JPH11163491A - Method of mounting structure for multiple terminal sub-module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize reduction in the number of multiple layers and prevent increase in cost by providing a structure capable of reducing the amount of wiring at a pad part and a signal path. SOLUTION: A sub-module 11 with a signal communication part for communicating with a daughter board 12 thereon is mounted on the daughter board 12 through an inter-board multiple terminal connector 15 and 16. In this case, the inter-board multiple terminal connector 15 for an input signal from the daughter board 12 and the inter-board multiple terminal connector 16 for an output signal to the daughter board 12 are mounted with a component mounting region 17 of the sub-module 11 sandwiched inbetween.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting method of a multi-terminal sub-module for mounting a sub-module on which components for transmitting signals to and from a daughter board are mounted on the daughter board by using a multi-terminal connector between boards.

[0002]

2. Description of the Related Art FIG. 4 is a plan view showing a conventional example of a mounting method of such a multi-terminal submodule, and FIG. 5 is a side view thereof. In the figure, reference numeral 1 denotes a submodule, and 2 denotes a daughter board on which the submodule 1 is mounted.

[0003] 3 is a component mounted on the sub-module 1,
Reference numeral 4 denotes a component mounted on the daughter board 2. Here, the component 3 is an LSI, and the component 4 is an IC.
Here, in the two-story structure of the daughter board 2 and the submodule 1, when there is a restriction in the height direction or when multi-channel and high-speed signal transmission is required, a signal input from the daughter board 2 and a daughter board Connection type multi-terminal multi-terminal connector 5 with integrated signal output to 2
So that the components 3 and 4 mounted on the sub-module 1 and the daughter board 2 do not interfere with each other.
Screw holes 6 are provided at the four corners of the sub-module 1, and posts (posts) 7 are fixed with screws 8 to realize a two-story mounting.

[0004]

However, in the above-described conventional method, when a connection type in which a signal input from a daughter board and a signal output to a daughter board are integrated with a multi-terminal connector between boards is used, Since the multi-terminal connector for power and output is close to each other, it is difficult to draw out wiring from the pad where the connector leads are mounted, and this part causes the multi-terminal sub-module board to be multi-layered, increasing costs. There was a problem of being connected.

As an example of a signal transmission path, a signal from a daughter board passes through a multi-terminal connector between boards in a left area of a sub-module, is input to a component mounted in a right area of the sub-module, and is further output. The signals again pass through the board-to-board multi-terminal connector in the left area and are interfaced on the daughter board. At this time, on the sub-module, since the signal path goes back and forth / bypass,
The amount of wiring on the substrate of the multi-terminal submodule increases, which also causes a problem of multi-layering of the substrate, leading to an increase in cost.

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a configuration for reducing the amount of lead-out wiring and signal paths for a multi-terminal connector between boards, thereby preventing multilayering of boards and realizing cost reduction. With the goal.

[0007]

In order to achieve the above-mentioned object, the present invention reduces the number of lead-out wires of a multi-terminal connector between boards by half and makes the signal path one-way. That is, the present invention relates to a method for mounting and configuring the multi-terminal sub-module of an electronic circuit device comprising a multi-terminal sub-module on which a component and a multi-terminal connector for input and output between boards are mounted on a daughter board. And a multi-terminal connector between boards for output and a multi-terminal connector between boards for output are mounted with the component mounting area interposed therebetween.

[0008] At this time, the components that require signal transmission from the daughter board are mounted in the component mounting area sandwiched between the multi-terminal connectors between boards, and the components that transmit signals only within the multi-terminal sub-module. May be mounted in an area outside the component mounting area.

[0009]

Embodiments of the present invention will be described below. FIG. 1 is a plan view showing a first embodiment of the present invention,
FIG. 2 is a side view of the same. In the figure, reference numeral 11 denotes a sub-module, and reference numeral 12 denotes a daughter board on which the sub-module 11 is mounted.

Reference numeral 13 denotes an LSI as a component mounted on the submodule 11, and reference numeral 14 denotes an IC as a component mounted on the daughter board 12. Reference numeral 15 denotes an input-to-board multi-terminal connector, and reference numeral 16 denotes an output-to-board multi-terminal connector. The inter-board multi-terminal connectors 15 and 16 are mounted with the component mounting area 17 of the submodule 11 interposed therebetween. In the present embodiment, the board-to-board multi-terminal connector 15, 1
The mounting position of 6 is on the left and right sides of the component mounting area 17, but may be on the upper and lower sides of the component mounting area 17.

With the above configuration, when mounting the submodule 11 on the daughter board 12, the upper and lower sides of the inter-board multi-terminal connector 15 and the upper and lower sides of the inter-board multi-terminal connector 16 are respectively fitted, and then the upper and lower boards are mounted on the upper and lower boards. Mounted parts 1
A screw 19 is inserted into a screw hole 18 provided in the vicinity of the board-to-board multi-terminal connectors 15 and 16 so that interference between the boards 3 and 14 does not occur, and a support (post) 20 is fixed and mounted in two stories. .

The present embodiment having the above configuration operates as follows. First, a signal from the IC 14 of the daughter board 12 is input to the LSI 13 of the submodule 11 via the inter-board multi-terminal connector 15, and a signal from the LSI 13 is input to the IC 14 via the inter-board multi-terminal connector 16.
Enter As a result, the signal path is one-way, and the amount of wiring is reduced to half at the maximum.

FIG. 3 is a plan view showing a second embodiment of the present invention. The description of the same configuration as that of the first embodiment is omitted, and the same reference numerals are used. In the present embodiment, components requiring signal transmission from daughter board 12-here, LSI 13 is mounted in component mounting area 17 sandwiched between multi-terminal connectors 15 and 16 between boards, and signal transmission is performed only within the submodule. Are mounted in an area 21 outside the component mounting area 17.

According to the second embodiment having the above configuration,
Even if the development of highly integrated LSI (such as integrated LSI) and the development of high-density wiring technology for printed circuit boards are made in the future and the board area is reduced, the mutual dimensions (interface conditions) between the multi-terminal connectors between boards will be reduced. If it does, the size can be easily reduced by deleting only the area 21, and the cost can be reduced.

Furthermore, according to the second embodiment, since the mounting position of the multi-terminal connector between boards can be reduced without changing at all, the inspection device and jig for the module once made can be diverted. Thus, the cost of the entire apparatus can be significantly reduced.

[0016]

As described above in detail, according to the present invention, a multi-terminal sub-module for mounting a sub-module on which components for transmitting signals to and from a daughter board are mounted on the daughter board using a multi-terminal connector between boards. In the configuration method, the board-to-board multi-terminal connector for signal input from the daughter board and the board-to-board multi-terminal connector for signal output to the daughter board are mounted with the component mounting area of the submodule interposed therebetween. The number of lead wires can be reduced by half, and the signal path can be made one way.

As a result, it is possible to reduce the amount of wiring of the pad portion and the signal path, thereby preventing the multilayer structure of the substrate and realizing a cost reduction. Also, at this time, components that require signal transmission from the daughter board are mounted in a component mounting area sandwiched between the board-to-substrate multi-terminal connectors, and components that perform signal transmission only within the submodule are the component mounting components. By mounting in a region outside the region, when the substrate area is reduced, size reduction can be easily realized, and there is an effect that cost can be reduced.

Furthermore, since the size of the module can be reduced without changing the mounting position of the board-to-board multi-terminal connector at all, the module inspection device and jigs once created can be diverted.
This has the effect of enabling a significant cost reduction of the entire apparatus.

[Brief description of the drawings]

FIG. 1 is a plan view showing a first embodiment of the present invention.

FIG. 2 is a side view showing the first embodiment of the present invention.

FIG. 3 is a plan view showing a second embodiment of the present invention.

FIG. 4 is a plan view showing a conventional example.

FIG. 5 is a side view showing a conventional example.

[Explanation of symbols]

 11 Sub-module 12 Daughter board 13 LSI 14 IC 15, 16 Multi-terminal connector between boards

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Naoaki Yamanaka 3-19-2 Nishishinjuku, Shinjuku-ku, Tokyo Japan Telegraph and Telephone Corporation (72) Inventor Tomoaki Kawamura 3-192-1, Nishishinjuku, Shinjuku-ku, Tokyo No. Within Nippon Telegraph and Telephone Corporation (72) Katsumi Kaizu 3-19-2 Nishi Shinjuku, Shinjuku-ku, Tokyo Japan Within (72) Inventor Akio Harada 3-192 Nishi Shinjuku, Shinjuku-ku, Tokyo No. Japan Telegraph and Telephone Corporation

Claims (2)

[Claims] 1. A method of mounting and configuring a multi-terminal sub-module in which a sub-module on which components for transmitting a signal to a daughter board are mounted is mounted on the daughter board using a multi-terminal connector between boards. A method of mounting and mounting a multi-terminal submodule, comprising: mounting a multi-terminal connector between boards and a multi-terminal connector between boards for signal output to a daughter board with a component mounting area of the submodule sandwiched therebetween. 2. The method for mounting and configuring a multi-terminal sub-module according to claim 1, wherein the component requiring signal transmission from the daughter board is mounted in a component mounting area sandwiched between the multi-terminal connectors between boards. A component mounting method for a multi-terminal sub-module, wherein the component that transmits signals only within the sub-module is mounted in an area outside the component mounting area.