JPH11168298A - Component mounter correcting method and equipment and component mounter equipped therewith - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately mount a component, by a method wherein the relative movements of a component handling tool and a component mounting object in the directions of X and Y are corrected on the amount of control based on the tabulated data so as to mount a component at a prescribed position on the component mounting object. SOLUTION: A component mounting object jig 31 having position marks 31a arranged in a matrix in the direction of Y and X in a maximum component mounting range corresponding to a circuit board 15 is used in place of the circuit board 15, and the relative movements of a suction nozzle 11 and the component mounting object jig 31 are made in the directions of X and Y. A relation between the drives of the nozzle 1 and the jig 31 in the directions of X and Y and the movement of the position marks 31a which moves in a direction corresponding to the above drives is tabulated, the relative movements of the suction nozzle 11 and the circuit board 15 made by a movable table 16 in the directions of X and Y are corrected on the amount of control based on the tabulated data, whereby an electronic component 12 is mounted at a prescribed position on the circuit board 15. By this setup, a component can be accurately mounted on a circuit board even if a fine position error caused by a temperature change or the like is present.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for correcting a component mounting position and a component mounting apparatus using the same, for example, for mounting or mounting an electronic component on a circuit board to manufacture an electronic circuit board. Used.

[0002]

2. Description of the Related Art Referring to a component mounting apparatus of FIG. 1 showing an embodiment of the present invention, a mounting head 10 is provided with a suction nozzle 11 for sucking and handling an electronic component 12, and an electronic component supplied from a component supply cassette 2. The electronic component 12 is moved to a position where the electronic component 12 is picked up and a component mounting position where the electronic component 12 is mounted on the circuit board 15. The circuit board 15 on which the electronic component 12 is mounted is positioned on a movable table 16 that moves in the orthogonal XY2 directions, and the movable table 16 moves in the XY2 directions to move between the suction nozzle 11 and the mounting head 10 in the XY2 directions. The electronic component 12 held by the suction nozzle 11 moving to the component mounting position is mounted at a predetermined position on the circuit board 15 by relative movement.

The X-axis driving mechanism 17 and the Y-axis driving mechanism 18 of the movable table 16 generally use a conventional servomotor as a driving source for precise driving. At this time, the amount of rotation of the motor of the X-axis drive mechanism 17 from the origin corresponds to the X coordinate value of the movable table 16 on a one-to-one basis. Similarly, the rotation amount of the motor of the Y-axis drive mechanism 18 corresponds to the Y coordinate value of the movable table 16 on a one-to-one basis.

When a ball screw is used for the X-axis driving mechanism 17, since the rotation amount of the X-axis motor and the change of the X coordinate value have a substantially linear relationship, a numerical value α unique to the X-axis driving mechanism 17 is used. A target position _XT is obtained as shown in FIG. Similarly, Y
Rotation of the shaft motor and the Y-coordinate value is also the target position Y _T is determined as shown in Fig. 5 with reference to specific numerical values β in the Y-axis drive mechanism 18. That is, N _X = αX _T (1) N _Y = βY _T (2) Therefore, the movable table 16 is moved to the target position (X _T ,
Y _T ) to move the X-axis motor from the origin to α
The X _T and Y axis motors may be rotated by βY _T from the origin.

[0005]

However, recently, recently,
Miniaturization of electronic components, finer wiring patterns on circuit boards,
With the demand for higher precision in the component mounting position due to the high density of component mounting and the like, it is no longer possible to cope with the conventional mechanism as described above. This is because the X-axis drive mechanism 17 and the Y-axis drive mechanism 18 do not always have a linear relationship between the rotation amount of the motor and the coordinate values. Specifically, errors due to the processing accuracy of the ball screw, temperature changes, and the like are conceivable. In the case of a temperature change, the linear relationship between the motor rotation amount and the coordinate values may be broken because the entire metal rod such as a ball screw does not expand uniformly. In such a case, an error occurs when the rotation amount of each motor is calculated by the equations (1) and (2).

FIG. 7 shows the relationship between the X-coordinate value and the X-axis motor rotation amount on the X-axis with respect to the theoretical formula and the actual relationship. In FIG. 7, according to the theoretical equation 7-1, the relationship between the motor rotation amount and the target position coordinate value 7-3 is linear, but in reality, it is a non-linear curve like 7-2.
When the theoretical formula 7-1 is used for the target position calculation, the rotation amount with respect to the target position coordinate value 7-3 is 7-4, and the position shift 7-
5 occurs. The same can be said for the Y axis. These errors are directly reflected in the error of the electronic component mounting position, and thus pose a problem when high-precision electronic component mounting is required.

When the motor rotation amount and the coordinate values have a non-linear relationship, the calculation of the motor rotation amount for the target position coordinate value 7-3 is extremely difficult to approximate with a mathematical expression. Therefore, a method of creating a table of the rotation amount and the coordinate value and obtaining the motor rotation amount by referring to the table can be considered. For this purpose, a known laser displacement meter is used, and when the movable table 16 is driven in the XY directions, the XY
The actual amount of movement in the direction may be measured, the relationship between the amount of drive and the amount of movement may be tabulated and reflected in position control.

However, in this case, the measuring device is large-scale and expensive, and cannot be easily measured by non-experts. Therefore, it is difficult for a user to perform measurement again every time there is a change in conditions, and it is difficult to use the measuring device. Not suitable.

SUMMARY OF THE INVENTION An object of the present invention is to make a table of a driving amount and an actual moving amount easy and can be performed whenever necessary, and to correct a component mounting position and mount a component with high accuracy based on the correction. An object of the present invention is to provide a correction method and apparatus and a component mounting apparatus using them.

[0010]

In order to achieve the above object, a method for correcting a component mounting position according to the present invention comprises: a component handling tool for handling components; and a component mounting target for mounting components. In order to relatively move in the XY2 directions orthogonal to each other and mount the component held by the component handling tool at each predetermined position of the component mounting target, the XY2 is set within the maximum component mounting range corresponding to the component mounting target. The amount of drive in each of the XY directions and the amount of each drive when attempting relative movement in the X and Y directions with the component handling tool using a component mounting target jig having position marks arranged in a matrix in the directions A table of the relationship between the position mark moved in the direction corresponding to the amount and a correction amount of the relative movement in the X and Y directions between the component handling tool and the component mounting target are corrected based on the tabulated data, Component at a predetermined position of the goods mounting object is characterized in that to be mounted.

[0011] According to this configuration, the component mounting object jig moves the component handling tool and the component mounting object to a predetermined position within the maximum mounting range corresponding to the component mounting object. It has position marks arranged in a matrix in the XY directions to be moved relative to each other, and when it is positioned instead of the component mounting object and is relatively moved in the XY directions relative to the component handling tool, the amount of movement with respect to the driving amount at that time Can be easily recognized as a change in the position of the position mark moved in the moving direction by image recognition using a recognition camera, and a table of the amount of movement and the amount of driving at that time can be obtained easily and with high accuracy. Based on this, the control amount of the relative movement between the component handling tool and the component mounting object in the X and Y directions is corrected, so that a minute position caused by a temperature change, a processing error, or the like is corrected. Even if there is a difference, accurate component mounting is achieved without it influences.

The device for correcting a component mounting position according to the present invention is provided in a XY2 direction provided on a component mounting object jig which is moved in an XY2 direction orthogonal to each other in place of a component mounting object with a component handling tool. Recognition cameras and recognition means for recognizing parallel part position marks in a matrix, drive amounts in each direction when the component handling tool and the component mounting target jig are relatively moved in the XY2 directions, and the corresponding drive amounts. Means for making a table of the relationship between the position mark movement amount and the image recognition performed in the direction, and the component handling tool and the component mounting target are represented by X in the table data thus tabulated.
Means for correcting a control amount of position control for relative movement in the Y2 direction.

In such a configuration, as described above, the moving amount with respect to the driving amount of the component mounting object jig is image-recognized from the large number of position marks arranged on the matrix in the XY directions, and the image is recognized. The tabulation of the relationship between the position mark movement amount and the drive amount is automatically tabulated by the tabulation means, and the component handling tool and the component mounting target at the time of component mounting are position controlled for component mounting. When the relative movement is performed in accordance with the component mounting position data, the correction means corrects the control amount based on the tabulated data, so that no manual operation is required, and it is time-consuming to perform such correction whenever necessary. It is suitable.

Specifically, the correction means refers to the XY drive amount for the coordinate position near the target position according to the component mounting position data from the table data, and interpolates the XY drive amount required to reach the target position. It is obtained by calculation and used as correction data of the position control means.

A component mounting apparatus according to the present invention picks up a supplied component by a component handling tool, and mounts the component on a component object. The mounting head or the component handling tool and the component mounting object include: An XY movement mechanism for relatively moving the X and Y in a predetermined positioning relationship in the X and Y directions orthogonal to each other, and X in accordance with the component mounting position data.
It is provided with position control means for operating the Y moving mechanism so that the component held by the component handling tool is mounted at a predetermined position on the component mounting target, and a component mounting position correction device having the above-described configuration. And while working on the parts mounting,
At any point in time, actual measurement and tabulation of the driving amount and the moving amount using the component mounting target jig, and correction based on this are achieved.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to FIGS.

This embodiment is an example of a component mounting apparatus for manufacturing an electronic circuit board by mounting an electronic component 12 on a circuit board 15 as shown in FIG. However, the present invention is not limited to this, and various component handling tools for holding and handling components such as the suction nozzle 11 and a chuck for sandwiching components and various component objects such as the circuit board 15 are mutually connected. The present invention is applied to all kinds of component mounting in which components held by the component handling tool are mounted at respective positions on the component mounting target object by relatively moving in the orthogonal XY2 directions.

The component mounting apparatus shown in FIG. 1 positions and holds the component mounting means A having the mounting head 10 described above and the circuit board 15 and moves them in the X and Y directions orthogonal to each other. Positioning means C having a movable table 16 for positioning the mounting head 10
And a component supply means B for supplying an electronic component 12 to each of the suction nozzles 11 provided in the apparatus.

The component supply means B includes a movable table 1 which moves in the X direction and a component supply machine 2 such as a component supply cassette.
And a drive mechanism 3 of the movable table 1. A plurality of component feeders 2 are arranged in parallel on the movable table 1, and a driving mechanism 3 including a motor moves the movable table 1 in the X-axis direction. Reel 4 loaded in each component feeder 2
Holds a tape component in which a large number of electronic components are stored in a line, and the stored electronic components 12 are sequentially pulled out to the respective component supply positions 5 and are moved by the suction nozzle 11 moving to the component pickup position. Each one is taken out and picked up.

The component mounting means A includes a driving mechanism 6 and a speed reducer 7
And an indexing device 8, an input shaft 9, a mounting head 10, and a suction nozzle 11 mounted on the mounting head. When the power from the drive mechanism 6 is transmitted to the index device 8 via the speed reducer 7, the continuous rotation of the input shaft 9 causes the mounting head 1 to rotate.
This is converted to zero intermittent rotation. A plurality of suction nozzles 11 arranged at equal intervals around the mounting head 10
Can rotate and move up and down around each axis.

When the component supply position 5 of an arbitrary component supply device 2 is positioned directly below the nozzle 11 at the component pickup position, the electronic component 12 is moved by the nozzle 11 lowered.
Is adsorbed. Thereafter, the suction nozzle 11 rises, picks up the sucked electronic component 12, and sets the mounting head 1.
By the rotation of 0, the sheet is conveyed to the component mounting position before the figure. In this transporting process, the suction nozzle is positioned just above the component imaging unit 13, and the imaging unit 13 captures an image of the electronic component 12 sucked by the nozzle 11 and captures the image. The captured image is used by the image processing in the recognizing unit 14 to analyze the suction state of the electronic component 12, and the control unit 19 uses the electronic component 12 based on the analysis result.
Are corrected. This correction is for adjusting the mounting position and the mounting angle of the electronic component 12 with respect to the circuit board 15 that should be correctly positioned.

The positioning means C horizontally positions and holds the circuit board 15 carried in by the transport means (not shown) on the movable table 16, and provides the electronic parts 12 for mounting.
The circuit board 15 on which the electronic components 12 have been mounted is carried out by a carrying means (not shown). On the movable table 16,
Since the X-axis driving mechanism 17 and the Y-axis driving mechanism 18 described above are coupled, the circuit board 15 is moved to any position in the horizontal plane in the XY2 directions orthogonal to each other and positioned, and the electronic component is moved to each position. 12 can be provided.

In mounting the electronic component 12 on the circuit board 15, a desired mounting position on the circuit board 15 is positioned directly below the suction nozzle 11 at the component mounting position. At this time, the suction nozzle 11 at the component mounting position is lowered to release suction of the electronic component 12, and the held electronic component 12 is mounted at a desired mounting position on the circuit board 15. Thereafter, the suction nozzle 11 rises and returns.

[0024] By such a series of operations, the mounting operation of one electronic component 12 is completed.

When a plurality of electronic components 12 are mounted, the above-described mounting operation is performed on each of the electronic components 12 in accordance with a mounting order (hereinafter referred to as an NC program) of electronic component mounting position data specified in advance. It is performed sequentially.

However, due to uneven shrinkage and expansion due to temperature change of the metal rod-like material, variation in processing of the ball screw, etc., an error sometimes occurs in the mounting position of the electronic component 12, and high-precision mounting is difficult. It may not be possible to respond when desired.

Therefore, in the present embodiment, the position marks 31a arranged in a matrix in the XY2 directions as shown in FIG.
Is used in place of the circuit board 15 to attempt relative movement in the X and Y directions with the suction nozzle 11. At the time of this trial, the relationship between each drive amount in each of the X and Y directions and the movement amount of the position mark 31a moving in the direction corresponding to each of these drive amounts is tabulated. The control amount of the relative movement of the movable table 16 in the X and Y directions with respect to the circuit board 15 is corrected so that the electronic component 12 is mounted at a predetermined position on the circuit board 15.

In this manner, the component mounting object jig 3
1 and the suction nozzle 11 are relatively moved in the XY directions on a trial basis.
As the position change of the position mark 1a, it is possible to capture the position mark 31a with high accuracy and automatically by the image recognition using the recognition camera without difficulty. XY of the suction nozzle 11 and the circuit board 15 is obtained based on this accuracy.
By correcting the control amount of the relative movement in the direction, even if there is a small positional error due to a temperature change, a processing error, or the like, a high-precision component mounting that is not affected by the small positional error can be achieved.

For such correction, the component mounting apparatus of the present embodiment is relatively moved in the XY directions with respect to the circuit board 15 used for component mounting and the suction nozzle 11 instead of the circuit board 15 as shown in FIG. A board recognition camera 41 for imaging the component mounting object jig 31 is provided. The image captured by the board recognition camera 41 is subjected to image processing by the image processing means 42, and the positions of the circuit board 15 and the component mounting target jig 31 on the movable table 16, that is, the positions on the component mounting apparatus and the component mounting target The movement position of the position mark 31a when the relative movement in the X and Y directions with the suction nozzle 11 is attempted using the object jig 31 can be recognized with high accuracy.

The position mark 31a from the image processing means 42
Is input to the tabulation means 43 to calculate the amount of movement, and at the same time, the X-direction drive amount X and the Y-direction drive amount Y of the movable table 16 input to the table formation means 43, Tabulates the relationship between the drive amount in the X direction and the actual movement amount, and tabulates the relationship between the drive amount in the Y direction and the actual movement amount. This tabulated data is input to the correction means 44. The correction means 44 corrects the control amount correction data X of the position control means 45 for relatively moving the suction nozzle 11 and the circuit board 15 in the X and Y directions based on the tabulated table data.
1 and Y1 are supplied to the position control means 45 shown in FIG. 1 to drive the X-axis drive mechanism 17 and the Y-axis drive mechanism 18 according to the component mounting data stored in the external or internal storage means 46 by the position control means 45. The amount of control to be performed is corrected.

When the tabulation processing and the correction based on the table processing are automatically performed in this manner, it is preferable that no manual operation is required and no trouble is required to perform such correction whenever necessary. However, each of the above operation controls is achieved by one control device by utilizing the internal functions of the microcomputer.

As a specific example, the correction means 44 refers to the XY drive amount for the coordinate position near the target position according to the component mounting position data in the component mounting program from the table data, and reaches the target position. XY required drive amount is obtained by interpolation calculation and used as correction data of the position control means 45.

Hereinafter, a specific correction operation will be described with reference to the flowchart of the operation procedure shown in FIG.

In step # 1, the jig plate is fixed to the movable table 16. In step # 2, an operation for executing a measurement command for the position of the mark 31a on the component mounting object jig 31 is performed from the operation screen of the component mounting apparatus main body.

Steps # 3 to # 13 correspond to the processing of the control software inside the position control means 45. # Initialize mark pointer m _x, the m _y at 3. Mark 31a on top component mounting object jig 31 is first in the X direction 0 column to the m _x M
_aX columns are arranged in a matrix to 0th row to the m _y M _aX row in the Y direction. The mark at the _mxth column and the _myth row is called a mark ( _mx , _MY ). # In 4 marks (m _x, m _y) to move within the field of view of the board recognition camera 41. At this time, X-axis motor, the rotational amount of the Y-axis motor in the position of the mark (m _x, m _y) is assumed to have an internal position control means 45 as a constant table.

[0036] # 5, # 6 and # 13 performs feedback of the recognition result using the board recognition camera 41 and the image processing unit 42, the mark (m _x, m _y) with center of the field of view of the board recognition camera field of view 41 Processing to move to. # 5
In the mark (m _x, m _y) the center position of the measured using the board recognition camera 41. In step # 6, it is checked whether or not the distance from the center of the field of view of the board recognition camera 41 is equal to or more than r based on the measurement result in step # 5. If within r, proceed to # 7, otherwise proceed to # 13. # In 13, # based on a recognition result of 5, the mark (m _x, m _y) is movable table 1 so as to approach the center of the visual field of the board recognition camera 41
Move 6.

[0037] In # 7, X-axis motor of the recognition result and when its in # 5, through a table means 43 the amount of rotation of the Y-axis motor, the elements of the target position table of the correcting means 44 (m _x, m _y) Register with. In # 8 increments the m _X. # 9, m _X is a check of whether or not does not exceed the maximum value m _xMax. If it has exceeded, proceed to # 10, otherwise return to # 4. The # 10, m _X is initialized to 0. In # 11 increments the m _y. # 12 In m _y is a check of whether or not does not exceed the maximum value m _yMax. If it has exceeded, the process is terminated; otherwise, the process returns to # 4. If the load does not increase a predetermined number of times, the process returns to the normal control and repeats the process.

As shown in FIG. 4, the amount of displacement between the center of the visual field of the board recognition camera 41 and the center of the suction nozzle 11 is now
Let X _ofs and Y _ofs . Mark the center of the visual field of the board recognition camera 41 (m _x, m _y) coordinate system coordinate values of the movable table 16 of the component mounting position when there is a (x, y),,
Mark (m _x, m _y) coordinate system coordinate values of the movable table 16 of the _{(x-X ofs, y-} Y ofs). Therefore,
The printing range 54 of the grid mark corresponding to the component mounting range 53 needs to be shifted from the mounting range by a shift amount 55 minutes.

The center of the board recognition camera 41 and the suction nozzle 1
The displacement of the center of 1 needs to be measured separately. An example is shown in FIG. Suction nozzle 11 and board recognition camera 4
It is assumed that the shift amount of the center of 1 is at most within the component mountable range as shown in FIG. The component mounting target jig 31 on which the position mark 31 a is printed is fixed to the movable table 16. The movable table 16 is moved so that the position mark 31 a printed on the component mounting target jig 31 is located at the center of the field of view of the board recognition camera 41.
A jig 56 is attached to the tip of the suction nozzle 11 and is mounted on the component mounting target jig 31 as shown in FIG. After this,
Distance 5 between the position mark 31a and the center of the attached jig 56
By measuring 7, the amount of deviation between the center of the board recognition camera 41 and the center of the suction nozzle 11 can be determined.

FIG. 3 shows a movable table 1 according to this embodiment.
6 shows a method of calculating the rotation amounts of the X-axis motor and the Y-axis motor 6.

X coordinate, Y coordinate and X axis motor corresponding to lattice points 3-2-2, 3-2-3, 3-2-4, 3-2-5 near the target position 3-2-1 The rotation amount and the Y-axis motor rotation amount are referenced from the table created in claim 1.

The coordinates of each neighboring grid point are defined as follows.

Neighboring lattice point 1: (X _Ntl , Y _Ntl ) Neighboring lattice point 2: (X _Ntr , Y _Ntr ) Neighboring lattice point 3: (X _Nbl , Y _Nbl ) Neighboring lattice point 4: (X _Nbr , Y _Nbr) The X-axis motor rotation amount corresponding to each neighboring grid point is defined as follows.

Neighborhood lattice point 1: N _Xtl neighborhood lattice point 2: X _Ntr neighborhood lattice point 3: X _Nbl neighborhood lattice point 4: X _{Nbr The} Y-axis motor rotation amount corresponding to each neighborhood lattice point is defined as follows. .

Neighboring lattice point 1: N _Ytl neighboring lattice point 2: X _Ytr neighboring lattice point 3: X _Ybl neighboring lattice point 4: _XYbr Distance from target position 3-2-2 to each neighboring lattice point is as follows. Become like

[0046]

(Equation 1)

[0047] From this, the rotation amount N _x of the X-axis motor relative to the target position can be calculated as follows.

[0048]

(Equation 2)

[0049] Similarly, the rotation amount N _x of Y-axis motor relative to the target position can be calculated as follows.

[0050]

(Equation 3)

Here, for the sake of simplicity, only the lattice points in the vicinity of the four surroundings are used, but if the number of neighboring points used in the interpolation calculation is further increased, more accurate calculation can be performed.

The present invention can be applied not only to a rotary type component mounting apparatus but also to an apparatus having another orthogonal axis driving mechanism, such as a component mounting apparatus having an XY orthogonal robot type head.

[0053]

According to the method and apparatus for correcting a component mounting position according to the present invention, even if there is a small positional error caused by a temperature change, a processing error, etc., a high-precision component mounting without the influence is achieved. Is done.

Further, according to the component mounting apparatus employing the method and apparatus for correcting the component mounting position according to the present invention, further, while performing the component mounting operation, the drive using the component mounting target jig at any point in time. Actual measurement and tabulation of the amount and the movement amount, and correction based on this are achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic configuration of a component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a flowchart illustrating a procedure of a correction operation according to the embodiment of the present invention.

FIG. 3 is an explanatory diagram showing a method of calculating a target position in the operation of FIG. 2;

FIG. 4 is a diagram showing a shift between a substrate recognition camera center and a suction nozzle center.

FIG. 5 is a diagram showing a measurement example of a deviation between the center of the board recognition camera and the center of the suction nozzle.

FIG. 6 is an explanatory diagram showing a normal target position calculation method.

FIG. 7 is an explanatory diagram showing a relationship between a theoretical expression of an X-axis target position coordinate value and a rotation amount of an X-axis motor and a real case.

[Explanation of symbols]

 Reference Signs List A component mounting means B component supply means C positioning means 2 component supply machine 10 mounting head 11 suction nozzle 12 electronic component 15 circuit board 16 movable table 31 component mounting target jig 31a position mark 41 board recognition camera 42 image processing means 43 table Conversion means 44 correction means 45 position control means 53 parts mountable range

Claims (4)

[Claims] 1. An XY2 in which a component handling tool for handling a component and a component mounting target on which the component is mounted are orthogonal to each other.
To move the parts held by the parts handling tool to each predetermined position of the parts mounting object,
In the maximum component mounting range corresponding to the component mounting target, the X
Using a component mounting target jig having position marks arranged in a matrix in the Y2 direction, an XY
When a relative movement in two directions is tried, the relationship between each drive amount in each of the X and Y directions and the position mark moved in the direction corresponding to each of these drive amounts is tabulated, and the component handling tool is represented by the tabulated data. X between the object and the component mounting object
A method for correcting a component mounting position, comprising correcting a control amount of a relative movement in the Y direction so that a component is mounted at a predetermined position of a component mounting target. 2. An image of parallel part position marks arranged in a matrix in the XY2 direction provided on a component mounting target jig which is moved in the XY2 directions orthogonal to each other instead of the component mounting target between the component handling tool and the component mounting tool. The recognition camera and the recognition means, the component handling tool and the component mounting object jig
Means for tabulating the relationship between the amount of drive in each direction when relatively moved in the Y2 direction and the amount of position mark movement in which the image has been recognized in the corresponding direction, and tabled table data A means for correcting a control amount of position control for relatively moving the component handling tool and the component mounting target in the XY2 directions. 3. A mounting head for picking up a supplied component by a component handling tool and mounting the component on a component object, and positioning the mounting head or the component handling tool and the component mounting object in a predetermined positioning relationship. And an XY moving mechanism for relatively moving in the XY2 directions orthogonal to each other, and operating the XY moving mechanism in accordance with the component mounting position data so that the component held by the component handling tool is mounted at a predetermined position on the component mounting target. A position control means, and a recognition camera for recognizing an image by imaging position marks arranged in a matrix in the XY directions provided in a maximum range of the component mounting target of the mounting target jig positioned instead of the component mounting target, and Image recognition means, trial operation control means for trial-moving the component handling tool and the component mounting object jig relatively in the XY directions, A table forming means for tabulating the relationship between each movement amount in the X and Y directions at the time of the line operation and the position mark which is moved in the corresponding direction and the image is recognized, and the position is determined by this table data at the time of component mounting. A component mounting device comprising: a correction unit configured to correct an operation position according to the component mounting position data by the control unit. 4. The correction means refers to the XY drive amount for the coordinate position near the target position according to the component mounting position data from the table data, and calculates the required XY drive amount for reaching the target position by interpolation calculation. The component mounting apparatus according to claim 3, wherein the component mounting apparatus obtains the control data of the position control means.