JPH11195696A5 - - Google Patents

Info

Publication number
JPH11195696A5
JPH11195696A5 JP1997361011A JP36101197A JPH11195696A5 JP H11195696 A5 JPH11195696 A5 JP H11195696A5 JP 1997361011 A JP1997361011 A JP 1997361011A JP 36101197 A JP36101197 A JP 36101197A JP H11195696 A5 JPH11195696 A5 JP H11195696A5
Authority
JP
Japan
Prior art keywords
substrate
processing apparatus
support table
supported
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1997361011A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11195696A (ja
Filing date
Publication date
Priority claimed from JP36101197A external-priority patent/JPH11195696A/ja
Priority to JP36101197A priority Critical patent/JPH11195696A/ja
Application filed filed Critical
Priority to SG1998005844A priority patent/SG71182A1/en
Priority to US09/211,875 priority patent/US6383890B2/en
Priority to TW087120962A priority patent/TW462086B/zh
Priority to EP98310414A priority patent/EP0926706A3/en
Priority to AU98182/98A priority patent/AU732765B2/en
Priority to CNB981263275A priority patent/CN1153258C/zh
Priority to KR10-1998-0058983A priority patent/KR100400590B1/ko
Publication of JPH11195696A publication Critical patent/JPH11195696A/ja
Priority to KR10-2003-0001768A priority patent/KR100408606B1/ko
Publication of JPH11195696A5 publication Critical patent/JPH11195696A5/ja
Withdrawn legal-status Critical Current

Links

JP36101197A 1997-12-26 1997-12-26 基板支持台及び基板処理装置 Withdrawn JPH11195696A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP36101197A JPH11195696A (ja) 1997-12-26 1997-12-26 基板支持台及び基板処理装置
SG1998005844A SG71182A1 (en) 1997-12-26 1998-12-15 Substrate processing apparatus substrate support apparatus substrate processing method and substrate manufacturing method
US09/211,875 US6383890B2 (en) 1997-12-26 1998-12-15 Wafer bonding method, apparatus and vacuum chuck
TW087120962A TW462086B (en) 1997-12-26 1998-12-16 Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate manufacturing method
EP98310414A EP0926706A3 (en) 1997-12-26 1998-12-18 Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate manufacturing method
AU98182/98A AU732765B2 (en) 1997-12-26 1998-12-24 Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate manufacturing method
CNB981263275A CN1153258C (zh) 1997-12-26 1998-12-25 基片的加工设备、支撑设备、加工及制造方法
KR10-1998-0058983A KR100400590B1 (ko) 1997-12-26 1998-12-26 기판처리장치,기판지지장치,기판처리방법및기판제조방법
KR10-2003-0001768A KR100408606B1 (ko) 1997-12-26 2003-01-10 기판처리장치, 기판지지장치, 기판처리방법 및 기판제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36101197A JPH11195696A (ja) 1997-12-26 1997-12-26 基板支持台及び基板処理装置

Publications (2)

Publication Number Publication Date
JPH11195696A JPH11195696A (ja) 1999-07-21
JPH11195696A5 true JPH11195696A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2005-08-04

Family

ID=18471818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36101197A Withdrawn JPH11195696A (ja) 1997-12-26 1997-12-26 基板支持台及び基板処理装置

Country Status (1)

Country Link
JP (1) JPH11195696A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1577421A1 (en) * 2002-11-15 2005-09-21 Ebara Corporation Substrate processing apparatus and method for processing substrate
US7675606B2 (en) * 2006-05-05 2010-03-09 Asml Netherlands B.V. Lithographic apparatus and method
DE102006058493B4 (de) * 2006-12-12 2012-03-22 Erich Thallner Verfahren und Vorrichtung zum Bonden von Wafern
JP4987577B2 (ja) * 2007-06-07 2012-07-25 リンテック株式会社 物品の固定ジグ
JP2010028011A (ja) * 2008-07-24 2010-02-04 Sumco Corp エピタキシャル層の膜厚測定方法、エピタキシャルウェーハの製造方法およびエピタキシャルウェーハ製造工程管理方法
US8714611B2 (en) * 2010-07-23 2014-05-06 Ev Group Gmbh Handling device for handling of a wafer
WO2013023708A1 (de) * 2011-08-12 2013-02-21 Ev Group E. Thallner Gmbh Vorrichtung und verfahren zum bonden von substraten
JP7717553B2 (ja) * 2021-09-17 2025-08-04 キオクシア株式会社 接合装置及び接合方法

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