JPH11166976A - X-ray detector and x-ray ct device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an X-ray detector without scattering of each channel characteristic. SOLUTION: A semiconductor layer 701 where a photoelectric converter element is placed in parallel, a scintillator layer 703 piled on the semiconductor layer, a metal plate 706 having the effects of light shield and X-ray shield preventing incidence of light and X-ray stroke against adjacent element on the scintillator layer 703 and a light reflection means preventing light scattering on the scintillator upper surface are provided. A light reflection means preventing light scattering is provided on the light reflection means, and a light reflection layer 707 is formed in the structure using a light reflection material with high reflection factor only on the upper surface of the scintillator layer and uniform light reflection layer thin film is easily formed using a peeling film pressurizing method.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an X-ray detector and an X-ray CT apparatus for performing highly accurate image measurement.

[0002]

2. Description of the Related Art For example, in an X-ray detector used in an X-ray CT apparatus, a scintillator layer is laminated on a side-by-side semiconductor photoelectric conversion element, and the scintillator layer has a photoelectric conversion element arranged at intervals of the photoelectric conversion elements. Each independent detection unit is a method of separating adjacent elements by inserting and fixing a light shielding plate for blocking visible light emitted from adjacent elements into this groove. Channels are formed to constitute one photoelectric conversion element array as a whole. An X-ray detector is formed by arranging several tens of the photoelectric conversion element arrays in a polygon shape in parallel.

Conventionally, as a light reflecting means on the upper surface of the scintillator layer, a single metal plate mirror-finished with aluminum or the like having a high light reflectance is fixed from above the photoelectric conversion element array group arranged in a polygonal shape. The structure is adopted.

FIG. 2 shows a conventional X-ray detector structure. 1 is a container of the X-ray detector, 2 is a photoelectric conversion element array arranged in a polygonal shape, 3 is a light reflection plate for preventing light leakage from the upper surface of the scintillator layer of the photoelectric conversion element array 2, and FIG. It is a photoelectric conversion element of an X-ray detector. FIG. 3 shows a photoelectric conversion element of a conventional X-ray detector. 2
01 is a semiconductor layer forming a photodiode, 20
2 is a substrate for forming a semiconductor layer, 203 is a scintillator layer laminated on the upper surface of the semiconductor layer, and 204 is a semiconductor layer 2
An adhesive layer for fixing the scintillator layer 203 on the reference numeral 03, a groove 205 for channel separation, and a metal plate 206 for blocking light from adjacent elements and X-rays.

As other conventional light reflecting means on the upper surface of the scintillator layer, in addition to the above-described method of tightly fixing a metal plate on the upper surface of the scintillator, a method of depositing aluminum on the upper surface of the scintillator, and FIG. Groove 2 as shown
05 and the top surface of the scintillator layer 203 are filled with a light reflecting material to form the reflecting layer 208, and the scintillator layer forming each channel is also sealed from the top and side surfaces with the light reflecting material to form the reflecting layer 208. This is the method.
This prevents entry of scattered X-rays and the like from the side.

As a specific well-known example, a groove for channel separation is filled with a flowable substance mainly composed of a photocurable resin mixed with a fine light reflecting material, and the scintillator layer is irradiated with light rays to fill the groove. (JP-A-6-160538).

Another known example (JP-A-7-148615)
In FIG. 6, a scintillator array 5 is formed by cutting a scintillator plate 22 and a light reflecting member 23 which are alternately overlapped by the number of channels in a sandwich shape as shown in FIG. 6, and formed on a substrate 702. There is an example of a manufacturing method in which the upper surface reflective layer 19 is provided on the upper surface of the scintillator array 15 by bonding the photodiode array 2 on the photodiode array 2. In this known example, when viewed as a structural example as shown in FIG. 5, a side surface reflective layer 21 for light reflection is formed in a groove between channels as a shield between channels.
(A substance such as TiO2) and a light shielding layer 20 (aluminum foil or the like) for the purpose of providing a shielding plate, and a metal wire 18 (a tungsten or the like) for the purpose of blocking X-rays is provided above the groove. The structure according to is adopted one by one.

Another known example (JP-A-9-54161)
7, a light reflecting film 23 is formed on a single scintillator plate 22 as shown in FIG. 7 and then cut into an elongated rectangular shape (24 is a cut surface). Are sandwiched in a sandwich shape, and are bonded (that is, rearranged) by the number of channels.
There is an example in which it is attached to the surface of the photodiode array 2 on the substrate 02.

[0009]

As shown in FIG. 2, in a structure in which several tens of photoelectric conversion element arrays 2 are arranged in a polygon as shown in FIG. 2, the light reflection plate 3 is fixed in close contact with the upper surface of the array group. The metal reflector 3 is fixed in an arc shape with respect to the element array thus formed, and the photoelectric conversion element array 2 is fixed.
A gap width different for each channel is generated between the upper surface of the X-ray and the light reflection plate 3, and a variation in the reflectance due to this, that is, a variation in the output occurs between the channels, and the output characteristic of the X-ray detector is reduced. It was a problem that made it worse.

In the example of FIG. 3, a metal plate 206 as a light shielding means inserted for channel separation is provided.
When the light reflecting plate 3 is pressed down from the upper surface as shown in FIG. 2, since a part of the protrusion protrudes from the upper surface of the scintillator when it is inserted into the groove 205 of the scintillator layer and the protrusion amount varies due to the processing accuracy of the metal plate 205. Different gap widths are generated between the upper surface of the photoelectric conversion element array 2 and the light reflection plate 3 for each element, which causes variations in output and similarly deteriorates output characteristics of the X-ray detector. Had become.

There is also a method in which aluminum is deposited on the upper surface of the scintillator. However, this method requires a step of polishing the deposited surface before the deposition in order to perform a strong deposition, thereby increasing work costs. Problems occur, even when the reflective film is attached to the top of the scintillator, burrs appear on the cross section of the reflective film when grooves are formed for channel separation, and bubbles are mixed in when bonding the reflective film. Problems had arisen.

In a method of providing a light reflecting layer 208 in the groove 205 and the scintillator layer 203 as shown in FIG. 4 and sealing the light from the top and side surfaces of the scintillator layer 203,
The light reflecting layer 208 obtained by filling the groove 205 has a sufficient reflectance to light, and light emitted from the scintillator layer of the adjacent channel passes through the groove of the light reflecting layer 208 and leaks into the channel. Although the X-rays do not enter the channel, the X-rays incident on the adjacent channel pass through the groove of the light reflection layer 208 and leak into the channel.
A phenomenon called so-called X-ray crosstalk 16 is extremely large. For this reason, a method of increasing the groove width of the light reflecting layer 208 is generally performed to reduce the X-ray crosstalk 16. However, there is a problem that the output is reduced by increasing the value.

In view of the manufacturing method in which the top and side surfaces of the scintillator are provided with shielding means, a scintillator array is prepared by slicing a plurality of scintillator plates shown in FIG. 6 which are laminated in a sandwich manner, or as shown in FIG. In a method such as laminating a scintillator square for each channel, there is also a problem that characteristics are varied between channels.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide an X-ray detector having no characteristic variation between channels, a method of manufacturing the same, and an X-ray CT apparatus. is there.

[0015]

SUMMARY OF THE INVENTION The present invention provides a semiconductor layer in which photoelectric regions of channel sections are juxtaposed, a scintillator layer provided above the photoelectric region of the semiconductor layer, and an internal layer provided above each scintillator layer. A light reflection layer for preventing light from being emitted to the outside upper part, a channel division groove provided for each channel division from the light reflection layer to the semiconductor layer via the scintillator layer, and an X-ray shielding plate inserted in the channel division groove. An X-ray detector comprising:

Further, according to the present invention, there is provided a semiconductor layer in which photoelectric regions of channel divisions are juxtaposed, a scintillator layer provided above the photoelectric region of the semiconductor layer, and an internal light provided above each scintillator layer. A light reflection layer for preventing emission,
A first X inserted into a channel dividing groove provided for each channel section from the light reflecting layer to the semiconductor layer via the scintillator layer and a channel dividing groove extending from the semiconductor layer to the light reflecting layer or the middle of the scintillator layer. An X-ray detector including a X-ray shield plate and a second X-ray shield plate having an end protruding to the outside and inserted above the first X-ray shield plate is disclosed.

Further, the present invention provides an X-ray detector for detecting X-rays through an object.
In an X-ray CT apparatus for detecting a line and obtaining a CT tomographic image, the X-ray detector is an X-ray CT as the X-ray detector disclosed above.
An apparatus is disclosed.

Further, according to the present invention, a step of laminating a scintillator layer on a semiconductor layer, a step of laminating a light reflecting layer on an upper surface of the scintillator layer, and a channel dividing groove for dividing a channel after the laminating, A method of manufacturing an X-ray detector including a step of forming a channel division groove of a semiconductor layer from a light reflection layer via a scintillator layer and a step of inserting an X-ray shielding plate into the channel division groove is disclosed.

The present invention further provides a step of laminating a scintillator layer having a light reflecting layer on the upper surface of the semiconductor layer,
Laminating a light reflecting layer on the upper surface of the scintillator layer; forming a channel dividing groove for dividing the channel after the lamination in the channel dividing groove of the semiconductor layer from the light reflecting layer through the scintillator layer; The first X is provided in the channel dividing groove from the semiconductor layer of the dividing groove to a layer position in the middle of the light reflecting layer or the scintillator layer.
A method of manufacturing an X-ray detector including a step of inserting a X-ray shield plate and a step of inserting a second X-ray shield plate having an end protruding outside above the first X-ray shield plate. Is disclosed.

[0020]

FIG. 8 illustrates an embodiment of an X-ray CT apparatus to which the X-ray detector according to the present invention is applied. In FIG. 8, an X-ray generator 4, a subject 5, and an X-ray detector 6 are arranged. The X-ray generator is irradiated at a certain spread angle, passes through the subject 5, and then enters the X-ray detector 6. The X-ray detector 6 has an arc shape for detecting X-rays emitted from the X-ray generator 4 with a certain spread, and the photoelectric conversion element array 7 is arranged along the arc. It has a structure. Next, the photoelectric conversion element array 7 in the X-ray detector 6 according to the present invention
Various embodiments of the embodiment will be described.

(Embodiment 1) First, the structure of the photoelectric conversion element array 7 of the present invention will be described in the order of the second, the manufacturing method thereof, and the third, the formation of the light reflection layer during the manufacturing process. First, the structure will be described with reference to a perspective view of the appearance of the photoelectric conversion element array constituting the X-ray detector 6 in FIG.

[0022] The photoelectric conversion element 701 formed of a photodiode on the substrate 702 in FIG. 9 is formed, a fluorescent material BGO, the scintillator layer 703, such as CdWO ₄ are laminated in this top. X-rays incident from the upper surface emit light at the scintillator layer, and this light is converted into an electric signal.

A groove 705 is formed in the scintillator layer 703 at equal intervals and parallel to the photodiode. In this groove, a material having a high X-ray shielding effect such as molybdenum or tungsten is vapor-deposited with aluminum to increase the light reflectance. Metal plate 70
6 are inserted to form channels that are independent detection units. On the top surface of the scintillator layer, a light reflection layer 707 is formed for each channel.

FIG. 1 is a configuration diagram showing a cross-sectional view taken along line II of FIG. FIG. 1 shows that the scintillator layer 703 is fixed to the semiconductor layer 701 via an adhesive layer 704 made of a transparent adhesive having a high light transmittance, and a groove 705 is shown.
Are divided into respective channels, and a metal plate 706 for shielding light is inserted into the groove. On the upper surface of each scintillator layer 703, a light reflection layer 707 is formed. The light reflection layer 707 is made of, for example, a material obtained by adding a dye to an epoxy resin, and is applied by so-called coating. Here, white pigments are more effective than black pigments. This is because a light having a higher light reflectance can use light emitted inside the scintillator more efficiently. For example, a light reflection material in which a white agent such as titanium dioxide or barium oxide is mixed with an epoxy resin is uniformly applied and cured to form a light reflection layer for each channel. As the light reflecting material, a material which does not cause a chemical change such as discoloration or softening in a high-temperature and high-humidity environment or an X-ray irradiation environment and has a small attenuation of X-rays is suitable.

The X-ray detector constituted by the photoelectric conversion element array 7 transmits X-rays transmitted through the light reflecting layer 707 and incident on the scintillator layer 703.
3, the converted visible light is not incident on the outside, that is, on the side of the adjacent scintillator layer 703, and all the photodiodes on the surface of the semiconductor layer 701 disposed immediately below Will be incident.
Such a state is caused by all other scintillator layers 7
Since the same applies to 03, there is no variation in the characteristics in the light detection (X-ray detection) for each photodiode, and the characteristics can be made uniform.

Second, a method for manufacturing a photoelectric conversion element array having the light reflection layer 707 formed will be described with reference to FIG. First, as a first step 1, a single scintillator plate 703 is adhered (adhered) to a surface of a substrate 702 on which a photoelectric conversion element (channel-separated) composed of a photodiode is formed, which is an upper surface of a semiconductor layer 701 separated by a channel. Layer 704). The adhesive used at this time is suitably a transparent adhesive having a good light transmittance so that light can be sufficiently transmitted and light emitted from the scintillator can be efficiently detected by the photodiode. Also, the scintillator plate 7 to be bonded here
03 is a dimension (+ α) slightly longer in the channel direction than the length of the photodiode in the channel direction. This is because it becomes necessary to fix the scintillator plate to the reflection layer forming jig in the next step.

Next, as a step 2, a light reflecting material is uniformly applied on the upper surface of the bonded scintillator plate (scintillator layer 703) to form a light reflecting layer 707. The application surface on the top surface of the scintillator layer 703 is washed with an organic solvent in advance, and care is taken so that dirt and the like are not trapped in the boundary surface between the light reflection layer and the scintillator. As the layer thickness of the light reflecting layer 707, light emitted from the scintillator layer 703 passes through the light reflecting layer and causes light leakage to the outside without causing a loss such as a decrease in output, and the thickness of the light reflecting layer 707. It is important that the layer has a sufficient thickness so as not to cause a local loss of output or the like even if some partial unevenness occurs. It is also important that the layer thickness has such a strength that the light reflection layer 707 does not peel off at the time of the groove cutting process in the later step 3, and the actual thickness is about 100 to 300 μm. There are methods such as a blade method, a screen printing method, a spinner method or a dropping method as a layer forming method,
As a method for easily and accurately forming a uniform layer thickness, there is a release film pressing method. The peeling film pressing method is a method in which a liquid light reflecting material is dropped on a surface on which a liquid is to be formed, and the liquid light reflecting material is uniformly pressed from above with a flat plate or the like and crushed to form a uniform film. The release film pressing method will be described later.

Next, as a step 3, a groove is formed for channel separation. In this case, grooves 705 are formed in the light reflection layer 707 and the scintillator layer 703 vertically to the photodiodes at equal intervals and parallel to the channel pitch of the photoelectric conversion elements formed in the semiconductor layer 701. After the light-reflective material of the light-reflective layer is sufficiently dried and not cured, the light-reflective material will be caught in the groove during groove cutting, causing local sensitivity unevenness. Perform grooving.

Next, a metal plate 706 for shielding light is inserted into the groove 705 formed in step 4. The metal plate 706 is slightly longer (+ α ₁ ) than the groove length, and is inserted into both ends of the groove such that the metal plate 706 and the like protrude equally.
The height of the metal plate 706 has a height protruding from the upper surface of the scintillator layer when inserted into the groove 705. At this time, it is important to take care not to damage or dirt the metal plate 706 at the time of insertion so as not to lower the light reflectance.

Next, as a final step 5, the metal plate 706 inserted into the groove 705 is fixed. Both ends of the metal plate 706 protruding from the groove are bonded and fixed 708 using an adhesive such as epoxy resin. At this time, care should be taken so that the adhesive does not flow into the groove 705 due to the capillary phenomenon along the metal plate 706. When the adhesive flows into the inside of the groove, the reflectance of the metal plate 706 on the side wall of the scintillator layer 703 decreases, causing a characteristic variation between channels.
As described above, an element block on which the light reflection layer is formed is manufactured.

Thirdly, a particularly optimum method for forming the reflective layer in the step 2 will be described with reference to FIG. Before explaining the release film pressing method, first, a reflection layer forming jig 9 used for forming a reflection layer is shown in FIG.
This will be described with reference to FIGS.

The reflection layer forming jig 9 has a shape having a predetermined step on both sides. As shown in FIG. 12, the respective planes will be referred to as plane A, plane B, plane A ', and plane B'. The plane A and the plane A 'and the plane B and the plane B' are horizontal planes at the same height, respectively (FIG. 13), and both have symmetric shapes. As shown in FIG. 14, the step distance a between the surface A and the surface B is equal to the scintillator plate 703 (scintillator layer).
The distance (d + h) is determined by adding the thickness d of the light reflecting layer to be formed to the thickness d. That is, a = d + h. Similarly, the step between the surfaces A 'and B' is also the distance (d + h). The distance e between the surface B and the surface B 'is longer than the width f of the substrate 702 and shorter than the width g of the scintillator plate 703, that is, the distance e where f <e <g. Actually, the distance e is 1 to 2 m larger than the width g of the scintillator plate 703.
A length as short as about m is sufficient. Surface A and surface A '
Is larger than the width g of the scintillator plate 703.
<K.

The release film pressing method will be described with reference to FIG. First, the back surface of the scintillator plate 703 is fixed on the surface B and the surface B 'of the reflection layer forming jig 8 so as to be in close contact with each other (step 2-1). At this time, the scintillator plate 70
The difference between the upper surface of the jig 8 and the surface A (surface A ′) of the reflection layer forming jig 8 is h. Since the back surface of the scintillator plate and the surfaces B and B 'of the reflection layer forming jig 8 serve as reference surfaces for forming a predetermined film thickness, it is important to check whether there are any irregularities due to dirt, scratches, or the like. .

Next, after fixing the scintillator plate, the light reflecting material 9 is dropped so as to swell the central portion of the upper surface of the scintillator plate 703 (step 2-2). The light reflecting material 9 is sufficiently defoamed so as not to mix air bubbles. This is because if air bubbles are trapped in the light reflection layer, the thickness of the light reflection layer becomes thinner at that portion, and the light reflectance is reduced. The amount of the light reflecting material 9 dropped is preferably about 1.5 to 2.0 times the volume calculated from the effective area and the film thickness. The reason why the amount of dripping is set to be large is to prevent the light reflecting material 9 from reaching the four corners of the scintillator plate 703 sufficiently with only the necessary amount for the film thickness, thereby preventing the film thickness from becoming uneven. It is.

Next, the release film 10 is gently dropped horizontally from above the dropped light reflecting material 9, and the metal plate 11 is placed horizontally on the release film 10 (Step 2).
3). At this time, it is important to gently and horizontally place so as not to get air bubbles.

Next, the metal flat plate 11 and the reflection layer forming jig 8 are tightly fixed with the screws 12 (step 2-4). At this time, the screws on the surface A side and the surface A 'side are alternately tightened and fixed while maintaining a horizontal state. The gap between the release film 10 and the scintillator plate 703 is a distance h. As a result, the light reflecting material 9 is crushed by the metal flat plate 11 to form the light reflecting layer 7 having a thickness h.
07 is formed. When the metal flat plate 11 is tightened with the screws 12 and pressed, excess light reflecting material 9 leaks from the gap h in all directions, so that the light reflecting material 9 spreads to every corner of the reflective layer forming surface area.

The release film 10 and the metal plate 11 have a sufficient width so as to be placed on both surfaces A and A 'and a vertical width slightly longer than the width of the scintillator plate in the slice direction. The material of the release film 10 depends on the material of the light reflection material 9 used for forming the reflection layer.
A material that does not cause a chemical reaction to adhere to the release film 10 when the light reflecting material 9 is cured and does not come off is selected as the film. For example, polyester or Teflon can be used. Also, if the release film 10 is warped from the beginning, the thickness of the light reflecting layer will be uneven, so it is important to use a film that does not warp. Step 2-5 in FIG. 2 shows a state where the film 10 is peeled off. Thus, the laminated structure shown in Step 2 is obtained. The light reflection layer is formed as described above.

(Embodiment 2) FIG. 15 shows another embodiment for forming the light reflecting material 9 in the step 2-3. In the first embodiment, the light reflection layer is formed using the release film 10 made of polyester or Teflon. However, the light reflection layer may not be a film. For example, a method using a transparent glass plate or the like instead of the release film as shown in FIG. The requisite conditions for the release film 10 are such that the light reflection material 9 forming the light reflection layer 9 does not stick and does not come off, and that sufficient flatness can be obtained. Therefore, a transparent glass plate 13 is used instead of the release film 10. A release oil 14 is applied to the glass surface on the side that is in close contact with the light reflection material 9 so as to be released. The release oil 14 includes, for example, silicone oil. Release oil 14
Select a material that does not penetrate the light reflection layer and can be removed by simple washing. As a coating method, a method using a method such as spraying which can apply a thin film uniformly on the whole is preferable. In the second embodiment, since a hard glass plate is used instead of the release film, there is no need to further press with a metal flat plate or the like from above, and air bubbles are mixed when the light reflecting material is crushed by pressing with transparent glass. It has the advantage that it can be visually inspected directly through the transparent glass. Process 2
-3, the same method as that of the first embodiment may be used except for the above-described method.

The X-ray detector 6 configured by arranging the photoelectric conversion element arrays 7 having the structure described in the second embodiment has a structure combined with an X-ray grid. It is possible to provide an extremely high-performance X-ray detector having no characteristic variation. X
The structure of the X-ray detector when combined with a line grid will be described with reference to FIG. The X-ray grid 15 is mounted on the X-ray incident side with respect to the photoelectric conversion element array 7 of the present invention.
The X-ray grid 15 is for removing the scattered X-rays 17 obliquely incident on each channel. A metal plate having a large attenuation of X-rays is directed in the radiation direction with respect to the X-ray focal point at a channel interval. As described above, the scattered X-rays are shielded by disposing them in an arc shape or a polygon shape along the X-ray detector.

FIG. 17 shows the X-ray grid 15 in FIG.
FIG. 2 is an enlarged view for explaining in detail a photoelectric conversion element array 7 of the present invention. It is required that the arrangement interval of the X-ray grids 15 be exactly the same without being shifted from the channel interval of the photoelectric conversion element array 7. This is because if the intervals do not match, characteristic variations between channels will occur. In the X-ray detector according to the present invention, it is possible to arrange the X-ray grid with high accuracy. In FIG. 17, a metal plate 706 for blocking light of an adjacent channel is inserted into a groove 705 of the photoelectric conversion element array 7. The height of the metal plate 706 is higher than the height of the scintillator layer 703, and
It is lower than 7. In other words, the height is such that the upper side of the metal plate 706 fits between the widths of the light reflecting layer 707. A part of the X-ray grid 15 is inserted into the groove 705, and the lower side of the X-ray grid is inserted so as to fit between the widths of the light reflecting layers 707. Therefore, the light shielding metal plate 706 and the X-ray grid 4 are arranged at the same groove position, and the joint between them is between the widths of the light reflection layer 707. With such a structure, the arrangement interval of the X-ray grid 15 and the channel interval of the photoelectric conversion element array 7 coincide with each other, and there is no X-ray characteristic variation between channels.
A line detector becomes possible.

The X-ray grid 15 described above has a configuration in which the metal plate of the X-ray grid 15 is partially inserted into the groove 705 of the photoelectric conversion element array 8. Without inserting a part of the metal plate of the X-ray grid 15 into the groove 705, the X-ray grid 15 and the photoelectric conversion element array 7 may be separated to provide a space between them. In this case, the metal plate 706 for blocking the light from the adjacent channel may protrude upward from the surface of the light reflection layer 707.

[0042]

As is clear from the above description, a structure in which a light reflecting layer is formed only on the upper surface of the scintillator layer and a metal plate having a light shielding effect is inserted in the groove for separating adjacent channels. By doing so, variations in output characteristics due to differences in reflectivity on the top surface of the scintillator layer depending on individual elements are eliminated, and a high-performance X-ray detector is obtained. As a method for forming the light reflecting layer, a light reflecting layer having a very uniform film thickness can be easily formed on the upper surface of the scintillator layer by applying a release film pressing method.

[Brief description of the drawings]

FIG. 1 is a sectional view of a photoelectric conversion element array constituting an X-ray detector according to the present invention.

FIG. 2 is a diagram showing a structure of a conventional X-ray detector.

FIG. 3 is a cross-sectional view of a photoelectric conversion element array constituting a conventional X-ray detector.

FIG. 4 is a cross-sectional view of a photoelectric conversion element array constituting a conventional X-ray detector.

FIG. 5 is a known example of a cross-sectional view of a photoelectric conversion element array constituting a conventional X-ray detector.

FIG. 6 is a view of a known example showing a manufacturing process of a photoelectric conversion element array constituting a conventional X-ray detector.

FIG. 7 is a view of a known example showing a manufacturing process of a photoelectric conversion element array constituting a conventional X-ray detector.

FIG. 8 shows an X-ray CT to which the X-ray detector according to the present invention is applied.
It is the schematic of an apparatus.

FIG. 9 is a perspective view of a photoelectric conversion element array constituting the X-ray detector of the present invention.

FIG. 10 is a diagram showing a manufacturing process of a photoelectric conversion element array constituting the X-ray detector of the present invention.

FIG. 11 is a view showing a process portion of forming a light reflection layer in a process of manufacturing a photoelectric conversion element array constituting the X-ray detector of the present invention.

FIG. 12 is a view showing a reflection layer forming jig used in a light reflection layer formation step in the manufacturing process of the photoelectric conversion element array constituting the X-ray detector of the present invention.

FIG. 13 is a sectional view of a reflection layer forming jig (FIG. 12).

FIG. 14 is a sectional view in which a photoelectric conversion element array is mounted on a reflection layer forming jig.

FIG. 15 is a diagram illustrating (Embodiment 2).

FIG. 16 is a diagram when an X-ray grid is mounted on the X-ray detector according to the present invention.

FIG. 17 is a detailed enlarged view when an X-ray grid is mounted on the X-ray detector according to the present invention.

[Explanation of symbols]

1, 6 container of X-ray detector 2 photoelectric conversion element array 3 light reflection plate 4 X-ray generator 5 subject 7 photoelectric conversion element array of the present invention 8 reflection layer forming jig 9 light reflection material 10 release film 11 metal flat plate DESCRIPTION OF SYMBOLS 12 Screw 13 Glass flat plate 14 Peeling oil 15 X-ray grid 16 X-ray crosstalk 17 Scattered X-ray 18 Wire 19 Upper surface reflection layer 20 Light shielding layer 21 Side reflection layer 22 Scintillator plate 23 Light reflection member 24 Cutting 201, 701 Conventional X Semiconductor layer 202, 702 Substrate 203, 703 Scintillator layer 204, 704 Adhesive layer 205, 705 Groove 206, 706 Metal plate for light shielding 207, 707 Light reflecting layer 208 Scintillator layer Light reflection layer 706 metal plate sealed from the periphery

Claims (2)

[Claims] 1. A semiconductor layer in which photoelectric regions of a channel section are juxtaposed; a scintillator layer provided on the photoelectric region of the semiconductor layer; and an internal light provided on each scintillator layer to prevent internal light from being emitted to the outside. An X-ray detector comprising: a light reflecting layer; a channel dividing groove provided for each channel section from the light reflecting layer to the semiconductor layer via the scintillator layer; and an X-ray shielding plate inserted into the channel dividing groove. 2. An X-ray detector detects X-rays transmitted through an object and detects C-rays.
2. An X-ray CT apparatus according to claim 1, wherein said X-ray detector is an X-ray detector according to claim 1.