JPH11204374A - Thick film printed capacitor - Google Patents
Thick film printed capacitorInfo
- Publication number
- JPH11204374A JPH11204374A JP1770698A JP1770698A JPH11204374A JP H11204374 A JPH11204374 A JP H11204374A JP 1770698 A JP1770698 A JP 1770698A JP 1770698 A JP1770698 A JP 1770698A JP H11204374 A JPH11204374 A JP H11204374A
- Authority
- JP
- Japan
- Prior art keywords
- electrode layer
- layer
- hole
- thick
- dielectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、厚膜印刷コンデンサに
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thick film printing capacitor.
【０００２】[0002]
【従来の技術】近年、電子部品の小型化が要求されてお
り、なかでもコンデンサの小型化、薄型化が要求されて
いる。低温焼成が可能な高誘電率の誘電体材料が開発さ
れて上記要求をかなえる厚膜印刷コンデンサ技術が多く
提案されてきている。構造的には、絶縁性基板の表面に
導電性ペーストを厚膜印刷して下部電極を形成し、該下
部電極の上に誘電体ペーストを厚膜印刷して誘電体層を
形成し、該誘電体層の上に導電性ペーストを厚膜印刷し
て上部電極を形成して、下部電極、誘電体層及び下部電
極を層状に形成したものである。例えば、特開平２−９
４５０５号公報に記載された基板上に一方の電極材料
層、誘電体層及び他方の電極材料層よりなる厚膜コンデ
ンサの製造方法がある。2. Description of the Related Art In recent years, miniaturization of electronic components has been demanded, and in particular, miniaturization and thinning of capacitors have been demanded. A dielectric material having a high dielectric constant that can be fired at a low temperature has been developed, and many thick-film printing capacitor technologies meeting the above requirements have been proposed. Structurally, a lower electrode is formed by printing a thick conductive paste on the surface of the insulating substrate, and a thick dielectric film is printed on the lower electrode to form a dielectric layer. The upper electrode is formed by printing a thick conductive paste on the body layer, and the lower electrode, the dielectric layer and the lower electrode are formed in layers. For example, Japanese Patent Laid-Open No. 2-9
There is a method for manufacturing a thick film capacitor including one electrode material layer, a dielectric layer, and the other electrode material layer on a substrate described in Japanese Patent No. 4505.
【０００３】[0003]
【発明が解決しようとする課題】従来技術において、図
３に示す如く基板１１の上に厚膜印刷方法にて形成され
た一方の電極材料層１２、誘電体層１３、他方の電極材
料層１４よりなる厚膜コンデンサに保護層１５を形成し
て信頼性を向上させている。しかしながら、保護層を設
けても図３のＡ部分において誘電体層の表面で電極材料
のマイグレーションによる電極材料層１２及び電極材料
層１４間の電気的短絡することがある。保護層を設けて
もＡ部分における該保護層及び誘電体層の密着度がよく
なく電極材料層１２，１４が接近しているため絶縁破壊
が起きる。厚膜方法にて印刷するときの位置ズレ、電極
材料の飛び散り等によりＡ部分にて電気的ショートを形
成する。等の問題点がある。In the prior art, as shown in FIG. 3, one electrode material layer 12, a dielectric layer 13, and the other electrode material layer 14 formed on a substrate 11 by a thick film printing method. The protection layer 15 is formed on a thick film capacitor made of such a material to improve reliability. However, even if the protective layer is provided, an electrical short circuit may occur between the electrode material layers 12 and 14 due to migration of the electrode material on the surface of the dielectric layer in the portion A in FIG. Even if the protective layer is provided, the degree of adhesion between the protective layer and the dielectric layer in part A is not good, and dielectric breakdown occurs because the electrode material layers 12 and 14 are close to each other. An electrical short is formed at the portion A due to misalignment when printing by the thick film method, scattering of the electrode material, and the like. And so on.
【０００４】[0004]
【課題を解決するための手段】本発明は、ベース基板の
ホールを通じて裏面に電気的導通を有する下部電極層、
該下部電極層を覆う誘電体層及び該誘電体層の上部に上
部電極層を厚膜印刷方法にて形成することによりマイグ
レーションによる電気的短絡がなくなる、絶縁破壊電圧
が向上する、印刷するときのショートがなくなる、など
の問題を解決した厚膜印刷コンデンサを提供するもので
ある。According to the present invention, there is provided a lower electrode layer having electrical conduction on the back surface through a hole in a base substrate;
By forming a dielectric layer covering the lower electrode layer and an upper electrode layer on top of the dielectric layer by a thick film printing method, an electrical short circuit due to migration is eliminated, a dielectric breakdown voltage is improved, and when printing, It is an object of the present invention to provide a thick-film printing capacitor that solves problems such as no short circuit.
【０００５】以下、本発明に係る厚膜印刷コンデンサに
ついて詳述する。本発明に係る厚膜印刷コンデンサは、
一般的に図１に示す如くベース基板１に下部電極層２、
誘電体層３、上部電極層４をそれ自体公知の厚膜印刷方
法で形成される。尚、必要により保護層５が形成され
る。また、本発明に係る厚膜印刷コンデンサは図１に示
す構造を必ずしもとる必要がなく、適宜な構造を採るこ
とができる。Hereinafter, the thick-film printing capacitor according to the present invention will be described in detail. The thick film printing capacitor according to the present invention,
Generally, as shown in FIG.
The dielectric layer 3 and the upper electrode layer 4 are formed by a known thick film printing method. Note that a protective layer 5 is formed as necessary. Further, the thick-film printing capacitor according to the present invention does not necessarily need to have the structure shown in FIG. 1, but can take an appropriate structure.
【０００６】ベース基板としては、厚膜印刷方法におけ
る焼成温度に耐えうる絶縁性の材料によるものでホール
９を形成したものであればよく特に限定するものではな
く、好ましくは、セラミック（アルミナ、窒化アルミ、
マグネシア、等を主成分としたもの）材料である。コネ
クタなどのフィルタ基板として使用する場合には、コン
タクトピン６を挿通するための貫通孔８を形成すること
が好ましい。ホール９、貫通孔８はそれ自身公知の方法
でセラミックグリーンシートに金型、パンチ、などで孔
を形成し、焼結して作成すればよい。または、セラミッ
クにレーザなどにより孔加工してもよい。The base substrate is not particularly limited as long as it is made of an insulating material that can withstand the firing temperature in the thick film printing method and has the holes 9 formed therein. Aluminum,
Magnesia, etc.). When used as a filter board for a connector or the like, it is preferable to form a through hole 8 for inserting the contact pin 6. The hole 9 and the through hole 8 may be formed by forming a hole in a ceramic green sheet using a mold, a punch, or the like by a method known per se and sintering. Alternatively, holes may be formed in the ceramic by laser or the like.
【０００７】上部電極層、下部電極層、誘電体層、保護
層の材料としては、厚膜印刷方法に使用できるものであ
ればよく特に限定するものではない。好ましくは、誘電
体層の材料として高誘電率であるペロブスカイト構造の
ものである、例えば、Ｐｂ（Ｍｇ1/3Ｎｂ2/3）Ｏ3およ
びＰｂＴｉＯ3を主成分としたものである。The materials for the upper electrode layer, lower electrode layer, dielectric layer and protective layer are not particularly limited as long as they can be used for a thick film printing method. Preferably, the material of the dielectric layer has a perovskite structure having a high dielectric constant, for example, Pb (Mg 1/3 Nb 2/3 ) O 3 and PbTiO 3 as main components.
【０００８】構成としては、ベース基板１のホール９を
通じて裏面に電気的導通（電極材料がホール９に充填さ
れていてもよく、側壁に層を形成してもよい）を有する
下部電極層２、裏面には該下部電極層２と導通する裏面
電極層２１、該下部電極層２を覆う（全面を覆うことが
好ましい）誘電体層３，該誘電体層３の上に上部電極層
４（好ましくは更に保護層５により厚膜印刷コンデンサ
保護する）を厚膜印刷方法で形成した厚膜印刷コンデン
サである。図２はベース基板１の貫通孔８に挿通したコ
ンタクトピン６の周囲に複数の厚膜印刷コンデンサ１０
をドーナツ状に形成したものである。図１は図２のＪ−
Ｊ’断面図であり、ベース基板１（ホール９、貫通孔８
を形成）の貫通孔８の周囲にドーナツ状に複数の厚膜印
刷コンデンサを形成し、裏面電極層２１を個別電極、上
部電極層４を共通なアース電極、該貫通孔８に挿通した
コンタクトピン６及び該裏面電極層２１を半田付７した
ものである。尚、かならずしも図１のような構成組合せ
をする必要がなく適宜に裏面電極層をアース電極として
上部電極層を個別電極としてもよく、また、個別電極、
アース電極を裏面電極層、上部電極層で組み合わせても
よい。The lower electrode layer 2 having electrical conduction (the electrode material may be filled in the hole 9 or a layer may be formed on the side wall) on the back surface through the hole 9 of the base substrate 1, On the back surface, a back electrode layer 21 which is electrically connected to the lower electrode layer 2, a dielectric layer covering the lower electrode layer 2 (preferably covering the entire surface) 3, and an upper electrode layer 4 (preferably on the dielectric layer 3) Is a thick-film printing capacitor formed by protecting the thick-film printing capacitor with a protective layer 5). FIG. 2 shows a plurality of thick-film printing capacitors 10 around contact pins 6 inserted through through holes 8 of base substrate 1.
Is formed in a donut shape. FIG. 1 shows J- in FIG.
FIG. 3 is a cross-sectional view taken along the line J ′, showing the base substrate 1 (hole 9, through-hole 8).
A plurality of thick film printing capacitors are formed in a donut shape around the through hole 8), the back electrode layer 21 is an individual electrode, the upper electrode layer 4 is a common ground electrode, and the contact pin is inserted through the through hole 8. 6 and the back electrode layer 21 are soldered 7. In addition, it is not always necessary to combine the components as shown in FIG.
The ground electrode may be combined with the back electrode layer and the upper electrode layer.
【０００９】このように下部電極層２を誘電体層３で全
面的に覆うことにより該下部電極層２及び上部電極層４
が該誘電体層３で完全に隔てられるため電極材料のマイ
グレーションによる電気的短絡がなく、絶縁破壊電圧が
向上し、電極材料の厚膜印刷時の位置ズレ、飛び散りに
よる電気的ショートがなくなる、などの信頼性が向上し
た本発明に係る厚膜印刷コンデンサを提供できる。By completely covering the lower electrode layer 2 with the dielectric layer 3 as described above, the lower electrode layer 2 and the upper electrode layer 4 are covered.
Are completely separated by the dielectric layer 3, so that there is no electrical short circuit due to migration of the electrode material, the breakdown voltage is improved, and there is no electrical short due to misalignment or scattering when printing the thick electrode material. Can provide a thick-film printing capacitor according to the present invention with improved reliability.
【００１０】[0010]
【実施例】以下、本発明に係る厚膜印刷コンデンサの実
施例を説明する。尚、本発明に係る厚膜印刷コンデンサ
は以下の実施例に限られるものではない。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a thick film printing capacitor according to the present invention will be described below. The thick-film printing capacitor according to the present invention is not limited to the following embodiments.
【００１１】（実施例１）直径０．８ｍｍ、ピッチ１．
２７ｍｍの貫通孔８及び直径０．３ｍｍのホール９を形
成したアルミナセラミック（純度９６％、厚み０．６３
５ｍｍ）製のベース基板１の一方の表面の貫通孔８の周
囲にドーナツ状に導電性ペースト（Ａｇ−Ｐｔ系）をス
クリーン印刷し、乾燥し、他方の面に導電性ペーストを
スクリーン印刷し、乾燥し、焼成（焼成温度８５０度１
０分）して下部電極層２および裏面電極層２１を形成し
た。該下部電極層及び該裏面電極層は厚膜印刷技術によ
りホール９を通じて電気的に導通されている。該裏面電
極層は貫通孔８のごく近傍まで形成されている。(Example 1) Diameter 0.8 mm, pitch 1.
Alumina ceramic having a through-hole 8 of 27 mm and a hole 9 of 0.3 mm in diameter (purity 96%, thickness 0.63)
5 mm) of a base substrate 1 made of a doughnut-shaped conductive paste (Ag-Pt-based) is screen-printed around the through hole 8 on one surface and dried, and the other surface is screen-printed with a conductive paste. Dry and bake (baking temperature 850 degrees 1
(0 minute) to form the lower electrode layer 2 and the back electrode layer 21. The lower electrode layer and the back electrode layer are electrically connected through the holes 9 by a thick film printing technique. The back electrode layer is formed very close to the through hole 8.
【００１２】更に、該下部電極層２の全面を覆うように
ドーナツ状に誘電体ペースト［Ｐｂ（Ｍｇ1/3Ｎｂ2/3）
Ｏ3＋ＰｂＴｉＯ3系］をスクリーン印刷し、乾燥し、焼
成（焼成温度９００度１０分）し、更にスクリーン印刷
し、乾燥し、焼成（焼成温度９００度１０分）して誘電
体層３を形成した。本実施例では誘電体ペーストを２回
印刷したが１回の印刷でもよく更に多い回数の印刷を行
ってもよい。Further, a dielectric paste [Pb (Mg 1/3 Nb 2/3 )] is formed in a donut shape so as to cover the entire surface of the lower electrode layer 2.
O 3 + PbTiO 3 ] is screen-printed, dried, fired (firing temperature 900 ° C. 10 minutes), screen-printed, dried and fired (firing temperature 900 ° C. 10 minutes) to form the dielectric layer 3 did. In this embodiment, the dielectric paste is printed twice, but it may be printed once or more times.
【００１３】更に、該誘電体層３の上部に導電性ペース
トをスクリーン印刷し、乾燥し、焼成して上部電極層４
を形成した。該上部電極層は複数の厚膜印刷コンデンサ
のアース電極として共通共用されている。Further, a conductive paste is screen-printed on the dielectric layer 3, dried and fired to form an upper electrode layer 4.
Was formed. The upper electrode layer is commonly used as a ground electrode of a plurality of thick film printing capacitors.
【００１４】更に、結晶化ガラスペーストをスクリーン
印刷し、乾燥し、焼成（焼成温度８５０度１０分）、更
に非晶質ガラスペーストをスクリーン印刷し、乾燥し、
焼成して厚膜印刷コンデンサを保護する保護層５を形成
して上記ベース基板に上記厚膜印刷コンデンサを同時に
複数個形成した。Further, the crystallized glass paste is screen-printed, dried and fired (firing temperature: 850 ° C. for 10 minutes), and the amorphous glass paste is screen-printed and dried.
Baking was performed to form a protective layer 5 for protecting the thick-film printing capacitor, and a plurality of the thick-film printing capacitors were simultaneously formed on the base substrate.
【００１５】更に、ホール９を通じて上記厚膜印刷コン
デンサの上記下部電極（個別電極）と電気的導通する上
記裏面電極層及び貫通孔８に挿通されたコンタクトピン
６を半田付７した。Further, the back electrode layer electrically connected to the lower electrode (individual electrode) of the thick film printing capacitor through the hole 9 and the contact pin 6 inserted into the through hole 8 were soldered 7.
【００１６】このようにコンタクトピンを挿通し半田付
けした厚膜印刷コンデンサは、下部電極層が誘電体層に
全面的に覆われていて上部電極層と電気的短絡をするこ
となく、絶縁破壊耐電圧が向上し、印刷時のショートも
ない、などの信頼性の高い厚膜印刷コンデンサであり、
コネクタのフィルタとして使用して有用である。In the thick-film printed capacitor in which the contact pins are inserted and soldered as described above, the lower electrode layer is entirely covered with the dielectric layer, and does not short-circuit with the upper electrode layer. This is a highly reliable thick film capacitor with improved voltage and no short circuit during printing.
Useful as a connector filter.
【００１７】[0017]
【発明の効果】本発明に係る厚膜印刷コンデンサにおい
ては、下部電極層を誘電体層がほぼ全面的に覆っている
ために電極材料によるマイグレーションによる電気的短
絡がない。絶縁破壊電圧が高い。印刷するときのショー
トがない。などの信頼性が高く、製造工程が簡略な厚膜
印刷コンデンサを提供できる。In the thick-film printing capacitor according to the present invention, since the dielectric layer covers the lower electrode layer almost entirely, there is no electrical short circuit due to migration by the electrode material. High breakdown voltage. There is no short circuit when printing. Therefore, it is possible to provide a thick-film printed capacitor having high reliability and a simple manufacturing process.
【００１８】[0018]
図１は、本発明に係る厚膜印刷コンデンサの図２のＪ−
Ｊ’断面図である。図２は、本発明に係る厚膜印刷コン
デンサの構造及びコンタクトピンを挿通した一実施態様
を示す図である。図３は、従来の厚膜コンデンサの断面
図である。FIG. 1 shows a thick film printed capacitor according to the present invention,
It is J 'sectional drawing. FIG. 2 is a diagram showing an embodiment of the structure of the thick film printing capacitor according to the present invention and a contact pin inserted therethrough. FIG. 3 is a sectional view of a conventional thick film capacitor.
【００１９】[0019]
１ ベース基板 ２ 下部電極層 ３ 誘電体層 ４ 上部電極層 ５ 保護層 ６ コンタクトピン ７ 半田付 ８ 貫通孔 ９ ホール １０ 厚膜印刷コンデンサ ２１ 裏面電極層 DESCRIPTION OF SYMBOLS 1 Base substrate 2 Lower electrode layer 3 Dielectric layer 4 Upper electrode layer 5 Protective layer 6 Contact pin 7 Soldering 8 Through hole 9 Hole 10 Thick film printing capacitor 21 Back electrode layer
Claims (3)
電極層を形成してなる厚膜印刷コンデンサにおいて、ベ
ース基板のホールを通じて裏面に電気的導通を有する下
部電極層、該下部電極層を覆う誘電体層及び該誘電体層
の上部に上部電極層を厚膜印刷方法にて形成したことを
特徴とする厚膜印刷コンデンサ。1. A thick-film printed capacitor comprising a base substrate having a lower electrode layer, a dielectric layer, and an upper electrode layer formed thereon. A thick-film printing capacitor, characterized in that a dielectric layer covering the dielectric layer and an upper electrode layer are formed on the dielectric layer by a thick-film printing method.
て電気的に接続し、該裏面電極層または上部電極層の一
方が個別電極であり他方がアース電極であることを特徴
とする請求項１に記載の厚膜印刷コンデンサ。2. The method according to claim 1, wherein the lower electrode layer and the back electrode layer are electrically connected through a hole, one of the back electrode layer and the upper electrode layer being an individual electrode and the other being a ground electrode. 4. The thick film printing capacitor according to claim 1.
通され、該コンタクトピン及び個別電極が電気的に接続
していることを特徴とする請求項１又は２のいずれかに
記載の厚膜印刷コンデンサ。3. The thick film printing according to claim 1, wherein a contact pin is inserted into a through hole of the base substrate, and the contact pin and the individual electrode are electrically connected. Capacitors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1770698A JPH11204374A (en) | 1998-01-14 | 1998-01-14 | Thick film printed capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1770698A JPH11204374A (en) | 1998-01-14 | 1998-01-14 | Thick film printed capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11204374A true JPH11204374A (en) | 1999-07-30 |
Family
ID=11951226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1770698A Pending JPH11204374A (en) | 1998-01-14 | 1998-01-14 | Thick film printed capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11204374A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003023271A (en) * | 2001-03-21 | 2003-01-24 | Siemens Ag | Electronic device |
| EP1921641A1 (en) * | 2006-11-10 | 2008-05-14 | E.I.Du pont de nemours and company | Method of making thin-film capacitors on metal foil using thick top electrodes |
| US10161820B2 (en) * | 2015-09-11 | 2018-12-25 | Saginomiya Seisakusho, Inc. | Capacitance-detection type pressure switch and pressure sensor |
-
1998
- 1998-01-14 JP JP1770698A patent/JPH11204374A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003023271A (en) * | 2001-03-21 | 2003-01-24 | Siemens Ag | Electronic device |
| EP1921641A1 (en) * | 2006-11-10 | 2008-05-14 | E.I.Du pont de nemours and company | Method of making thin-film capacitors on metal foil using thick top electrodes |
| US7818855B2 (en) | 2006-11-10 | 2010-10-26 | E. I. Du Pont De Nemours And Company | Method of making thin-film capacitors on metal foil using thick top electrodes |
| US10161820B2 (en) * | 2015-09-11 | 2018-12-25 | Saginomiya Seisakusho, Inc. | Capacitance-detection type pressure switch and pressure sensor |
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