be accurately measured without using signal pins or solder balls.

[0024]

Embodiments of the present invention will be described below with reference to the drawings. 1A, 1B, and 1C are structural views of a TBGA package according to a first embodiment of the present invention. FIG. 1A is a sectional view, and FIGS. FIG.

As shown in FIG. 1A, the polyimide tape 10 includes a tape body 11 having copper foils 14 formed on both sides in a pattern, and resists 12 and 13 covering the tape body 11 and the copper foil 14. On the bottom surface of the polyimide tape 10, a solder ball 15 is attached. A semiconductor chip 16 is provided at the center of the upper surface of the polyimide tape 10.
Are mounted face down, and each electrode of the semiconductor chip 16 is connected to the tape body 11 so as to form a predetermined electric circuit. Further, a semiconductor chip 16 is molded with a resin 17 on the bottom surface side of the polyimide tape 10.

A stiffener 19 is adhered to the upper surface of the polyimide tape 10 around the semiconductor chip 16 with an insulating adhesive 18. Further, a cover plate 21 is attached to the stiffener 19 and the upper surface of the semiconductor chip 16 with an insulating adhesive 20. Glued. In the figure, 16A is the semiconductor chip 16, the stiffener 19 and the cover plate 2.
1 is a void formed by Through holes 22 and 23 are formed on both sides of the semiconductor chip 16 from the semiconductor chip 16 to the copper foil 14 of the stiffener 19 via the stiffener 19.

FIGS. 2A to 2E show the steps of assembling the TBGA package having such a structure.

As shown in FIGS. 1B and 1C,
Holes 22 and 23 of the same size are provided at the same position on the stiffener 19 and the cover plate 21.

First, the face-down semiconductor chip 16
Is pressed onto the polyimide tape 10 (FIG. 2A),
The semiconductor chip 16 is molded with a resin 17 on the bottom side of the polyimide tape 10 (FIG. 2B). Then
The stiffener 19 provided with the holes 22 and 23 is
To adhere to the upper surface of the polyimide tape 10 (FIG. 2 (c)),
Further, the cover plate 21 provided with the holes 22 and 23 is bonded to the upper surface of the stiffener 19 with an adhesive 20 (FIG. 2D). At this time, positioning is performed so that the stiffener 19 and the holes 22 and 23 of the cover plate 21 overlap.

Finally, if the solder balls 15 are attached to the bottom surface of the polyimide tape 10, the TBG having the structure shown in FIG.
An A package is obtained (FIG. 2E).

According to the TBGA package having the above structure,
The through holes 2 are formed in portions P1 and P2 of the copper foil 14 of the polyimide tape 10 electrically connected to the semiconductor chip 16.
Through the needles 2 and 23, the needle-like measuring terminal can make contact from above the package. Thus, the present embodiment has the following advantages.

(1) Electrical measurement such as potential measurement of an arbitrary copper foil 14 on the polyimide tape 10 is possible. This is possible even after the package is mounted on a PCB substrate or the like.

(2) Since it is not necessary to contact the signal pins, the potentials of the terminals not connected to the signal pins on the semiconductor chip 16 can be measured on the polyimide tape 10, the stiffener 19 and the cover plate 21, A plurality of measurement or test terminals for elements other than the functions originally required of the IC can be provided without using signal pins.

(3) If there are at least two electrodes, it is possible to easily measure the temperature of the semiconductor chip 16 even after mounting using elements on the semiconductor chip 16.

With respect to the advantage of (3), specific examples (A),
(B) will be described.

(A) A semiconductor device such as a diode is formed on a semiconductor chip 16 for use in temperature measurement. Furthermore, the relationship between the ambient temperature and the electric resistance of the semiconductor element is recorded in advance.If the ambient temperature is changed, allow sufficient time for the electric resistance to be recorded. Be careful to record the electrical resistance value. Actually, the temperature of the semiconductor chip 16 can be known by measuring the electric resistance of the semiconductor element while the IC is operated.

(B) A thermocouple element is formed on the semiconductor chip 16 in advance, and the temperature is measured.

In any case, two or more measuring terminals are required outside the package to electrically measure the temperature.

If balls or pins of the IC package are used as terminals for temperature measurement, several balls / lead are wasted. Also, after mounting the IC package, it is difficult or impossible to contact the ball / lead with a needle-like measuring terminal (the lead of the QFP is thin and the lead pitch is narrow). Therefore, it is necessary to prepare temperature measurement wiring and terminals on the substrate on which the IC package is mounted.

In the present invention, since the measurement terminals can be contacted from above the package, this type of temperature measurement can be easily performed without using a ball (BGA) or a signal pin (QFP). .

Next, a second embodiment of the present invention will be described.

FIGS. 3A, 3B and 3C are structural views of a TBGA package according to a second embodiment of the present invention. FIG. 3A is a sectional view, and FIG. 1C is a top view of the cover plate, and the same elements as those in FIG. 1 are denoted by the same reference numerals and description thereof will be omitted.

In this embodiment, a plurality of divided stiffeners 19A are provided with convex portions 19a and 19b, respectively, and the cover plate 21 is provided with holes at positions corresponding to the upper portions of the convex portions 19a and 19b of the stiffener 19A in advance. 22,2
3 is provided.

When assembling by crimping, the stiffener 1
The convex portions 19a and 19b of 9A break through the adhesive 18 connecting the polyimide tape 10 and the stiffener 19, and come into contact with the portions P1 and P2 of the polyimide tape 10 electrically connected to the semiconductor chip 16. Accordingly, the stiffener 19A electrically connected to the portion P1 of the polyimide tape 10 can function as a plurality of independent electrodes, and can contact the stiffener 19A from above the package.

This embodiment has the same advantages as the first embodiment, and also facilitates the adjustment of the shielding effect and the characteristic impedance of the package.

Next, a third embodiment of the present invention will be described.

FIGS. 4A, 4B, and 4C are structural views of a TBGA package according to a third embodiment of the present invention. FIG. 4A is a sectional view, and FIG. 1C is a top view of the cover plate, and the same elements as those in FIG. 1 are denoted by the same reference numerals and description thereof will be omitted.

In the present embodiment, the divided stiffener 19A and the divided cover plate 2
Each of the convex portions 19a, 19b, 21a,
21b is provided.

At the time of assembly by crimping, the convex portions 21a and 21b of the cover plate 21A break through the adhesive 20 connecting the stiffener 19A and the cover plate 21A and come into contact with the stiffener 19A.
Of the polyimide tape 1 electrically connected to the semiconductor chip 16 by breaking through the adhesive 18 connecting the polyimide tape 10 and the stiffener 19A.
Touch the conductive part on 0. Thereby, the cover plate 2 electrically connected to the conductive portion of the polyimide tape 10
1A can function as a plurality of independent electrodes, and can contact the cover plate 21A from above the package.

This embodiment has the same advantages as the second embodiment.

Next, a fourth embodiment of the present invention will be described.

FIG. 5 shows a TB according to a fourth embodiment of the present invention.
FIG. 2 is a structural diagram of a GA package, in which components common to FIG. 1 are denoted by the same reference numerals and description thereof is omitted.

In this embodiment, similarly to the third embodiment, the convex portions 19a, 19b, 21c, and 21d are formed in the shapes of the divided stiffener 19A and the divided cover plate 21B, respectively. Provide. The shape of the cover plate 21B after assembly is different from the cover plate of the third embodiment, and the convex portions 21c and 21d are different.
Holes 21e and 2e reaching the stiffener 19A, respectively.
1f is formed.

At the time of assembly by crimping, the convex portions 21c and 21d of the cover plate 21B break through the adhesive 20 connecting the stiffener 19A and the cover plate 21B and come into contact with the stiffener 19A.
Of the polyimide tape 1 electrically connected to the semiconductor chip 16 by breaking through the adhesive 18 connecting the polyimide tape 10 and the stiffener 19A.
Touch the conductive part on 0. Thereby, the semiconductor chip 1
The cover plate 21B electrically connected to the cover 6 functions as a plurality of independent electrodes, and can contact the cover plate 21B from above the package.

This embodiment also has the same advantages as the first embodiment.

Next, a fifth embodiment of the present invention will be described.

FIG. 6 shows a TB according to a fifth embodiment of the present invention.
FIG. 2 is a structural diagram of a GA package, in which components common to FIG. 1 are denoted by the same reference numerals and description thereof is omitted.

In this embodiment, the shape of the cover plate 21C divided into a plurality of portions is different from that of the convex portions 21g and 21g.
h, the stiffener 19A has a cover plate 2 in advance.
Holes 19 are formed so that convex portions 21g and 21h of 1C pass through.
c and 19d are provided.

At the time of assembling by crimping, the convex portions 21g and 21h of the cover plate 21C pass through the holes 19c and 19d of the stiffener 19A and come into contact with the conductive portion on the polyimide tape 10 electrically connected to the semiconductor chip 16. I do. Thus, the cover plate 21C can function as a plurality of independent electrodes, and can contact the cover plate 21C from above the package.

This embodiment has the same advantages as the second embodiment.

Next, a sixth embodiment of the present invention will be described.

FIG. 7 shows a TB according to a sixth embodiment of the present invention.
FIG. 2 is a structural diagram of a GA package, in which components common to FIG. 1 are denoted by the same reference numerals and description thereof is omitted.

In the present embodiment, similarly to the fifth embodiment, the cover plate 21C divided into a plurality of parts is provided with convex portions 21g and 21h, respectively, and the stiffener 19 is provided.
In A, the convex portions 21g and 21g of the cover plate 21C are previously set.
Holes 19c and 19d are provided so that h can pass through. The shape of the assembling cover plate 21C is different from the cover plate of the fifth embodiment described above, and the convex portions 21g, 21
In h, holes each reaching the stiffener 19A are formed.

When assembling by crimping, the convex portions of the cover plate 21C are inserted into the holes 19c, 19c of the stiffener 19A.
d, and comes into contact with the conductive portion on the polyimide tape 10 electrically connected to the semiconductor chip 16. As a result, the cover plate 21C functions as a plurality of independent electrodes, and the cover plate 21C
Can be contacted.

This embodiment has the same advantages as the second embodiment.

[0066]

As described above in detail, according to the BGA package of the first invention, one or a plurality of through holes are provided from the cover plate to the conductive portion of the circuit board via the fixing plate member. Therefore, the following effects can be obtained.

(1) Since any conductive portion on the circuit board electrically connected to the semiconductor chip can be contacted from above the package, it is possible to measure the potential of any conductive portion on the circuit board. Electrical measurements are possible. This is an effect that can be obtained even after the package is mounted.

(2) Since it is not necessary to make contact with the signal pins, the potentials of the terminals not connected to the signal pins on the semiconductor chip can be measured on the circuit board, the fixing plate member and the cover plate. A plurality of measurement or test terminals other than those originally required for the chip can be provided without using signal pins.

According to the BGA package of the second invention, the cover plate is provided with the hole reaching the fixing plate member, and the fixing plate member is provided with the convex portion which comes into contact with the conductive portion of the circuit board. In addition to providing the same effects as the first aspect of the invention, a plurality of independent electrodes can be provided which can be contacted from above the package, and electrical measurement such as potential measurement of the electrodes can be performed. Further, it is possible to easily adjust the shielding effect and the characteristic impedance of the package.

According to the BGA package of the third invention, the cover plate is provided with the convex portion abutting on the fixing plate, and the fixing plate is provided with the convex portion abutting on the conductive portion of the circuit board. The same effects as those of the first and second inventions are provided.

According to the BGA package of the fourth invention, the fixing plate member is provided with the through hole, and the cover plate is provided with the convex portion which passes through the through hole and directly contacts the conductive portion of the circuit board. Therefore, the same effects as those of the first and second inventions are provided.

According to the method for measuring the temperature of a semiconductor chip in a package according to a fifth aspect of the present invention, a semiconductor element for temperature measurement is incorporated in the semiconductor chip and electrically connected to a conductive portion on a circuit board from above the IC package. Connection means for setting the electrical resistance of the semiconductor element, and setting the relationship between the ambient temperature and the electric resistance of the semiconductor element, and measuring the electric resistance of the semiconductor element via the connection means while the semiconductor chip is operating. Therefore, it is possible to easily measure the temperature of the semiconductor chip in the IC package even after the semiconductor chip is mounted by using the semiconductor element on the semiconductor chip.

[Brief description of the drawings]

FIG. 1 is a structural diagram of a TBGA package according to a first embodiment of the present invention.

FIG. 2 is an assembly process diagram of the TBGA package shown in FIG. 1;

FIG. 3 is a structural diagram of a TBGA package according to a second embodiment of the present invention.

FIG. 4 is a structural diagram of a TBGA package according to a third embodiment of the present invention.

FIG. 5 is a structural diagram of a TBGA package according to a fourth embodiment of the present invention.

FIG. 6 is a structural diagram of a TBGA package according to a fifth embodiment of the present invention.

FIG. 7 is a structural diagram of a TBGA package according to a sixth embodiment of the present invention.

FIG. 8 is a diagram showing a structure of a conventional TBGA package.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Polyimide tape 11 Tape body 12, 13 Resist 14 Copper foil 15 Solder ball 16 Semiconductor chip 17 Resin 18 Adhesive 19 Stiffener 19A Stiffener 19a, 19b Convex part of stiffener 20 Adhesive 21, 21A, 21B, 21C Cover plate 21a, 21b, 21c, 21d, 21g, 21h Convex portion of cover plate 22, 23 Through hole

Claims (5)

[Claims] A circuit board for electrically connecting a solder ball mounted for connection to an external circuit and a semiconductor chip mounted on a side opposite to a mounting surface of the solder ball; A fixing plate member fixed to the circuit board by bonding with an insulating adhesive, and a cover plate bonded to the surface of the semiconductor chip and the fixing plate member with an insulating adhesive; In a BGA package in which the semiconductor chip is resin-sealed on a side opposite to a plate, one or a plurality of through holes are provided from the cover plate to the conductive portion of the circuit board via the fixing plate member. BGA package. 2. A circuit board for electrically connecting a solder ball mounted for connection to an external circuit and a semiconductor chip mounted on a side opposite to a surface on which the solder ball is mounted, and on the circuit board. A conductive fixing plate member fixed to the circuit board by bonding with an insulating adhesive, and a cover plate bonded to the surface of the semiconductor chip and the fixing plate member with an insulating adhesive. In a BGA package in which the semiconductor chip is resin-sealed on the opposite side of the cover plate, a hole reaching the fixing plate member is provided in the cover plate, and the fixing plate member is provided in a conductive portion of the circuit board. A BGA package characterized by providing a contacting projection. 3. A circuit board for electrically connecting a solder ball mounted for connection to an external circuit and a semiconductor chip mounted on a side opposite to a surface on which the solder ball is mounted, and on the circuit board. A conductive fixing plate member fixed to the circuit board by bonding with an insulating adhesive; and a conductive cover plate bonded to the surface of the semiconductor chip and the fixing plate member with an insulating adhesive. B in which the semiconductor chip is resin-sealed on the opposite side of the cover plate.
In the GA package, a BGA package is provided, wherein the cover plate has a convex portion that contacts the fixing plate, and the fixing plate has a convex portion that contacts the conductive portion of the circuit board. 4. A circuit board for electrically connecting a solder ball mounted for connection to an external circuit and a semiconductor chip mounted on a side opposite to the surface on which the solder ball is mounted, and on the circuit board. A fixing plate member fixed to the circuit board by bonding with an insulating adhesive, and a conductive cover plate bonded to the surface of the semiconductor chip and the fixing plate member with an insulating adhesive. In a BGA package in which the semiconductor chip is resin-sealed on the opposite side of the cover plate, a through hole is provided in the fixing plate member, and the cover plate passes through the through hole and a conductive portion of the circuit board is provided. Characterized in that a convex portion is provided which directly abuts on the BG
A package. 5. An I for sealing a semiconductor chip on a circuit board.
For the C package, a semiconductor element for temperature measurement is incorporated in the semiconductor chip, and two or more connection means for electrically connecting the conductive element on the circuit board from above the IC package are provided. And setting the electrical resistance value of the semiconductor element, and measuring the electrical resistance value of the semiconductor element via the connection means while the semiconductor chip is operating. To measure the temperature of semiconductor chips in packages.