JPH11195749A - Semiconductor mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the number of connecting plugs which of which is two times without changing a pitch by forming connecting plug terminals provided at a front and a back surfaces of an insulating substrate, so that the terminal becomes the individual connecting plug terminal, which is electrically insulated to each other. SOLUTION: Eight memories IC 30 are mounted on front and back surfaces of an insulating substrate 10, respectively. Connecting plug terminals 11a, 11b, 11c..., having the same shape are formed at the equal pitch along one side of the substrate. The connecting plug terminals 11a, 11b, 11c... on the front side and the connecting plug terminals 11a', 11b', 11c'... on the back side are insulated electrically so that the positions are deviated by a half pitch, respectively. When the number of the connecting plug terminals are equal, the size of the insulating substrate can be made approximately half. Since the highly softening temperature glass having the thermal expansion coefficient of about 100 ppm is used as the material to the substrate 10, a memory IC 20 having a thin-type small outline package structure, having thermal expansion coefficient of about 5 ppm, wherein a lead terminal is bent so as to expand outwards, can be used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC mounting technology, and more particularly to a technology particularly effective when applied to a semiconductor mounting insulating substrate having a row of plug terminals, for example, a socket mounting in which a plurality of memory ICs are mounted at high density. The present invention relates to technology that is effective when used for a type of memory module.

[0002]

2. Description of the Related Art In recent years, memory modules in which a plurality of memory ICs are mounted at a high density on an insulating substrate having an array of plug terminals on one side have been developed for small electronic devices such as notebook personal computers. The plug terminal rows in the conventional memory module are formed by applying copper plating to the front and back surfaces of the mounting insulating substrate 10 and etching the plug terminals 11a, 11b having the same shape along one side of the substrate as shown in FIG. ... and 11a ', 11b' ... are formed on the front and back of the board, respectively, and drilled to penetrate the base end of each connector terminal 11 and the board to form a through hole 15,
By applying copper plating from the surface of each plug terminal 11 to the inner surface of the through hole 15, the corresponding plug terminal 11 on the front and back of the substrate is electrically connected.

[0003]

However, it has been clarified by the present inventors that the above-described technology has the following problems. That is, in the conventional socket mounting type memory module, the pitch of the plug terminals provided on the mounting insulating substrate is 2.54 mm or 1.
Since it was standardized at 27 mm, there was a limit on the number of plug terminals that can be provided on a board of a certain size. In other words, there is a problem that the outer dimensions of the board are limited by the number of plug terminals when trying to secure the required number of plug terminals.

SUMMARY OF THE INVENTION An object of the present invention is to provide a module using a substrate having a structure in which twice as many plug terminals can be provided on an insulating substrate having the same size as the conventional one without changing the pitch. And Alternatively, it is another object of the present invention to provide a substrate structure capable of reducing the size of an insulating substrate to about half if the number of plug terminals is the same, and a module using a substrate having such a structure. The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0005]

The outline of a typical invention among the inventions disclosed in the present application is as follows. That is, the plug terminals provided on the front and back of the insulating substrate are formed so as to be separate plug terminals electrically insulated from each other. Specifically, a rectangular insulating substrate having first and third sides facing each other, and second and fourth sides facing each other, and a surface of the insulating substrate along the first side Plural semiconductors including a plurality of plug terminals provided on a side and a back side thereof and electrically insulated from each other, and a plurality of memories provided on the insulating substrate and including a plurality of memories and a driver for transmitting a common signal to the plurality of memories. According to another aspect of the present invention, there is provided a semiconductor mounting device including a device and a wiring provided on the insulating substrate and electrically connecting the semiconductor device and the plug terminal.

According to the above-described means, twice the number of plug terminals can be provided on an insulating substrate having the same size as the conventional one without changing the pitch, or if the number of plug terminals is the same, The size of the insulating substrate can be reduced to about half. Further, in the insulating substrate, it is preferable that a notch for preventing erroneous insertion is provided on the first side, and a notch for retaining is provided on each of the second and fourth sides.
Thereby, when the insulating substrate is mounted on the socket, erroneous insertion can be prevented, and after the substrate is mounted, the substrate can be prevented from coming off. A rectangular insulating substrate; a plurality of plug terminals electrically insulated on both surfaces of the insulating substrate along one long side of the insulating substrate; and a plurality of plug terminals provided on the insulating substrate. A semiconductor device;
The semiconductor device may include a wiring provided on the insulating substrate for electrically connecting the semiconductor device and the plug terminal, wherein the plug terminal includes a terminal for board identification. This makes it possible to standardize the substrate for a plurality of types of modules having different specifications, thereby reducing the total cost. Further, also in the case of the insulating substrate, a notch for preventing erroneous insertion may be provided on a long side of the insulating substrate, and a notch for preventing a detachment may be provided on each of two short sides of the insulating substrate. This can prevent erroneous insertion when mounting the insulating substrate in the socket,
After mounting the substrate, the substrate can be prevented from coming off.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show one embodiment of a memory module to which the present invention is applied. In the memory module of this embodiment, eight memory ICs 20 and one driver I
C30 is mounted, and plug terminals 11a, 11 of the same shape are formed on the front and back of the insulating substrate 10 along one side of the substrate.
.., 11c are formed at an equal pitch P, respectively. Plug terminals 11a, 11b on the front side of the insulating substrate 10,
11c..., And the plugging terminals 11a ', 11b',
11c '... Are electrically insulated from each other.
In addition, in this embodiment, although not particularly limited, the plug terminals 11a, 11b, 11c on the front side of the insulating substrate 10.
And the plug terminals 11a ', 11b', 11c 'on the back side.
.., As shown in FIG.
It is formed so as to be shifted by two.

The insulating substrate 10 has a multilayer structure in which a plurality of (for example, six) insulating substrates each having a wiring pattern formed of a conductive layer formed on the surface thereof are stacked. In this embodiment, a high TG material (glass having a high softening temperature) having a thermal expansion coefficient of about 10 ppm called FR-5 is used as a material of the insulating substrate 10.
Thus, the memory IC 20 having a TSOP (thin small outline package) structure can be mounted. That is, in the case of a substrate made of glass epoxy or the like generally called FR-4, which has been generally used in the past, since the coefficient of thermal expansion is about 16 ppm, the TSOP (solder joint) has a coefficient of thermal expansion of about 5 ppm. Thin small
When a memory IC having an outline / package structure is used, the solder joint may be peeled off due to a thermal cycle or the like.
A memory IC having an SOJ structure of about pm has to be mounted.

However, in the present embodiment, since a high TG material having a thermal expansion coefficient of about 10 ppm is used as a material of the substrate 10, the thermal expansion coefficient of the lead terminal bent so as to spread outward is about 5 ppm. TSOP (Thin Small
A memory IC having an outline package structure can be used. As a result, the height of the IC mounted on the substrate is reduced, and the module can be reduced in size.

Further, in this embodiment, memory ICs 20 whose lead terminals are bent in opposite directions are soldered to predetermined positions of the insulating substrate 10. That is, the memory IC 20 mounted on the front side of the insulating substrate 10 corresponds to FIG.
As shown in FIG. 7, the lead terminal 21 is bent toward the antinode of the IC, and the memory IC 20 ′ mounted on the back side of the insulating substrate 10 has the lead terminal 21 ′ bent toward the back of the IC. ing. As a result, the signal terminals of the front IC and the rear IC come to be at the same position,
The wiring pattern to be formed on the surface of the substrate 10 can be shared, and the shortest distance wiring can be easily formed.
This facilitates the design of the wiring pattern,
The number of intersections between the wirings can be reduced, the wirings are simplified, and the characteristics and quality of the module are improved.

As shown in FIG. 1, the side of the insulating substrate 10 where the plug terminal 11 is formed and two sides orthogonal thereto are provided as shown in FIG.
Notches 12a, 12b and 13a, 13b are formed respectively. Of these, notches 12a and 12b on the side where the plug terminal is formed are notches (recesses) for mechanical key-in for preventing erroneous insertion, and 13a, 1
3b is a notch for retaining. That is, the insulating substrate 10 of this embodiment has a structure suitable for being mounted on the socket 40 as shown in FIG.

Next, an embodiment of the socket 40 will be described. The socket 40 on which the insulating substrate 10 is mounted is connected to the plug terminals 11a, 11b, 11c,.
a, 11b, 11c ... and 11a ', 11b', 11
terminal pins 41a, 41b, 4 corresponding to the number of c '...
1c on the outside and the notches 12a,
Protrusions 42a and 42b engageable with the notches are provided at positions corresponding to 12b.

The terminal pins 41a, 41b, 4
1c, as shown in FIG.
1 are formed integrally with each other, and are formed integrally with each other.
4 are held at a pitch P / 2, which is half the pitch P of the plug terminals. The leads 43 are separated from each other, and the leads 43 alternate between a slightly downward lead as shown by a solid line A and a slightly upward lead as shown by a two-dot chain line B in FIG. , An engagement portion facing each other at a slightly smaller interval than the thickness of the substrate 10 is formed. The insulating substrate 10 is mounted by inserting the plug terminal portion into the engaging portion formed by the lead 43 from the direction of arrow C and rotating it in the direction of arrow D.

As shown in FIG. 4, a pair of holding arms 45a and 45b having projections 47a and 47b at the ends thereof are rotatably mounted on both ends of the socket 40 with pins 46a and 46b as fulcrums. Lead 4 above
After the insulating substrate 10 is mounted on the substrate 3, the holding arms 45a and 45b are rotated inward, and the projections 47a and 47b are engaged with the notches 13a and 13b on the side surfaces of the substrate 10, thereby preventing the substrate from coming off. I can do it.
Further, operating pieces 48a, 48b are formed on the holding arms 45a, 45b inwardly.
a and 46b are pivoted outward with respect to the fulcrum, respectively.
It is configured so that 0 is pushed out to be separated. As a result, the connection between the substrate 10 and the socket 40, which has become difficult to remove due to an increase in terminal density, is performed by the holding arms 45a,
By the operation of 5b, the lever can be easily removed by the principle of leverage.

Further, the insulating substrate 10 of this embodiment includes:
PD terminals 17a, 17b, 17c, 17d for board identification
And jumper chip connection terminals 18a, 18b, 18
c, 18d and ground terminal (or Vcc terminal) 1
The wiring patterns 50 for connecting the PD terminals 17a, 17b, 17c and 17d to the jumper chip connection terminals 18a, 18b, 18c and 18d are shown by broken lines in FIG. As shown, the PD terminal 17 is provided on the internal wiring layer.
Jumper chips 50a, 50c,... having a conductor (0Ω resistance) for short-circuiting between a, 17b, 17c, 17d and ground terminals (or Vcc terminals) 19a, 19b, 19c, 19d are selected. The connection is made. Jumper chip 50
a, 50c... are used to generate codes for identifying modules having different specifications.

That is, as shown in FIG. 6, the PD terminals 17a, 1 to which the jumper chips 50a, 50c are connected.
7c is fixed to the ground potential (or Vcc potential), and the PD terminals 17b, to which no jumper chip is connected,
Since 17d is an NC terminal (NO connection terminal), the microprocessor reads the state of these PD terminals 17a to 17d to determine the specification of the module, that is, the storage capacity and electrical characteristics of the module. For example, it can be known by referring to a table (memory) owned by the user. 1 if there are 4 PD terminals
If there are 6 types and n units, 2 n types of modules can be identified.

FIG. 7 shows an example of a block configuration of the memory module. The module of this embodiment includes 16 dynamic RAMs D0 to D15 (memory IC 20).
And drivers B0 to B26. The drivers B0 to B26 are each formed on a single semiconductor chip by half, formed into an IC, and mounted on the substrate 10 (IC30 in FIG. 1). The above drivers B0 to B2
6 is a signal common to a plurality of dynamic RAMs (OE,
WE, CAS, etc.) to each chip.

As described above, since the driver is provided on the module side, the driver on the CPU side for driving the module becomes unnecessary, and the user does not need to design a driver for each type of module. That is, if there is no driver on the module side, if the module to be used changes, the driving force required to drive the module also changes, so it is necessary to redesign the optimum driver each time. Since it is provided on the module side, a driver on the CPU side is not required.

As described above, in the above embodiment, the plug terminals provided on the front and back of the insulating substrate are formed to be separate plug terminals electrically insulated from each other. Twice the number of plug terminals can be provided on an insulating substrate of the same size without changing the pitch. Alternatively, if the number of plug terminals is the same, the size of the insulating substrate can be reduced to about half. Further, since a material having a low coefficient of thermal expansion is used as the material of the insulating substrate, and it is mounted as an IC having a TSOP (thin small outline package) structure, it is mounted on an insulating substrate as compared with an IC having a SOJ structure. There is an effect that the height of the IC in the state is reduced and the module is downsized.

A row of plug terminals on the front side of the insulating substrate;
Since the plug terminal rows on the back side are formed so as to be shifted from each other by a half pitch, there is an effect that a socket having a lead (connector) in contact with each plug terminal row can be easily produced. Further, a notch is provided on the end face of the insulating substrate on the side of the connector terminal row, and a projection which can be engaged with the notch is provided at a corresponding position of the socket, so that the system is inserted into an incorrect substrate (module). Can be prevented from malfunctioning and the IC in the module can be prevented from being damaged. A plurality of board identification terminals (PD terminals) are provided in a part of the connector terminal row of the insulating board, and a connection capable of mounting a jumper chip for selectively short-circuiting between these terminals and the power supply terminal. Since the terminals are provided, it is possible to standardize the substrate for a plurality of types of modules having different specifications, thereby reducing the total cost.

Although the invention made by the inventor has been specifically described based on the embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention. Needless to say. For example, in the above embodiment, a plurality of memory ICs are mounted on the front surface and the back surface of the insulating substrate, respectively, but a plurality of ICs may be mounted on only one of the front surface and the back surface of the insulating substrate. In the above description, the case where the invention made by the inventor is mainly applied to the memory module which is the field of application as the background has been described. However, the present invention is not limited to this case, and a memory card or another insulating sheet may be used. It can be widely used for a semiconductor mounting substrate in which a plurality of ICs are mounted on a substrate.

[0022]

The effects obtained by typical ones of the inventions disclosed in the present application will be briefly described as follows. That is, twice the number of plug terminals can be provided on the insulating substrate on which the IC is mounted without changing the pitch, or if the number of plug terminals is the same, the size of the insulating substrate can be reduced. Can be halved.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a memory module to which the present invention is applied.

FIG. 2 is an enlarged explanatory view of a plug terminal portion of the memory module of FIG. 1;

FIG. 3 is an enlarged explanatory view showing an IC mounted state of the memory module of FIG. 1;

FIG. 4 is a side view showing one embodiment of a socket in which the memory module of FIG. 1 is mounted.

FIG. 5 is an enlarged sectional view showing the structure of the socket of FIG. 3;

FIG. 6 is an equalization circuit diagram showing a relationship between a PD terminal and a jumper chip.

FIG. 7 is a block diagram illustrating a configuration example of a memory module of FIG. 1;

FIG. 8 is an enlarged explanatory view of a plug terminal portion of a conventional memory module.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Insulating board 11a, 11b, 11c Connector terminal 12a, 12b Notch for mechanical key-in 13a, 13b Notch for retaining 17a-17d PD terminal 20 Memory IC 30 Driver IC 40 Socket 50a, 50c Jumper chip

Claims (4)

[Claims] 1. A rectangular insulating substrate having first and third sides facing each other, and second and fourth sides facing each other, and a surface of the insulating substrate along the first side. Plural semiconductors including a plurality of plug terminals electrically insulated from each other on a side and a back side; and a plurality of semiconductors provided on the insulating substrate and including a plurality of memories and a driver for transmitting a common signal to the plurality of memories. A semiconductor mounting device, comprising: a device; and a wiring provided on the insulating substrate and electrically connecting the semiconductor device and the plug terminal. 2. The insulating substrate includes a notch provided on the first side for preventing erroneous insertion, and a notch for retaining provided on each of the second and fourth sides. The semiconductor mounting device according to claim 1, wherein: 3. A rectangular insulating substrate; a plurality of plug terminals provided on both surfaces of the insulating substrate along one long side of the insulating substrate so as to be electrically insulated from each other; And a wiring provided on the insulating substrate and electrically connecting the semiconductor device and the plug terminal, wherein the plug terminal includes a terminal for board identification. Characteristic semiconductor mounting device. 4. The insulating substrate includes a notch provided on the long side for preventing erroneous insertion, and a notch for retaining provided on each of two short sides of the insulating substrate. 4. The semiconductor mounting device according to claim 3, wherein