JPH11214112A - Soldering device and method of electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform soldering without breaking the metallic foil by holding the electronic parts on a soldering position of a board, pressing the metallic foil to the soldering position coated with the solder, heating the metallic foil to melt the solder, and moving the pressing member and a heating head respec tively in a vertical direction. SOLUTION: A land 37 of a printed board 36 is coated with solder 38. A super slim tape carrier package(TCP) 31 is positioned on the land 37 where a copper foil 32 is to be fixed. A heating head 22 is mounted just above the copper foil 32, and a pressing plate 23 is positioned just above the TCP 31. When a soldering device is driven, an operating part body comprising the heating head 22 and the pressing plate 23 is moved downward. Whereby the pressing plate 23 is brought into contact with the TCP 31, so that the TCP 31 is pressed and held on the printed board 36. On this occasion, the heating head and the copper foil 32 are not yet kept into contact with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus used for soldering an electronic component having a metal foil as a lead to a substrate, and a method for soldering an electronic component using the apparatus.

[0002]

2. Description of the Related Art For example, in a manufacturing process of a liquid crystal display device,
There is a step of mounting a driving LSI on a printed circuit board (hereinafter abbreviated as PWB) around the liquid crystal cell. As this type of driving LSI, a thin tape carrier package (hereinafter abbreviated as TCP) is suitably used. Conventionally, when mounting TCP on PWB, ironing has been performed by a robot soldering machine. This TCP is P
The process of performing soldering on a WB using a robot soldering machine will be described with reference to the drawings.

FIG. 8 is a schematic side view showing a soldering operation of TCP and PWB by ironing of a conventional robot soldering machine, and FIG. 9 is a rear view thereof. TCP1 is shown in FIG.
As shown in FIG. 1, a bare chip 1b is mounted on a tape 1a of a polyimide resin or the like.
It is sealed with a resin 1c with a interposed therebetween.
Further, a portion of the copper foil 2 extending from the bare chip 1b toward the tape outer peripheral portion 6 serves as a lead and is connected to the land 4 on the PWB. The copper foil 2 serving as a lead is extremely thin, about 25 to 35 μm. The solder is applied in advance on the land 4 on the PWB.

As shown in FIG. 8, the copper foils 2, 2,... Extending from the TCP 1 are soldered while being pressed against the lands 4, 4,. . In this manner, a plurality of leads of TCP1 are connected to a plurality of lands 4, 4,... On the PWB by one ironing operation.

[0005]

In recent years, the size and weight of liquid crystal display devices have been reduced, and accordingly, small and thin drive LSIs built in the devices have been used. Therefore, an LSI called a super slim TCP which is thinner than the conventional TCP has come to be used. The thickness of the copper foil 2 used as a lead in this super slim TCP is about 18 μm.

[0006] In particular, this super slim TCP is referred to as PWB.
When soldering on the upper side, as shown in FIGS. 8 and 9, there is a gap between the copper foil 2 before soldering and the land 4 on the PWB, so the copper foil 2 and the land 4 are soldered. At this time, the copper foil 2 is moved downward in the drawing
In the direction of travel. At this time, there is a possibility that the copper foil 2 cannot withstand the force applied by the iron 5, or the copper foil 2 may be caught by the moving iron 5 to break the wire. In view of the above, the present invention provides an apparatus and a method for soldering an electronic component having a metal foil as a lead without breaking the metal foil when the electronic component is soldered to a substrate. Aim.

[0007]

As a result of analyzing a super slim TCP in which the copper foil has been broken, as shown in FIG. 10, a large number of broken parts 7 are generated particularly in the vicinity of the joint between the TCP 1 and the copper foils 2, 2,. I found out. From this, in order to solder the copper foils 2, 2,... To the lands 4, 4,... Without breaking them with the iron 5, the copper foils 2, 2,. It is considered to be effective to fix them or to give the shapes after soldering to the copper foils 2, 2,... In advance.

Therefore, the soldering device for an electronic component according to the present invention, when an electronic component having a metal foil as a lead is soldered to a substrate, comes into contact with the electronic component and holds the electronic component at a soldering portion of the substrate. Pressing the holding member and the metal foil against the soldering location where the solder was applied,
It is characterized by comprising a heating head for melting the solder by heating the metal foil, and a drive mechanism for moving the pressing member and the heating head vertically.

The holding member holds the electronic component at the soldering portion of the substrate, thereby preventing the displacement of the metal foil of the lead of the electronic component, and the heating head removes the metal foil from the soldering portion where the solder is applied. And the metal foil is heated to melt the solder, and the metal foil can be temporarily fixed to the soldering location. After this, if the final fixation is performed by the robot soldering machine, even if the robot soldering machine is the same as the conventional one, the metal foil is already formed into the final shape, and the soldering of the metal foil is performed. Since there is no floating from the attachment point, soldering can be performed without problems by ironing with a robot soldering machine.

In the soldering device for an electronic component according to the present invention, the bottom surface of the heating head that comes into contact with the metal foil is flat, so that the metal foil is hardly damaged and the metal foil can be pressed uniformly to the soldering point. Also, since the peripheral edge of the bottom surface of the heating head is chamfered in a curved shape, when the heating head is brought into contact with the metal foil and pressed against a soldering point, the metal foil can be smoothly bent by the peripheral edge of the bottom surface of the heating head. So that it will not be damaged by bending the metal foil.

Further, in the method of soldering an electronic component according to the present invention, the electronic component is held at a soldering location of the substrate by a holding member, and the heating is performed while pressing the metal foil to the soldering location by a heating head in that state. Then, after cooling and curing the solder, the metal foil is temporarily fixed to the soldering point, and soldering is further performed on the temporary fixing part to electrically connect the electronic components to the soldering point. Features. By using such a method, an electronic component having a metal foil as a lead can be soldered onto a substrate without breaking the metal foil.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings, but the present invention is not limited to only these embodiments. FIG. 1 is a schematic configuration diagram showing an embodiment of an electronic component soldering apparatus according to the present invention. The soldering apparatus 11 shown in FIG.
It is roughly composed of a soldering head section 13 and a control section 14. The soldering head 13 is mounted on the operating section main body 2.
1, a heating head 22, a holding plate 23 (holding member), a main cylinder 24 (drive mechanism), and a head slightly ascending cylinder 25.

A heating head 22 is attached to the lower end of the operating section main body 21 extending in the vertical direction.
2 is designed to be heated by a heater (not shown). A column 23a provided on an upper portion of a holding plate 23 is inserted through a plate portion 21a protruding in a lateral direction from immediately above the heating head 22 mounting portion of the operation portion main body 21 so as to be slidable in the vertical direction. A spring 23b is provided around the center of the column 23a, the upper end of which is on the lower surface of the plate 21a, and the lower end of which is the column 2
3a is in contact with the enlarged diameter portion. A stopper 23c is provided near the upper end of the column 23a to prevent the column 23a from falling off the plate portion 21a. Further, the lower end of the holding plate 23 is configured to be located below the lower end of the heating head 22.

At the upper end of the operating section body 21, a frame 12
, A piston 24a of the main cylinder 24 fixed thereto. The operating section main body 21 includes a piston 24a.
Is configured to be able to move up and down in FIG. Holding plate 23 for holding electronic components
1 can move in the vertical direction in FIG. 1 together with the operating section main body 21. However, when the operating section main body 21 moves downward in FIG.
And the strut 23a remains at that position. Further, when the operating section main body 21 moves downward in FIG. 1, the spring 23b contracts, and the pressing plate 23 presses and holds the electronic component downward in FIG.

The upper end of the operating portion body 21 is a plate portion 21b, and a head slightly ascending cylinder 25 is mounted so as to pass through the plate portion 21b. A stopper 26 fixed to the frame 12 is provided below the head slightly ascending cylinder 25. Here, the head slightly ascending cylinder 25 and the stopper 26 are mounted at positions where they do not come into contact with each other unless the head slightly ascending cylinder 25 is actuated even when the operating section main body 21 is lowered to the lowest point. When the pressing plate 23 comes into contact with the electronic component and the spring 23b is further contracted and the head slightly ascending cylinder 25 is driven to lower the piston 25a,
The piston 25a is provided with a stopper 26 provided below the piston 25a.
Contact When the piston 25a further lowers, the operating portion main body 21 moves upward in FIG. 1 due to the reaction of the force applied by the piston 25a to the stopper 26. At this time, the spring 23b
Extend to keep the holding plate 23 in contact with the electronic component.

A stage 12a for setting a substrate is provided near the center of the frame 12, and the soldering head 13 is configured to be movable to an arbitrary position on the stage 12a by an XY slide unit (not shown). The control unit 14 is configured by a microcomputer or the like, and controls the position of the soldering head unit 13 and its movement.
The entire operation of the soldering device 11 can be controlled.

Next, the soldering of copper foil using the electronic component soldering apparatus of this embodiment will be described with reference to FIGS. FIGS. 2 to 7 are flowcharts showing the operation of the electronic component soldering apparatus according to the present embodiment. FIG. 2 is a view showing a state in which the printed circuit board (PWB) 36 and the super slim TCP 31 are set in the soldering apparatus 11. Land 3 of PWB36
7 is coated with solder 38. The super slim TCP 31 is arranged on a land 37 to which the copper foil 32 is fixed. The heating head 22 is disposed directly above the copper foil 32, and the holding plate 23 is disposed immediately above the super slim TCP 31.

Next, when the soldering apparatus 11 is driven, the operating section main body 21 provided with the heating head 22 and the pressing plate 23 moves downward in the drawing. Then, as shown in FIG.
And held by pressing it onto the PWB 36. At this time, the heating head 22 and the copper foil 32 are not yet in contact with each other, and the copper foil 32 is in a state of floating directly above the solder 38 on the land 37.

When the operating section main body 21 further moves downward in FIG. 3, the holding plate 23 remains in contact with the super slim TCP 31, and only the heating head 22 further lowers. Then, as shown in FIG. 4, the heating head 22 comes into contact with the copper foil 32, and bends it while embossing it, and presses it downward in the figure, thereby pushing the copper foil 32 into the land 37.
It is brought into close contact with the upper solder 38. At this time, the heating head 22
Is always heated to a temperature sufficient to melt the solder, so that the heat of the heating head 22 is transmitted to the solder 38 via the copper foil 32 and melts it.

After the solder 38 is sufficiently melted, the heating head 22 moves upward in the figure as shown in FIG.
Move away from After the heating head 22 moves upward in the drawing, the super slim TCP 31 is held by the holding plate 23 until the solder 38 is solidified so that the copper foil 32 does not shift. After the solder 38 is solidified, the temporary fixing of the copper foil 32 on the land 37 is completed by moving the pressing plate 23 upward in the drawing as shown in FIG. Thereafter, a flux is applied from above the temporarily fixed copper foil 32, and as shown in FIG. 7, using another robot soldering apparatus, ironing is performed with an iron 40 and soldering is performed. The land 37 can be securely fixed.

As described above, in the electronic component soldering apparatus according to the present embodiment, the holding plate 23 has a super slim TC
While the P31 is pressed and held on the PWB 36, the copper foil 32, which is the lead of the super slim TCP 31, is pressed on the land 37 by the heating head 22 to melt the solder 38, and the copper foil 32 is temporarily fixed on the land 37. That is, the copper foil 32 can be soldered without breaking the copper foil 32. Since the bottom surface of the heating head 22 is flat, the copper foil 32 can be uniformly pressed onto the land 37, and since the bottom surface of the heating head 22 is chamfered in a curved shape, the copper foil 32 cannot be bent. Absent.

The method of soldering an electronic component according to the present embodiment is different from the prior art in that the copper foil used for the lead of the electronic component is not soldered to the PWB without pretreatment, but the copper foil is placed on the PWB. Then, the iron is temporarily fixed by pressing it, and ironing is performed. With this method, an electronic component having a copper foil as a lead can be soldered on a substrate without causing a break in the copper foil.

The technical scope of the present invention is not limited to the above embodiment, and various changes can be made without departing from the spirit of the present invention. For example, in the present embodiment, a copper foil is used as a lead of an electronic component, but another metal foil such as gold, aluminum, or various alloys may be used. The heating head may be constantly heated to a temperature sufficient to melt the solder, or may be heated only when needed. In the above-mentioned soldering device, the device for temporarily fixing the metal foil and the device for ironing may be combined into one device or may be divided into a plurality of devices.

[0024]

As described above, the electronic component soldering apparatus according to the present invention comes into contact with the electronic component when the electronic component having the metal foil as a lead is soldered to the substrate, and this electronic component is soldered to the substrate. A holding member to hold in place
A heating head that presses the metal foil against a soldering portion to which the solder is applied and heats the metal foil to melt the solder, and a driving mechanism that moves the holding member and the heating head in the vertical direction, respectively. The holding member holds the electronic component at the soldering position on the board, thereby preventing the displacement of the metal foil serving as the lead of the electronic component. The solder is melted by pressing against the applied soldering location and heating the metal foil, and the metal foil can be temporarily fixed to the soldering location. By using such a soldering device, soldering can be performed without any problem even when ironing is performed by a robot soldering machine, which conventionally has a possibility of causing a problem that the metal foil is disconnected.

In the electronic component soldering apparatus according to the present invention, since the bottom surface of the heating head that comes into contact with the metal foil is flat, the metal foil is hardly damaged, and the metal foil can be pressed uniformly to the soldering point. In addition, since the peripheral portion of the bottom surface of the heating head is chamfered in a curved shape, when the heating head is brought into contact with the metal foil and pressed against a soldering point, the metal foil is smoothly bent by the peripheral portion of the bottom surface of the heating head, The metal foil does not bend.

Further, in the method of soldering an electronic component according to the present invention, the electronic component is held at a soldering location on the substrate by a holding member, and the metal foil is heated while being pressed against the soldering location by a heating head in that state. Then, after cooling and hardening the solder, the metal foil is temporarily fixed to the soldering place, and the electronic components are electrically connected to the soldering place by further soldering from the temporary fixing part. An electronic component having a metal foil as a lead can be reliably soldered onto a substrate without causing a break in the metal foil.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of an electronic component soldering apparatus according to the present invention.

FIG. 2 is a part of a flowchart showing the operation of the electronic component soldering apparatus of the embodiment.

FIG. 3 is a part of a flowchart showing the operation of the electronic component soldering apparatus of the embodiment.

FIG. 4 is a part of a flowchart showing the operation of the electronic component soldering apparatus of the embodiment.

FIG. 5 is a part of a flowchart showing the operation of the electronic component soldering apparatus of the embodiment.

FIG. 6 is a part of a flowchart showing the operation of the electronic component soldering apparatus of the embodiment.

FIG. 7 is a part of a flowchart showing the operation of the electronic component soldering apparatus of the embodiment.

FIG. 8 is a schematic side view showing a soldering operation of TCP and PWB by ironing of a conventional robot soldering machine.

FIG. 9 is a back view showing a soldering operation of TCP and PWB by ironing of a conventional robot soldering machine.

FIG. 10 is an enlarged perspective view of a super slim TCP in which a copper foil is broken.

[Explanation of symbols]

 REFERENCE SIGNS LIST 11 soldering device 12 frame 13 soldering head unit 14 control unit 21 operating unit main body 22 heating head 23 holding plate (holding member) 23a support column 23b spring 24 main cylinder (drive mechanism) 25 head slightly ascending cylinder 26 stopper 31 super slim TCP 32 Copper foil 36 Printed circuit board (PWB) 37 Land 38 Solder

Claims (3)

[Claims] 1. An apparatus for soldering an electronic component having a metal foil as a lead to a substrate, comprising: a holding member that abuts on the electronic component and holds the electronic component at a soldering location on the substrate; A heating head that presses the foil against a soldering location to which the solder is applied and heats the metal foil to melt the solder; and a drive mechanism that moves the pressing member and the heating head in the vertical direction, respectively. An electronic component soldering apparatus, comprising: 2. The electronic component soldering apparatus according to claim 1, wherein a bottom surface of the heating head that contacts the metal foil is flat, and a peripheral edge of the bottom surface is chamfered in a curved shape. . 3. A method of soldering an electronic component using the electronic component soldering apparatus according to claim 1, wherein the electronic component is held at a soldering position on the substrate by the holding member. The metal foil is heated while being pressed against the soldering point by the heating head as it is, and then the solder is cooled and hardened, and the metal foil is temporarily fixed to the soldering point. A method of soldering an electronic component, wherein the electronic component is electrically connected to the soldering portion by performing soldering.