JPH11211796A - Substrate unit function tester - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate unit function tester which is inexpensive, improves space efficiency and can reduce man-hour for work and read time. SOLUTION: This substrate unit function tester is provided with a mother board 2 having slots 2a for connecting several kinds of substrates 1 to be tested as test objects and plural jig substrates 3 arranged corresponding to the respective substrates 1 to be tested so as to change the setting of each substrate 1 to be tested by changing the state of the shunt connector or dip switch of each substrate 1 to be tested. A personal computer 4 changes the setting of each substrate 1 to be tested by transmitting a setting command to each jig substrate 3 and executes a unit function test by transmitting a test command for each substrate 1 to be tested while controlling the bus signal of each substrate 1 to be tested on the mother board through a bus signal control part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board unit function test apparatus for performing a board unit function test, and more particularly, covers all settings of each board in a state where a plurality of boards are arranged in a product unit. The present invention relates to a board unit function test apparatus for performing a unit function test.

[0002]

2. Description of the Related Art A single functional test of a substrate is generally performed by a test R
A test corresponding to the test command according to the test program stored in the test ROM on the test target board side that has received the test command by transmitting a test command from the outside via the maintenance port to the test board on which the OM is mounted. And sending back the test results to the outside.

Here, when such a single function test of the board is performed for all the settings of the board, the test is performed by the above-described method while changing the setting of the board by a shunt connector or a dip switch provided on the board. The following two methods are known as such conventional methods.

First, a first method is to develop a dedicated tester having a function of changing the setting of a board and a function of another board, and to cover all the settings of the board while changing the setting of the board by the dedicated testing machine. This is a method for performing a single function test.

Next, a second method is to perform a single function test covering all the settings of the substrate while manually changing the settings of the substrate using a shunt connector or the like. The test is performed in a state in which is disposed, the power is cut off as necessary, the substrate is taken out, and the setting of the substrate is manually changed by a shunt connector or the like.

[0006]

However, in the above-mentioned first method, an expensive dedicated tester is required for each type of substrate, which raises the cost and the space efficiency. is there. Further, in the second conventional method described above, since a manual operation is required, there is a problem that the number of work steps is increased and a lead time is lengthened.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has as its object to provide a single-substrate functional test apparatus which is inexpensive, has good space efficiency, and can reduce the number of work steps and lead time. And

[0008]

According to the present invention, there is provided a motherboard to which a plurality of boards to be tested are connected, a board setting change section for changing settings of each of the boards to be tested, and each of the boards to be tested on the motherboard. A bus signal control unit for controlling the bus signal of the test, and a test execution for executing a unit function test for each of the test boards while changing the settings of the test boards by the board setting change unit and the bus signal control unit. And a functional unit for testing a single board.

Here, in the present invention, the board setting change section is arranged corresponding to each of the test boards, and changes the electrical connection state of each of the test boards to change the electrical connection state of each of the test boards. It is preferable that the bus signal control section is formed of a plurality of extender boards inserted between each of the boards under test and the motherboard.

Further, in the present invention, it is preferable that each of the jig substrates has a plurality of pins for securing a contact from the back surface side with the shunt connector or the DIP switch of each of the substrates under test. In addition, each of the jig substrates,
It is preferable that the apparatus further comprises a block on which the pins are mounted, the block having an adjusting function for adjusting the height of the pins. Further, it is preferable that the jig board further includes a relay circuit for switching a connection state of each of the pins. Furthermore, it is preferable that each of the jig substrates further includes a pawl member for fixing each of the substrates under test.

Further, in the present invention, each of the jig substrates may be a metal fitting for correcting the warpage of each of the test substrates, or a spring for pressing each of the test substrates and correcting the warpage of each of the test substrates. It is preferable to further have a metal fitting.

Still further, in the present invention, it is preferable that a fixture for detachably fixing the jig substrate and the extender substrate is further provided.

In the present invention, the jig substrate and the extender substrate may be provided integrally, or the jig substrate, the extender substrate,
A spring-like fitting for pressing the substrate under test to correct the warp of the substrate under test may be provided integrally.

According to the present invention, a board setting change unit for changing the setting of each board under test connected to the motherboard;
A bus signal control unit for controlling a bus signal of each board under test on the motherboard, and changing the setting of each board under test by the board setting change unit and the bus signal control unit under the control of the test execution unit. Since a unit function test is performed for each board under test, the settings of each board under test and bus signals can be changed by remote control while the boards under test are arranged in the product unit. The whole can be automated to reduce the number of work steps and the lead time. Further, a plurality of substrates to be tested connected on the motherboard can be tested by one test apparatus, and a product unit can be used as a part of the test apparatus, so that it is inexpensive and increases space efficiency. be able to.

Here, in the present invention, the setting of each DUT is performed by changing the electrical connection state of each DUT arranged as a substrate setting change unit corresponding to each DUT. By using a plurality of jig boards to be changed and using a plurality of extender boards inserted between each board under test and the motherboard as a bus signal control unit, the space in the product unit can be effectively used. Testing can be performed.

In the present invention, each jig substrate is
By having multiple pins to secure contacts from the back side with the shunt connector or DIP switch of each board under test, any type of switch, shunt connector or DIP switch, can be used to change the settings of each board under test. Even if it is used, it can respond. Further, since each jig substrate further includes a block on which each pin is mounted and which has an adjusting function for adjusting the height of each pin, it is possible to effectively prevent contact failure from occurring. Can be prevented. further,
Since each jig board further includes a relay circuit for switching the connection state of each pin, the distance between the contacts can be kept within a certain limit. A test can be performed on a substrate under test that is stable. Furthermore, since each jig board further has a claw member for fixing each board to be tested, the positioning of the board to be tested and the jig board can be performed without providing a fixing means on a product rack or the like. The test substrate can be easily replaced, and the contact between the test substrate and the jig substrate can be prevented from being accidentally disconnected during the test or preparation.

Further, in the present invention, each jig substrate includes a metal fitting for correcting a warp of each of the DUTs and a spring-shaped metal fitting for pressing each of the DUTs to correct the warp of each of the DUTs. Further, it is possible to prevent poor contact of the contacts and breakage of the substrate under test.

Still further, according to the present invention, a fixture for detachably fixing the jig board and the extender board is further provided, so that the extender board can be taken out simultaneously with taking out the board under test from the product rack. Therefore, it is possible to prevent an inconvenience such as leaving only the extender substrate in the product unit.

In the present invention, the jig substrate and the extender substrate may be provided integrally, so that the substrate to be tested and the jig substrate can be aligned.
In addition, it is possible to easily perform the replacement work of the board under test. Further, a jig substrate, an extender substrate, and a spring-like metal fitting for pressing the substrate under test to correct the warp of the substrate under test may be provided integrally, whereby the jig substrate and the jig are fixed. It is possible to easily perform alignment with the fixture substrate and exchange work of the test board, fixation of the test board and the jig board, and correction of warpage of the test board.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 to FIG. 4 are views showing a first embodiment of a board unit function test apparatus according to the present invention.

First, referring to FIG. 1, the overall configuration of the substrate single function test apparatus will be described. As shown in FIG. 1, a board unit function test apparatus includes a motherboard 2 having a slot 2a to which several types of boards 1 to be tested are connected.
And each substrate under test 1 arranged corresponding to each substrate under test 1
A plurality of jig boards (board setting change units) 3 for changing the setting of each board under test 1 by changing the state (jumper setting) of a shunt connector or a dip switch (not shown) A bus signal control unit (not shown) for controlling a bus signal of each substrate under test 1
A setting command is transmitted to each jig board 3 to change the setting of each board 1 under test, and the bus signal control section controls each bus signal of each board 1 under test on the motherboard 2 while controlling each bus under test. A personal computer (test execution unit) 4 for transmitting a test command for each board 1 and executing a single function test is provided.

FIG. 2 is a diagram showing in detail the hardware configuration of the board unit function test apparatus shown in FIG. As shown in FIG. 2, the motherboard 2 stored in the product racks A and B
Are connected to several types of substrates under test 1 (MMP substrate, CPU substrate, etc.) via slots 2a (SL1, SL2, etc.). A jig substrate 3 (MMP jig substrate, CPU jig substrate, etc.) having substantially the same outer shape as each of the DUTs 1 is arranged near each of the DUTs 1. Further, the substrate under test 1 is connected to the personal computer 4 via an RS-232C interface via a multiplexer (bus signal control unit) 41. Further, the jig board 3 is connected to the personal computer 4 via an expansion box 42 by an expansion I / O interface. The extension box 42 is an input / output board (PI, PO) for exchanging signals with the jig board 3.
And a GPIB board for turning on / off the power supply 43 of the motherboard 2.

FIGS. 3 and 4 are diagrams showing in detail the software configuration of the board unit function test apparatus shown in FIGS. 1 and 2. FIG. As shown in FIG. 3, a test ROM 1a storing a test program 1b is mounted on the board under test 1. Test program 1 stored in test ROM 1a
“b” performs a test corresponding to the test command transmitted from the personal computer 4 and returns the test result to the personal computer 4. Here, the test command transmitted from the personal computer 4 is:
ASCI for reading and writing data in substrate under test 1
Such test commands and corresponding test results are stored in maintenance ports (serial or parallel communication ports prepared for testing and maintenance) provided on the board under test 1. Is exchanged with the personal computer 4 via the.

On the other hand, in the personal computer 4, the test execution system 10 operates on the operating system 4a. As shown in FIG. 4, the test execution system 10 has an initial setting program 11, a test procedure program 12, and an end processing program 20 (and a test result storage program 21) as programs for managing the test procedure 10a and the test result 10b. ing. The test procedure program 12 includes a command transmission program 13, a command reception program 14, and an RS-232C control program 15 as a group of programs for transmitting and receiving test commands and test results to and from the board under test 1 via the motherboard 2. The jumper setting program 16 and the extension I are provided as a group of programs for changing the setting of the board under test 1 through the jig board 3.
/ O control program. Further, the test procedure program 12 turns on / off the power supply 43 of the motherboard 2.
A power operation program 18 and a GPIB control program 19 are provided as a group of programs to be executed.

Next, the operation of the first embodiment of the present invention having such a configuration will be described.

First, the test execution system 10 operating on the personal computer 4 includes an initialization program 11
After performing the initial setting, the unit function test of the board under test 1 is executed by the test procedure program 12 according to the test procedure 10a.

Here, the test procedure program 12 first
The jumper setting program 16 and the expansion I / O control program 17 use the input / output board (P
I, PO), the setting command is transmitted to the corresponding jig substrate 3, and the setting of the DUT 1 is changed by changing the state of the shunt connector or the DIP switch of the DUT 1. Specifically, for example, in FIG.
Motherboard (BB7) of product rack A through PO
With respect to the MMP jig board 3 located in the second slot (SL2) 2a, "the first pin and the second pin of the jumper 1 are short-circuited, the first pin and the second pin of the jumper 2 are short-circuited, and the second Pin 3 and pin 3 open ". In addition, the personal computer 4 sends the “pins 1 and 2 of the jumper 2” to the CPU jig board 3 located in the slot (SL6) 2a of the motherboard (BB7) 2 of the product rack A via the PO of the expansion box 42.
Short-circuit the pin # 2. "

Next, the test procedure program 12 turns on the power supply 43 of the motherboard 2 via the GPIB board of the expansion box 42 by the power supply operation program 18 and the GPIB control program 19.

After that, the test procedure program 12 transmits the RS-2 through the multiplexer 41 by the command transmission program 13 and the RS-232C control program 15.
A test command is transmitted to the board under test 1 through the 32C interface.

Here, the substrate under test 1 that has received the test command performs a test corresponding to the test command in accordance with the test program 1b stored in the test ROM 1a, and transmits the test result via the multiplexer 41 to the RS-232C.
The test result is returned to the personal computer 4 by the interface, and then, the personal computer 4 receives the test result returned from the board under test 1 by the command receiving program 14 of the test procedure program 12 and the RS-232C control program 15. Specifically, for example, in FIG.
RS-2 via multiplexer 41 to P substrate 1
">> WRITE9000008080 [RET] by 32C interface
”Command and RS-
It is confirmed that no error message has been returned from the MMP board 1 by the 232C interface.

After that, the power supply operation program 18 of the test procedure program 12 and the GPIB control program 19 turn off the power supply 43 of the motherboard 2 via the GPIB board of the expansion box 42, and then the termination processing program 20 and the test result storage program 21 Save the test result 10b.

Incidentally, since one item of the unit function test of the substrate under test 1 is completed in this manner, a plurality of substrates under test 1 are tested.
The above processing is repeated for the number of test items while changing the setting and the test command for
A single function test covering all settings can be performed.

As described above, according to the first embodiment of the present invention, a plurality of jig boards 3 for changing the setting of each board 1 to be tested connected to the motherboard 2 are provided. A setting command is transmitted to each jig substrate 3 under the following conditions to change the setting of each substrate 1 to be tested, and each bus is controlled while controlling a bus signal of each substrate 1 to be tested on the motherboard 2 by the bus signal control unit. Test board 1
Each time a test command is transmitted and a unit function test is executed, it is possible to change the setting of each board under test 1 and the bus signal by remote control in a state where each board under test 1 is arranged in the product unit. Therefore, the entire test operation can be automated, and the number of man-hours and lead time can be reduced. Further, a plurality of substrates under test 1 connected on the motherboard 2 can be tested by one test apparatus, and a product unit can be used as a part of the test apparatus, so that it is inexpensive and space efficient. Can be increased.

Second Embodiment Next, a second embodiment of the substrate single function test apparatus according to the present invention will be described with reference to FIGS. The second embodiment of the present invention is the same as the first embodiment shown in FIGS. 1 to 4 except that an extender board is inserted between a motherboard and each board under test as a bus signal control unit. This is substantially the same as the embodiment. In the second embodiment of the present invention, the same parts as those in the first embodiment shown in FIGS. 1 to 4 are denoted by the same reference numerals, and detailed description is omitted.

FIG. 5 is a view showing the assembled state of the substrate to be tested, the jig substrate and the extender substrate in the second embodiment of the substrate single function test apparatus according to the present invention. FIG.
As shown in (1), the substrate under test 1 and the jig substrate 3 are fixed to each other by a claw member 34 provided on the jig substrate 3. The substrate under test 1 and the extender substrate 5 are connected to each other through a connector 51a on the substrate under test, and the extender substrate 5 is hooked to the jig substrate 3 by a fixing metal 7 and is detachably fixed. The substrate under test 1, the jig substrate 3, and the extender substrate 5 assembled in this manner are arranged in a product unit.
It is connected to the motherboard via the motherboard connector 51b of the extender board 5.

Here, as shown in FIGS. 5 and 6, the jig substrate 3 has a plurality of pins for securing contacts from the back side with a shunt connector or a dip switch (not shown) of the substrate under test 1. 31a. The plurality of pins 31a are mounted on a block 31 having an adjusting function for adjusting the height of each pin 31a. Specifically, the plurality of pins 31 mounted on the block 31
A is provided with a predetermined amount of stroke by a spring or the like in order to absorb the individual difference of the substrate under test 1. Here, a relay circuit 32 for switching the connection state of each pin 31 a is connected to the plurality of pins 31 a via a cable 33. The relay circuit 32 has an extended I / O
Personal computer connection connector 36 for connecting to a personal computer by an interface or the like
And an extender board connection connector 37 for connecting a cable 38 from the extender board 5 to each of the pins 3 by a signal from a personal computer.
1a can be switched.

As shown in FIGS. 5 and 7, the extender board 5 has a board-side connector 51a and a motherboard-side connector 51b for connecting to the board-under-test 1 and the motherboard 2, respectively. The bus signal can be opened and shorted for each board under test 1 by cutting and connecting the output signal line between the board and the motherboard 2. A relay circuit 52 is provided on the extender board 5, and the jig board 3 is connected via a cable 38.
Is connected to the extender board connection connector 37.

FIGS. 8A and 8B are diagrams for explaining the use state of the warp correcting bracket 6 for correcting the warp of the substrate 1 to be tested. As shown in FIG. 8A, the substrate under test 1 fixed to the jig substrate 3 by the pawl members 34
There is a possibility that a part of the plurality of pins 31a may not be in contact with the back surface of the shunt connector or the DIP switch of the substrate under test 1 due to the pressing force of the pin 31a mounted on the substrate 31. In order to correct such a warp, as shown in FIG. 8 (b), a warp correction metal fitting 6 for correcting the warp of the substrate under test 1 is attached to the jig substrate 3, and a tooling hole (for positioning) of the substrate under test 1 is provided. It is preferable that the warped peripheral edge of the test substrate 1 is forcibly returned to a normal position by inserting the bent portion 1a into the hole 1a.

FIGS. 9A and 9B are diagrams for explaining the use state of the warp correcting spring fitting 8 for correcting the warp of the substrate 1 to be tested. As shown in FIG. 9A, the warp of the substrate under test 1 occurs not only at the periphery of the substrate 1 under test as shown in FIG. For this reason, as shown in FIG. 9B, the warp correcting spring metal fitting 8 for correcting the warp of the substrate under test 1 is attached to the pawl member 34, and is extended so as to sandwich the substrate 1 under test with the jig substrate 3. By pressing the substrate under test 1 from the back side
It is preferable to forcibly return the warped central portion of the test substrate 1 to a normal position.

As described above, according to the second embodiment of the present invention, the jig substrate 3 is accommodated within the thickness of one slot of a normal VME substrate or the like, and each substrate under test is used as a bus signal control unit. Since a plurality of extender boards 5 are inserted between the motherboard 2 and the test board 1, the test board 1, the jig board 3
In addition, the extender board 5 can be stored in the product rack in a form close to the actual operating state, and thus the test can be performed by effectively using the space in the product unit. Further, since the bus signal is automatically controlled by the extender board 5 inserted between the board under test 1 and the motherboard 2, there is no need to manually change the wiring. Furthermore, since the jig substrate 3 can be connected to the extender substrate 5 with the same interface, the interface of the jig substrate 3 can be unified, and therefore the jig substrate 3
Types can be suppressed.

Further, since each jig substrate 3 has a plurality of pins 31a for securing a contact from the back surface side with the shunt connector or the DIP switch of each substrate under test 1,
It is possible to cope with a case where any type of switch such as a shunt connector or a DIP switch is used to change the setting of each substrate under test 1. In addition, each pin 3
Since 1a is mounted on the block 31 having an adjusting function for adjusting the height of each pin 31a, it is possible to effectively prevent a contact failure from occurring. Furthermore, since each pin 31a is connected to the relay circuit 32 for switching the connection state of each pin 31a, the distance between the contacts can be kept within a certain limit, and the signal line becomes longer. A test can be performed on a substrate under test that becomes electrically unstable. Furthermore, since each jig substrate 3 further has a claw member 34 for fixing each substrate under test 1, the substrate under test 1 and the jig substrate 3 can be provided without providing fixing means on a product rack or the like.
, And replacement of the substrate under test 1 can be easily performed, and the contact between the substrate under test 1 and the jig substrate 3 is prevented from being accidentally disconnected during the test or preparation. be able to.

Further, each jig substrate 3 is connected to each test substrate 1
Since it further includes a warp correcting metal member 6 for correcting warpage and a warp correcting spring metal member 8 for pressing each of the substrates under test 1 to correct the warp of each of the substrates under test 1, contact failure of contacts and breakage of the substrate to be tested are provided. Can be prevented.

Further, since the jig substrate 3 and the extender substrate 5 are detachably fixed by the fixing metal 7,
The extender board 5 can also be taken out simultaneously with taking out the board under test 1 from the product rack, so that it is possible to prevent the trouble of leaving only the extender board 5 in the product rack. This eliminates the trouble of separately pulling out the extender board 5 left behind the product rack, and prevents the cable 38 connecting the jig board 3 and the extender board 5 from being damaged. In addition, the position of the front panel of each substrate under test 1 can be aligned by the extender substrate 5, so that the workability at the time of installation and removal from the product rack can be improved.

Third Embodiment Next, a third embodiment of the substrate single function test apparatus according to the present invention will be described with reference to FIGS.
The third embodiment of the present invention is substantially the same as the second embodiment shown in FIGS. 5 to 9 except that the extender substrate and the jig substrate are provided integrally. It is. In the third embodiment of the present invention, the same parts as those of the second embodiment shown in FIGS. 5 to 9 are denoted by the same reference numerals, and detailed description is omitted.

FIG. 10 is a diagram showing the assembled state of the substrate under test, the jig substrate, and the extender substrate in the third embodiment of the substrate function testing apparatus according to the present invention. As shown in FIG. 10, the substrate under test 1 and the jig substrate 3 are fixed to each other by a claw member 34 provided on the jig substrate 3. Further, the jig substrate 3 and the extender substrate 5 are connected by a hinge 9 to be integrated. The board under test 1, the jig board 3, and the extender board 5 assembled in this manner are arranged in a product unit and connected to the motherboard via the motherboard connector 51b of the extender board 5.

As described above, according to the third embodiment of the present invention, since the jig substrate 3 and the extender substrate 5 are provided integrally, the positioning of the substrate under test 1 and the jig substrate 3 can be performed.
In addition, it is possible to easily exchange the substrate under test 1. Specifically, the test board 1, the jig board 3, and the extender board 5 are assembled by attaching the test board 1 to the test board side connector 51 a of the extender board 5,
The jig substrate 3 is used as the substrate under test 1 with the hinge 9 as a support shaft.
, And hooked on a pawl member 34 provided on the jig substrate 3. After the assembly is performed in this way, only the operation of correcting the warpage generated on the substrate under test 1 is required, so that the operation is about 2/3 of that in the second embodiment. The test substrate 1, the jig substrate 3, and the extender substrate 5 can be assembled with a little trouble. In addition, since the board under test 1 is previously mounted on the connector 51a on the board under test of the extender board 5, the board under test 1 is mounted in a state where the extender board 5 is arranged in the product unit. No adjustment at hand during assembly is required.

In the above-described third embodiment, the jig substrate 3 and the extender substrate 5 are provided integrally. However, as shown in FIG. 11, the warpage of the substrate under test 1 is corrected. The warp correction spring fitting 8 may be further provided integrally. The warp correcting spring metal fitting 8 extends along the test substrate 1 from the extender substrate 5 side so as to sandwich the test substrate 1 with the jig substrate 3. FIG.
As shown in FIG. 5, the test board 1 is sandwiched between the jig board 3 and the warp correcting spring fitting 8, so that the test board 1 can be mounted in a form almost close to one touch. It is possible to correct a warp generated at an arbitrary place on the substrate 1. In addition, since the claws 34 do not directly contact the substrate under test 1, damage to the substrate under test 1 can be prevented.

[0048]

As described above, according to the present invention, the setting of each board to be tested and the bus signal can be changed by remote control in a state where the boards to be tested are arranged in the product unit. Therefore, the entire test work can be automated, and the number of man-hours and lead time can be reduced. Also,
Since a plurality of substrates under test connected on the motherboard can be tested with one test device, and the product unit can be used as it is as a part of the test device,
It is inexpensive and can improve space efficiency.

[Brief description of the drawings]

FIG. 1 is a schematic view showing first to third embodiments of a substrate single function test apparatus according to the present invention.

FIG. 2 is a diagram showing in detail a hardware configuration of the board unit function test apparatus.

FIG. 3 is a schematic diagram showing a software configuration of a board unit function test apparatus.

FIG. 4 is a diagram showing the software configuration of the board unit function test apparatus in detail.

FIG. 5 is a diagram showing an assembled state of a substrate to be tested, a jig substrate, and an extender substrate in a second embodiment of the substrate single function test apparatus according to the present invention.

FIG. 6 is a diagram showing a jig substrate in detail.

FIG. 7 is a diagram showing an extender substrate in detail.

FIG. 8 is a view for explaining a use state of a warp correcting bracket for correcting a warp of a substrate under test.

FIG. 9 is a view for explaining a use state of a warp correcting spring fitting for correcting a warp of a substrate under test.

FIG. 10 is a diagram showing an assembled state of a substrate to be tested, a jig substrate, and an extender substrate in a third embodiment of the substrate unit function test apparatus according to the present invention.

11 is a view showing a modification of the jig substrate and the extender substrate shown in FIG.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 board under test 1 a tooling hole 2 motherboard 3 jig board (board setting change section) 4 personal computer (test execution section) 5 extender board (bus signal control section) 6 warp correction fitting 7 fixing fitting 8 warp correction spring fitting 9 Mating 31 Block 31a Pin 32 Relay circuit 33, 38 Cable 34 Claw member 36 Connector for personal computer connection 37 Connector for extender board connection 41 Multiplexer (bus signal control unit) 51a Connector for board under test 51b Connector for motherboard 52 Relay circuit

Claims (12)

[Claims] A motherboard to which a plurality of boards under test are connected; a board setting change section for changing settings of the boards under test; and a bus signal controlling bus signals of the boards under test on the motherboard. A control unit, and a test execution unit that executes a unit function test for each of the test boards while changing settings of the test boards by the board setting change unit and the bus signal control unit. Substrate single function test equipment. 2. The apparatus according to claim 1, wherein said board setting changing section is arranged corresponding to each of said boards under test, and changes a setting of said board under test by changing an electrical connection state of said boards under test. 2. A jig substrate according to claim 1, wherein
The board unit function test apparatus described in the above. 3. The board single function testing apparatus according to claim 2, wherein said bus signal control section comprises a plurality of extender boards inserted between each of said boards under test and said mother board. 4. The jig substrate according to claim 2, wherein each of the jig substrates has a plurality of pins for securing a contact from the back surface side with a shunt connector or a dip switch of each of the substrates under test. Board single function test equipment. 5. The apparatus according to claim 4, wherein each of the jig substrates further includes a block on which each of the pins is mounted, the block having an adjusting function for adjusting the height of each of the pins. The board unit function test apparatus described in the above. 6. The apparatus according to claim 4, wherein each of the jig boards further has a relay circuit for switching a connection state of each of the pins. 7. The apparatus according to claim 2, wherein each of the jig substrates further includes a pawl member for fixing the substrate under test. 8. The apparatus according to claim 6, wherein each of the jig substrates further includes a metal fitting for correcting a warp of each of the substrates under test. 9. The function of a single substrate according to claim 7, wherein each of the jig substrates further includes a spring-like metal fitting for pressing each of the test substrates and correcting a warp of the test substrate. Testing equipment. 10. The apparatus according to claim 3, further comprising a fixture for detachably fixing the jig substrate and the extender substrate. 11. The apparatus according to claim 3, wherein said jig substrate and said extender substrate are provided integrally.
The board unit function test apparatus described in the above. 12. The jig substrate, the extender substrate, and a spring-like metal fitting for pressing the substrate under test to correct the warp of the substrate under test are provided integrally. The substrate single function test apparatus according to claim 3.