JPH11214564A - Method for preparing plate with built-in electrode terminal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for preparing a plate, in which plural fine electrode terminals arranged so as to be mutually distributed like a matrix with a fine pitch are mechanically and electrically incorporated in an insulating structure. SOLUTION: A multi-layer print wiring board 100 is cut in board thickness direction so that a thin strap-shaped cut piece 200 can be formed. Photoresist solution is applied to one cut face 200A of the cut piece 200, and dried so that a resist film 230 can be formed. Then, a prescribed pattern mask is arranged on the cut face 200A of the cut piece 200, and exposure is operated. Then, a resist pattern 232 is developed and etched so that electrode terminals 222 constituted of partial metallic films 220 can be formed. Afterwards, plated metal films 224 are formed at the both edge parts of each electrode terminal 222 so that a plate in which almost rectangular cylindrical electrode terminals are arranged like a matrix can be completed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a plate in which a large number of fine electrode terminals are arranged in a matrix at a fine pitch with a mechanically and electrically insulating structure.

[0002]

2. Description of the Related Art Conventionally, for example, when an appropriate test of a semiconductor package (CSP; chip size package, etc.) formed in a chip shape is performed, a socket (for mounting the semiconductor package on a test wiring board) is used. CSP
Socket), a semiconductor package is mounted in the socket, and various tests are performed via a wiring board. In this case, the socket has a structure in which the electrode terminals on the socket side are positioned and arranged corresponding to the electrode terminals of the semiconductor package, whereby the electrode terminals on the socket side are positioned and arranged in an insulated state from each other, and mounted on the socket. The semiconductor device is brought into contact with each electrode terminal of the semiconductor package.

FIG. 5 is a partial sectional side view showing an electrode film provided on such a conventional socket. The semiconductor package 10 has a plurality of electrode terminals 12 on the lower surface,
It is mounted on the socket 20 while being positioned by a positioning portion (not shown). The socket 20
Has a connection electrode film 22 disposed on the lower surface of the semiconductor package 10.

The electrode film 22 (trade name: Asmat) is made of, for example, polyimide and has a plurality of holes 2.
4 has an electrode terminal 26 attached thereto. Each electrode terminal 2
Numeral 6 is formed from a rivet-shaped metal piece, and is arranged corresponding to the electrode terminal 12 of the semiconductor package 10 described above. FIG. 6 is a plan view showing the arrangement of the electrode terminals 26 provided on the electrode film 22. As shown in the figure, each electrode terminal 26 is formed in a matrix at equal intervals in the vertical, horizontal, and vertical directions corresponding to the electrode terminals 12 of the semiconductor package 10. Further, there is also provided one in which a large number of holes are formed in a matrix on an insulating plate instead of a resin film as in this example, and electrode terminals are provided in each hole.

[0005]

By the way, with the miniaturization and multifunctionality of the semiconductor package, the above-mentioned socket is also required to be miniaturized. For example, it is necessary to arrange tens to hundreds of electrode terminals in a matrix at a fine pitch of 10 μ to 100 μ.

On the other hand, as a method of providing a metal electrode on the above-mentioned electrode film or plate on the socket side, there is a conventional method as follows. Utilizes through holes in printed circuit boards. Use through-hole pins. Use rivets. Utilization of metal deposition on resin film, etc. However, all of the above methods are easy to process,
There are problems in miniaturization, cost, quality, dimensional accuracy, durability, heat resistance, reliability, and the like.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for producing a plate in which a large number of fine electrode terminals arranged in a matrix at a fine pitch are built in a mechanically and electrically insulating structure. .

[0008]

According to the present invention, there is provided a method for producing a plate in which electrode terminals dispersed and arranged in a matrix are mechanically and electrically incorporated in an insulating structure. A cutting step of cutting a multilayer substrate obtained by alternately laminating a substrate and a metal film at predetermined intervals in the thickness direction thereof, and a cutting section of a cut piece of the multilayer substrate obtained by the cutting step, wherein the electrode terminals A metal film removing step of removing a metal film piece at a predetermined pitch between the insulating substrates by masking a corresponding region and removing the other metal film by etching.

In the method for producing a built-in plate for electrode terminals according to the present invention, first, in a cutting step, a multilayer substrate in which insulating substrates and metal films are alternately laminated is cut at predetermined intervals in the plate thickness direction. As a result, a cut piece of the multilayer substrate in which the insulating substrate and the metal film are alternately laminated is formed.

Next, in the metal film removing step, a region corresponding to the electrode terminal is masked on the cut surface of the cut piece of the multilayer substrate obtained in the cutting step, and the other metal films are removed by etching. I do. Thereby, the metal film pieces are left at a predetermined pitch between the insulating substrates. As a result,
A plate in which a large number of fine electrode terminals dispersed and arranged in a matrix at a fine pitch with respect to each other can be easily formed mechanically and electrically in a built-in insulating structure.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a method for producing a built-in plate of a fine electrode terminal according to the present invention will be described. FIG. 1 is a diagram showing a specific example of a method for producing a built-in plate of a fine electrode terminal according to the present embodiment, and FIG. 1 (A) is a perspective view conceptually showing a cutting step of the present embodiment;
(B) is a side sectional view showing each step of the metal film removing step of the present embodiment. FIG. 2 is an enlarged partial cross-sectional view showing a cut section of a cut piece cut in the cutting step of the present embodiment. Further, FIG. 3 is a view showing a plate prepared by the preparation method shown in FIG. 1, (A) is a plan view, and (B) is a side sectional view.

As shown in FIG. 1A, in a cutting step in the present embodiment, a multilayer printed wiring board 100 in which insulating substrates and metal films are alternately laminated is cut in the thickness direction to form a thin strip shape. Is formed. The multilayer printed wiring board 100 used here is composed of, for example, an insulating substrate made of an epoxy-based synthetic resin and having a thickness of several tens to several hundreds μ, and an entire surface of the insulating substrate having a thickness of, for example, several tens μm.
It is obtained by laminating a metal film such as a copper foil having a thickness of several hundreds of micrometers in multiple layers.

That is, the thickness of the insulating substrate and the thickness of the metal film are set according to the arrangement pitch and the thickness of the electrode terminals in a matrix arrangement using the plate of this embodiment. Further, the number of layers in the multilayer printed wiring board 100 is also set according to the number of electrode terminals in the row and column directions of the electrode arrangement in a matrix using the plate of this example. Then, as shown in FIG. 2, the cut pieces 200 obtained by the cutting process shown in FIG.
0A and metal film 220 are laminated in multiple layers.
It becomes what has.

Next, the cut pieces 200 are cut to a required length. If the width of the multilayer printed wiring board 100 matches the required plate length in advance, this cutting step is unnecessary. Next, the cut piece 200 after this cutting is used.
On the other hand, in the metal film removing step shown in FIG. 1B, a process of intermittently forming a metal film as an electrode terminal at a predetermined pitch interval between the insulating substrates is performed. 1B shows a state in which the stacking direction of the cut pieces 200 is oriented in the direction of the paper surface, and each cross-section of FIG. The state in which the cross section of the film 220 is exposed is shown.

In the metal film removing step of this embodiment, first, FIG.
In (B), one cut surface 20 of the cut piece 200 is shown.
A photoresist solution is applied to the entire surface of 0A and dried to form a resist film 230. Next, a mask having a predetermined pattern is arranged on the cutting section 200A of the cutting piece 200, and exposure is performed. Here, the metal film 220 is used as a mask pattern.
A plurality of stripe-shaped mask regions and exposure regions are provided in parallel with the film thickness direction, and the distance between the mask regions and the exposure regions corresponds to the width and pitch of the electrode terminals described above. Then, the resist film corresponding to the mask region is removed while leaving the resist film solidified by the above exposure, and the resist pattern 232 is developed as shown in FIG. 1B.

Next, etching is performed to remove the metal film 220 in a region where there is no resist film. Then, after this etching, the unnecessary resist pattern 232 is removed. As a result, as shown in FIG. 1B, the partial metal film 220 remaining by the etching becomes the electrode terminal 2.
The gap portion 226 is formed between the electrode terminals 222 by etching. After this, FIG.
As shown in (B), a metal plating film 224 such as a gold plating is applied to both end portions of each electrode terminal 222 facing the cutting section of the cutting piece 200. As described above, as shown in FIG. 3, it is possible to complete a plate having substantially rectangular columnar electrode terminals arranged in a matrix.

According to the above-described method for preparing a built-in plate of fine electrode terminals, it is possible to easily produce low-cost electrode terminals arranged in a matrix at a fine pitch in the plate. Further, the built-in plate of the electrode terminal prepared as described above has excellent mass productivity, durability, heat resistance, and high electrical reliability. In addition, the resinous insulating substrate 21
0, a rectangular columnar electrode terminal 222 is held,
Since the insulating substrate 210 has a structure in which the plurality of electrode terminals 222 are joined to each other, it has high mechanical reliability. Further, according to the application, each electrode terminal 2
The arrangement, the number, the size, and the pitch of the 22 can be easily changed by selecting a mask, and a high degree of freedom at the time of creation can be obtained.

FIG. 4 is a side sectional view showing an outline of a case where a CSP socket 320 for mounting a CSP semiconductor (chip size package) chip 310 is formed using the plate prepared as described above. As shown, C
A plurality of electrode terminals 3 are provided on the lower surface of the SP semiconductor chip 310.
12 are provided in a matrix at a predetermined pitch,
The CSP semiconductor chip 310 is mounted in a positioning state by a positioning portion of a CSP socket 320 (not shown).

The plate 330 of the present embodiment is provided on the lower surface of the CSP semiconductor chip 310, and the above-mentioned electrode terminals 222 are arranged corresponding to the positions of the electrode terminals 312 of the CSP semiconductor chip 310. Also, plate 330
A printed wiring board 350 is provided on the lower surface of the device via an anisotropic conductive rubber 340. The electrode terminal 312 of the CSP semiconductor chip 310 is connected to the copper foil pattern wiring of the printed wiring board 350 via the electrode terminal 222 and the anisotropic conductive rubber 340.

The plate 330 of the present embodiment is not limited to the CSP socket 320 as described above, and a large number of fine electrode terminals dispersed and arranged in a matrix at a fine pitch are positioned mechanically and electrically with an insulating structure. It can be widely applied as a plate for arrangement.

[0021]

As described above, in the method for preparing a built-in electrode terminal plate according to the present invention, a multilayer substrate in which insulating substrates and metal films are alternately laminated is cut at predetermined intervals in the thickness direction. By masking a region corresponding to the electrode terminal with respect to the cut surface of the cut piece and removing the other metal film by etching, metal film pieces are left at a predetermined pitch between the insulating substrates. . Accordingly, there is an effect that a plate in which a large number of fine electrode terminals arranged in a matrix at a fine pitch are mechanically and electrically incorporated in an insulating structure can be easily formed.

[Brief description of the drawings]

1A and 1B are views showing a specific example of a method for producing a built-in plate of a fine electrode terminal according to an embodiment of the present invention, wherein FIG. 1A is a perspective view conceptually showing a cutting step, and FIG. It is a sectional side view which shows each process of.

FIG. 2 is an enlarged partial sectional view showing a cut section of a cut piece cut by the cutting step shown in FIG. 1;

3A and 3B are views showing a plate prepared by the preparation method shown in FIG. 1, wherein FIG. 3A is a plan view and FIG. 3B is a side sectional view.

FIG. 4 is a diagram showing a C formed using the insulating guide plate of the present embodiment.
It is a sectional side view which shows the outline of SP socket.

FIG. 5 is a partial side sectional view showing an electrode film provided in a conventional socket.

6 is a plan view showing an arrangement of electrode terminals provided on the electrode film shown in FIG.

[Explanation of symbols]

100: multilayer printed wiring board, 200: cut piece,
200A ... cut surface, 210 ... insulating substrate, 220 ...
... metal film, 222 ... electrode terminal, 224 ... metal plating film, 230 ... resist film, 232 ... resist pattern.

Claims (7)

[Claims] 1. A method of producing a plate in which electrode terminals dispersed and arranged in a matrix are mechanically and electrically incorporated in an insulating structure, wherein a multi-layer substrate in which insulating substrates and metal films are alternately laminated is formed. A cutting step of cutting at a predetermined interval in the plate thickness direction, for a cut surface of the cut piece of the multilayer substrate obtained by the cutting step, by masking a region corresponding to the electrode terminal,
A metal film removing step of removing metal film pieces at a predetermined pitch between the insulating substrates by removing other metal films by etching. 2. A built-in plate for an electrode terminal according to claim 1, wherein metal plating is applied to an end face facing the cut surface of the metal film piece remaining between the insulating substrates in the metal film removing step. How to make. 3. The metal film removing step includes: forming a resist film on a cut surface of the cut piece; exposing the resist film through a mask having a pattern corresponding to the electrode terminal. An exposing step of selectively solidifying according to: a developing step of removing a resist film that is not exposed by the exposing step; an etching step of etching a cut surface of the cut piece that has undergone the developing step; and a cutting piece that has passed through the etching step 2. The method according to claim 1, further comprising the step of removing a residual resist film on the cut surface. 4. The method according to claim 1, wherein the metal film removing step is performed after cutting the cut piece of the multilayer substrate obtained by the cutting step into a predetermined length. Method. 5. The method according to claim 1, wherein the multilayer board is a multilayer printed wiring board. 6. The semiconductor device according to claim 1, wherein the fine electrode terminal is used as an electrode terminal for connecting an electrode terminal of the semiconductor package and a wiring board of the socket in a socket mounted on the semiconductor package. 1
How to make a built-in electrode terminal plate as described. 7. The method according to claim 6, wherein the socket is a socket for performing a proper test of the semiconductor package.