JPH11172169A - Pattern-forming paste and pattern-formation - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain the subject paste capable of forming a large-area pattern of an electrode, resistor or the like, in high precision with uniform thickness by including a high-boiling organic solvent and an organic solvent in a liquid medium. SOLUTION: This paste is composed of at least (A) a resin component, (B) an inorganic powder and (C) a liquid medium for dissolving or dispersing these components. The component C at least contains a high-boiling organic solvent having a boiling point of 200-240 deg.C and an organic solvent having a boiling point of 140-180 deg.C. Preferably, the component A is a resin evaporating or decomposing by the baking at <=600 deg.C, the viscosity η1 measured at a shearing rate of 0.1/sec is <=4,000 poise, the viscosity η2 measured at a shearing rate of 10/sec is >=40 poise and the (η1 /η2 ) ratio is 1-100.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern forming paste and a pattern forming method, and more particularly to a pattern forming paste for uniformly forming a large area pattern in an image display device and the like, and this pattern forming paste. And a method for forming a high-precision pattern using the same.

[0002]

2. Description of the Related Art In recent years, with the enlargement of image display devices and the like,
It is required to form large-area patterns such as electrodes and resistors with a uniform film thickness.

Conventionally, as a method of forming a large area pattern as described above, a method of etching a thin film or the like formed by vapor deposition, sputtering, or the like by a photolithography method, a screen printing method using a pattern forming paste having desired characteristics. A method in which a predetermined pattern is formed by an extrusion coating method, a die coating method, or the like, and a pattern is formed by baking after drying.

[0004] However, the above-mentioned etching method can form a pattern with high accuracy, but has a problem that the manufacturing cost is increased due to the etching step. Further, when a pattern is formed on a large-area substrate such as a large-sized image display device, a large number of large-sized thin film forming apparatuses, exposure apparatuses and etching apparatuses are required, and this also raises the problem of increasing the manufacturing cost. there were. In addition, there was a problem in the thickness distribution of the pattern, the smoothness, and the like, and a product of sufficient quality could not be obtained.

On the other hand, the screen printing method, the extrusion coating method, the die coating method, and the like using the paste for forming a pattern have no etching step, and the steps are simpler than the above-mentioned etching method, and the manufacturing cost is reduced. Be expected.

[0006]

However, in a screen printing method, an extrusion coating method, a die coating method, and the like using a paste for forming a pattern, a pattern is formed by a coating film containing an organic solvent. Depending on the type, there is a problem that the paste is dried and solidified in the plate, the coating head or the die, and the accuracy of the formed pattern is reduced.

If an organic solvent having a low volatility, that is, a high boiling point, is used to avoid such a problem, it takes a long time to dry the coating pattern. In addition, uneven distribution of the organic solvent in the coating liquid occurs during drying, and the resulting pattern has a problem that the edge of the pattern is raised and the precision of the pattern is reduced.

Further, the conventional pattern forming paste used in the screen printing method has a problem that a mesh of a screen plate is generated or bleeding or backing occurs when a pattern is formed by screen printing, so that the film thickness is uniform and the edge precision is high. It was difficult to form a pattern with high density.

In the extrusion coating method, a pattern is formed by moving a pressure nozzle for extruding a paste for pattern formation on a substrate along a predetermined path. The leveling at the place where the application surfaces overlap with the nozzle was insufficient, and the pattern was uneven in accordance with the application width of the pressure nozzle, and it was difficult to form a pattern with a uniform film thickness.

On the other hand, the die coating method can form a pattern having a uniform film thickness, but it is difficult to form a pattern in a peripheral portion of a substrate, and leveling is insufficient with a conventional paste for pattern formation. In some cases, streak-like coating unevenness generated when foreign matter enters between the die and the substrate remains in the pattern as it is, and it is difficult to form a pattern having a uniform film thickness.

Accordingly, an object of the present invention is to provide a pattern forming paste capable of forming a large-area pattern such as an electrode, a resistor, a dielectric, and a barrier material with a uniform thickness and fineness, and the use of the pattern forming paste. To provide a pattern forming method capable of forming a large-area pattern having a uniform film thickness.

[0012]

The above object is achieved by the present invention described below. That is, the present invention relates to a pattern forming paste comprising at least a resin component, an inorganic powder, and a liquid medium in which these components are dissolved or dispersed, wherein the liquid medium is a high-boiling organic solvent having a boiling point of 200 to 240 ° C.
A pattern forming paste comprising at least an organic solvent at 40 to 180 ° C., and a pattern forming method using the pattern forming paste.

By using at least two kinds of organic solvents having different boiling points as a liquid medium of the pattern forming paste containing a large amount of inorganic powder, the pattern forming paste is dried and solidified in the coating head when the pattern forming paste is applied. No drying time can be reduced,
It is possible to provide a pattern forming paste and a pattern forming method capable of forming a large-area pattern such as a resistor and a dielectric with a uniform thickness and fineness.

By setting the viscosity characteristic of the pattern forming paste to a specific range, a pattern layer is formed on a substrate by any of a screen printing method, an extrusion coating method, and a die coating method. The pattern forming paste of the present invention, which constitutes the above, forms a pattern layer having a uniform thickness by producing good leveling, and in a subsequent baking, the resin component of the pattern layer is removed, and the pattern layer is fixed to the substrate to obtain a desired pattern layer. A pattern is obtained.

[0015]

Next, the present invention will be described in more detail with reference to preferred embodiments. The pattern forming paste of the present invention comprises at least a resin component, an inorganic powder, and a liquid medium in which these components are dissolved or dispersed, and the liquid medium is a high-boiling organic solvent having a boiling point of 200 to 240 ° C. and a boiling point of 140.
And at least 180 ° C organic solvent.

The resin component constituting the pattern forming paste of the present invention is preferably one which does not volatilize or decompose by firing at a low temperature of 600 ° C. or less and does not leave carbide in the pattern. Examples of such a resin component include cellulose resins such as ethyl cellulose, methyl cellulose, nitrocellulose, cellulose acetate, ethyl cellulose, methyl cellulose, nitrocellulose, cellulose acetate, cellulose propionate, cellulose butyrate, methyl (meth) acrylate, ethyl ( Meth) acrylate, normal butyl (meth) acrylate, isobutyl (meth) acrylate,
Isopropyl (meth) acrylate, 2-ethylmethyl (meth) acrylate, 2-hydroxyethyl (meth)
Examples thereof include polymers such as acrylates or esters of poly (meth) acrylic acid comprising these copolymers, poly-α-methylstyrene, polyvinyl alcohol, and polybutene-based resins. Particularly preferred are ethylcellulose-based and methacrylate-based resins. It is a system resin.

The volatilization or decomposition temperature of the above resin component is 60
If the temperature exceeds 0 ° C., the firing temperature at the time of removing the resin component becomes high. For example, when the heat resistance of the substrate is low, the substrate is undesirably thermally deformed. On the other hand, the lower limit of the volatilization or decomposition temperature of the resin component is not particularly limited, but as the volatilization or decomposition temperature decreases, the type of resin that is completely volatilized or decomposed decreases and the range of material selection becomes narrower. It is preferable to set the lower limit of the volatilization or decomposition temperature to about 300 ° C. The content of the resin component in the paste for pattern formation is 0.5 to 10% by weight,
Preferably, it can be in the range of 0.5 to 5% by weight.

The inorganic powder constituting the pattern forming paste of the present invention has characteristics according to the intended use of the pattern to be formed, and an inorganic powder having a softening temperature of 450 to 600 ° C. can be used. . Softening temperature of inorganic powder is 600
If the temperature exceeds ℃, the substrate will be thermally deformed at the firing temperature, which is not preferable. When the softening temperature of the inorganic powder is lower than 450 ° C., the inorganic powder is fused before the resin component of the pattern forming paste is completely decomposed or volatilized, so that voids are easily generated in the formed pattern layer. Not preferred.

Specific examples of usable inorganic powders include, for example, conductive powders such as Ag powder, Ag-Pd powder, Au powder, Cu powder, low softening temperature glass powder, and dielectric powder. Powders and the like can be mentioned. In order to provide an effect of preventing phase separation of the glass during firing, to adjust the softening temperature, and to adjust the thermal swelling coefficient to the glass substrate, Al is used.
₂ O ₃ , B ₂ O ₃ , SiO ₂ , MgO, CaO, SrO, B
An inorganic powder such as aO can be used in combination. Furthermore, ceramic powders such as alumina, magnesia, zirconia, calcia, cordierite, silica, and mullite can be used as the durable filler.

The average particle size of the above inorganic powder is 0.1 to 1
It can be set in the range of 0 μm, preferably 0.5 to 5 μm. If the average particle size is less than 0.1 μm, the structural viscosity (thixotropic method) increases, and the viscosity ratio (η ₁ / η ₂ ) described later exceeds 100, which is not preferable. On the other hand, when the average particle size exceeds 10 μm, the surface flatness of the formed pattern layer is undesirably reduced. Such an inorganic powder is added to the paste for pattern formation in an amount of 5 to 9%.
5% by weight. Most preferably, it can be contained in the range of 50 to 90% by weight.

In the pattern forming paste of the present invention, a plasticizer, a surfactant, an antifoaming agent, an antioxidant and the like are used as necessary as additives. Of these, phthalates, sebacates,
Phosphates, adipates, glycolates, citrates, and the like are generally used.

The paste for pattern formation of the present invention may be prepared by adding the above-mentioned resin component, inorganic powder and other optional components to a liquid medium, mixing and kneading with a roll mill to form a paste-like coating liquid. It can be kneaded by a ball mill or the like to obtain a slurry-like coating liquid.

The main feature of the paste for pattern formation of the present invention is that it contains at least a high-boiling organic solvent having a boiling point of 200 to 240 ° C. and an organic solvent having a boiling point of 140 to 180 ° C. as the liquid medium. Boiling point 200-240
Preferred examples of the organic solvent having a high boiling point at ° C include, for example, triethylene glycol monobutyl ether, triethylene glycol, polyethylene glycol, polypropylene glycol, dioctyl phthalate, diisodecyl phthalate and the like.

Examples of the organic solvent having a boiling point of 140 to 180 ° C. include amyl acetate, isoamyl acetate, methyl lactate, ethyl lactate, butyl lactate, methyl amyl acetate, 2-ethylbutyl acetate, methyl acetoacetate, and 3-methoxybutyl acetate. , Glycol diformate, propylene glycol monobutyl ether, propylene glycol monopropyl ether, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether, ethylene glycol monoisobutyl ether, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl Ether and the like can be mentioned.

The ratio of the above-mentioned high-boiling organic solvent to the relatively low-boiling organic solvent is the former / latter = 1/4 to 4 /
A range of 1 is preferred. If the amount of the high-boiling organic solvent is too large, the organic component is unevenly distributed due to a long drying time,
It is not preferable because the pattern edge rises and the pattern accuracy decreases, and on the other hand, when the amount of the relatively low boiling point organic solvent used is too large, the coating solution is dried and solidified in the printing plate, the application head or the die portion, and the pattern accuracy decreases. Or a defect is generated.

Further, the pattern forming paste may contain a solvent that is a good solvent for the resin component used, for example, glycol ether. The selection of the solvent is performed mainly in consideration of the volatility of the solvent and the solubility of the resin component used. If the solubility of the solvent in the resin component is low, the viscosity of the paste for forming a pattern becomes high, and the printability deteriorates, which is not preferable. Further, the content of the solvent can be set in a viscosity range in which bubbles in the pattern forming paste can be removed, the leveling is good, and the smoothness of the formed pattern is good, for example, 25 to 50. % By weight is preferred.

In the paste for forming a pattern of the present invention, its viscosity characteristics are also important. In the paste for forming a pattern of the present invention, its shear rate is 0.1 /.
The viscosity η ₁ in seconds is 4,000 poise or less, and the viscosity η _{2 at} a shear rate of 10 / sec is 40 pois
e or more, and the ratio of the viscosity η ₁ to the viscosity η ₂ (η ₁ /
η ₂ ) is preferably in the range of 1 to 100. A viscosity η _{1 at a} shear rate of 0.1 / sec is 4,000 pois
Exceeding e, when a pattern layer is formed on a substrate by one of a screen printing method, an extrusion coating method, and a die coating method as described below, a mesh of a screen plate,
If unevenness due to the overlapping of the application surfaces by the pressure nozzle, streak-like application unevenness in die application, etc. occurs in the pattern layer, such non-uniformity of the film thickness is not eliminated, but remains in the pattern layer as it is. It is not preferable.

If the viscosity η _{2 at} a shear rate of 10 / sec is less than 40 poise, streaks may occur in pattern formation by screen printing as described later, or pressure may be reduced in pattern formation by extrusion coating or die coating. Becomes unstable and unevenness occurs. On the other hand, if the viscosity ratio (η ₁ / η ₂ ) exceeds 100, the paste that has passed through the screen plate will wrap around on the back side of the screen plate or bleed in the image area during pattern formation by screen printing. At the time of pattern formation by die coating via a mask, the wraparound of the paste on the back surface of the mask or the like occurs, which makes it difficult to form a high-definition pattern. On the other hand, when the viscosity ratio (η ₁ / η ₂ ) is less than 1, dilatancy is exhibited, and component unevenness occurs, making uniform coating difficult.

Next, the pattern forming method of the present invention will be described with reference to the drawings. FIG. 1 is a drawing for explaining an embodiment of the pattern forming method of the present invention. In FIG. 1, a pattern forming method according to the present invention firstly comprises a screen plate 1 having a predetermined pattern formed on one surface of a substrate S.
The screen printing is performed using the pattern forming paste 1 of the present invention through the step 1.

In the illustrated example, the pattern layer 15 is formed on the substrate S by moving the squeegee 12 on the screen plate 11 in the direction of the arrow. The pattern layer 15 can be formed as a large-area pattern (hatched portion) on the substrate S, for example, as shown in FIG. At the time of this screen printing, the screen plate 11
The pattern forming paste 1 is excellent in leveling property even if the meshes of the pattern layer 15 are formed in the pattern layer 15, so that the surface of the pattern layer 15 is extremely flat.
Further, the pattern forming paste 1 to be used does not wrap around the back surface of the screen plate 11 and does not cause bleeding in the image portion, so that the pattern of the screen plate 11 is accurately reproduced.

Next, by baking at 500 to 600 ° C., the resin component contained in the pattern layer 15 is volatilized or decomposed, and is removed without leaving any carbide.
The inorganic powders contained in the pattern layer 15 are mutually fused by firing, and are fixed to the substrate S with sufficient strength. Thereby, a desired pattern having a uniform film thickness can be formed on the substrate S with high accuracy. The screen plate used for pattern formation by the screen printing method described above has a mesh size of 100 to 500 mesh, preferably 200 to 500 mesh.
A plate of about 300 mesh can be used.

FIG. 3 is a drawing for explaining another embodiment of the pattern forming method of the present invention. In FIG.
In the pattern forming method of the present invention, first, the pattern forming paste 1 of the present invention is extruded and applied to one surface of the substrate S using the pressurizing nozzle 21. In this extrusion coating, as shown in FIG. 4, a pressure nozzle 21 having a predetermined width is used.
Arrow A ₁ after coating is moved in a direction has been completed, pressure nozzle 21 in the arrow A ₂ direction as coated surface slightly overlap
Is moved to perform coating.

[0033] Thereafter, similarly, an arrow A ₃ direction of arrow A ₄ direction, arrow A ₅ by performing coating by moving the pressure nozzle in the direction, the pattern layer of a large area in a predetermined pattern on the substrate S 25 (Shaded area) is formed. As described above, the application surface of the pattern layer 25 in each of the moving directions (A _{1 to} A ₅ ) of the pressure nozzle 21 slightly overlaps. Immediately after application, the application surface has irregularities. Since the pattern forming paste 1 has excellent leveling properties, the surface of the pattern layer 25 becomes extremely flat.

Next, by baking at 500 to 600 ° C., the resin component contained in the pattern layer 25 is volatilized or decomposed, and is removed without leaving any carbide.
The inorganic powders contained in the pattern layer 25 are mutually fused by firing and are fixed to the substrate S with sufficient strength. Thereby, a desired pattern having a uniform film thickness can be formed on the substrate S with high accuracy.

FIG. 5 is a drawing for explaining another embodiment of the pattern forming method of the present invention. In FIG.
According to the pattern forming method of the present invention, first, the pattern forming paste 1 of the present invention is extruded from a die 31 moving in the direction of an arrow through a mask 32 having a predetermined pattern formed on one surface of a substrate S to perform coating. Then, the pattern layer 35 is formed on the substrate S.

FIG. 6 is a view showing a state in which the extrusion coating by the die 31 is completed. The pattern layer 35 can be formed as a large-area pattern (hatched portion) on the substrate S. A pattern can be formed in a peripheral portion of the substrate, which has been difficult by the method. At the time of this die extrusion coating, the pattern forming paste 1 to be used is excellent in leveling property. Therefore, even if foreign matter is mixed between the die 31 and the substrate S to cause a streak-like coating unevenness, the pattern forming paste 1 can be used. Due to the leveling of the forming paste, the surface of the pattern layer 35 becomes extremely flat. Further, since the pattern forming paste 1 to be used does not wrap around the back surface of the mask 32, the mask 32
Is exactly reproduced.

Next, by baking at 500 to 600 ° C., the resin component contained in the pattern layer 35 is volatilized or decomposed, and is removed without leaving any carbide.
The inorganic powders contained in the pattern layer 35 are mutually fused by firing, and are fixed to the substrate S with sufficient strength. Thereby, a desired pattern having a uniform film thickness can be formed on the substrate S with high accuracy.

[0038]

Next, the present invention will be described in more detail with reference to Examples and Comparative Examples. 1. Example 1 of the extrusion coating method and Comparative Examples 1 to 3 Four types of pattern forming pastes having the following compositions were prepared using a ball mill as the pattern forming pastes of the respective examples and comparative examples. Composition of Example 1 Glass frit (ASF1340 manufactured by Iwaki Glass Co., Ltd.) 75 parts by weight Ethyl cellulose (Ethocel 100 manufactured by Dow Corning) 6.25 parts by weight Terpineol (boiling point 217 ° C.) 32.6 parts by weight Methoxy Butyl acetate (boiling point 170 ° C) 52.3 parts by weight

Composition of Comparative Example 1 Glass frit (ASF1340 manufactured by Iwaki Glass Co., Ltd.) 75 parts by weight Ethyl cellulose (Ethocel 100 manufactured by Dow Corning) 6.25 parts by weight Methoxybutyl acetate (boiling point 170 ° C.) 8 parts by weight Composition of Comparative Example 2 75 parts by weight of glass frit (ASF1340 manufactured by Iwaki Glass Co., Ltd.) 6.25 parts by weight of ethyl cellulose (Ethocel 100 manufactured by Dow Corning) 32 butyl carbitol acetate (boiling point 247 ° C.) 32 0.6 parts by weight ・ Methoxybutyl acetate (boiling point 170 ° C.) 52.3 parts by weight

Composition of Comparative Example 3 75 parts by weight of glass frit (ASF1340 manufactured by Iwaki Glass Co., Ltd.) 6.25 parts by weight of ethyl cellulose (Ethocel 100 manufactured by Dow Corning) 85.8 parts by weight of terpineol (boiling point 217 ° C.) Part Paste for pattern formation described above (Example 1, Comparative Example 1
Using (3), a pattern layer (area: 1500 cm ² ) was formed on a glass substrate having a thickness of 2 mm by an extrusion coating method using a pressure nozzle under the following conditions.

Extrusion coating conditions using a pressure nozzle Nozzle shape: slit (1 cm × 0.2 cm) Coating speed: 16 cm / sec Pressure: 1.6 kg / cm ² Next, each of the above patterns is dried at 170 ° C. And then fired at a peak temperature of 520 ° C (peak temperature holding time 10 minutes)
To make each pattern. The suitability for pattern formation by the extrusion coating method using this pressure nozzle was evaluated and the results are shown in Table 1 below.

[0042]

[Table 1]

2. Examples 1 and 2 of screen printing application method
And Comparative Examples 1 to 3 Using the above-described pastes for pattern formation (Example 1 and Comparative Examples 1 to 3), a pattern layer (having an area of 150) was formed on a glass substrate having a thickness of 2 mm by screen printing under the following conditions.
0 cm ² ).

Screen printing conditions : 250 mesh plate ・ Squeegee speed: 50 mm / sec ・ Squeegee hardness: 70 ° ・ Squeegee angle: 70 ° ・ Squeegee pushing amount: 400 μm Next, after drying each of the above patterns at 170 ° C., Baking at a peak temperature of 520 ° C (peak temperature holding time 10 minutes)
To make each pattern. The suitability for pattern formation by this screen printing method was evaluated and is shown in Table 2 below.

[0045]

[Table 2]

3. Example 1 of die extrusion coating method and
Comparative Examples 1 to 3 Using the above-described pastes for pattern formation (Example 1 and Comparative Examples 1 to 3), a pattern layer (area 1) was formed on a glass substrate having a thickness of 2 mm by a die extrusion coating method under the following conditions.
500 cm ² ).

Die extrusion coating conditions Nozzle shape: slit (30 cm × 0.2 cm) Coating speed: 1 cm / sec Pressure: 5 kg / cm ² Next, after drying each of the above patterns at 170 ° C., peak temperature Baking at 520 ° C (peak temperature holding time 20 minutes)
To make each pattern. The suitability for pattern formation by this die extrusion coating method was evaluated and is shown in Table 3 below.

[0048]

[Table 3]

[0049]

According to the present invention, at least two kinds of organic solvents having different boiling points are used as a liquid medium of a pattern forming paste containing a large amount of inorganic powder, so that a coating head can be used at the time of applying the pattern forming paste. A pattern forming paste and a pattern forming method capable of forming a large-area pattern such as an electrode, a resistor, and a dielectric with a uniform thickness and fineness without drying and solidifying the pattern forming paste and reducing the drying time. Can be provided.

By setting the viscosity characteristic of the pattern forming paste to a specific range, a pattern layer is formed on a substrate by any of a screen printing method, an extrusion coating method, and a die coating method. The pattern forming paste of the present invention, which constitutes the above, forms a pattern layer having a uniform thickness by producing good leveling, and in a subsequent baking, the resin component of the pattern layer is removed, and the pattern layer is fixed to the substrate to obtain a desired pattern layer. A pattern is obtained.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an example of a pattern forming method according to the present invention.

FIG. 2 is a diagram illustrating an example of a pattern formed on a substrate.

FIG. 3 is a view for explaining another example of the pattern forming method of the present invention.

FIG. 4 is a view for explaining an operation of a pressure nozzle on a substrate and an example of a pattern.

FIG. 5 is a view for explaining another example of the pattern forming method of the present invention.

FIG. 6 is a diagram illustrating an example of a pattern formed on a substrate.

[Explanation of symbols]

 1: pattern forming paste 11: screen plate 12: squeegee 15: pattern layer 21: pressure nozzle 25: pattern layer 31: die 32: mask 35: pattern layer S: substrate

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI G03F 7/004 501 G03F 7/004 501 7/16 501 7/16 501 H05K 1/09 H05K 1/09

Claims (7)

[Claims] 1. A pattern forming paste comprising at least a resin component, an inorganic powder, and a liquid medium in which these components are dissolved or dispersed, wherein the liquid medium has a boiling point of 200 to 24.
A paste for forming a pattern, comprising at least an organic solvent having a high boiling point of 0 ° C and an organic solvent having a boiling point of 140 to 180 ° C. 2. The pattern forming paste according to claim 1, wherein the resin component is a resin which volatilizes or decomposes when fired at 600 ° C. or lower. 3. The viscosity η _{1 at a} shear rate of 0.1 / sec is 4,000 poise or less, the viscosity η ₂ at a shear rate of 10 / sec is 40 poise or more, and the ratio of the viscosity η ₁ to the viscosity η ₂ (η The pattern forming paste according to claim 1, wherein ₁ /? ₂ ) is in the range of 1 to 100. 4. A pattern layer is formed on one surface of a base material in a predetermined pattern by a screen printing method using the pattern forming paste according to any one of claims 1 to 3,
Thereafter, baking is performed at 500 to 600 [deg.] C. to remove the resin component of the pattern layer and to fix the pattern layer to a substrate. 5. A pattern layer is formed on one surface of a base material in a predetermined pattern by a method of extrusion using a paste for forming a pattern according to any one of claims 1 to 3 from a pressure nozzle, followed by a coating method. Baking at 500 to 600 [deg.] C. to remove the resin component of the pattern layer and fixing the pattern layer to a substrate. 6. A pattern layer is formed on one surface of a base material in a predetermined pattern by a die coating method using the pattern forming paste according to claim 1; A pattern forming method, wherein the pattern layer is fixed to a substrate while baking at a temperature of about 10 ° C. to remove a resin component of the pattern layer. 7. A pattern is formed on one surface of a substrate by using the pattern forming paste according to any one of claims 1 to 3 by the coating method according to claim 4 to 6, and further on the pattern. After a predetermined pattern is provided and the pattern is etched, the pattern is removed to form a pattern layer, and then fired at 500 to 600 ° C. to remove the resin component of the pattern layer and fix the pattern layer to the substrate. A pattern forming method, characterized in that: