JPH11168153A - High-frequency circuit module and mounting structure for high-frequency circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a high-frequency circuit module which prevents a drop in the Q-value of a microstrip line, formed inside a plurality of dielectric layers which constitute a multilayered substrate. SOLUTION: At least a first dielectric layer 2a, a second dielectric layer 2b, and a third dielectric layer 2c are laminated sequentially. A first grounding conductor layer 13 is formed between the first dielectric layer 2a and the second dielectric layer 2b. A belt-like microstrip line 4 is formed between the second dielectric layer 2b and the third dielectric layer 2c to face opposite the first grounding conductor 3. A first dielectric removed hole 5 which is formed by cutting off the third dielectric layer 2c is formed in the third dielectric layer 2c, so as to face the microstrip line 4. A metal plate 8 which closes the first dielectric removed hole 5 on a face on the side opposite to a face on the side of the second dielectric layer 2c is installed on the third dielectric layer 2c. The metal plate 8 is connected to the first grounding conductor layer 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency circuit module such as a voltage controlled oscillator having a microstrip line and constituted by a multilayer wiring board.

[0002]

2. Description of the Related Art A conventional high-frequency circuit module such as a voltage-controlled oscillator using a multilayer wiring board will be described with reference to a sectional view of a main part shown in FIG. For the high-frequency circuit module 21, for example, a square multilayer wiring board 22 formed by sequentially stacking a first dielectric layer 22a to a fifth dielectric layer 22e made of resin or the like is used. Therefore, the first dielectric layer 22a and the fifth dielectric layer 22e are the outermost dielectric layers. Then, a first ground conductor layer 23 is formed between the first dielectric layer 22a and the second dielectric layer 22b,
A strip-shaped microstrip line 24 is formed between the second dielectric layer 22b and the third dielectric layer 22c, and between the third dielectric layer 22c and the fourth dielectric layer 33d. A second ground conductor layer 25 is formed.

As a result, the microstrip line 24
Is connected to the first ground conductor 23 via the second dielectric layer 22b.
A resonance element is formed by facing the second ground conductor 25 via the third dielectric layer 22c. When the high frequency circuit module 21 is, for example, a voltage controlled oscillator, the microstrip line 24 determines the oscillation frequency. A first circuit conductor layer 26 for circuit wiring is formed between the fourth dielectric layer 22d and the fifth dielectric layer 22e.

An oscillation transistor, a chip resistor, and the like are provided on the upper surface of a fifth dielectric layer 22e which is one of the outermost layers.
An electronic component 27 such as a chip capacitor is mounted, and this electronic component 27 is connected to a circuit conductor layer (not shown) formed on the upper surface of the fifth dielectric layer 22e. Further, the microstrip line 24 and the second ground conductor layer 2
Reference numeral 5 is connected to the circuit conductor layer on the fifth dielectric layer 22e via so-called through-hole conducting means 28 and 29. On the lower surface of the first dielectric layer 22a, which is the other outermost layer, a third ground conductor layer 30 serving as a ground terminal and a second circuit conductor layer 31 serving as a signal extraction terminal are formed. Have been. Then, the first ground conductor layer 23 and the second ground conductor layer 25 are formed on the end surfaces of the first to third dielectric layers 22a to 22c through the end surface conduction means 32. The first circuit conductor layer 26 is connected to the second circuit conductor 31 via the end surface conduction means 33.

[0005] The high-frequency circuit module thus configured
21 is in the form of a so-called surface mount component.
It is mounted together with other electronic components (not shown) on a main board (not shown) constituting the mobile phone. The third ground conductor layer 30 and the second circuit conductor layer 31 are connected to connection electrodes (not shown) formed on the main substrate by soldering or the like.

When the high-frequency circuit module 21 is a voltage controlled oscillator, the oscillation frequency is adjusted to a predetermined value before being mounted on the main board. This adjustment is called so-called trimming, and a cut or the like is made in the microstrip line 24 while drilling a hole from a lower surface side of the first dielectric layer 22a with a dedicated trimming device (laser trimming device or the like) not shown. In this case, the equivalent length or width of the microstrip line 24 is changed.

[0007]

In the conventional high-frequency circuit module 21, a second dielectric layer 22b is interposed between the microstrip line 24 and the first ground conductor layer 23. A third dielectric layer 22c is interposed between the strip line 24 and the second ground conductor layer 25. That is, the microstrip line 24 is directly sandwiched between the second dielectric layer 22b and the third dielectric layer 22c. These dielectric layers 22
b and 22c have a dielectric constant (Εr) determined by the material used and also have a dielectric loss (tan δ). In particular, when a resin is used as the dielectric layer, the dielectric loss increases, and therefore, when used at high frequencies, the Q of the microstrip line 24 as a resonance element decreases.

As a result, there arises a problem that the C / N of the oscillation signal of the voltage controlled oscillator 21 decreases, and (... a specific example of performance as a device that deteriorates with C / N deterioration) deteriorates. Therefore, an object of the present invention is to prevent a Q of a microstrip line provided in a plurality of dielectric layers constituting a multilayer substrate from being lowered.

[0009]

In order to solve the above-mentioned problems, a high-frequency circuit module according to the present invention comprises at least a first dielectric layer, a second dielectric layer and a third dielectric layer. Stacked in order, forming a first ground conductor layer between the first dielectric layer and the second dielectric layer, facing the first ground conductor layer, the second dielectric A strip-shaped microstrip line is formed between the layer and the third dielectric layer, and the third dielectric layer is cut away from the third dielectric layer so as to face the microstrip line. A metal plate for providing a formed first dielectric deleted hole, and closing the first dielectric deleted hole on a surface of the third dielectric layer opposite to a surface on the second dielectric layer side. And the metal plate was connected to the first ground conductor layer.

Further, the high-frequency circuit module of the present invention comprises:
A second ground conductor was formed on the opposite surface of the third dielectric layer, and the metal plate was connected to the second ground conductor.

Further, the high-frequency circuit module of the present invention comprises:
A circuit conductor layer is formed on the side of the first dielectric layer opposite to the side of the second dielectric layer, and a signal deriving terminal for deriving a signal from the circuit conductor is provided on the third dielectric layer. It was formed on the opposite side.

Further, the high-frequency circuit module of the present invention comprises:
A fourth dielectric layer was laminated on the third dielectric layer, and a second dielectric deleted hole larger than the first dielectric deleted hole was formed in the fourth dielectric layer.

Further, the high-frequency circuit module of the present invention comprises:
Forming a ground terminal and the signal deriving terminal on a surface of the fourth dielectric layer opposite to the surface on the third dielectric side,
The first ground conductor layer and the second ground conductor were connected to the ground terminal.

The mounting structure of the high-frequency circuit module according to the present invention is characterized in that at least a first dielectric layer, a second dielectric layer, and a third dielectric layer are laminated in this order, Forming a first ground conductor layer between the body layer and the second dielectric layer, and facing the first ground conductor layer, the second dielectric layer and the third dielectric layer A strip-shaped microstrip line is formed between the first and second dielectric layers, and the third dielectric layer is formed by cutting out the third dielectric layer so as to face the microstrip line. And a main board on which the high-frequency circuit module is mounted, a ground conductor is provided on the main board, and the first dielectric removal hole is provided in the ground conductor. The first grounding conductor layer was connected to the grounding conductor while being opposed.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1 to 3 show a high-frequency circuit module of the present invention such as a voltage controlled oscillator using a multilayer wiring board.
It will be described according to. First, FIG. 1 is a sectional view of a main part of a high-frequency circuit module 1 according to the present invention. FIG. 2 is an exploded perspective view thereof. For the high-frequency circuit module 1, for example, a square multilayer wiring board 2 composed of at least a first dielectric layer 2a to a third dielectric layer 2c made of resin or the like laminated in order from the top is used. (See FIG. 2). If necessary, a fourth dielectric layer 2d as a lowermost layer is laminated below the third dielectric layer 2c, and a fourth dielectric layer as an uppermost layer is formed on the first dielectric layer 2a. Five dielectric layers 2e are stacked. Therefore, in this case, as shown in FIG. 1, the fourth dielectric layer 2d and the fifth dielectric layer 2e are the outermost dielectric layers. Then, a first ground conductor layer 3 is formed between the first dielectric layer 2a and the second dielectric layer 2b.

A strip-shaped microstrip line 4 is formed between the second dielectric layer 2b and the third dielectric layer 2c so as to face the first ground conductor layer 3. The third dielectric layer 2c is provided with a first dielectric deletion hole 5 formed by cutting out a portion facing the microstrip line 4 in a square shape. Further, the third dielectric layer 2c
A second ground conductor layer 6 is formed between the first dielectric layer 2c and the fourth dielectric layer 2d. The third dielectric layer 2c and the second ground conductor layer 6 have a square frame shape because they are cut out in a square shape when the deletion hole 5 is formed (see FIG. 2). The fourth dielectric layer 2d, which is the lowermost layer, has a third dielectric layer 2c
Is provided with a second dielectric removal hole 7 which is larger than the first dielectric removal hole 5 and is formed by notching in a square shape. Therefore, the fourth dielectric layer 2d also has a square frame shape (see FIG. 2).

Therefore, when the third dielectric layer 2c, the second ground conductor layer 6 and the fourth dielectric layer 2d are laminated, the second ground conductor layer 6 is It is exposed in the second dielectric removal hole 7 formed in the body layer 2d. Then, the metal plate 8 is positioned in the second dielectric removal hole 7 formed in the fourth dielectric layer 2d so as to cover the first dielectric removal hole 5, and the metal plate 8 is positioned in the third dielectric layer 2c. It is attached to the lower surface (see FIG. 1). As a result, the first dielectric deletion hole 7 formed in the third dielectric layer 2c is closed. The metal plate 8 is electrically connected to the exposed portion of the second ground conductor layer 6 by soldering or the like.

As a result, the microstrip line 4
Opposes the first ground conductor layer 3 via the second dielectric layer 2b and the metal plate 8 via the first dielectric removal hole 5.
A resonance element is formed by opposing. When the high frequency circuit module 1 is a voltage controlled oscillator, the microstrip line 4 determines the oscillation frequency. Then, the microstrip line 4 comes into contact with the air layer for the first dielectric removal hole 7.

A first circuit conductor layer 9 is formed between the first dielectric layer 2a and the uppermost fifth dielectric layer 2e, and the lowermost fourth dielectric layer 2e is formed. On the lower surface of 2d, that is, on the surface opposite to the surface on the third dielectric layer 2c side, a third ground conductor layer 10 serving as a ground terminal and a second circuit conductor layer 11 serving as a signal deriving terminal are provided. Are formed (see FIG. 1).

Further, an electronic component 12 such as a transistor, a chip resistor, and a chip capacitor is mounted on the upper surface of the fifth dielectric layer 2e, which is the uppermost dielectric layer. It is connected to a circuit conductor layer (not shown) formed on the upper surface of the body layer 2e. The first ground conductor layer 3 is formed on the first dielectric layer 2a and the fifth dielectric layer 2e by the through-hole conducting means 13 formed on the first dielectric layer 2a and the fifth dielectric layer 2e. The microstrip line 4 is also connected to the fifth dielectric layer 2b by the through-hole conducting means 14 formed on the second dielectric layer 2b, the first dielectric layer 2a, and the fifth dielectric layer 2e. 2e is connected to the circuit conductor layer on the upper surface. Further, the first ground conductor layer 3 and the second ground conductor layer 6 are composed of the second dielectric layer 2b and the third dielectric layer 2b.
c, connected to the third ground conductor layer 10 formed on the lower surface of the fourth dielectric layer 2d by end surface conduction means 15 formed on the end surface of the fourth dielectric layer 2d, The layer 9 is also formed by the end surface conduction means 16 formed on the end surfaces of the first dielectric layer 2a, the second dielectric layer 2b, the third dielectric layer 2c, and the fourth dielectric layer 2d. It is connected to the second circuit conductor layer 11 on the lower surface of 2d.

The high-frequency circuit module constructed as described above
The socket 1 is in the form of a so-called surface mount component, and is mounted, for example, on a main board (not shown) constituting a mobile phone together with other electronic components (not shown). The third ground conductor layer 10 and the second circuit conductor layer 11 are connected to connection electrodes (not shown) formed on the main substrate by soldering or the like.

When the high-frequency circuit module 1 is a voltage-controlled oscillator, the oscillation frequency is adjusted to a predetermined value before being mounted on the main board. For this adjustment, laser trimming is performed, and before closing the first dielectric removal hole 5 with the metal plate 8, the microstrip line 4 is directly irradiated with a laser beam to make a cut or the like. This is performed by changing the equivalent length or width of the microstrip line 4.

As described above, in the high-frequency circuit module 1 of the present invention, the microstrip line 4 is formed between the dielectric layers constituting the multilayer substrate 2, and the two dielectric layers sandwiching the microstrip line 4 are formed. One of the dielectric layers 2c of the body layers 2b and 2c is provided with the first dielectric removing hole 5 corresponding to the microstrip line 4, so that
Third dielectric layer 2 for microstrip line 4
The influence of dielectric loss due to c is eliminated, and the Q of the microstrip line 4 increases. Therefore, the C / N ratio of the oscillation signal of the voltage controlled oscillator or the like is increased, and (..?) Is improved. In addition, since the microstrip line 4 is shielded by closing the first dielectric removing hole 5 facing the microstrip line 4 with the metal plate 8, it is possible to prevent the interference signal from jumping into the microstrip line 4.
Further, the metal plate 8 serves as a protective cover, and it is possible to prevent the microstrip line 4 from being damaged during the handling process.

FIG. 3 shows the fourth dielectric layer 2d in FIG.
FIG. 3 is a cross-sectional view of a main part for describing a mounting state of a high-frequency circuit module 17 configured by removing the metal plate 8 and the metal plate 8. That is, on the lower surface of the third dielectric layer 2c, which is the lowermost layer of the high-frequency circuit module 17, that is, on the surface opposite to the surface on the second dielectric layer 2b side, a second terminal serving as a ground terminal is provided. In addition to the ground conductor layer 6, a second circuit conductor layer 11 serving as a signal deriving terminal is formed. Then, the first ground conductor layer 3 and the second ground conductor layer 6 are connected by the end surface conduction means 15 formed on the end surfaces of the second dielectric layer 2b and the third dielectric layer 2c, and A first dielectric layer 2a, a second dielectric layer 2b,
The first circuit conductor layer 9 and the second circuit conductor layer 11 are connected by the end surface conduction means 16 formed on the end surface of the third dielectric layer.

The high-frequency circuit module configured as described above
The module 17 is in the form of a surface mount component and is mounted together with other electronic components (not shown) on, for example, a main board 18 constituting a mobile phone. On the main board 18, the third dielectric layer 2c, which is the lowermost layer of the high-frequency circuit module 17, is provided.
A ground conductor 18a and a signal lead-out conductor 18b are formed so as to cover the area of the first dielectric removal hole 5 formed in FIG. When the high-frequency circuit module 17 is mounted on the main board 18, the first dielectric removing hole 5 is closed by the ground conductor 18a and formed on the lower surface of the third dielectric layer 2c. The second ground conductor layer 6 and the ground conductor 18a formed on the main substrate 18 are connected by solder or the like. Further, the second circuit conductor layer 11 formed on the lower surface of the third dielectric layer 2c and the signal lead-out conductor 18b formed on the main substrate 18 are connected by solder or the like.

As described above, in the high-frequency circuit module 17 shown in FIG. 3, the metal plate 8 is omitted as compared with the circuit module 1 shown in FIG.
Since the ground conductor 18a of the main board 18 on which the module 17 is mounted plays the role of the metal plate 8, the high-frequency circuit module 17
Can be reduced when the device is mounted on the main board 18.

The high-frequency circuit module 1 shown in FIG.
7, a metal plate 8 for closing the first dielectric hole 5 is used, and this metal plate 8 is soldered to the second ground conductor layer 6 on the lower surface of the third dielectric layer 2c. The good thing is, of course. This prevents the microstrip line 4 from being damaged in handling the high-frequency circuit module.

[0028]

As described above, the high-frequency circuit module according to the present invention has at least a first dielectric layer, a second dielectric layer, and a third dielectric layer laminated in this order. Forming a first ground conductor layer between the dielectric layer and the second dielectric layer, and opposing the first ground conductor layer between the second dielectric layer and the third dielectric layer; To form a strip-shaped microstrip line,
A third dielectric layer is provided with a first dielectric deletion hole formed by cutting out the third dielectric layer facing the microstrip line, and a second dielectric layer is provided in the third dielectric layer. A metal plate that covers the first dielectric removal hole is provided on the surface opposite to the surface on the body layer side, and the metal plate is connected to the first ground conductor layer. Since it faces the metal plate via the hole, a decrease in Q due to dielectric loss can be prevented. Further, since the metal plate has a role of a protective cover, the microstrip line is not damaged.
Further, it prevents the interference signal from jumping into the microstrip line due to the shield effect of the metal plate.

Further, the high-frequency circuit module of the present invention comprises:
A second ground conductor was formed on the opposite surface of the third dielectric layer, and the metal plate was connected to the second ground conductor, so the first dielectric removal hole was electrically and magnetically formed by the metal plate. It can be reliably closed.

Further, the high-frequency circuit module of the present invention comprises:
A circuit conductor layer is formed on the opposite side of the first dielectric layer from the second dielectric layer side, and a signal deriving terminal for deriving a signal from the circuit conductor is provided on a surface on the opposite side of the third dielectric layer. Because it was formed in
When mounted on a main board, a metal plate and a terminal for signal derivation can be directly connected to a conductor on the main board, so that the mounting height can be reduced.

Further, the high-frequency circuit module of the present invention comprises:
While laminating the fourth dielectric layer on the third dielectric layer,
Since the second dielectric deleted hole larger than the first dielectric deleted hole was formed in the fourth dielectric layer, a metal plate closing the first dielectric deleted hole with the second dielectric deleted hole was formed. Can be positioned.

Further, the high-frequency circuit module of the present invention comprises:
The fourth dielectric layer has a ground terminal and a signal deriving terminal formed on the surface opposite to the surface on the third dielectric side, and the first ground conductor layer and the second ground conductor are connected to the ground terminal. Since it is connected to a surface mount component, it can be in the form of a surface mount component, and another circuit conductor is provided between the fourth dielectric layer and the third dielectric layer, and on the lower surface of the fourth dielectric layer. Since layers can be provided, the degree of freedom in circuit design is increased.

The mounting structure of the high-frequency circuit module according to the present invention is characterized in that at least a first dielectric layer, a second dielectric layer, and a third dielectric layer are laminated in this order, and the first dielectric layer is A first ground conductor layer is formed between the second dielectric layer and the second ground layer, and a strip-shaped micro-layer is formed between the second dielectric layer and the third dielectric layer facing the first ground conductor layer. A high-frequency circuit module in which a strip line is formed, and a third dielectric layer is provided with a first dielectric removal hole formed by cutting out the third dielectric layer opposite to the microstrip line; A main board on which the high-frequency circuit module is mounted, a ground conductor is provided on the main board, the first dielectric removing hole is opposed to the ground conductor, and the first ground conductor layer is connected to the ground conductor. Therefore, the microstrip line is connected to the main board through the first dielectric removal hole. Q supposed to be opposed to the ground conductor
Is enhanced. In addition, since a metal plate is not used, the number of parts and the number of assembly steps can be reduced, and the height of attachment to the main board can be reduced.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of a high-frequency circuit module according to the present invention.

FIG. 2 is an exploded perspective view of the high-frequency circuit module of the present invention.

FIG. 3 is a cross-sectional view of a main part for describing a mounting state of the high-frequency circuit module of the present invention.

FIG. 4 is a sectional view of a main part of a conventional high-frequency circuit module.

[Explanation of symbols]

 Reference Signs List 1, 17 High-frequency circuit module 2 Multilayer substrate 2a First dielectric layer 2b Second dielectric layer 2c Third dielectric layer 2d Fourth dielectric layer 2e Fifth dielectric layer 3 First Ground conductor layer 4 Microstrip line 5 First dielectric removal hole 6 Second ground conductor layer (ground terminal) 7 Second dielectric removal hole 8 Metal plate 9 First circuit conductor layer 10 Third ground conductor Layer (ground terminal) 11 Second circuit conductor layer (terminal for signal derivation) 12 Electronic component 13, 14 Through-hole conduction means 15, 16 End surface conduction means 18 Main substrate 18a Ground conductor 18b Signal derivation conductor

Claims (6)

[Claims] At least a first dielectric layer, a second dielectric layer, and a third dielectric layer are sequentially stacked, and a first dielectric layer, a second dielectric layer, and a third dielectric layer are stacked. Forming a first ground conductor layer, forming a strip-shaped microstrip line between the second dielectric layer and the third dielectric layer facing the first ground conductor layer, The third dielectric layer is provided with a first dielectric deletion hole formed by cutting out the third dielectric layer facing the microstrip line, and the third dielectric layer has A metal plate for closing the first dielectric removal hole is provided on a surface opposite to the surface on the second dielectric layer side, and the metal plate is connected to the first ground conductor layer. High frequency circuit module. 2. The method according to claim 1, wherein a second ground conductor is formed on the opposite surface of the third dielectric layer, and the metal plate is connected to the second ground conductor. The high-frequency circuit module as described in the above. 3. A circuit conductor layer is formed on the first dielectric layer on a side opposite to the second dielectric layer side, and a signal deriving terminal for deriving a signal from the circuit conductor is provided on the third dielectric layer. 3. The high-frequency circuit module according to claim 1, wherein said high-frequency circuit module is formed on said opposite surface of said dielectric layer. 4. A fourth dielectric layer is laminated on the third dielectric layer, and a second dielectric layer larger than the first dielectric hole is formed on the fourth dielectric layer. 3. The high-frequency circuit module according to claim 2, wherein a hole is formed.
Le. 5. A ground terminal and the signal deriving terminal are formed on a surface of the fourth dielectric layer opposite to the surface on the third dielectric side, and the first ground conductor layer 5. The high frequency circuit module according to claim 4, wherein said second ground conductor is connected to said ground terminal. 6. At least a first dielectric layer, a second dielectric layer, and a third dielectric layer are sequentially laminated, and a first dielectric layer, a second dielectric layer, and a third dielectric layer are stacked. Forming a first ground conductor layer, forming a strip-shaped microstrip line between the second dielectric layer and the third dielectric layer facing the first ground conductor layer, A high-frequency circuit module provided with a first dielectric removal hole formed by cutting out the third dielectric layer facing the microstrip line in the third dielectric layer; A main board on which a module is mounted, a ground conductor is provided on the main board, the first dielectric removal hole is opposed to the ground conductor, and the first ground conductor layer is grounded. A mounting structure for a high-frequency circuit module, which is connected to a conductor.