JPH1117053A - Structure and method for mounting semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To modify thermal stress generated between a semiconductor device and a mounting board at the time of mounting, by electrically connecting a connecting terminal with a connecting pad by a connecting metal and providing an electrically insulating resin material between the mounting plane of the board and the mounting plane of the mounting board. SOLUTION: On the mounting plane of the board 10 of a semiconductor device 5, many connecting terminals 16 are arranged in array. On the plane of the mounting board 30 for mounting the semiconductor device 5, a connecting pad 32 is formed in the same flat plane arrangement as that of the connecting terminal 16. A connecting wiring body 20 is provided between the mounting plane of the board 10 and the mounting board 30, by forming an electrically insulating resin material 22 as a film and arranging a connecting metal 24, which is to be an electrical continuity part, by penetrating the film in the thickness direction in the same flat plane arrangement as that of the connecting terminal 16 of the board 10. The semiconductor device 5 is bonded to the mounting board 30 through the connecting wiring body 20 to be electrically connected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device mounting structure and a semiconductor device mounting method, and more particularly to a semiconductor device mounting structure and a surface mounting method for surface mounting.

[0002]

2. Description of the Related Art In recent semiconductor devices, since a multi-pin semiconductor chip is mounted, the entire mounting surface of a package such as a BGA (Ball Grid Array) or LGA (Land Grid Array) is used as a space for arranging external connection terminals. In recent years, products have been used in which external connection terminals are arranged in an array so that a large number of external connection terminals can be arranged. The BGA and the LGA are both semiconductor devices for surface mounting. The BGA is mounted via solder balls, and the LGA is mounted by applying a solder paste to a socket or a connection pad.

[0003]

By the way, in the case of surface-mount type semiconductor packages, there is a problem that when they are mounted, the thermal stress generated between the mounting substrate and the semiconductor package greatly affects the reliability of the electronic device. is there. In particular,
In products with external connection terminals arranged almost all over the mounting surface as described above, the package is bonded to the mounting substrate over substantially the entire area of the substrate, so the thermal stress due to the difference in the coefficient of thermal expansion between the substrate and the mounting substrate is reduced by the semiconductor. It tends to concentrate on the joint between the package and the mounting board, and even when the difference in thermal expansion coefficient is not so large, a problem that the joint is broken by thermal stress easily occurs.

The present invention relates to a structure for mounting a semiconductor device in which connection terminals are arranged in an array on a mounting surface of a substrate in such a surface-mount type semiconductor device, and particularly to a mounting method without a solder ball therebetween. The structure reduces the thermal stress generated between the semiconductor device and the mounting board during mounting, thereby preventing the joint from being damaged and providing a highly reliable electronic device. It is an object of the present invention to provide a semiconductor device mounting structure and a semiconductor device mounting method.

[0005]

The present invention has the following arrangement to achieve the above object. That is, a semiconductor device in which a large number of connection terminals are arranged on a mounting surface of a substrate is mounted on a mounting substrate on which connection pads are formed in the same plane arrangement as the connection terminals, and between the mounting surface and the mounting substrate. A mounting structure of a semiconductor device which is surface-mounted via a connection wiring body, wherein the connection wiring body is welded to the connection terminal and the connection pad, which are arranged in the same planar arrangement as the connection terminal. A connection metal for electrically connecting the connection terminal and the connection pad, and a resin material having electrical insulation interposed between a mounting surface of the substrate and a mounting surface of the mounting substrate. It is characterized by. Further, the resin material is integrally bonded to a mounting surface of the substrate, and is not bonded to a mounting surface of the mounting substrate. Further, the resin material is not bonded to the mounting surface of the substrate and the mounting surface of the mounting substrate. Further, the bonding metal is arranged in an array so as to correspond to the entire mounting surface of the substrate including at least the arrangement position of the connection terminal. The bonding metal that is not bonded to the connection terminal dissipates heat from the semiconductor device to the mounting substrate, thereby providing a semiconductor device mounting structure with good heat dissipation.

Further, a semiconductor device having a large number of connection terminals disposed on a mounting surface of a substrate is mounted on a mounting substrate having connection pads formed in the same planar arrangement as the connection terminals. A method for mounting a semiconductor device which is surface-mounted via a connection wiring body between the connection terminals, wherein the resin terminal having electrical insulation formed in a film shape is penetrated in a thickness direction and is flush with the connection terminal. The connection wiring body in which the joining metal is arranged is aligned with the substrate and the mounting board, and is squeezed and supported between the mounting surface of the substrate and the mounting board, and the temperature at which the joining metal melts And welding the joining metal to the connection terminals and the connection pads. In addition, as the connection wiring body, a material in which the resin material does not have an adhesive property with respect to the board and the mounting board is used, and an adhesive property such as a solder resist is attached to the mounting surface of the board except for a position where the connection terminal is arranged. After applying a resin material having the following, the connection wiring body is aligned with the substrate and the mounting substrate, and squeezed and supported between the mounting surface of the substrate and the mounting substrate, so that the bonding metal is melted. To a predetermined temperature, the joining metal is welded to the connection terminals and the connection pads, and the adhesive resin material is cured, whereby the resin material of the connection wiring body is integrally bonded to the substrate. It is characterized by doing. Further, the connection wiring body is made of a material in which the resin material has no adhesiveness to the substrate and the mounting substrate.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is an explanatory view showing a mounting structure of a semiconductor device according to the present invention. In the figure, reference numeral 10 denotes a substrate of the semiconductor device 5, and reference numeral 12 denotes a resin sealing portion in which a semiconductor chip mounted on the substrate 10 is resin-sealed.
The substrate 10 on which the semiconductor chip is mounted is a resin substrate,
A ceramic substrate or the like can be used, and the material and the like of the substrate 10 are not particularly limited. Reference numeral 20 denotes a connection wiring body for mounting the semiconductor device 5 on the mounting board 30.

FIG. 2 shows a method of mounting a semiconductor device on a mounting board 30 via a connection wiring body 20. FIG. 2A is an enlarged view of the configuration of the semiconductor device 5, the mounting substrate 30, and the connection wiring body 20. A large number of connection terminals 16 are arranged in an array on the mounting surface of the substrate 10 of the semiconductor device 5. A connection pad 32 electrically connected to the connection terminal 16 is provided on the mounting surface of the semiconductor device 5 of the mounting substrate 30.
6 are formed in the same planar arrangement. Reference numeral 34 denotes a protective film such as a solder resist for protecting the surface of the mounting board 30.

The connection wiring body 20 is interposed between the mounting surface of the substrate 10 and the mounting substrate 30, and connects the semiconductor device 5 to the mounting substrate 30.
And has the function of electrically connecting the semiconductor device 5 to the mounting substrate 30. Connection wiring body 20 of embodiment
Is a bonding metal which is formed in a film shape using a resin material 22 having electrical insulation as a base material, penetrates the film in the thickness direction in the same planar arrangement as the connection terminals 16 of the substrate 10, and becomes an electrically conductive portion. 24 are arranged. Joining metal 2
For 4, a metal such as solder that is easily melted by heating at about 400 ° C. or less is used.

FIG. 4 shows a method of forming the connection wiring body 20.
FIG. 4A shows a columnar body 40 in which a number of metal wires penetrate from the bottom surface to the upper surface in parallel with the axis and are integrally solidified by the resin material 22. The columnar body 40 is provided with metal wires standing in the same arrangement as the planar arrangement of the connection terminals 16 in a bottomed cylindrical container, and after filling the container with the fluid resin material 22 before solidification,
It can be obtained by solidifying the resin material 22.

Next, the solidified columnar body 40 is sliced from a direction perpendicular to the axis to obtain a sliced body 42. The slice thickness of the slice body 42 is set according to the thickness of the connection wiring body 20. Metal wires may be repeatedly arranged on the columnar body 40 so that a plurality of connection wiring bodies 20 are obtained from one slice body 42. The obtained slice body 42
Is cut out into individual pieces to obtain a connection wiring body 20 as shown in FIG. By slicing the columnar body 40, the connection wiring body 20 is formed with the end surfaces of the bonding metal 24 exposed on both surfaces.

As the resin material 22 constituting the connection wiring body 20, a resin material such as a polyimide resin or a polyphenylene ether resin can be used as a thermoplastic resin material, and an epoxy resin, a polyimide resin, a cyanate resin or the like can be used as a thermosetting resin material. Resin material can be used. The connection wiring body 20 is used in a state in which the resin material 22 has no adhesive property or has an adhesive property, depending on a mounting method of the semiconductor device 5. This resin material 2
The property of No. 2 can be set according to the processing conditions at the time of forming the columnar body 40. When the columnar body 40 is solidified, it is completely cured so that it has no adhesiveness, and it is not completely cured so that the adhesiveness is not obtained. Can be held.
When the connection wiring body 20 is mounted using the connection wiring body 20 in a state in which the resin material 22 has adhesiveness, the connection wiring body 20 is integrally bonded to the substrate 10 and the mounting substrate 30 of the semiconductor device 5.

When the semiconductor device 5 is mounted on the mounting board 30 using the connection wiring body 20, the semiconductor device 5, the connection wiring body 20 and the mounting board 30 are aligned with each other, and the substrate 10 and the mounting board 30 are aligned. The connection wiring body 20 is sandwiched in the middle of the connection wiring body 20 and heated while slightly applying a load to melt the bonding metal 24 of the connection wiring body 20, and the connection metal 16 is connected to the connection terminals 16 of the board 10 and the connection pads 32 of the mounting board 30. 24 are welded.

The mounting method according to the present embodiment uses the connection wiring body 20.
Are bonded integrally to the substrate 10 of the semiconductor device 5 so that the resin material 22 of the connection wiring body 20 is not integrally bonded to the mounting substrate 30. Therefore, first, an adhesive resin material 18 such as a solder resist is applied to the mounting surface of the substrate 10. FIG. 2A shows a state in which the resin material 18 is applied to the substrate 10. The material of the resin material 18 is the connection wiring body 2
Although it is not necessary to be the same as the resin material 22 of the No. 0, a material of the same quality is better in order to surely integrate them. The connection wiring body 20 used in the present embodiment has been completely cured, and the resin material 22 itself has no adhesiveness.

When the resin material 18 is applied to the substrate 10,
The entire outer surface of the mounting surface except the connection terminals 16 is covered by a screen printing method or the like. After the application of the resin material 18, the adhesive is obtained by completely preventing the resin material from being cured. Next, as shown in FIG.
The connection wiring body 20 is mounted on the substrate 1 by aligning the mounting substrate 30.
0 and the mounting substrate 30, and heated in a heating furnace to melt the joining metal 24, and apply a slight load to weld the joining metal 24 to the connection terminals 16 and the connection pads 32.

After the bonding metal 24 of the connection wiring body 20 is welded to the connection terminals 16 and the connection pads 32, the semiconductor device 5 is applied to the substrate 10 by holding the entire mounting substrate 30 in an atmosphere heated to a predetermined temperature. The cured resin material 18 is completely cured so that the resin material 22 of the connection wiring body 20 and the resin material 18 are integrated, and the connection wiring body 20 is integrally bonded to the mounting surface of the substrate 10. Although the resin material 22 itself of the connection wiring body 20 has no adhesiveness, the connection wiring body 20 is integrally bonded to the mounting surface of the substrate 10 by using the resin material 18 as an adhesive.

On the surface of the mounting substrate 30, the resin material 22 of the connection wiring body 20 is merely in contact with the surface of the mounting substrate 30. In FIG. 2B, the state in which the resin material 22 is not adhered to the mounting board 30 is shown by the protective film 34 of the mounting board 30 and the resin material 2.
2 are exaggerated as if a gap was formed between them. When the semiconductor device 5 is mounted on the mounting substrate 30 via the connection wiring body 20 in this manner, the bonding metal 24
0 connection terminal 16 and connection pad 32 of mounting board 30
That the resin material 22 is simply in contact with the mounting board 30 is very effective for reducing thermal stress generated between the mounting board 30 and the semiconductor device 5.

That is, when the semiconductor device 5 and the mounting substrate 30 are integrally joined on the entire mounting surface of the substrate 10, the thermal stress caused by the difference in the thermal expansion coefficient between the mounting substrate 30 and the substrate 10 Acts on the entire substrate 10, whereas when the resin material 22 portion of the connection wiring body 20 is separated from the mounting substrate 30 as in the present embodiment, the substrate 10 and the mounting substrate 30 Between the substrate 10
Does not directly act on the entire structure, thereby making it possible to effectively reduce the thermal stress generated between the substrate 10 and the mounting substrate 30. In addition, since the resin material 22 is interposed between the adjacent joining metals 24, the thermal stress directly acting on the joining metal 24 is dispersed, and the thermal stress is applied to the joint between the joining metal 24 and the connection pad 32. Can be prevented from being concentrated.

In FIG. 2B, the reason why the vicinity of the joint between the joining metal 24 and the connection pad 32 is slightly constricted is that the joining metal 24 is melted during mounting and This indicates that the joining metal 24 has moved from the hole filled with the joining metal 24 by wetting. Since the bonding metal 24 does not wet with the resin material 22, a gap is formed in the hole. The fact that the joining metal 24 is not wet with the resin material 22 means that when thermal stress acts on the joining metal 24, the resin material 22 acts independently on the joining metal 24 to more effectively cushion the metal. To be able to demonstrate.

FIG. 3 shows another embodiment in which a semiconductor device is mounted on a mounting substrate 30 using the connection wiring body 20. This embodiment is characterized in that the connection wiring body 20 is mounted on the substrate 10 and the mounting substrate 30 of the semiconductor device without being integrally bonded. FIG. 3 shows a state where the semiconductor device is mounted on the mounting board 30 via the connection wiring body 20. Also in the case of the present embodiment, the connection wiring body 20 and the semiconductor device and the mounting board 30 are aligned with each other, and the connection wiring body 20 is
The bonding metal 24 is melted in a heating furnace while being pressed between the substrate and the mounting substrate 30, and the bonding metal 24 is welded to the connection terminals 16 of the substrate 10 and the connection pads 32 of the mounting substrate 30.

The joining metal 24 is wet-joined to the connection terminal 16 and the connection pad 32, and has a constricted shape as shown in FIG. In the present embodiment, as in the above-described embodiment, the bonding metal 24 includes the connection terminal 16 and the connection pad 32.
On the other hand, the portion of the resin material 22 other than the bonding metal 24 is not integrally bonded to the substrate 10 or the mounting substrate 30 but is simply sandwiched in the middle. The resin material 22 functions to effectively reduce the thermal stress generated between the board 10 and the mounting board 30 in this manner.

As described above, the method of mounting the wiring device using the connection wiring body 20 allows the semiconductor device to be easily mounted on the mounting substrate and also allows the semiconductor device to be mounted on the surface mounting type semiconductor device when mounted. This has the advantage that the thermal stress generated between the semiconductor device and the mounting substrate can be suitably reduced, and the semiconductor device can be provided as a highly reliable semiconductor device mounting structure.

In the above embodiment, all the bonding metals 24 of the connection wiring body 20 contribute to the electrical connection of the signal lines and the like between the semiconductor device and the mounting substrate 30. Not all must contribute to the electrical connection. That is, the connection wiring body 20 is
As shown in (c), the joining metals 24 are arranged in an array at predetermined intervals in the plane of the connection wiring body 20, and these are arranged according to the arrangement of the connection terminals 16 arranged on the mounting surface of the semiconductor device. However, for example, there is a connection terminal 16 that needs electrical connection such as a signal line in a peripheral portion on a mounting surface, and there is no connection terminal 16 that needs an electrical connection near a central portion of the mounting surface. Even in such a case, by arranging the bonding metal 24 near the center of the connection wiring body 20, the bonding metal 24 has an effect similar to that of a thermal via which dissipates heat from the semiconductor device to the mounting substrate. Because it can be used as.

In the case where the connection terminals 16 are present only in the peripheral portion of the mounting surface of the semiconductor device, a heat radiator is provided near the center of the mounting surface, and when the semiconductor device is mounted on the mounting board, It is also possible to further improve the heat dissipation from the semiconductor device by joining the radiator and the joining metal 24.

[0025]

【Example】

(Example 1) A plastic LGA was mounted on a resin mounting board using a connection wiring body 20 using an epoxy resin as a resin material 22 and a metal material having a lead-tin eutectic composition as a bonding metal 24. . In this embodiment, the connection wiring body 20 has a mounting structure in which the resin material does not adhere to both the plastic LGA and the mounting board.

The connection wiring body 20 is made of plastic LGA
And a plastic LGA was mounted on the mounting board by repositioning the battery in a vapor feeder at 210 ° C. for 1 minute while applying a load. The connection wiring body 20 does not adhere to the mounting surface of the plastic LGA and the mounting substrate, and the bonding metal 24 is
The connection terminals 16 provided on the mounting surface of the GA and the connection pads 32 provided on the surface of the mounting board were welded and mounted.

(Embodiment 2) Using the same connection wiring body 20 as used in the first embodiment,
This is an example of a mounting structure in which the connection wiring body 20 is adhered only to the mounting surface side of the GA. First, an epoxy-based solder resist is screen-printed on a substrate to bond the connection wiring body 20 to the mounting surface side of the plastic LGA. This screen printing is an operation of covering the outer surface except for the connection terminals 16 formed on the mounting surface of the substrate with a solder resist.

Next, in a state where the epoxy solder resist applied to the mounting surface of the plastic LGA by screen printing is not fully cured, the connection wiring body 20 is positioned and sandwiched between the mounting surface of the plastic LGA and the mounting board, and the load is applied. After reflowing in a vapor feeder at 210 ° C. for 1 minute, 30 ° C. in a nitrogen box at 150 ° C.
And the connection wiring 2 on the mounting surface of the plastic LGA.
0 resin material 22 was integrally bonded. By this joining operation, the joining metal 24 is connected to the connection terminals 16 formed on the plastic LGA substrate and the connection pads 32 provided on the mounting substrate.
Then, the connection wiring body 20 was integrally bonded to a plastic LGA substrate, and the semiconductor device was mounted on the mounting substrate.

[0029]

According to the semiconductor device mounting structure of the present invention, as described above, the semiconductor device is mounted between the substrate of the semiconductor device and the mounting substrate via the connection wiring body. When a product in which connection terminals are arranged on a mounting surface in a surface-mount type semiconductor device is mounted, the thermal stress generated between the mounting substrate and the semiconductor device can be suitably reduced, thereby increasing the reliability of the semiconductor. An apparatus mounting structure can be provided. Further, in the case of the mounting structure according to the present invention, since mounting can be performed simply by mounting the connection wiring body on the semiconductor device, it is possible to provide a mounting structure in which thermal stress is reduced and the mounting structure is easy to mount. Play.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a mounting structure of a semiconductor device according to the present invention.

FIG. 2 is an explanatory view showing a method of mounting a connection wiring body on a board and mounting the connection wiring body on a mounting board;

FIG. 3 is an explanatory view showing another method of mounting a connection wiring body on a board and mounting the connection wiring body on a mounting board;

FIG. 4 is an explanatory view showing an example of manufacturing a connection wiring body.

[Explanation of symbols]

 Reference Signs List 5 semiconductor device 10 substrate 16 connection terminal 18 resin material 20 connection wiring body 22 resin material 24 bonding metal 30 mounting board 32 connection pad 34 protective film 40 pillar body 42 sliced body

Claims (7)

[Claims] A semiconductor device having a plurality of connection terminals arranged on a mounting surface of a substrate is provided on a mounting substrate having connection pads formed in the same planar arrangement as the connection terminals. A mounting structure of the semiconductor device, which is surface-mounted via a connection wiring body therebetween, wherein the connection wiring body is arranged in the same planar arrangement as the connection terminal, wherein the connection terminal and the connection pad A bonding metal that is welded to the connection terminal and electrically connects the connection pad, and a resin material having electrical insulation interposed between a mounting surface of the substrate and a mounting surface of the mounting substrate. A mounting structure of a semiconductor device, comprising: 2. The mounting structure for a semiconductor device according to claim 1, wherein said resin material is integrally bonded to a mounting surface of said substrate, and is not bonded to a mounting surface of said mounting substrate. . 3. The semiconductor device mounting structure according to claim 1, wherein said resin material is not bonded to a mounting surface of said substrate and a mounting surface of said mounting substrate. 4. The semiconductor device according to claim 12, wherein the bonding metals are arranged in an array corresponding to at least the entire mounting surface of the substrate including the arrangement position of the connection terminals. Mounting structure. 5. A semiconductor device having a plurality of connection terminals disposed on a mounting surface of a substrate, wherein the mounting surface and the mounting substrate are mounted on a mounting substrate having connection pads formed in the same plane as the connection terminals. A method for mounting a semiconductor device, which is surface-mounted via a connection wiring body between the connection terminals, wherein a resin material having an electrical insulating property formed in a film shape is penetrated in a thickness direction and is flush with the connection terminal. The connection wiring body on which the joining metal is arranged is aligned with the substrate and the mounting board, and is squeezed and supported between the mounting surface of the substrate and the mounting board, and the temperature at which the joining metal melts Wherein the bonding metal is welded to the connection terminals and the connection pads by heating the semiconductor device to the temperature. 6. The connection wiring body, wherein the resin material has no adhesiveness to the substrate and the mounting substrate, and a solder resist or the like except for a position of the connection terminal on a mounting surface of the substrate. After applying a resin material having an adhesive property, the connection wiring body is aligned with the substrate and the mounting substrate, and squeezed and supported between the mounting surface of the substrate and the mounting substrate. By heating to a temperature at which the metal is melted, the joining metal is welded to the connection terminal and the connection pad, and the resin material having the adhesive property is cured, so that the resin material of the connection wiring body is formed on the substrate. A method for mounting a semiconductor device, wherein the semiconductor device is integrally bonded. 7. The mounting method of a semiconductor device according to claim 5, wherein the connection wiring body is made of a material in which the resin material has no adhesiveness to the substrate and the mounting substrate.