JPH11204986A - Electromagnetic wave shielding light transmissive window material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding light transmissive window material which can prevent moire phenomena and has extremely high light transmissivity, a high electromagnetic wave shielding property, and a high heat-ray (near infrared ray) shutoff property, by laminating two transparent substrates upon another with transparent conductive films and a conductive printed film in between and, in addition, to make the window material easily assembled and incorporated in an enclosure, and to uniformly conduct the enclosure with a low electric resistance. SOLUTION: A light transmissive window material is constituted by integrally joining transparent substrates 2B and 2B having transparent conductive films 4 with each other through a printed film 5 and sticking conductive adhesive tapes 7A and 7B to the end face of the substrate 2B, so that the tapes 7A and 7B may reach the edge sections of the conductive films 4 and printed film 5 and the surface edge section of the substrate 2B. The printed film 5 is formed by printing conductive ink on a transparent plate in a rough grid-like pattern having a line width of <=200 μm and an opening ratio of >=75%.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave shielding light transmitting window material useful as a front filter or the like of a plasma display panel (PDP), and can be easily incorporated into a housing of an OA device and the like. The present invention relates to an electromagnetic wave shielding light transmitting window material capable of achieving good conduction to a housing.

[0002]

2. Description of the Related Art In recent years, with the spread of office automation equipment and communication equipment, electromagnetic waves generated from these equipment have become a problem. That is, there is a concern that the electromagnetic waves may affect the human body, and malfunctions of precision equipment due to the electromagnetic waves have become a problem.

Therefore, as a front filter of a PDP of an OA device, a window material having an electromagnetic wave shielding property and a light transmitting property has been conventionally developed and put to practical use. Such a window material is also used as a window material in a place where precision equipment is installed, such as a hospital or a laboratory, in order to protect precision equipment from electromagnetic waves such as mobile phones.

[0004] The conventional electromagnetic wave shielding light transmitting window material has a structure in which a conductive mesh material such as a wire mesh or a transparent conductive film is interposed between transparent substrates such as an acrylic plate to be integrated. I have.

The conductive mesh used for the conventional electromagnetic shielding light transmitting window material generally has a wire diameter of 10 to 500.
It is about 5 to 500 mesh in μm, and the aperture ratio is less than 75%.

[0006]

Generally, the conductive mesh used in the prior art generally has a coarse mesh when the conductive fiber constituting the mesh has a large wire diameter, and a fine mesh when the wire diameter is small. . This is a fiber with a large wire diameter.
Although it is possible to form a coarse mesh, it is very difficult to form a coarse mesh with fibers having a small wire diameter.

For this reason, in the conventional electromagnetic wave shielding light transmitting window material using such a conductive mesh, even a material having a good light transmittance is at most about 70%, and it is possible to obtain a good light transmittance. There was a disadvantage that it could not be done.

Further, in the conventional conductive mesh, there is a problem that moire (interference fringes) is easily generated in relation to the pixel pitch of the light emitting panel on which the electromagnetic wave shielding light transmitting window material is mounted.

It is conceivable that both light transmittance and electromagnetic wave shielding properties can be achieved by using a transparent conductive film in combination. However, the transparent conductive film has a drawback that it is not easy to establish conduction with the housing. is there.

That is, in the case of a conductive mesh, as described above, the peripheral portion of the conductive mesh protrudes from the peripheral portion of the transparent substrate, the protruding portion is bent, and conduction from the bent portion to the housing is achieved. However, in the case of a transparent conductive film, if the peripheral portion of the transparent conductive film protrudes from the peripheral portion of the transparent substrate and is bent, the film is torn at the fold portion and conduction with the housing cannot be achieved.

It is also conceivable to form a transparent conductive film directly on the bonding surface of one transparent substrate instead of the transparent conductive film. In this case, the transparent conductive film is formed on the other transparent substrate. Therefore, conduction from the transparent conductive film to the housing cannot be achieved.

Therefore, when a transparent conductive film is used, it is necessary to make a design change such as forming a through hole in a transparent substrate to provide a conduction path with the transparent conductive film. The work of assembling the window material and assembling it into the housing becomes complicated.

The present invention solves the above-mentioned conventional problems, prevents the moire phenomenon, and has an excellent electromagnetic wave shielding light transmitting window material which is extremely excellent in light transmittance, electromagnetic wave shielding property and heat ray (near infrared ray) cutting property. An electromagnetic shielding light transmitting window material in which a conductive printing film and a conductive mesh are interposed between two transparent substrates, so that the window material can be easily assembled and incorporated into a housing. In the case,
It is an object of the present invention to provide an electromagnetic wave shielding light transmitting window material capable of achieving uniform and low-resistance conduction.

[0014]

According to the present invention, there is provided an electromagnetic wave shielding light transmitting window material comprising a first transparent substrate and a second transparent substrate having a transparent conductive film on one plate surface. An electromagnetic shielding light transmitting window material formed by bonding and integrating with a transparent adhesive with a conductive printing film interposed therebetween such that the conductive film is on the bonding surface side, and the conductive printing film is made of conductive ink.
The transparent conductive film is formed by pattern printing on the surface of the transparent plate in a grid pattern having a line width of 200 μm or less and an aperture ratio of 75% or more, and passes through the edge of the second transparent substrate from the edge of the transparent conductive film.
The first transparent substrate so as to reach the edge of the other plate surface.
A conductive adhesive tape, and the second transparent substrate is moved from the edge of the conductive printing film to the edge of the other plate surface of the second transparent substrate through the end surface of the second transparent substrate. It is characterized by attaching a conductive adhesive tape.

According to the pattern printing, since a conductive layer having a desired pattern shape can be formed, the line width, the interval, and the degree of freedom of the mesh shape are much larger than the conductive mesh, and the line width is 200 μm or less. Even a grid-shaped conductive layer having a high aperture ratio with a fine line having an aperture ratio of 75% or more can be easily formed.

However, a conductive printed film formed with such a fine-lined coarse conductive layer can obtain good light transmittance and prevent the moire phenomenon.

In the present invention, the aperture ratio is calculated from the mesh line width and the number of lines existing in one inch width.

In the present invention, by using such a conductive printing film and a transparent conductive film in combination, the electromagnetic wave shielding property, which is insufficient for a conductive printing film designed to have a high light transmittance without a moire phenomenon, can be provided by a transparent conductive film. By supplementing with a film, the moire phenomenon is prevented and good light transmittance, electromagnetic wave shielding properties, and heat ray (near infrared) cut properties are obtained.

According to the present invention, the first and second conductive adhesive tapes are attached to the edges of the transparent conductive film and the conductive print film, respectively, and the first and second conductive adhesive tapes are bonded to the first and second conductive adhesive tapes. 2
The conductive portion can be easily pulled out without changing the design of the window material by wrapping around the end surface of the transparent substrate. For this reason, the electromagnetic wave shielding light transmitting window material can be easily assembled, and can be easily incorporated into the housing, and the transparent conductive material of the electromagnetic wave shielding light transmitting window material can be interposed via the conductive adhesive tape. Good conduction between the conductive film and the conductive printed film and the housing can be obtained.

In the present invention, apart from the first and second conductive pressure-sensitive adhesive tapes, the edge of the surface of the first transparent substrate and the second transparent adhesive are further separated from the end faces of the first and second transparent substrates. It is preferable to apply a third cross-linkable conductive adhesive tape around the edge of the surface of the substrate, thereby improving the bonding strength of the electromagnetic wave shielding light transmitting window material and improving the handleability. In addition, it is possible to further facilitate the incorporation into the housing and achieve uniform and stable conduction.

By the way, in the conventional conductive adhesive tape,
As described above, since temporary fixing and reattachment cannot be performed, workability is poor, and a problem such as insufficient durability and adhesive strength of the bonded portion occurs.

Therefore, it is particularly preferable to use a cross-linked conductive pressure-sensitive adhesive tape as the conductive pressure-sensitive adhesive tape.

The cross-linkable conductive pressure-sensitive adhesive tape, particularly a cross-linkable conductive pressure-sensitive adhesive tape having an adhesive layer composed of an ethylene-vinyl acetate copolymer and a post-cross-linking adhesive layer containing a cross-linking agent thereof, is as follows: With such features, efficient assembly can be performed.

(I) It has excellent adhesiveness, and can be temporarily fixed to an object to be adhered easily and with an appropriate adhesive force. (ii) The adhesive strength before cross-linking is sufficient for temporary fixing, but is not so strong, so that it can be re-applied and repair work can be easily performed. (iii) Since the adhesive strength after crosslinking and curing is extremely strong, high adhesive strength can be obtained. (iv) High moisture resistance and heat resistance, and excellent long-term durability. (v) Even in the case of thermal crosslinking, crosslinking can be generally performed at a temperature of 130 ° C. or lower, and photocrosslinking can be performed. Since crosslinking and curing can be performed at a relatively low temperature, the bonding operation is easy.

In the present invention, the transparent adhesive is preferably a heat-crosslinkable adhesive mainly containing an ethylene-vinyl acetate copolymer resin and containing a crosslinking agent.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the electromagnetic wave shielding light transmitting window material of the present invention will be described below in detail with reference to the drawings.

FIG. 1A is a schematic cross-sectional view showing an embodiment of an electromagnetic wave shielding light transmitting window material of the present invention, and FIG. 1B is a transparent sheet to which a cross-linkable conductive adhesive tape is adhered. It is a top view showing a conductive film or a printing film.

This electromagnetic wave shielding light transmitting window material 1 is composed of a transparent substrate (first transparent substrate) 2A and a transparent substrate (second transparent substrate) having a transparent conductive film 4 adhered to one plate surface with an adhesive resin film 3C. (A transparent substrate) 2B and an adhesive resin film 3 via a conductive printing film (hereinafter, referred to as “printing film”) 5 in which a conductive layer 5B is printed on the surface of a transparent plate 5A.
A and 3B are bonded and integrated, and reach from the edge of the four sides of the transparent conductive film 4 of the transparent substrate 2B to the edge of the other plate surface via the end surface of the transparent substrate 2B. Thus, the first cross-linkable conductive pressure-sensitive adhesive tape a is stuck. Also, a second cross-linkable conductive adhesive tape b is provided so as to reach from the edge of the four sides of the printed film 5 on the conductive layer 5B side to the edge of the other plate surface via the end face of the transparent substrate 2B.
Is pasted. Furthermore, in the entire periphery of the laminate of the transparent substrates 2A and 2B, the print film 5, and the transparent conductive film 4, the adhesive adheres to the entire end surface and goes around the front and back corners of the laminate to form one transparent substrate 2A A third cross-linkable conductive adhesive tape 7C is further provided so as to adhere to both the edge of the surface and the edge of the surface of the other transparent substrate 2B.

Cross-linked conductive pressure-sensitive adhesive tape 7 used in the present invention
As shown in the figure, A, 7B, and 7C are provided with an adhesive layer b in which conductive particles are dispersed on one surface of a metal foil a, and the adhesive layer b is an ethylene-vinyl acetate-based adhesive layer. A post-crosslinkable adhesive layer containing a polymer containing a copolymer as a main component and a crosslinking agent thereof is preferable.

As the conductive particles to be dispersed in the adhesive layer b, various conductive particles may be used as long as they are electrically good conductors. For example, metal powder such as copper, silver, and nickel, resin or ceramic powder coated with such a metal can be used. There is no particular limitation on the shape, and any shape such as a scale shape, a tree shape, a granular shape, and a pellet shape can be adopted.

The compounding amount of the conductive particles is preferably 0.1 to 15% by volume based on a polymer described later constituting the adhesive layer b, and the average particle size is 0.1 to 100%.
μm is preferred. As described above, by defining the blending amount and the particle size, it is possible to prevent the conductive particles from condensing and obtain good conductivity.

The polymer constituting the adhesive layer b is mainly composed of an ethylene-vinyl acetate copolymer selected from the following (I) to (III), and has a melt index (MF).
R) is from 1 to 3000, especially from 1 to 1000, especially from 1 to
A value of 800 is preferred.

Thus, when the MFR is from 1 to 3000 and the vinyl acetate content is from 2 to 80% by weight, the following (I) to (II)
By using the copolymer (I), the tackiness before cross-linking is increased, the workability is improved, and the cured product after cross-linking has a high three-dimensional cross-linking density, exhibits strong adhesive strength, and has moisture resistance.・ The heat resistance is also improved.

(I) Ethylene-vinyl acetate copolymer having a vinyl acetate content of 20 to 80% by weight (II) Vinyl acetate content of 20 to 80% by weight and an acrylate and / or methacrylate monomer A copolymer of ethylene, vinyl acetate and acrylate and / or methacrylate monomers having a content of 0.01 to 10% by weight (III) a vinyl acetate content of 20 to 80% by weight,
When the content of maleic acid and / or maleic anhydride is 0.0
1 to 10% by weight of a copolymer of ethylene, vinyl acetate, maleic acid and / or maleic anhydride In the above ethylene-vinyl acetate copolymers (I) to (III), ethylene-vinyl acetate copolymer The combined vinyl acetate content is 20 to 80% by weight, preferably 20 to 80% by weight.
60% by weight. If the vinyl acetate content is less than 20% by weight, a sufficient degree of crosslinking cannot be obtained when crosslinking and curing at a high temperature, while if it exceeds 80% by weight, (I) and (II)
In the ethylene-vinyl acetate copolymer, the softening temperature of the resin is lowered, and storage becomes difficult, which is a practical problem.
In the case of the ethylene-vinyl acetate copolymer (III), the adhesive layer strength and durability tend to be significantly reduced.

In the copolymer (II) of ethylene, vinyl acetate and acrylate and / or methacrylate monomers, the content of the acrylate and / or methacrylate monomers is 0.01 to 10% by weight. , Preferably 0.05 to 5% by weight. When the content of the monomer is less than 0.01% by weight, the effect of improving the adhesive strength is reduced, while when it exceeds 10% by weight, the processability may be reduced. In addition, as an acrylate type | system | group and / or a methacrylate type | system | group monomer, the monomer selected from an acrylate or a methacrylate type monomer is mentioned, Acrylic acid or methacrylic acid is a C1-C20, especially -18 unsubstituted. Alternatively, an ester with a substituted aliphatic alcohol having a substituent such as an epoxy group is preferable, and examples thereof include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, and glycidyl methacrylate.

In the (III) copolymer of ethylene, vinyl acetate, maleic acid and / or maleic anhydride, the content of maleic acid and / or maleic anhydride is 0.01 to 10% by weight. , Preferably 0.05 to 5
% By weight. If the content is less than 0.01% by weight, the effect of improving the adhesive strength is reduced, while if it exceeds 10% by weight, the workability may be reduced.

The polymer according to the present invention has the above (I)
Containing at least 40% by weight, particularly at least 60% by weight, of the ethylene-vinyl acetate copolymer of (III), and in particular, comprising only the ethylene-vinyl acetate copolymer of (I) to (III) above Is preferred. When the polymer contains a polymer other than the ethylene-vinyl acetate-based copolymer, the polymer other than the ethylene-vinyl acetate-based copolymer is an olefin-based polymer containing 20 mol% or more of ethylene and / or propylene in the main chain. Polymers, polyvinyl chloride, acetal resins and the like can be mentioned.

As a crosslinking agent for this polymer, an organic peroxide as a thermal crosslinking agent for forming a thermosetting adhesive layer, and as a photocrosslinking agent for forming a photocurable adhesive layer. Can be used.

As the organic peroxide, any organic peroxide can be used as long as it decomposes at a temperature of 70 ° C. or more to generate radicals. The adhesive is preferably selected in consideration of the application temperature of the pressure-sensitive adhesive, preparation conditions, storage stability, curing (adhesion) temperature, heat resistance of the object to be adhered, and the like.

Examples of usable organic peroxides include 2,5-dimethylhexane-2,5-dihydroperoxide and 2,5-dimethyl-2,5-di (t-butylperoxy) hexyne- 3, di-t-butyl peroxide, t-butylcumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane,
Dicumyl peroxide, α, α′-bis (t-butylperoxyisopropyl) benzene, n-butyl-4,
4′-bis (t-butylperoxy) valerate, 1,
1-bis (t-butylperoxy) cyclohexane,
1,1-bis (t-butylperoxy) -3,3,5-
Trimethylcyclohexane, t-butylperoxybenzoate, benzoyl peroxide, t-butylperoxyacetate, methyl ethyl ketone peroxide, 2,5-dimethylhexyl-2,5-bisperoxybenzoate, butyl hydroperoxide, p-
Menthane hydroperoxide, p-chlorobenzoyl peroxide, hydroxyheptyl peroxide, chlorohexanone peroxide, octanoyl peroxide, decanoyl peroxide, lauroyl peroxide, cumyl peroxy octoate, succinic acid peroxide, acetyl peroxide Oxide, t-butyl peroxy (2-ethylhexanoate), m-toluoyl peroxide, t-butyl peroxyisobutyrate, 2,4-dichlorobenzoyl peroxide, and the like. As organic peroxides,
At least one of them is used alone or in combination, and usually 0.1 to 10% by weight is added to the polymer.

On the other hand, as the photosensitizer (photopolymerization initiator), a radical photopolymerization initiator is suitably used. Among the radical photopolymerization initiators, benzophenone, methyl o-benzoyl benzoate, 4-
Benzoyl-4′-methyldiphenyl sulfide, isopropylthioxanthone, diethylthioxanthone,
Ethyl 4- (diethylamino) benzoate and the like can be used. In addition, among the radical photopolymerization initiators, benzoin ether, benzoyl propyl ether, benzyl dimethyl ketal, α-hydroxyalkylphenone as an intramolecular cleavage type initiator, and 2-hydroxy-2-type as an α-hydroxyalkylphenone type.
Methyl-1-phenylpropan-1-one, 1-hydroxycyclohexylphenyl ketone, alkylphenylglyoxylate, diethoxyacetophenone, and 2-methyl-1- [4- (methylthiophene) as α-aminoalkylphenone type )) Phenyl) -2-morpholinopropanone-1,2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1
But also acylphosphine oxide and the like. As the photosensitizer, at least one of them is used alone or in combination, and usually 0.1 to 10% by weight is added to the polymer.

The pressure-sensitive adhesive layer according to the present invention preferably contains a silane coupling agent as an adhesion promoter. Examples of the silane coupling agent include vinyltriethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxy. Propyltriethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, vinyltrichlorosilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-β- (aminoethyl) -γ
One or a mixture of two or more such as -aminopropyltrimethoxysilane is used. These silane coupling agents are usually used in an amount of 0.01 to 5% by weight based on the weight of the polymer.
Used to a degree.

Further, an epoxy group-containing compound may be blended as an adhesion promoter. In this case, as the epoxy group-containing compound, triglycidyl tris (2-hydroxyethyl) isocyanurate, neopentyl glycol diglycidyl ether, , 6-hexanediol diglycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether, phenyl glycidyl ether, phenol (EO) ₅ glycidyl ether, p-
t-butylphenyl glycidyl ether, adipic acid diglycidyl ester, phthalic acid diglycidyl ester,
Glycidyl methacrylate, butyl glycidyl ether and the like can be mentioned. A similar effect can be obtained by alloying a polymer containing an epoxy group. These epoxy group-containing compounds may be used alone or in combination.
As a mixture of at least two or more kinds, usually 0.1 to 0.1% of the polymer is used.
About 1 to 20% by weight is used.

Physical properties (mechanical strength,
A compound having an acryloxy group, a methacryloxy group or an allyl group may be blended in the pressure-sensitive adhesive layer in order to improve or adjust the adhesiveness, optical properties, heat resistance, moisture resistance, weather resistance, crosslinking rate, etc.). .

As the compound used for this purpose, acrylic acid or methacrylic acid derivatives such as esters and amides thereof are the most common, and the ester residue is an alkyl group such as methyl, ethyl, dodecyl, stearyl and lauryl. Cyclohexyl group, tetrahydrofurfuryl group, aminoethyl group, 2-hydroxyethyl group, 3-hydroxypropyl group, 3-chloro-2-
And a hydroxypropyl group. Further, esters with polyfunctional alcohols such as ethylene glycol, triethylene glycol, polypropylene glycol, polyethylene glycol, trimethylolpropane, and pentaerythritol are also used. As the amide, diacetone acrylamide is typical. Examples of the polyfunctional crosslinking assistant include acrylic acid or methacrylic acid ester such as trimethylolpropane, pentaerythritol and glycerin, and compounds having an allyl group include triallyl cyanurate, triallyl isocyanurate, diallyl phthalate, diallyl isophthalate. , Diallyl maleate and the like. These compounds are usually used as one kind or as a mixture of two or more kinds,
0% by weight, preferably 0.5 to 30% by weight is used. If the amount exceeds 50% by weight, the workability and coatability during preparation of the pressure-sensitive adhesive may be reduced.

Further, a hydrocarbon resin can be added to the pressure-sensitive adhesive layer for the purpose of improving workability, bonding and the like. In this case, the hydrocarbon resin to be added may be either a natural resin type or a synthetic resin type. Rosin, rosin derivatives, and terpene resins are preferably used as the natural resin. For rosin, gum-based resins, tall oil-based resins, and wood-based resins can be used. As the rosin derivative, rosin obtained by hydrogenation, heterogeneization, polymerization, esterification, and metal salification can be used. As the terpene-based resin, terpene-based resins such as α-pinene and β-pinene, as well as terpene phenol resins can be used. Further, dammar, koval, and shellac may be used as other natural resins. On the other hand, in the case of synthetic resins, petroleum resins, phenol resins, and xylene resins are preferably used. Petroleum resins include aliphatic petroleum resins, aromatic petroleum resins, alicyclic petroleum resins, copolymer petroleum resins, hydrogenated petroleum resins,
Pure monomer petroleum resins and coumarone indene resins can be used. As the phenolic resin, an alkylphenol resin and a modified phenol resin can be used. As the xylene-based resin, a xylene resin or a modified xylene resin can be used. The addition amount of these hydrocarbon resins is appropriately selected, but is preferably from 1 to 200% by weight, more preferably from 5 to 150% by weight, based on the polymer.

In addition to the above additives, in the present invention,
Antioxidants, ultraviolet absorbers, dyes, processing aids, and the like may be incorporated in the pressure-sensitive adhesive layer in a range that does not impair the purpose of the present invention.

The cross-linked conductive pressure-sensitive adhesive tapes 7A to 7 of the present invention
As the metal foil a serving as the base material of C, copper, silver, nickel,
Aluminum or stainless steel foil can be used,
The thickness is usually about 1 to 100 μm.

The adhesive layer b is obtained by uniformly mixing the above-mentioned metal foil a with the above-mentioned ethylene-vinyl acetate copolymer, a cross-linking agent, and other additives as necessary, and conductive particles at a predetermined ratio. Can be easily formed by coating with a roll coater, a die coater, a knife coater, a my cover coater, a flow coater, a spray coater or the like.

The thickness of the adhesive layer b is usually 5 to 10
It is about 0 μm.

In the present invention, the constituent materials of the transparent substrates 2A and 2B include glass, polyester, polyethylene terephthalate (PET), polybutylene terephthalate, polymethyl methacrylate (PMMA), acrylic plate, polycarbonate (PC), polystyrene, Triacetate film, polyvinyl alcohol, polyvinyl chloride, polyvinylidene chloride, polyethylene, ethylene-vinyl acetate copolymer, polyvinyl butyral, metal ion-crosslinked ethylene-methacrylic acid copolymer, polyurethane, cellophane, etc., preferably, glass, PET , P
C and PMMA.

The thickness of the transparent substrates 2A and 2B is appropriately determined depending on the required characteristics (for example, strength and light weight) depending on the use of the obtained window material, but is usually 0.1 to 10 mm.
Range.

The transparent substrates 2A and 2B are not necessarily required to be made of the same material. For example, in the case where only the front side is required to be scratch-resistant or durable, etc. Transparent substrate 2A having a thickness of 0.1 to 1
A glass plate of about 0mm, back side (electromagnetic wave source side)
The transparent substrate 2B can be a PET film or a PET plate, an acrylic film or an acrylic plate, a polycarbonate film or a polycarbonate plate having a thickness of about 1 μm to 10 mm.

Electromagnetic wave shielding light transmitting window material 1 of this embodiment
In this example, a black frame coating 6 based on an acrylic resin is provided on the periphery of the transparent substrate 2B on the back side.

Further, in the electromagnetic wave shielding light transmitting window material 1 of this embodiment, the antireflection film 8 is formed on the surface of the transparent substrate 2A on the front side. As the antireflection film 8 formed on the surface side of the transparent substrate 2A, a single-layer film of the following (1) or a laminated film of a high-refractive-index transparent film and a low-refractive-index transparent film, for example, the following (2) ) To (5).

(1) One layer of a transparent film having a lower refractive index than the transparent substrate. (2) One layer of a high refractive index transparent film and one layer of a low refractive index transparent film. (3) High A total of four alternately laminated two-layer transparent and low-refractive-index transparent films (4) One layer in the order of medium-refractive-index transparent film / high-refractive-index transparent film / low-refractive-index transparent film. Three layers laminated (5) High refractive index transparent film / Low refractive index transparent film In this order, three layers are alternately laminated, and a total of six layers are laminated. As the high refractive index transparent film, ITO (tin indium) is used. Oxide) or ZnO, Al-doped ZnO, TiO ₂ ,
A thin film having a refractive index of 1.8 or more, such as SnO ₂ or ZrO, preferably a transparent conductive thin film can be formed. Also,
As the low-refractive-index transparent film, a thin film made of a low-refractive-index material having a refractive index of 1.6 or less, such as SiO ₂ , MgF ₂ , or Al ₂ O _3, can be formed. These film thicknesses differ depending on the film configuration, film type, and center wavelength in order to reduce the reflectance in the visible light region due to light interference. However, in the case of a four-layer structure, the first layer on the transparent substrate side (high refractive index) 5 to 50 nm for the second layer (transparent film with low refractive index), 50 to 100 nm for the third layer (transparent film with high refractive index), and 50 for the fourth layer (transparent film with low refractive index). It is formed with a thickness of about 150 nm.

Further, an anti-contamination film may be further formed on the anti-reflection film 8 so as to enhance the anti-staining property of the surface. In this case, as the contamination prevention film, a film thickness of 1 to 1000 nm made of a fluorine-based thin film, a silicon-based thin film, or the like.
A thin film of the order is preferred.

In the electromagnetic wave shielding light transmitting window material of the present invention, the transparent substrate 2A on the front side is further subjected to a hard coat treatment with a silicon-based material or the like, or an antiglare in which a light scattering material is kneaded in the hard coat layer. Processing or the like may be performed. Further, the transparent substrate 2B on the back surface side can be provided with a heat ray reflection coat such as a metal thin film or a transparent conductive film to enhance the functionality. The transparent conductive film can be formed on the transparent substrate 2A on the front side.

As the transparent conductive film 4 adhered to the transparent substrate 2B, a resin film in which conductive particles are dispersed can be used. The conductive particles are not particularly limited as long as they have conductivity. However, for example, the following may be mentioned.

(I) Carbon particles or powder (ii) Nickel, indium, chromium, gold, vanadium, tin, cadmium, silver, platinum, aluminum, copper, titanium, cobalt, lead and other metals or alloys or their conductive properties Oxide particles or powder (iii) A coating layer of the conductive material of (i) or (ii) above formed on the surface of plastic particles such as polystyrene or polyethylene.The particle size of these conductive particles is excessively large. If it is large, it affects the light transmittance and the thickness of the transparent conductive film 4, so that it is preferably 0.5 mm or less. The preferred particle size of the conductive particles is 0.01 to 0.5 mm.

When the mixing ratio of the conductive particles in the transparent conductive film 4 is too large, the light transmittance is impaired, and when the mixing ratio is too small, the electromagnetic wave shielding property is insufficient. 0.1 to 50 by weight
% By weight, especially 0.1 to 20% by weight, especially 0.5 to 2%
It is preferred to be about 0% by weight.

The color and gloss of the conductive particles are appropriately selected depending on the purpose. In the case of a display filter, a dark color such as black or brown and a matte color are preferable. In this case, by adjusting the light transmittance of the filter appropriately by the conductive particles, there is also an effect that the screen becomes easy to see.

As the matrix resin of the transparent conductive film, polyester, polyethylene terephthalate (PET), polybutylene terephthalate, polymethyl methacrylate (PMMA), acrylic plate, polycarbonate (PC), polystyrene, triacetate film, polyvinyl alcohol, Polyvinyl chloride, polyvinylidene chloride, polyethylene, ethylene-vinyl acetate copolymer, polyvinyl butyral, metal ion crosslinked ethylene-methacrylic acid copolymer, polyurethane, cellophane, and the like, preferably, PET, PC, and PMMA.

The thickness of such a transparent conductive film 4 varies depending on the use of the electromagnetic wave shielding light transmitting window material and the like, but is usually about 1 μm to 5 mm. The thickness of the conductive layer of the transparent conductive film 4 is 0.01 μm.
If the thickness is less than 5, the thickness of the conductive layer for shielding the electromagnetic wave is too thin, so that sufficient electromagnetic wave shielding property cannot be obtained.
If it exceeds μm, light transmittance may be impaired.

In the present invention, such a transparent substrate 2
The printed film 5 interposed between A and 2B is formed by patterning a grid-like conductive layer 5B on the surface of a transparent plate 5A using the following conductive ink by screen printing, ink jet printing, electrostatic printing or the like. It was printed. Particles of carbon black having a particle size of 100 μm or less, or particles of a conductive material such as particles of a metal or alloy such as silver, copper, aluminum, nickel, etc. are adjusted to a concentration of 50 to 90% by weight.
Dispersed in a binder resin such as MMA, polyvinyl acetate and epoxy resin. This ink is diluted or dispersed in an appropriate concentration in a solvent such as toluene, xylene, methylene chloride, or water and applied by printing to the plate surface of a transparent substrate, and then dried at room temperature to 120 ° C. as necessary, and then dried on the transparent plate. Paint. Particles obtained by covering particles of the same conductive material as described above with a binder resin are directly applied by electrostatic printing and fixed by heat or the like.

The thickness of the conductive layer 5B formed in this manner is not preferable because the electromagnetic wave shielding performance is insufficient if it is too thin, and affects the thickness of the obtained electromagnetic wave shielding light transmitting window material if it is too thick. From 0.5 to 100
It is preferably about μm.

According to such pattern printing, the conductive layer 5B having a large degree of freedom in the pattern and having an arbitrary line width, interval and opening shape can be formed. It is possible to easily form an electromagnetic wave shielding light transmitting window material having a property and a light transmitting property.

In the present invention, the conductive layer 5B is formed in a grid pattern of coarse fine lines having a line width of 200 μm or less and an aperture ratio of 75% or more. If the line width of the lattice exceeds 200 μm or the aperture ratio is smaller than 75%, the light transmittance is reduced and moire is generated. However, if the line width is excessively small and the aperture is excessively large, the electromagnetic wave shielding property is deteriorated.
165 mesh or less for about 20 μm or less, 100 mesh or less for about 30 μm, 40 μm
About 80 mesh or less, about 50 μm about 60
It is preferable that the mesh is 30 mesh or less when the mesh is about 100 μm or less, and 15 mesh or less when the mesh is about 200 μm.

In the present invention, if the pattern printing of the conductive layer 5B has the above-mentioned line width and aperture,
The shape of the opening of the lattice is not particularly limited, and may be a circle, a hexagon, a triangle, an ellipse, or the like in addition to a square. Further, the openings are not limited to those regularly arranged, but may be random patterns.

As the transparent plate 5A for forming the conductive layer 5B, those exemplified as constituent materials of the transparent substrate can be used, and the thickness thereof is usually 1 μm to 5 mm.
Degree.

In the present invention, the adhesive resin for adhering the transparent substrates 2A and 2B via the printing film 5 includes ethylene-vinyl acetate copolymer, ethylene-methyl acrylate copolymer, ethylene- (meth) acrylic acid. Copolymer,
Ethylene-ethyl (meth) acrylate copolymer, ethylene-methyl (meth) acrylate copolymer, metal ion crosslinked ethylene- (meth) acrylic acid copolymer, partially saponified ethylene-vinyl acetate copolymer, carboxyl ethylene −
Ethylene copolymers such as a vinyl acetate copolymer, an ethylene- (meth) acryl-maleic anhydride copolymer, and an ethylene-vinyl acetate- (meth) acrylate copolymer (here, “(meth) acryl” Represents "acrylic or methacrylic.") In addition, polyvinyl butyral (PVB) resin, epoxy resin, acrylic resin, phenol resin, silicone resin, polyester resin, urethane resin, etc. can also be used, but the most balanced in terms of performance and ethylene-vinyl acetate is easy to use. It is a copolymer (EVA). Further, PVB resins used in laminated glass for automobiles are also suitable in terms of impact resistance, penetration resistance, adhesiveness, transparency and the like.

The PVB resin contains 70 to 95% by weight of a polyvinyl acetal unit, 1 to 15% by weight of a polyvinyl acetate unit, and has an average degree of polymerization of 200 to 3,000, preferably 3,
It is preferably from 00 to 2500, and the PVB resin is used as a resin composition containing a plasticizer.

Examples of the plasticizer for the PVB resin composition include organic plasticizers such as monobasic acid esters and polybasic acid esters, and phosphoric acid plasticizers.

The monobasic acid esters include butyric acid, isobutyric acid, caproic acid, 2-ethylbutyric acid, heptanoic acid, n-octylic acid, 2-ethylhexylic acid, pelargonic acid (n-
Esters obtained by the reaction of an organic acid such as nonylic acid) and decylic acid with triethylene glycol, and more preferably triethylene-di-2-ethylbutyrate and triethylene glycol-di-2-ethylhexo. Ethates, triethylene glycol-di-capronate, triethylene glycol-di-n-octoate and the like. Note that an ester of the above organic acid with tetraethylene glycol or tripropylene glycol can also be used.

As the polybasic acid ester plasticizer, for example, an ester of an organic acid such as adipic acid, sebacic acid, azelaic acid and a linear or branched alcohol having 4 to 8 carbon atoms is preferable, and more preferably. , Dibutyl sebacate, dioctyl azelate, dibutyl carbitol adipate and the like.

Examples of the phosphoric acid plasticizer include tributoxyethyl phosphate, isodecylphenyl phosphate, triisopropyl phosphate and the like.

In the PVB resin composition, if the amount of the plasticizer is small, the film-forming property is reduced, and if the amount is large, the durability at the time of heat resistance is impaired. Therefore, the plasticizer is added in an amount of 5 to 100 parts by weight of the polyvinyl butyral resin. 50 parts by weight, preferably 10-4
0 parts by weight.

To the PVB resin composition, additives such as a stabilizer, an antioxidant and an ultraviolet absorber may be added in order to further prevent deterioration.

Although the thickness of the adhesive layer formed of the transparent conductive film 4 and the print film 5 and the adhesive resin varies depending on the use of the electromagnetic wave shielding light transmitting window material, etc.
Usually, it is about 2 μm to 2 mm. Therefore, the adhesive resin films 3A to 3C are formed in such a thickness that an adhesive layer having such a thickness is obtained.

Hereinafter, the adhesive layer according to the present invention will be described in more detail by exemplifying the case where EVA is used as the resin.

The EVA has a vinyl acetate content of 5 to 5
0% by weight, preferably 15-40% by weight is used. If the vinyl acetate content is less than 5% by weight, there is a problem in weather resistance and transparency, and if it exceeds 40% by weight, mechanical properties are remarkably deteriorated, film formation becomes difficult, and film mutual blocking occurs. .

When crosslinking by heating, an organic peroxide is suitable as the crosslinking agent, and is selected in consideration of sheet processing temperature, crosslinking temperature, storage stability and the like. Usable peroxides include, for example, 2,5-dimethylhexane-2,5-dihydroperoxide; 2,5-dimethyl-2,5-
Di (t-butylperoxy) hexane-3; di-t-butyl peroxide; t-butylcumyl peroxide; 2,5-dimethyl-2,5-di (t-butylperoxy) hexane; dicumyl peroxide Α, α'-
Bis (t-butylperoxyisopropyl) benzene;
n-butyl-4,4-bis (t-butylperoxy) valerate; 2,2-bis (t-butylperoxy) butane; 1,1-bis (t-butylperoxy) cyclohexane; 1,1- Bis (t-butylperoxy) -3,
3,5-trimethylcyclohexane; t-butylperoxybenzoate; benzoyl peroxide; tert-butylperoxyacetate; 2,5-dimethyl-2,5
-Bis (tert-butylperoxy) hexyne-3; 1,1
-Bis (tert-butylperoxy) -3,3,5-trimethylcyclohexane; 1,1-bis (tert-butylperoxy) cyclohexane; methyl ethyl ketone peroxide; 2,5-dimethylhexyl-2,5-bisper Oxybenzoate; tertiary butyl hydroperoxide; p-menthane hydroperoxide; p-chlorobenzoyl peroxide; tertiary butyl peroxyisobutyrate; hydroxyheptyl peroxide; chlorohexanone peroxide. These peroxides are used alone or as a mixture of two or more, usually in a proportion of 10 parts by weight or less, preferably 0.1 to 10 parts by weight, based on 100 parts by weight of EVA.

The organic peroxide is usually extruded to EVA,
It is kneaded by a roll mill or the like, but may be dissolved in an organic solvent, a plasticizer, a vinyl monomer or the like, and added to the EVA film by an impregnation method.

In order to improve the physical properties (mechanical strength, optical properties, adhesion, weather resistance, whitening resistance, cross-linking speed, etc.) of EVA, various acryloxy or methacryloxy and allyl group-containing compounds are added. be able to. As the compound used for this purpose, acrylic acid or methacrylic acid derivatives, for example, esters and amides thereof are the most common, and ester residues include methyl, ethyl, dodecyl, stearyl, lauryl and other alkyl groups, as well as cyclohexyl groups. , A tetrahydrofurfuryl group, an aminoethyl group, a 2-hydroxyethyl group, a 3-hydroxypropyl group, and a 3-chloro-2-hydroxypropyl group. Further, esters with polyfunctional alcohols such as ethylene glycol, triethylene glycol, polyethylene glycol, trimethylolpropane, and pentaerythritol can also be used. As the amide, diacetone acrylamide is typical.

More specifically, polyfunctional esters such as acrylic or methacrylic esters such as trimethylolpropane, pentaerythritol and glycerin, triallyl cyanurate, triallyl isocyanurate, diallyl phthalate, diallyl isophthalate, and maleic Allyl group-containing compounds, such as diallyl acid, are listed. These may be used alone or as a mixture of two or more.
0.1 to 2 parts by weight, preferably 0.5 to 0 parts by weight
To 5 parts by weight.

When EVA is crosslinked by light, a photosensitizer is used in an amount of usually 10 parts by weight or less, preferably 0.1 to 10 parts by weight, per 100 parts by weight of EVA instead of the above-mentioned peroxide.

In this case, usable photosensitizers include:
For example, benzoin, benzophenone, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, dibenzyl, 5-nitroacenaphthene, hexachlorocyclopentadiene, p-nitrodiphenyl, p-nitroaniline, 2,4,6-triene Nitroaniline, 1,2-benzanthraquinone, 3-methyl-1,3-diaza-
1,9-benzanthrone and the like;
Species can be used alone or in combination of two or more.

In this case, a silane coupling agent is used in combination as an accelerator. As the silane coupling agent, vinyltriethoxysilane, vinyltris (β
-Methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, γ-glycidoxypropyltrimethoxysilane, γ
-Glycidoxypropyltriethoxysilane, β-
(3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-chloropropylmethoxysilane, vinyltrichlorosilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N
-Β (aminoethyl) -γ-aminopropyltrimethoxysilane and the like.

These silane coupling agents are usually EV
One or more kinds are mixed and used at a ratio of 0.001 to 10 parts by weight, preferably 0.001 to 5 parts by weight with respect to 100 parts by weight of A.

The adhesive resin film according to the present invention may further contain a small amount of an ultraviolet absorber, an infrared absorber, an antioxidant, and a paint processing aid, and may adjust the color of the filter itself. For this purpose, an appropriate amount of a coloring agent such as a dye or a pigment, or a filler such as carbon black, hydrophobic silica or calcium carbonate may be blended.

As means for improving adhesiveness, means such as corona discharge treatment, low-temperature plasma treatment, electron beam irradiation, and ultraviolet light irradiation on the surface of the adhesive resin film formed into a sheet are also effective.

The adhesive resin film according to the present invention may be an EV
A or an adhesive resin such as PVB and the above additives are mixed,
After kneading with extruder, roll, etc., calender, roll, T
It is manufactured by forming a sheet into a predetermined shape by a film forming method such as die extrusion or inflation. During film formation, embossing is applied to prevent blocking and facilitate degassing during pressure bonding with a transparent substrate.

Electromagnetic wave shielding light transmitting window material 1 shown in FIG.
In order to manufacture the transparent substrate 2A on which the antireflection film 8 is formed,
And a transparent substrate 2B provided with a black frame coating 6, a transparent conductive film 4, a printing film 5, and an adhesive resin film 3A,
3B, 3C and cross-linkable conductive adhesive tapes 7A, 7B, 7
C is prepared, and first, a cross-linked conductive pressure-sensitive adhesive tape a is adhered to the periphery of the transparent conductive film 4, and is electrically connected between the film and the cross-linked conductive pressure-sensitive adhesive tape a while being cross-linked by heating and pressing with a heat sealer or the like. To have. Next, it is laminated with the transparent substrate 2B via the adhesive resin film 3C, and the crosslinked conductive adhesive tape a is wrapped around and bonded. In addition, a cross-linkable conductive adhesive tape b is attached to the periphery of the print film 5 to similarly provide electrical continuity. Next, it is laminated on the transparent substrate 2B via the adhesive resin film 3B, and the crosslinked conductive adhesive tape b is wrapped around and bonded. Thereafter, the resin film for bonding is laminated between the transparent substrate 2A and the printed film 5 of the transparent substrate 2B via the bonding resin film 3A, and heated or irradiated with light under pressure under the curing conditions of the bonding resin films 3A to 3C to be integrated. After doing
Further, the third cross-linkable conductive adhesive tape 7 is extended from the edge of the surface of the transparent substrate 2A to the edge of the surface of the transparent substrate 2B.
Paste C.

Crosslinkable conductive adhesive tapes 7A, 7B, 7C
At the time of sticking, sticking to the laminate using the adhesiveness of the adhesive layer b (this temporary fixing, if necessary,
Re-pasting is possible. Then, heating or ultraviolet irradiation is performed while applying pressure as necessary. Heating may also be performed at the time of this ultraviolet irradiation. In addition, by locally performing the heating or the light irradiation, it is possible to adhere only a part of the cross-linkable conductive adhesive tape.

The heat bonding can be easily performed with a general heat sealer. As a method of heating under pressure, a laminate having a cross-linked conductive adhesive tape stuck thereon is put in a vacuum bag and degassed. A method of heating may be used, and bonding can be performed very easily.

The bonding conditions are as follows in the case of thermal crosslinking:
Although it depends on the type of the crosslinking agent (organic peroxide) to be used, it is usually 70 to 150 ° C, preferably 70 to 130 ° C, and usually 10 seconds to 120 minutes, preferably 20 seconds to 60 minutes.

In the case of photocrosslinking, the light source is ultraviolet to
Many light sources that emit light in the visible region can be used, and examples thereof include ultra-high pressure, high pressure, low pressure mercury lamps, chemical lamps, xenon lamps, halogen lamps, mercury halogen lamps, carbon arc lamps, incandescent lamps, and laser light.
The irradiation time is not generally determined depending on the type of the lamp and the intensity of the light source, but is usually several tens seconds to several tens of minutes. After heating to 40 to 120 ° C. in advance to promote cross-linking, this may be irradiated with ultraviolet rays.

The pressing force at the time of bonding is also appropriately selected, and is usually 5 to 50 kg / cm ² , particularly 10 to 30 kg.
/ Cm ² is preferably applied.

The width of the cross-linked conductive adhesive tape a at the edge of the transparent conductive film 4 and the width of the cross-linked conductive adhesive tape b at the edge of the printed film 5 (FIG. 1B) W) varies depending on the area of the electromagnetic wave shielding light transmitting window material 1, but usually 3 to 2
It is about 0 mm.

In this manner, the cross-linkable conductive adhesive tape 7
The electromagnetic-shielding light-transmitting window material 1 to which A, 7B, and 7C are attached can be very simply and easily incorporated into the housing simply by being fitted into the housing, and at the same time, the cross-linkable conductive adhesive tapes 7A, 7B, Good conduction between the transparent conductive film 4, the conductive layer 5 </ b> B of the print film 5, and the housing via 7 </ b> C can be uniformly obtained at the four side edges. Therefore, a good electromagnetic wave shielding effect can be obtained.

The electromagnetic shielding light transmitting window material shown in FIG. 1 is an example of the electromagnetic shielding light transmitting window material of the present invention, and the present invention is not limited to the illustrated one.
For example, the cross-linkable conductive adhesive tapes 7A and 7B may be attached to the four side edges of the transparent conductive film 4 and the print film 5, respectively, or may be attached only to the opposing two side edges. However, from the viewpoint of uniform conductivity,
As shown in the figure, it is preferable to attach them at the four side edges.

Further, as shown in FIG. 1, the electromagnetic wave shielding light transmitting window material of the present invention is not limited to a transparent conductive film bonded to a second transparent substrate with an adhesive resin film, but may be a second transparent substrate. A transparent conductive film may be directly formed on a substrate. As such an electromagnetic wave shielding light transmitting window material, a material in which the following transparent conductive film is formed on a second transparent substrate is exemplified.

A metal film in the form of a lattice or punching metal formed by etching a predetermined pattern on a plate surface of a transparent substrate by a process of coating a photoresist, exposing a pattern, and etching. A grid or punched metal printed film formed by pattern printing of conductive ink on the surface of a transparent substrate.

Further, the electromagnetic wave shielding light transmitting window material of the present invention is the same as the electromagnetic wave shielding light transmitting window material shown in FIG. 1, except that the transparent conductive film is replaced with a lattice-shaped or punched metal shape by pattern etching. The foil may be adhered to a transparent substrate. In this case as well, the metal foil which is easily cut by folding can easily conduct without turning the metal foil.

Such an electromagnetic wave shielding light transmitting window material of the present invention is very suitable as a front filter of a PDP or a window material of a precision equipment installation place such as a hospital or a laboratory.

[0106]

As described above in detail, the electromagnetic wave shielding light transmitting window material of the present invention is easy to assemble and can be easily incorporated into the housing to be installed. As a result, uniform and low-resistance conduction can be reliably obtained, so that a high electromagnetic wave shielding performance can be obtained.

Further, in the electromagnetic wave shielding light transmitting window material of the present invention, by using both the transparent conductive film and the conductive printed film, the conductive printed film can be made of fine lines, large apertures, and high light. By adopting a grid design that is transparent and free from moiré phenomenon, and by supplementing the electromagnetic shielding properties that are insufficient with such a conductive printing film with a transparent conductive film, it is possible to obtain clear images with high electromagnetic shielding properties and high light transmission. It becomes possible. Also,
Good heat ray (near infrared) cut properties can also be obtained.

[Brief description of the drawings]

FIG. 1A is a schematic cross-sectional view showing an embodiment of an electromagnetic wave shielding light transmitting window material of the present invention.
(B) is a plan view showing a transparent conductive film or a printed film to which a cross-linkable conductive adhesive tape has been attached.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electromagnetic wave shielding light transmission window material 2A, 2B Transparent substrate 3A, 3B, 3C Adhesive resin film 4 Transparent conductive film 5 Printing film 5A Transparent plate 5B Conductive layer a, b, 7C Cross-linked conductive adhesive tape a Metal foil b Adhesive layer 8 Anti-reflective coating

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Masato Yoshikawa 3-1-1, Ogawa-Higashicho, Kodaira-shi, Tokyo Inside Bridgestone Technology Center Co., Ltd.

Claims (4)

[Claims] 1. A first transparent substrate and a second transparent substrate having a transparent conductive film on one plate surface, with a conductive printed film interposed therebetween such that the transparent conductive film is on the bonding surface side. An electromagnetic wave shielding light transmitting window material which is joined and integrated with a transparent adhesive, wherein the conductive printing film is made of a transparent plate in a grid shape having a line width of 200 μm or less and an aperture ratio of 75% or more. Is formed by pattern printing on the surface of the second transparent substrate from the edge of the transparent conductive film to the edge of the other plate surface of the second transparent substrate through the end surface of the second transparent substrate. A first conductive pressure-sensitive adhesive tape is adhered, and the first conductive pressure-sensitive adhesive tape is applied so as to reach the edge of the other plate surface of the second transparent substrate from the edge of the second transparent substrate through the edge of the second transparent substrate. 2. An electromagnetic wave shielding light transmitting window material, characterized in that the conductive adhesive tape according to (2) is attached. 2. The device according to claim 1, wherein the edge of the plate surface on the non-joining surface side of the first transparent substrate from the end surfaces of the first and second transparent substrates and the other plate surface of the second transparent substrate. An electromagnetic-shielding light-transmitting window material, wherein a third conductive adhesive tape is stuck around the edge. 3. The electromagnetic wave shielding light transmitting window material according to claim 1, wherein the conductive adhesive tape is a cross-linkable conductive adhesive tape. 4. The heat-crosslinkable adhesive according to claim 1, wherein the transparent adhesive is an ethylene-vinyl acetate copolymer resin as a main component and a crosslinking agent. Electromagnetic wave shielding light transmitting window material.