JPH11195595A - Aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an aligner capable of avoiding an heterogeneity position of focus caused by its own weight of large masks by arranging an optical items so that the masks are arranged vertically. SOLUTION: A mask 1 is arranged vertically. Image focussing optical sections 52, 53, and 51' are arranged, so that pattern of the mask 1 irradiated by a slit beam 55 is focussed and transcribed on a substrate 3. The mask 1 can be vertically supported with the composition of the image focussing optical sections 52, 53, 51', and the like. This enable elimination of deformation of the mask 1 caused by its own weight and the occurrence of positional difference of focus between center and circumference. Therefore, there is not deformation caused by its own weight even for a larger mask 1, and since the focussing position is kept the same, adequate depth of focus is ensured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for transferring a mask pattern onto a substrate for manufacturing a semiconductor element, a liquid crystal panel, and the like, and more particularly, to a division scanning type mirror projection exposure apparatus for dividing and printing a large screen. Things.

[0002]

2. Description of the Related Art Conventionally, in an exposure apparatus such as a semiconductor,
As shown in FIGS. 2 and 3, the pattern transfer mask (hereinafter, mask) and the substrate to be exposed were horizontally and parallelly arranged with the imaging optical system interposed therebetween. In the figure, 1 is a mask, 2 is a mask stage, 3 is a substrate, 4 is a substrate stage, 6 is an illumination system, 9 is a structure, 13 is a base, 15 is a control circuit, 16 is a mask stage driving member, and 17 is a mask stage driving member. A substrate stage driving member, 19 is a laser interference system, 51 is a trapezoidal mirror, 52 is a convex mirror, 53 is a concave mirror, and 55 is slit-shaped illumination light.

[0003]

However, since the mask holder for holding the mask needs to transmit the light for exposure, the periphery is fixed by suction as shown in FIG. In a conventional structure such as that described above, when the size of the mask increases as the size of the substrate increases as in the recent trend, the focal position differs between the center and the periphery due to deformation due to its own weight. There is a problem that can not be obtained.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an exposure apparatus having a configuration in which the focal position does not become uneven due to its own weight deformation even when the size of the mask is increased.

[0005]

In order to achieve the above object, according to the present invention, in an exposure apparatus for arranging a substrate to be exposed in a direction other than a vertical direction (for example, in a horizontal direction) during exposure, a mask is arranged in a vertical direction. By arranging the optical members and the like so that the mask does not undergo its own weight deformation.

[0006]

By arranging the mask in the vertical direction, it is possible to prevent the deflection of the mask due to its own weight, to keep the exposure light transmitting surface of the mask flat, and to provide a sufficient mask over the entire exposure light transmitting surface of the mask. Depth of focus can be secured.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In an exposure apparatus according to an embodiment of the present invention, a transmission type mask for transferring a pattern is held vertically, and a substrate to be exposed is held horizontally, and the exposure light transmitted through the mask is made a right angle. And forming an image on the substrate to be exposed. As shown in FIG. 1, a mirror projection exposure apparatus according to another embodiment of the present invention includes a holder for vertically holding a transmission type mask for pattern transfer, and a bending mirror 51 having only one reflection surface. '
And imaging mirrors 52 and 53.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a conceptual diagram of an exposure apparatus embodying the present invention,
FIG. 2 is a conceptual diagram of a conventional exposure apparatus. The exposure apparatus shown in FIG. 1 is different from the apparatus shown in FIG. 2 in that a mask 1 arranged horizontally in FIG. 2 is arranged vertically, and the number of reflection surfaces for bending exposure light is reduced by one from that shown in FIG. is there. In FIG. 1, 1 is a mask, 2 is a mask stage, 3 is a substrate, 4 is a substrate stage, 16 is a mask stage driving member, 17 is a substrate stage driving member, 51 ′ is a bending mirror, 52
Is a convex mirror, 53 is a concave mirror, and 55 is a slit-like illumination light. The folding mirror 51 'has only one reflecting surface. In contrast, the apparatus shown in FIG. 2 uses a trapezoidal mirror 51 having two reflection surfaces.

The pattern on the mask 1 illuminated by the slit-shaped illumination light 55 is formed by imaging optical members 52, 53, 5.
1 'forms an image on the substrate 3 and is transferred. A mask holder (not shown) holding the mask 1 is scanned by a mask holder driving member 16 in a direction perpendicular to the slit-shaped illumination light 55. On the other hand, the substrate stage 4 holding the substrate 3 is scanned by the substrate stage driving member 17 in a direction perpendicular to the slit-shaped illumination light 55. By synchronously driving the mask stage 2 and the substrate stage 4 at the same speed, the entire pattern of the mask 1 is transferred onto the substrate 3.

By configuring the optical member as shown in FIG. 1, the mask can be held vertically, so that there is no deformation of its own weight and no difference occurs between the center and the periphery of the focal position.

[0011]

[Embodiment of Device Production Method] Next, an embodiment of a device production method using the above-described exposure apparatus or exposure method will be described. FIG. 5 shows a micro device (a semiconductor chip such as an IC or an LSI, a liquid crystal panel, a CCD, a thin film magnetic head,
2 shows a flow of manufacturing a micromachine or the like. Step 1
In (Circuit Design), a device pattern is designed. Step 2 is a process for making a mask on the basis of the designed pattern. Step 3 (wafer manufacturing)
Then, a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is called a pre-process,
An actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). including. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 6 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 15
In (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.

By using the production method of this embodiment, it is possible to produce a highly integrated device, which was conventionally difficult to produce, at low cost.

[0014]

As described above, according to the present invention,
The transmission type mask is held vertically, and the exposure light transmitted through the mask can be held vertically by arranging an optical member on a substrate to be exposed which is arranged in a different direction from the mask, for example, horizontally. Even if the size of the camera becomes large, deformation due to its own weight does not occur and the focus position is kept the same, so that a sufficient depth of focus can be secured.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram of an exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a conceptual diagram of a conventional exposure apparatus.

FIG. 3 is a schematic configuration diagram of a conventional exposure apparatus.

FIG. 4 is a diagram showing a structure of a mask stage.

FIG. 5 is a diagram showing a flow of manufacturing a micro device.

FIG. 6 is a diagram showing a detailed flow of a wafer process in FIG. 5;

[Explanation of symbols]

1: mask, 2: mask stage, 3: substrate, 4: substrate stage, 6: illumination system, 9: structure, 13: base, 1
5: control circuit, 16: mask stage driving member, 17:
Substrate stage driving member, 19: laser interference system, 51: trapezoidal mirror, 51 ′: bending mirror, 52: convex mirror, 53: concave mirror, 55: slit illumination light.

Claims (4)

[Claims] 1. An exposure apparatus for arranging a substrate to be exposed in a direction other than a vertical direction at the time of exposure, wherein an optical member or the like is arranged so that an arrangement of a mask at the time of exposure is vertical. 2. The method according to claim 1, wherein the transmission type mask for pattern transfer is held vertically and the substrate to be exposed is held horizontally, and the exposure light transmitted through the mask is bent at a right angle to form an image on the substrate to be exposed. Exposure equipment. 3. A mirror projection exposure comprising a holder for vertically holding a transmission type mask for pattern transfer, a bending mirror 51 'having only one reflection surface, and imaging mirrors 52 and 53. apparatus. 4. A device manufacturing method, comprising manufacturing a device using the exposure apparatus according to claim 1.