JPH11163601A5 - - Google Patents

Info

Publication number
JPH11163601A5
JPH11163601A5 JP1998233908A JP23390898A JPH11163601A5 JP H11163601 A5 JPH11163601 A5 JP H11163601A5 JP 1998233908 A JP1998233908 A JP 1998233908A JP 23390898 A JP23390898 A JP 23390898A JP H11163601 A5 JPH11163601 A5 JP H11163601A5
Authority
JP
Japan
Prior art keywords
thin film
ground plane
interconnect
film circuit
bottom ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998233908A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11163601A (ja
Filing date
Publication date
Priority claimed from US08/924,371 external-priority patent/US6028498A/en
Application filed filed Critical
Publication of JPH11163601A publication Critical patent/JPH11163601A/ja
Publication of JPH11163601A5 publication Critical patent/JPH11163601A5/ja
Pending legal-status Critical Current

Links

JP10233908A 1997-09-05 1998-08-20 低インダクタンス相互接続構造 Pending JPH11163601A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US924,371 1997-09-05
US08/924,371 US6028498A (en) 1997-09-05 1997-09-05 Low inductance interconnect having a comb-like resilient structure

Publications (2)

Publication Number Publication Date
JPH11163601A JPH11163601A (ja) 1999-06-18
JPH11163601A5 true JPH11163601A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2005-11-04

Family

ID=25450139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10233908A Pending JPH11163601A (ja) 1997-09-05 1998-08-20 低インダクタンス相互接続構造

Country Status (2)

Country Link
US (1) US6028498A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPH11163601A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6292073B1 (en) * 1998-10-26 2001-09-18 The United States Of America As Represented By The Secretary Of The Air Force Solderless circuit interconnect having a spring contact passing through an aperture
US6307446B1 (en) * 1999-09-14 2001-10-23 Raytheon Company Planar interconnects using compressible wire bundle contacts
US8076696B2 (en) * 2009-10-30 2011-12-13 General Electric Company Power module assembly with reduced inductance
US9391581B2 (en) * 2014-02-28 2016-07-12 Alcatel-Lucent Shanghai Bell Co., Ltd Methods and devices for protecting band rejection filters from external forces

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3221286A (en) * 1961-07-31 1965-11-30 Sperry Rand Corp Connector for printed circuit strip transmission line
US3582833A (en) * 1969-12-23 1971-06-01 Bell Telephone Labor Inc Stripline thin-film resistive termination wherein capacitive reactance cancels out undesired series inductance of resistive film
DE2119567C2 (de) * 1970-05-05 1983-07-14 International Computers Ltd., London Elektrische Verbindungsvorrichtung und Verfahren zu ihrer Herstellung
US3795884A (en) * 1973-03-06 1974-03-05 Amp Inc Electrical connector formed from coil spring
US4394633A (en) * 1981-04-28 1983-07-19 Westinghouse Electric Corp. Microstrip circuit with suspended substrate stripline regions embedded therein
JPS61238102A (ja) * 1985-04-15 1986-10-23 Tokyo Keiki Co Ltd マイクロストリツプ線路用終端抵抗器
JPH04291501A (ja) * 1991-03-20 1992-10-15 Nec Corp 高周波接続構造
JPH06188602A (ja) * 1992-12-21 1994-07-08 Mitsubishi Electric Corp 高周波モジュール
US5432486A (en) * 1993-05-20 1995-07-11 Northern Telecom Limited Capacitive and inductive coupling connector

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