JPH11183038A - Heating furnace - Google Patents

Heating furnace

Info

Publication number
JPH11183038A
JPH11183038A JP9349157A JP34915797A JPH11183038A JP H11183038 A JPH11183038 A JP H11183038A JP 9349157 A JP9349157 A JP 9349157A JP 34915797 A JP34915797 A JP 34915797A JP H11183038 A JPH11183038 A JP H11183038A
Authority
JP
Japan
Prior art keywords
temperature
heating
heating furnace
heated
independently
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9349157A
Other languages
Japanese (ja)
Inventor
Tomonori Yamada
智紀 山田
Tetsuya Goto
哲哉 後藤
Tetsuo Suzuki
哲男 鈴木
Satoshi Tanaka
聡 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP9349157A priority Critical patent/JPH11183038A/en
Publication of JPH11183038A publication Critical patent/JPH11183038A/en
Pending legal-status Critical Current

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  • Liquid Crystal (AREA)
  • Control Of Resistance Heating (AREA)
  • Resistance Heating (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a heating furnace for uniformly heating a work, irrespective of its size. SOLUTION: The furnace has a heating position of a size enough to heat one work. This position is composed of heating sources 1a-1c capable of independent temp. settings. Or in addition to these independent temp. setting type source 1a-1c, temp. detecting means may be provided for independently controlling the heat sources 1a-1c, based on the temp. detection result.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、特に液晶ディスプ
レイ用カラーフィルターの製造工程などに用いると好適
な加熱炉に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating furnace particularly suitable for use in a process for producing a color filter for a liquid crystal display.

【0002】[0002]

【従来の技術】液晶ディスプレイ用カラーフィルターの
製造工程では、基板上に顔料などで着色したポジ型また
はネガ型の感光性樹脂、あるいは着色した非感光性樹脂
の上に感光性樹脂を積層状態に塗布し、これを加熱炉に
よって乾燥、硬化させた後にフォトリソグラフィー法に
よって所望のパターンに加工する方法が主流となってい
る。また、フォトリソグラフィー加工後の基板表面にオ
ーバーコート剤を塗布し、乾燥、硬化させることも多
く、カラーフィルター製造工程では加熱炉による乾燥、
硬化工程が重要な位置を占めている。
2. Description of the Related Art In a process of manufacturing a color filter for a liquid crystal display, a photosensitive resin of a positive type or a negative type colored with a pigment or the like on a substrate, or a photosensitive resin is laminated on a colored non-photosensitive resin. The mainstream method is to apply the coating, dry and cure it in a heating furnace, and then process it into a desired pattern by photolithography. In addition, overcoating is often applied to the substrate surface after photolithography processing, dried and cured, and in the color filter manufacturing process, drying with a heating furnace,
The curing process occupies an important position.

【0003】加熱炉の種類としては、ホットプレート
(以下HPと称す)方式、熱風オーブン方式、真空乾燥
方式など様々な方法があり、樹脂の種類や目的に応じて
適宜選択される。
There are various types of heating furnaces, such as a hot plate (hereinafter referred to as HP) system, a hot air oven system, and a vacuum drying system, and are appropriately selected according to the type and purpose of the resin.

【0004】HP方式は、電熱ヒーター等で加熱したプ
レート上に直接、もしくは、プレート上に設置したピン
等の治具上に被加熱体を保持し、主にHPからの輻射伝
熱によって被加熱体を加熱する方式である。
In the HP method, an object to be heated is held directly on a plate heated by an electric heater or on a jig such as a pin installed on the plate, and is mainly heated by radiant heat transfer from the HP. This is a method of heating the body.

【0005】熱風オーブン方式は、電熱ヒーター等で加
熱した熱風を加熱炉内で循環させ、炉内に保持した被加
熱体を主に対流伝熱により加熱する方式である。
[0005] The hot-air oven system is a system in which hot air heated by an electric heater or the like is circulated in a heating furnace, and an object to be heated held in the furnace is heated mainly by convection heat transfer.

【0006】真空乾燥方式は、真空チャンバー内に乾燥
を要する物体を保持し、チャンバー内を減圧することに
よって、溶媒の気化を促進させる乾燥方式である。
[0006] The vacuum drying method is a drying method in which an object requiring drying is held in a vacuum chamber and the inside of the chamber is decompressed to promote the evaporation of the solvent.

【0007】しかしながら、従来のHP方式の加熱炉で
は以下に示すような問題点がみられた。
However, the conventional HP type heating furnace has the following problems.

【0008】HP上に被加熱体を保持して加熱した場
合、被加熱体の中央部と端部で温度差を生じる。例え
ば、被加熱体の端部は加熱源のない炉壁に近接してお
り、中央部より低温になりやすい。また、複数枚のHP
で構成され、被加熱体が順次HP上で加熱、搬送される
加熱炉では、1枚目のHPでは入口から外気の影響を受
け、被加熱体の後端部が低温になりやすい。さらに、徐
冷ゾーンを設けた加熱炉の場合、徐冷ゾーン前のHPで
は被加熱体の前端部が低温になりやすい。
When the object to be heated is heated while being held on the HP, a temperature difference occurs between the center and the end of the object to be heated. For example, the end of the object to be heated is close to the furnace wall without a heating source, and is likely to be lower in temperature than the center. In addition, a plurality of HP
In a heating furnace in which the object to be heated is sequentially heated and conveyed on the HP, the rear end of the object to be heated tends to be low in temperature in the first HP because of the influence of the outside air from the inlet. Furthermore, in the case of a heating furnace provided with a slow cooling zone, the front end of the body to be heated tends to be low in HP before the slow cooling zone.

【0009】被加熱体より十分大きいHPを用いれば、
前記の問題を解決し端部の温度を中央部と同程度に保つ
ことは可能であるが、装置サイズが大きくなり、また初
期コスト、ランニングコストが増大する。
If an HP which is sufficiently larger than the object to be heated is used,
Although it is possible to solve the above problem and keep the temperature of the end portion almost the same as that of the central portion, the size of the apparatus becomes large, and the initial cost and running cost increase.

【0010】さらに、過剰に大きいHPを用いると、逆
に被加熱体端部の方が中央部より高温になるので、適正
なHPサイズを選択しても被加熱体のサイズが変更にな
れば、端部と中央部で温度差を生じることになる。
Further, if an excessively large HP is used, the temperature of the end of the object to be heated is higher than that of the center, so if the size of the object to be heated is changed even if an appropriate HP size is selected. Therefore, a temperature difference occurs between the end and the center.

【0011】被加熱体の中央部と端部で温度差が大きい
と、製品品質にバラツキを生じ好ましくない。例えば本
発明が特に好適に用いられる液晶ディスプレイ用カラー
フィルターのフォトリソ加工工程の場合、露光、現像工
程前の加熱工程で被加熱体であるガラス基板の温度分布
が広がると、後の現像工程で面内の現像状態が不均一に
なるなど製品品質上、大きな問題となる。
[0011] If the temperature difference between the central portion and the end portion of the object to be heated is large, the product quality varies, which is not preferable. For example, in the case of a photolithography process of a color filter for a liquid crystal display in which the present invention is particularly preferably used, if the temperature distribution of a glass substrate as a heating target spreads in a heating process before an exposure and a development process, a surface development in a subsequent development process may occur. This causes a serious problem in product quality, such as uneven development state in the product.

【0012】[0012]

【発明が解決しようとする課題】本発明はかかる従来技
術の欠点を改良し、被加熱体のサイズに依らず被加熱体
を均一に加熱する加熱炉を提供することを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to improve the disadvantages of the prior art and to provide a heating furnace for uniformly heating the object to be heated regardless of the size of the object to be heated.

【0013】[0013]

【課題を解決するための手段】上記目的を達成する本発
明の加熱炉およびカラーフィルターの製造方法は以下の
とおりである。
The heating furnace and the method for producing a color filter according to the present invention which achieve the above objects are as follows.

【0014】(1)1つの被加熱体を加熱する大きさの
ポジションが、独立して温度設定できる複数個の加熱源
により構成されていることを特徴とする加熱炉。
(1) A heating furnace characterized in that a position for heating one object to be heated is constituted by a plurality of heating sources whose temperatures can be independently set.

【0015】(2)独立して温度設定できる複数個の加
熱源に加えて複数個の温度検知手段を設け、該温度検知
結果に基づいて各加熱源を独立して温度制御するように
したものであることを特徴とする前記(1)に記載の加
熱炉。
(2) In addition to a plurality of heating sources capable of independently setting the temperature, a plurality of temperature detecting means are provided, and the temperature of each heating source is independently controlled based on the temperature detection result. The heating furnace according to the above (1), wherein

【0016】(3)複数個の加熱源が1枚のホットプレ
ートであることを特徴とする前記(1)または(2)に
記載の加熱炉。
(3) The heating furnace according to (1) or (2), wherein the plurality of heating sources are one hot plate.

【0017】(4)ホットプレートが、中央部と端部に
独立して温度設定できる加熱源を設けたものであること
を特徴とする前記(3)に記載の加熱炉。
(4) The heating furnace according to (3), wherein the hot plate is provided with a heating source capable of independently setting a temperature at a center portion and an end portion.

【0018】(5)ホットプレートが、中央部と端部に
独立して温度設定できる加熱源と温度検知手段とが設け
られたものであり、該温度検知結果に基づいて各加熱源
を独立して温度制御するようにしたことを特徴とする前
記(3)または(4)に記載の加熱炉。
(5) The hot plate is provided with a heating source and a temperature detecting means capable of setting the temperature independently at the center and at the end, and each heating source is independently controlled based on the temperature detection result. The heating furnace according to the above (3) or (4), wherein the temperature is controlled by heating.

【0019】(6)ホットプレートの材質が、アルミニ
ウムまたは表面にセラミック処理を施した金属からなる
ことを特徴とする前記(3)〜(5)のいずれかに記載
の加熱炉。
(6) The heating furnace according to any one of (3) to (5), wherein the material of the hot plate is made of aluminum or metal whose surface has been subjected to ceramic treatment.

【0020】(7)前記(1)〜(6)のいずれかに記
載の加熱炉を用いることを特徴とするカラーフィルター
の製造方法。
(7) A method for producing a color filter, comprising using the heating furnace according to any one of (1) to (6).

【0021】[0021]

【発明の実施の形態】次に本発明の好ましい実施の形態
について説明する。
Next, a preferred embodiment of the present invention will be described.

【0022】本発明を構成する加熱炉は1枚、もしくは
複数枚のHPから構成されるが、複数枚の全部もしくは
特に限定した1部に適用しても本発明の効用を損なうも
のではない。
The heating furnace constituting the present invention is composed of one or a plurality of HPs. However, even if the heating furnace is applied to all or a particularly limited part of the plurality of HPs, the effect of the present invention is not impaired.

【0023】本発明では、1つの被加熱体を同時に複数
の加熱源によって加熱するが、その方法としては、1枚
のHPの内部に複数の加熱源を設置する方法、1つの被
加熱体を加熱する位置に独立して温度設定できる複数の
HPを配置する方法などがあり、特に限定されない。
In the present invention, one object to be heated is simultaneously heated by a plurality of heating sources. As a method, a method of installing a plurality of heating sources inside one HP and one object to be heated are used. There is a method of arranging a plurality of HPs whose temperatures can be independently set at a position to be heated, and the method is not particularly limited.

【0024】HPの材質は、特に限定されないが、アル
ミニウム、鉄、銅等の金属類、金属の合金、さらに金属
類にセラミック等の表面処理を施したものが好ましく用
いられる。
The material of the HP is not particularly limited, but metals such as aluminum, iron, and copper, alloys of metals, and materials obtained by subjecting metals to surface treatment such as ceramics are preferably used.

【0025】HPの形状は、特に限定されないが被加熱
体と対向する面が平坦であることが好ましい。平坦でな
いとHP面から被加熱体までの距離のバラツキによっ
て、被加熱体を均一に加熱できない懸念がある。
The shape of the HP is not particularly limited, but it is preferable that the surface facing the object to be heated is flat. If it is not flat, there is a concern that the object to be heated cannot be heated uniformly due to the variation in the distance from the HP surface to the object to be heated.

【0026】HPの加熱温度範囲としては、被加熱体の
種類や目的に様々であり、室温〜200℃、室温〜30
0℃、室温〜350℃など適宜選択すればよい。
The range of the heating temperature of the HP varies depending on the type and purpose of the object to be heated.
The temperature may be appropriately selected, such as 0 ° C. and room temperature to 350 ° C.

【0027】基板を保持するピンの材質は特に限定され
ないが、SUS、鉄、銅、真鍮などの金属類、ベスペル
などの耐熱性高分子材料などが好ましく用いられる。
The material of the pins for holding the substrate is not particularly limited, but metals such as SUS, iron, copper, and brass, and heat-resistant polymer materials such as Vespel are preferably used.

【0028】HPと被加熱体の距離は特に限定されない
が、好ましくは2〜50mm、さらに好ましくは3〜1
0mm、より好ましくは5〜8mmである。上記の値よ
りピン高さが低いと、搬送用治具が被加熱体の下に進入
する時、被加熱体と治具の接触により破損する恐れがあ
り、逆に大きいと被加熱体の温度分布が悪くなり好まし
くない。
The distance between the HP and the object to be heated is not particularly limited, but is preferably 2 to 50 mm, more preferably 3 to 1 mm.
0 mm, more preferably 5 to 8 mm. If the pin height is lower than the above value, the transport jig may be damaged by the contact between the heated object and the jig when the transport jig enters below the heated object. The distribution is poor, which is not preferable.

【0029】従来の技術では、1つの被加熱体を1つの
温度設定による加熱源によって加熱していたため、被加
熱体全体の平均到達温度の調整は容易であったが、被加
熱体の中央部と端部など部分的に生じる温度差を補正す
るのが困難であった。
In the prior art, since one heated body is heated by a heating source with one temperature setting, it is easy to adjust the average ultimate temperature of the whole heated body. It is difficult to correct the temperature difference that occurs partially at the end and the like.

【0030】それに対し、本発明では1つの被加熱体を
複数の温度設定による加熱源によって加熱するため、被
加熱体全体の平均到達温度だけでなく、部分的に生じる
温度差も容易に補正できる。
On the other hand, in the present invention, since one object to be heated is heated by a heating source with a plurality of temperature settings, not only the average attained temperature of the entire object to be heated but also a temperature difference occurring partially can be easily corrected. .

【0031】加えて、複数個の温度検知手段設け、該温
度検知手段に基づいて各加熱源を独立して温度制御すれ
ば、温度補正がより容易になり、かつ、被加熱体がより
均一に加熱できる。また、被加熱体を載置した時と載置
していない時等で生じるHPの温度バラツキを補正し、安
定した加熱を行うことができる。
In addition, if a plurality of temperature detecting means are provided, and the temperature of each heating source is independently controlled based on the temperature detecting means, temperature correction becomes easier and the object to be heated can be made more uniform. Can be heated. Further, it is possible to correct the temperature variation of the HP generated when the object to be heated is mounted and not mounted, and to perform stable heating.

【0032】[0032]

【実施例】本発明を実施例に基づいて説明するが、実施
例によって本発明の効力はなんら限定されるものではな
い。
EXAMPLES The present invention will be described based on examples, but the effects of the present invention are not limited by the examples.

【0033】図1は本発明の実施例、比較例に用いた加
熱炉の概略図である。1はHP、2は反射板である。3
はガラス基板を保持するピンであり、4はガラス基板で
ある。加熱炉の側面5、すなわち操作側から見て左右は
排気口であり開放状態である。排気口からは、炉内で加
熱された気体が流出し、炉外の室温の気体流入している
ため、ガラス基板の排気口近傍部、すなわち操作側から
見て左右は低温になりやすい。
FIG. 1 is a schematic view of a heating furnace used in Examples and Comparative Examples of the present invention. 1 is an HP, 2 is a reflection plate. 3
Is a pin for holding a glass substrate, and 4 is a glass substrate. The side surfaces 5 of the heating furnace, that is, the left and right sides viewed from the operation side are exhaust ports and are open. The gas heated in the furnace flows out from the exhaust port, and the gas at room temperature outside the furnace flows in. Therefore, the temperature near the exhaust port of the glass substrate, that is, the left and right sides when viewed from the operation side, tends to be low.

【0034】図2は実施例の加熱炉を構成するHPの上
面概略図であり、ガラス基板の設置位置や温度測定位置
を示したものである。
FIG. 2 is a schematic top view of the HP constituting the heating furnace of the embodiment, and shows the installation position of the glass substrate and the temperature measurement position.

【0035】図3は実施例の加熱炉を構成するHPの温
度制御機構を示す概略図である。本実施例では、1枚の
HPの内部に複数の加熱源を設置する方法を採用してお
り、1a、1b、1cでは異なる加熱源を用いて加熱し
ている。なお、各部を加熱する加熱源の中間を各部の境
界線とし模式的に図示した。また、1b、1cは1つの
温度検知手段と温度制御手段によって同一の温度になる
よう制御されている。
FIG. 3 is a schematic view showing a temperature control mechanism of the HP constituting the heating furnace of the embodiment. In the present embodiment, a method of installing a plurality of heating sources inside one HP is adopted, and heating is performed using different heating sources in 1a, 1b, and 1c. In addition, the middle of the heating source which heats each part was shown typically as the boundary line of each part. In addition, 1b and 1c are controlled so as to have the same temperature by one temperature detecting means and one temperature controlling means.

【0036】図4は比較例の加熱炉を構成するHPの上
面概略図であり、ガラス基板の設置位置や温度測定位置
を示したものである。
FIG. 4 is a schematic top view of the HP constituting the heating furnace of the comparative example, showing the installation position of the glass substrate and the temperature measurement position.

【0037】図5は比較例の加熱炉を構成するHPの温
度制御機構を示す概略図である。比較例では、1枚のH
Pを1つの温度検知手段と温度制御手段によって制御し
ている。
FIG. 5 is a schematic view showing a temperature control mechanism of the HP constituting the heating furnace of the comparative example. In the comparative example, one H
P is controlled by one temperature detecting means and one temperature controlling means.

【0038】[実施例1]300×400mm2 サイズ
の無アルカリガラス基板を、図2の装置に300秒間保
持し、図3に示した基板中央部と基板端部から10mm
の位置の温度をTYPE−Kの熱電対を用いて測定し
た。HPの設定温度は表1のように設定した。
Example 1 An alkali-free glass substrate having a size of 300 × 400 mm 2 was held in the apparatus shown in FIG. 2 for 300 seconds, and 10 mm from the center and the edge of the substrate shown in FIG.
Was measured using a TYPE-K thermocouple. The set temperature of the HP was set as shown in Table 1.

【0039】[比較例1]図4の装置を用い、HPの設
定温度を表1のようにして実施例1と同様に検討した。
Comparative Example 1 Using the apparatus shown in FIG. 4, the set temperature of the HP was examined as shown in Table 1 in the same manner as in Example 1.

【0040】[実施例2]図2の装置を用い、HPの設
定温度を表2のようにして実施例1と同様に検討した。
Example 2 Using the apparatus shown in FIG. 2, the set temperature of the HP was examined as shown in Table 2 in the same manner as in Example 1.

【0041】[比較例2]図4の装置を用い、HPの設
定温度を表2のようにし、実施例2と同様に検討した。
Comparative Example 2 Using the apparatus shown in FIG. 4, the set temperature of the HP was set as shown in Table 2, and the same study as in Example 2 was conducted.

【0042】[温度プロファイルの比較]基板中央部と
基板端部の温度プロファイルを比較した。
[Comparison of Temperature Profiles] The temperature profiles of the central portion of the substrate and the edge portion of the substrate were compared.

【0043】表3に実施例と比較例の300秒後の基板
中央部の到達温度と基板端部の平均到達温度の温度差Δ
Tを示す。ΔTは基板中央部の到達温度から基板端部の
平均到達温度を減算した値であり、正であれば中央部の
方が高温であることを、負であれば低温であることを示
す。
Table 3 shows the temperature difference Δ between the ultimate temperature at the center of the substrate and the average ultimate temperature at the edge of the substrate after 300 seconds between the example and the comparative example.
T is shown. ΔT is a value obtained by subtracting the average temperature reached at the substrate end from the temperature reached at the center of the substrate. If it is positive, it indicates that the temperature is higher at the center, and if negative, it indicates that it is lower.

【0044】表3に示すとおり、比較例1では基板端部
のほうが中央部に比べ7℃低温であったが、実施例1で
は2℃に縮小した。また同様に、比較例2では基板端部
のほうが16℃低温であったが、実施例2では5℃に縮
小した。
As shown in Table 3, in Comparative Example 1, the temperature at the substrate end was lower by 7 ° C. than that at the center, but in Example 1, it was reduced to 2 ° C. Similarly, in Comparative Example 2, the temperature at the substrate end was lower by 16 ° C., but in Example 2, the temperature was reduced to 5 ° C.

【0045】以上より、HPを中央部と端部に分割して
温度制御することにより、基板中央部と端部の温度差を
縮小することができることを確認できた。
As described above, it was confirmed that the temperature difference between the central portion and the end portion of the substrate can be reduced by dividing the HP into the central portion and the end portion and controlling the temperature.

【0046】[0046]

【表1】 [Table 1]

【表2】 [Table 2]

【表3】 [Table 3]

【0047】[0047]

【発明の効果】本発明の加熱炉は、HPを中央部と端部
に分割して温度制御するため、従来技術では制御が困難
であった被加熱体の中央部と端部で温度差を縮小し、均
一に被加熱体を加熱できる加熱炉を提供することができ
る。
According to the heating furnace of the present invention, since the temperature is controlled by dividing the HP into a central part and an end part, the temperature difference between the central part and the end part of the object to be heated, which was difficult to control with the prior art, A heating furnace which can be reduced in size and can uniformly heat the object to be heated can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】実施例、比較例に用いた加熱炉の全体概略図で
ある。
FIG. 1 is an overall schematic diagram of a heating furnace used in Examples and Comparative Examples.

【図2】本発明の加熱炉を構成するHPの一例を示す上
面概略図である。
FIG. 2 is a schematic top view showing an example of an HP constituting the heating furnace of the present invention.

【図3】本発明の加熱炉を構成するHPの温度制御機構
の一例を示す概略図である。
FIG. 3 is a schematic view showing an example of a temperature control mechanism of an HP constituting the heating furnace of the present invention.

【図4】比較例として用いた従来の加熱炉を構成するH
Pの一例を示す上面概略図である。
FIG. 4 shows H constituting a conventional heating furnace used as a comparative example.
It is an upper surface schematic diagram which shows an example of P.

【図5】比較例として用いた従来の加熱炉を構成するH
Pの温度制御機構の一例を示す概略図である。
FIG. 5 shows H constituting a conventional heating furnace used as a comparative example.
It is the schematic which shows an example of the temperature control mechanism of P.

【符号の説明】[Explanation of symbols]

1a〜1c:HP 2:反射板 3:プロキシピン 4:ガラス基板 5:加熱炉側面(開放状態) 1a to 1c: HP 2: Reflector 3: Proxy pin 4: Glass substrate 5: Side of heating furnace (open state)

───────────────────────────────────────────────────── フロントページの続き (72)発明者 田中 聡 滋賀県大津市園山1丁目1番1号 東レ株 式会社滋賀事業場内 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Satoshi Tanaka 1-1-1 Sonoyama, Otsu City, Shiga Pref.

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】1つの被加熱体を加熱する大きさのポジシ
ョンが、独立して温度設定できる複数個の加熱源により
構成されていることを特徴とする加熱炉。
1. A heating furnace wherein a position having a size for heating one heated object is constituted by a plurality of heating sources whose temperatures can be independently set.
【請求項2】独立して温度設定できる複数個の加熱源に
加えて複数個の温度検知手段を設け、該温度検知結果に
基づいて各加熱源を独立して温度制御するようにしたも
のであることを特徴とする請求項1に記載の加熱炉。
2. A plurality of temperature detecting means are provided in addition to a plurality of heating sources whose temperatures can be set independently, and each of the heating sources is independently temperature-controlled based on a result of the temperature detection. The heating furnace according to claim 1, wherein:
【請求項3】複数個の加熱源が1枚のホットプレートで
あることを特徴とする請求項1または2に記載の加熱
炉。
3. The heating furnace according to claim 1, wherein the plurality of heating sources are one hot plate.
【請求項4】ホットプレートが、中央部と端部に独立し
て温度設定できる加熱源を設けたものであることを特徴
とする請求項3に記載の加熱炉。
4. The heating furnace according to claim 3, wherein the hot plate is provided with a heating source capable of independently setting a temperature at a center portion and an end portion.
【請求項5】ホットプレートが、中央部と端部に独立し
て温度設定できる加熱源と温度検知手段とが設けられた
ものであり、該温度検知結果に基づいて各加熱源を独立
して温度制御するようにしたことを特徴とする請求項3
または4に記載の加熱炉。
5. A hot plate is provided with a heating source and a temperature detecting means capable of independently setting a temperature at a center portion and an end portion, and independently controls each heating source based on the temperature detection result. 4. The apparatus according to claim 3, wherein the temperature is controlled.
Or the heating furnace according to 4.
【請求項6】ホットプレートの材質が、アルミニウムま
たは表面にセラミック処理を施した金属からなることを
特徴とする請求項3〜5のいずれかに記載の加熱炉。
6. The heating furnace according to claim 3, wherein the material of the hot plate is aluminum or a metal whose surface has been subjected to a ceramic treatment.
【請求項7】請求項1〜6のいずれかに記載の加熱炉を
用いることを特徴とするカラーフィルターの製造方法。
7. A method for producing a color filter, comprising using the heating furnace according to claim 1.
JP9349157A 1997-12-18 1997-12-18 Heating furnace Pending JPH11183038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9349157A JPH11183038A (en) 1997-12-18 1997-12-18 Heating furnace

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9349157A JPH11183038A (en) 1997-12-18 1997-12-18 Heating furnace

Publications (1)

Publication Number Publication Date
JPH11183038A true JPH11183038A (en) 1999-07-06

Family

ID=18401864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9349157A Pending JPH11183038A (en) 1997-12-18 1997-12-18 Heating furnace

Country Status (1)

Country Link
JP (1) JPH11183038A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108022856A (en) * 2016-10-31 2018-05-11 日新离子机器株式会社 Heating unit, semiconductor- fabricating device
JP2018078265A (en) * 2016-10-31 2018-05-17 日新イオン機器株式会社 Heating apparatus and semiconductor manufacturing apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108022856A (en) * 2016-10-31 2018-05-11 日新离子机器株式会社 Heating unit, semiconductor- fabricating device
JP2018078265A (en) * 2016-10-31 2018-05-17 日新イオン機器株式会社 Heating apparatus and semiconductor manufacturing apparatus

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