JPH11163191A - Apparatus for cutting and housing semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve productivity by reducing the cycle time beginning to separate semiconductor devices until they are housed, thereby moving the semiconductor devices safely at a high speed. SOLUTION: For first and second pickup heads 55, 56 located midway stop positions, a pickup is standing intermediate stop position of a different height until another pickup which chucks a semiconductor device has passed the intermediate stop position of a second passage. When a second housing pickup 60 reaches a housing tray, a second housing cylinder 58 is turned ON/OFF to vertically move the second pickup head 56 to arrive at a lower end position. Then a vacuum pad 54 stops vacuum chucking to house the semiconductor device in the housing tray. This reduces the cycle time for picking up the semiconductor devices individuals by cutting means from dies by transporting means and housing the separated devices in housing means, thus enabling high speed processing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device cutting and storing apparatus for individually cutting and storing semiconductor devices from a substrate on which a plurality of semiconductor devices are formed. As the substrate, a resin substrate for wiring is generally used. Particularly, a so-called BGA (Ball Grid) in which a semiconductor element mounted on one surface is resin-sealed and a solder ball is formed on the other surface.
An (Array) type semiconductor device manufacturing substrate is preferably used.

[0002]

2. Description of the Related Art Conventionally, when manufacturing a semiconductor device such as a plastic package, a lead processing machine for performing lead forming after resin sealing is used. Specifically, a lead processing machine transports a strip-shaped lead frame on which a plurality of semiconductor chips are mounted and resin-sealed into a device, removes the resin, cuts the dam bar, cuts the tip of the lead, and forms the lead. Required processing such as is performed.

[0003] Among the above-mentioned lead processing machines, an apparatus for performing a bending process, for example, will be described with reference to FIG. FIG.
, A strip-shaped lead frame 101 having a plurality of resin-sealed portions on which a semiconductor chip is mounted and resin-sealed
Is the hand 103 of the feeder 102 in the rail hole on both sides.
Through the pin formed in the direction indicated by the arrow in the direction of the arrow from the left hand to the right hand. A mold apparatus 107 having a mold 105 and a mold 106 is provided on the apparatus mount 104.
The first die 105 is provided with a bending die, and the second die 106 is provided with a punching die. The lead frame 101 is subjected to a bending process for performing lead bending in the die 105, and is then separated individually in the die 106 to form a semiconductor device 108.
Is taken out of the mold device 107.

The above-mentioned individually separated semiconductor devices 108
Is placed on a transfer tray (not shown) or sucked and held by a pickup, and is taken out from the mold device 107. Then, the semiconductor device 108 is transferred by a transfer pickup (not shown) onto a rotary table 109 driven by a rotary actuator (not shown) as necessary, and the orientation of the semiconductor device 108 is changed, for example, by 90 ° in preparation for the next step. Then, it is sucked and held by the transfer pickup again and stored in the storage tray provided in the storage section 110.

In recent years, a BGA type semiconductor device has been used as an example of a surface mount type semiconductor device.
In this semiconductor device manufacturing apparatus, the external lead of the semiconductor device is not bent, but is formed in a strip shape in which a plurality of resin sealing portions in which the semiconductor elements are resin-sealed are formed in the same configuration as in FIG. The substrates are carried into a mold apparatus equipped with a cutting press die, and are individually separated by simultaneously punching out four sides or four corners, and the separated semiconductor devices 108 are transferred to a storage tray by changing the direction as necessary. Was stored.

[0006]

However, FIG.
In a semiconductor device manufacturing apparatus such as a lead processing machine shown in (1), it takes time to separate a semiconductor device from a strip-shaped lead frame or a substrate, and then take out the semiconductor device from the mold device 107. It took time from taking out from the mold device 107 to storing in the storage unit 110.

More specifically, the semiconductor device 1 separated from the mold device 107 by a transfer tray or a pick-up for removal is used.
Since the moving distance before taking out the semiconductor device 08 is long, it takes time to take out the semiconductor device 108. The moving distance required for this removal depends on the size of the mold, but since the size of the mold cannot be reduced due to the provision of the guide post, there is a limit to shortening the moving distance. .
In addition, the semiconductor device 108 picked up by the transfer tray or the pick-up pickup from the mold apparatus 107 is transferred to the transfer pickup and transferred to the storage unit 110, or is transferred to the rotary table 109 in the middle to transfer the semiconductor device 108 to the rotary table 109. After the device 108 has been rotated by a predetermined angle, the semiconductor device 108 has been transferred from the turntable 109 to the storage section 110, so that the semiconductor device 108 is transferred between transfer means driven by separate driving sources such as motors and cylinders. It takes time to be done. Further, since the moving distance of the transfer pickup to the storage section 110 is long, the semiconductor device 1
It takes time to store 08. The moving distance required for the storage depends on the volume of the storage section and the size of the storage tray. Therefore, if the storage is performed in a large storage tray, the movement distance becomes longer, and it takes time.

If the transfer tray, the pick-up pickup, or the pickup for transfer is reciprocated by the cylinder drive, the transfer tray starts moving at a high speed from the beginning and stops suddenly at a high speed. In such a case, a large impact may be applied to the semiconductor device to damage a precise semiconductor component, which is not preferable in terms of safety and reliability.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems of the prior art, shorten the cycle time from the separation of a semiconductor device to the storage thereof, and transfer the semiconductor device at high speed and safely. An object of the present invention is to provide a semiconductor device cutting and accommodating device which has improved.

[0010]

The present invention has the following arrangement to achieve the above object. That is, a driving source and a cutting unit that is driven by the driving source and individually cuts the semiconductor device from a substrate on which a plurality of semiconductor devices are formed;
Storing means for storing the semiconductor device cut by the cutting means; and removing the semiconductor device after cutting along a first transfer path;
Transfer means for transferring to the storage means along a transfer path of
The removal of the semiconductor device by the transfer means and the transfer operation of the removed semiconductor device to the storage means are performed in a linked manner through a plurality of cams provided on a cam shaft that is rotationally driven by the drive source. And a drive transmission mechanism for transmitting the drive as described above.

Further, the transfer means includes a first transfer means disposed on the first transfer path for taking out the semiconductor device after cutting, and a second transfer means intersecting the first transfer path. It is preferable that the semiconductor device further includes a second transfer unit that is disposed on a transfer path and transfers the semiconductor device from the first transfer unit to the storage unit.

Further, the first transfer means mounts one or more of the semiconductor devices on the cutting-side mounting portion and the storage-side mounting portion, and is reciprocated by being driven and transmitted by the drive transmitting mechanism. A transfer tray, which is disposed on the first transfer path,
When the transfer tray reciprocates, there may be provided a transfer means for temporarily receiving the semiconductor device from the cutting-side mounting portion, rotating the semiconductor device by a predetermined angle, and transferring the semiconductor device to the storage-side mounting portion. The transfer unit includes a pickup head that holds one or more of the semiconductor devices, a rotation unit that rotates the pickup head at a predetermined angle, and a drive transmission mechanism that drives the pickup head to move the pickup head up and down. A rotating pickup provided with a vertical movement mechanism for moving may be provided.

Further, the second transfer means includes a pickup head for holding one or more of the semiconductor devices, and a pickup head for holding the semiconductor device by vertically moving the pickup head to place the semiconductor device on the storage means. A storage cylinder having a storage cylinder and reciprocating means for reciprocating the pickup head along the second transfer path, wherein the storage pickup is driven by the drive transmission mechanism to move vertically. Preferably, the semiconductor device is transferred from the first transfer means and transferred to the storage means. Further, the second transfer means includes first and second storage pickups for holding one or more of the semiconductor devices and alternately transferring the semiconductor devices along the second transfer path to the storage means; Up and down moving means for moving the second storage pickup at different height positions in the second transfer path between forward movement and backward movement. Further, the first and second storage pickups may be arranged such that the suction pads of the first and second pickup heads move up and down on the same line when the semiconductor device is sucked and held. good. In addition, the first,
Until one of the pickups holding the semiconductor device among the second storage pickups passes the intermediate stop position of the second transfer path, the other pickup stops at a different height from the intermediate stop position. It is desirable to have.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In the present embodiment, as an example of a semiconductor device cutting and storing apparatus, a cutting and storing apparatus for manufacturing a so-called BGA type semiconductor device will be described. 1 is a front view showing the entire configuration of the semiconductor device cutting and storing apparatus, FIG. 2 is a schematic plan view of the semiconductor device cutting and storing apparatus of FIG. 1, FIG. 3 is a plan perspective view showing a drive transmission mechanism, and FIG. FIG. 5 is an explanatory view showing a moving mechanism of the transfer tray, FIG. 6 is a front view and an explanatory view of parts of the rotary pickup, and FIG. 7 is an explanatory view showing a rotating mechanism of the rotary pickup. 8 is an explanatory view showing a vertical movement mechanism of the rotary pickup, FIG. 9 is a right side view of the storage pickup, FIG. 10 is an explanatory view of a pickup head of the storage pickup of FIG. 9, and FIG. 11 moves the storage pickup. FIG. 12 is an explanatory view showing a second transfer path, FIG. 12 is an explanatory view showing a drive transmission mechanism of the storage pickup, FIG. 13 is a timing chart showing movement and suction operation of the storage pickup, and FIG. It is a schematic view showing the reciprocating operation of the use pickups.

(Overall Configuration) First, the overall configuration of a BGA type semiconductor device cutting and accommodating apparatus according to the present invention will be described with reference to FIG.
This will be described with reference to FIG. 1 and 2, reference numeral 1 denotes an electric motor as a driving source, which is fixed on the top plate 1a and supplies a driving force to a cutting unit and a transfer unit described later. Reference numeral 2 denotes a carry-in device, which carries in a rectangular substrate on which a plurality of semiconductor devices are formed in the direction of arrow A. As shown in FIG. 1, the carry-in device 2 sandwiches and conveys a substrate between a conveyor belt 2a and a plurality of rollers 2b pressed against the conveyor belt 2a.

Reference numeral 3 denotes a cutting device as cutting means, which is equipped with a press die for cutting. This press mold is
A punch 5 that moves up and down in conjunction with a press ram 4 that moves up and down in conjunction with a crank (not shown) that is rotationally driven by the electric motor 1, and is provided on a press bed 6;
A die 7 capable of supporting the substrate at the cutting position is provided (FIG. 1).
2). The punch 5 moves up and down while being guided by guide posts 6a erected at the four corners of the lower die. The cutting device 3 simultaneously cuts out four sides of the semiconductor device from the substrate transported by the loading device 2 and individually cuts the semiconductor device. The cutting speed of the cutting device 3 can be variously set, but is set to 60 spm (stroke per minute). In this embodiment, a BGA type substrate is used, and a glass epoxy resin substrate or TAB (Tape Automated Bonding) which is generally continuous in a strip shape is used as a substrate material.
A tape or the like is used. On one surface of the substrate, resin-sealed portions on which semiconductor elements are mounted and resin-sealed are formed at a plurality of places, and solder balls are formed on the other surface.

In FIG. 2, reference numeral 8 denotes a transfer device as transfer means, which takes out the semiconductor device cut by the cutting device 3 along a first transfer path P, and transfers the semiconductor device taken out to a second transfer device. Along the transfer path Q. The transfer device 8 includes a transfer tray 9 as a first transfer unit, a rotary pickup 10 as a transfer unit, and a storage pickup 11 as a second transfer unit.

The transfer tray 9 includes a cutting-side mounting portion 9a and a storage-side mounting portion 9b on which one or more semiconductor devices can be mounted.
(See FIG. 5), and is provided so as to be able to reciprocate along the first transfer path P in the direction of the arrow. In the transfer tray 9, the cutting-side mounting portion 9a is waiting at the cutting position B below the mold,
The semiconductor device pulled out by the cutting device 3 is received by the cutting-side mounting portion 9a, and the rotation pickup 10 is received.
Is moved to the transfer position C below. At the same time, the storage-side mounting portion 9b moves from the transfer position C to the transfer position D below the storage pickup 11. Next, the rotation pickup 10 is moved downward to suck the semiconductor device from the cutting-side mounting portion 9a, and is moved upward to temporarily hold the semiconductor device. At this time, if necessary, the rotation pickup 10 is rotated by a predetermined angle by a rotation mechanism described later, and the orientation of the semiconductor device is changed and held. Then, when the transfer tray 9 moves to the original position and the cutting-side placing portion 9a returns to the cutting position B below the mold again, the rotary pickup 10 is again turned on.
Is moved up and down, and the semiconductor device sucked and held is transferred to the storage-side mounting portion 9b moved to the transfer position C. Also,
The storage pickup 11 is disposed on a second transfer path Q of the semiconductor device that intersects the first transfer path P. When the transfer tray 9 places the semiconductor device on the storage side mounting portion 9b at the transfer position C and moves to the transfer position D, the transfer tray 9 sucks and holds the semiconductor device when the storage pickup 11 moves up and down. It is transferred to the storage means described later.

In FIG. 2, reference numeral 12 denotes a storage section as storage means for storing semiconductor devices in a line. The storage section 12 is provided with a storage tray supply section 12a for supplying an empty storage tray (not shown) and a storage tray storage section 12b for storing a storage tray filled with semiconductor devices.

In FIG. 1, reference numeral 13 denotes a drive transmission mechanism, which is provided via first to third cams 16 to 18 provided on a cam shaft 15 which is rotationally driven by the electric motor 1 via a timing belt 14. By transmitting drive, the transfer device 8
The drive transmission is performed so that the removal of the semiconductor device by the above and the transfer operation of the removed semiconductor device to the storage means are performed in a linked manner. More specifically, the reciprocating movement of the transfer tray 9, the vertical movement of the rotary pickup 10, and the vertical movement of the storage pickup 11 are synchronized and operated.

Next, the configuration of each part of the semiconductor device cutting and storing apparatus will be described with reference to FIGS. (Drive Transmission Mechanism) In FIG. 3, a pulley 19 is attached to one end of the cam shaft 15, and a timing belt 14 is hung on the pulley 19. This camshaft 1
When the first cam 16 fitted in 5 rotates once, it reciprocates the transfer tray 9 via a moving mechanism described later.
Also, the second cam 17 fitted on the cam shaft 15
Moves the rotation pickup 10 up and down at a predetermined timing during one rotation through a rotation pickup vertical movement mechanism described later. The third cam 18 fitted on the cam shaft 15 moves the storage pickup 11 up and down at a predetermined timing during one rotation through a storage pickup vertical movement mechanism described later. A rotary encoder 20 is attached to the other end of the cam shaft 15 so that the rotational position of each cam can be detected.

(Transfer Tray) Next, the structure of the transfer tray 9 and its moving mechanism will be described with reference to FIGS. The transfer tray 9 has a cut-side mounting portion 9a and a storage-side mounting portion 9b on which semiconductor devices can be mounted at two locations in the longitudinal direction, and can reciprocate in the first transfer path P in the direction of the arrow. It is provided in. In the transfer tray 9, the cutting-side placing portion 9a is waiting at the cutting position B below the mold, and the semiconductor device pulled out by the cutting device 3 is received by the cutting-side placing portion 9a. It moves to the transfer position C below the pickup 10. At the same time, the storage-side mounting portion 9b moves from the transfer position C to the transfer position D below the storage pickup 11. The semiconductor device mounted on the cutting-side mounting portion 9a and transferred to the transfer position C is temporarily held by suction by moving the rotary pickup 10 up and down, and is further rotated by a predetermined angle and held in a different direction. Is done. Then, when the transfer tray 9 moves to the original position and the cutting-side mounting portion 9a returns to the cutting position B below the mold again, the rotary pickup 10 is moved up and down again, and the transfer position is changed. The semiconductor device sucked and held is transferred to the storage-side mounting portion 9b in C. When the semiconductor device is mounted on the storage-side mounting portion 9b at the transfer position C, the transfer tray 9 moves to the transfer position D.
And the pickup 11 for storage moves up and down, and the semiconductor device is delivered.

Next, the mechanism for moving the transfer tray 9 will be described. First cam 1 fitted to cam shaft 15
One end 21 a of an L-shaped swing lever 21 is in pressure contact with 6, and the other end 21 b of the swing lever 21 is connected to a movable block 22. In FIG. 5, the swing lever 21 is urged in the counterclockwise direction on the other end 21b side by a tension spring 23, and the first end 21a side is on the first side.
Is always in pressure contact with the cam surface of the cam 16.

In FIGS. 4 and 5, a transfer tray support member 24 is connected to the upper surface of the movable block 22, and the transfer tray 9 is fixed on the transfer tray support member 24 by screws 9c. Supported in a cantilevered manner. A linear motion guide (hereinafter referred to as an “LM guide”) 25 is slidably fitted along a guide rail 26 on the lower surface side of the movable block 22. The guide rail 26 is provided on a support plate 27 fixed near the end of the press bed 6 (see FIG. 5). When the first cam 16 makes one rotation, the swing lever 21 swings around the swing center 21c in the direction of the arrow in FIG. 5, and the transfer tray 9 supported by the movable block 22 moves the swing lever. Reciprocating along the guide rail 26 within the swing range of 21.

(Rotation Pickup) Next, the rotation pickup and its vertical movement mechanism will be described with reference to FIG. FIG. 6A is an explanatory view showing the structure of a rotary pickup, FIG. 6B is a plan view of an intermediate plate, and FIG.
(C) is a plan view of the lower plate. The rotation pickup 10 is driven and transmitted by the drive transmission mechanism 13 and moves up and down at the transfer position C. At this time, the semiconductor device is mounted on the cutting-side mounting portion 9a, the semiconductor device is sucked from the cutting-side mounting portion 9a of the transfer tray 9 moved from the cutting position B to the transfer position C, and rotated by a predetermined angle. And hold. When the cutting-side mounting portion 9a of the transfer tray 9 moves to the cutting position B and the storage-side mounting portion 9b moves to the transfer position C, the rotation pickup 10 is moved up and down again to change the direction. Then, the semiconductor device sucked and held is transferred to the storage-side mounting portion 9b.

In FIG. 6A, the rotary pickup 10 has a rotary pickup head 29 having a suction pad 28 at its lower end for holding one or more semiconductor devices by suction. This rotary pickup head 2
9 is detachably attached to the lower plate 30. In this embodiment, the rotary pickup head 29 is provided with one to three suction pads 28. The lower plate 30 is supported by an intermediate plate 31 by a holding rod 32 and a coil spring 33 fitted around the holding rod 32. The coil spring 33 absorbs the shock when the rotary pickup 10 moves down and the semiconductor device is sucked by the suction pad 28. A piping air tube 34 for sucking air from the suction pad 28 is connected between the lower plate 30 and the intermediate plate 31. FIG. 6 (b)
3 (c), three pipe joints 30a, 30b, 3 are provided around the lower plate 30 and the intermediate plate 31.
30c and pipe joints 31a, 31b, 31c are provided respectively, and these are connected to three air tubes 34.
Are connected up and down using In FIG. 6C, suction holes 30 d communicating with the suction pads 28 provided on the rotary pickup head 29 are formed at three places in the lower plate 30.

The intermediate plate 31 is connected to and supported by the lower ends of three hollow pipe rods 35. The piping rod 35 is inserted through the upper rotating plate 36, and the upper end thereof is connected to the piping block 37. The upper rotating plate 36 is vertically guided and held by a rotating plate holding member 38. The rotating plate holding plate 38 is horizontally attached to a mounting plate 39 erected on the press bed 6. Installed. A vertical rod 40 is provided upright on the rotary plate holding plate 38 through the upper rotary plate 36, and the upper rotary plate 36 is rotatable about the vertical rod 40. . Vertical rod 4
A stopper block 41 is provided near the upper end of 0. A coil spring 42 is elastically provided between the stopper block 41 and the piping block 37, and urges the piping block 37 and the piping rod 35 connected thereto downward. An air tube 43 is connected to the piping block 37 at three places, and communicates with an air tube 34 connected to the intermediate plate 31 by using the hollow portions of the three piping rods 35 as conduits. It is supposed to.

Next, the rotation mechanism of the rotation pickup 10 will be described with reference to FIG. FIG. 7A is an explanatory view of a rotating mechanism of the rotary pickup 10, and FIG. 7B is an explanatory view of an upper rotating plate. In FIG. 7A, the cylinder holding plate 4 provided on the mounting plate 39 is used.
A rotation cylinder 45 is attached to 4, and this cylinder rod 45 a is rotatably connected to a connection pin 36 a erected on the upper rotation plate 36. The case body of the rotation cylinder 45 is provided with a cylinder holding plate 4 in order to smoothly rotate the upper rotation plate 36.
4 can be slightly swung about a rotation pin 45b. In FIG. 7B, two stopper pins 39a protrude from the mounting plate 39, and regulate the rotation range of the upper rotation plate 36. When the rotation cylinder 45 is operated, the upper rotation plate 36 is moved to the bearing portion 3 provided on the rotation plate holding member 38.
It is guided up and down by 8 a and rotates about the vertical rod 40. At this time, the intermediate plate 31, the lower plate 30, and the rotary pickup head 29 rotate integrally via the piping rod 35 inserted through the upper rotary plate 36, and change the direction of the semiconductor device suction-held by the suction pad 28. be able to. In the present embodiment, the upper rotating plate 36 is designed to rotate by 90 °.

Next, a vertical movement mechanism of the rotary pickup 10 will be described with reference to FIG. One end 46a of an L-shaped swing lever 46 is in pressure contact with the second cam 17 fitted on the cam shaft 15, and the swing lever 46
The other end 46b is connected to a vertical movement block 47.
An up-and-down rod 48 is provided upright on the up-and-down movement block 47. The up-and-down rod 48 passes through a base plate 49 on which the press bed 6 is placed, and abuts on an upper end thereof.
Are connected. A coil spring 52 is fitted between a base plate 49 and a stopper block 51 provided on the peripheral surface of the upper and lower rods 48 to urge the upper and lower rods 48 downward. The upper end of the abutment member 50 is abutted against the fan-shaped extension 53 of the intermediate plate 31 to support the rotary pickup 10. Since the intermediate plate 31 is rotated by the rotation cylinder 45, the tip of the abutting member 50 is always fixed to the rotation pickup 10.
It is shaped like a fan so that you can support it.

The rotary pickup 10 is attached downward by a coil spring 42 fitted between the piping block 37 and the stopper block 41 and a coil spring 52 fitted between the base plate 49 and the stopper block 51. The swing lever 46 is urged so that the other end 46b is urged in a counterclockwise direction, and the one end 46a is always in pressure contact with the cam surface of the second cam 17. When the second cam 17 makes one rotation, the swing lever 46 swings around the swing center 46c in the direction of the arrow in FIG. 8, and when the pressing force by the cam surface is increased, the vertical rod 48 and the abutting member 50 is moved upward against the elastic force of the coil springs 42 and 52. At this time, the rotating pickup 10 is moved upward by abutting against the fan-shaped extension 53 of the intermediate plate 31 by the abutting member 50, and the cam surface is moved. When the pressing force is weakened, the rotary pickup 10 moves down by the elastic force of the coil springs 42 and 52, and the semiconductor device can be sucked by the suction pad 28.

(Storage Pickup) Next, the configuration of the storage pickup 11 and its moving mechanism will be described with reference to FIGS. The storage pickup 11 is
When the drive is transmitted by the drive transmission mechanism 13 and moves up and down, the semiconductor device is held by the storage-side mounting portion 9 b of the transfer tray 9 and transferred to the storage portion 12.

In FIG. 9, the storage pickup 1
Reference numeral 1 denotes first and second pickup heads 55 and 56 which can be equipped with one to three suction pads 54 for sucking and holding a semiconductor device, and the first and second pickup heads 55 and 56.
The semiconductor device held by the
And second storage cylinders 57 and 58 for mounting on
, Respectively, are provided. The first and second storage pickups 5
9 and 60 suck and hold one to three semiconductor devices and alternately transfer the semiconductor devices to the storage unit 12 along the second transfer path Q (see FIG. 2).

The first and second storage cylinders 57, 58
Are mounted by upper and lower mounting plates 61 and 62 and horizontal mounting plates 63 and 64. Upper and lower guide rails 65, 66 are provided on the side surfaces of the first and second storage cylinders 57, 58, respectively.
Is laid. The upper and lower guide rails 65,
Head holding plates 69 and 70 are attached to 66 via LM guides 67 and 68. The head holding plate 6
The first and second pickup heads 55 and 56 are attached to lower ends of the components 9 and 70, respectively. The above first and second
When the storage cylinders 57 and 58 are operated, the head holding plates 69 and 70 slide vertically along the vertical guide rails 65 and 66 via the LM guides 67 and 68, and the first and second pickup heads are moved. 55 and 56 move up and down. The moving range of the first and second pickup heads 55 and 56 is regulated by the stopper portions 69a and 70a of the head holding plates 69 and 70 abutting against the abutting pins 63a and 64a of the horizontal mounting plates 63 and 64. .

The number of first and second pickup heads 55 and 56 provided in the first and second storage pickups 59 and 60 will be described with reference to FIG.
FIG. 10 is described using the first storage pickup 59. FIGS. 10A and 10B are a left side view and a bottom view of the first storage pickup 59 of FIG. FIG.
As shown in FIG. 0A, in the present embodiment, the first and second storage pickup hands 59 and 60 include upper and lower mounting plates 61 and 60.
Each of the first and second storage cylinders 57 and 58 is equipped with one of the first and second storage cylinders 57 and 58, respectively, as shown in FIG. 10B. 58 can be attached. The upper and lower mounting plates 61 are respectively formed with a plurality of piping paths capable of supplying air to the first storage cylinder 57 so that cylinders are provided at three locations. When the first storage cylinder 57 is added, the head holding plate 69 moved up and down by the cylinder 57 and the first pickup head 55 held integrally with the head holding plate 69 are also added to three places. . As described above, the plurality of the first and second storage cylinders 57 and 58 and the first and second pickup heads 55 and 56 are individually provided for storing the semiconductor device. This is because, when the number of storage recesses and the number of cut semiconductor devices are fractional, for example, three semiconductor devices cannot be stored in the storage tray at one time and must be stored individually.

In FIG. 9, the upper and lower mounting plates 61, 6
2 is connected to the lower ends of the vertical rods 71 and 72,
The vertical rods 71, 72 pass through the housings 73, 74, and are urged by coil springs 75, 76 fitted inside the housings 73, 74 so as to always be pulled upward (see FIG. 11). ). The vertical mounting plates 61 and 62 have cylinder rods 78a of vertical cylinders 77 and 78 as vertical moving means.
79a are connected. The vertically moving cylinder 77, 7
By operating the pickup 8, the first and second storage pickups 59 and 60 can be further moved above the lifting positions by the coil springs 75 and 76 to change the height position.

In FIG. 9, the first and second storage pickups 59 and 60 are provided on the storage side mounting portion 9 of the transfer tray 9 in order to reduce the transfer space as much as possible.
When the semiconductor device is sucked from b, the heads are arranged on the second transfer path Q so that the suction pads 54 of the first and second pickup heads 55 and 56 move up and down on the same line. ing.

Here, the reciprocating mechanism of the first and second storage pickups 59 and 60 will be described. In FIG. 11, a transfer guide 79 is provided along the second transfer path Q, and ball shaft linear guides 80 and 81 constituting reciprocating means are provided on both sides thereof. The ball shaft linear guides 80 and 81 are connected to the transfer guide 7.
9 are provided along with ball axes (not shown). A timing belt 85 is stretched between a pulley 82 provided at the shaft end of the ball shaft and a motor pulley 84 of the servo motor 83. By driving the servo motor 83 to rotate forward and reverse, the first and second storage pickups 59 and 60 can reciprocate along the second transfer path Q along the linear guides 80 and 81. .

In FIG. 9, the moving body chassis 86, 87 of the first and second storage pickups 59, 60 are provided with detection plates 88, 89 for detecting a passing position. Further, position detection sensors 90 and 91 are provided at the intermediate stop positions on both side surfaces of the transfer guide 79.
The detection plates 88 and 89 block the optical axes of the position detection sensors 90 and 91 when the first and second storage pickups 59 and 60 transfer the semiconductor device to the storage section 12 and return. The drive of the servo motor 83 shown in FIG. 11 is controlled so as to stop at the intermediate stop position.

Next, the first and second storage pickups 5
The vertical movement mechanisms 9 and 60 will be described with reference to FIGS. In FIG. 12, the third cam 18 fitted on the cam shaft 15 has one end 92a of a swing lever 92.
Are pressed against each other, and the other end 92b of the swing lever 92 is
It is connected to a vertical movement plate 93. The up-and-down movement plate 93 is provided with two up-and-down rods 94, two for each. The upper and lower rods 94 pass through the base plate 49 on which the press bed 6 is placed, and a coil spring 96 is provided between a stopper block 95 provided on the upper end side and a cylindrical guide 49a for guiding the upper and lower rods 94.
Are fitted respectively.

In FIG. 4, the first and second rods 94 are provided at the upper ends of the two sets of upper and lower rods 94.
Up and down movement levers 97 and 98 for lowering the storage pickups 59 and 60 respectively are connected. As shown in FIG. 9, the vertically moving levers 97 and 98 respectively abut against the horizontally extending portions 61a and 62a of the upper and lower mounting plates 61 and 62, and move the first and second storage pickups 59 and 60, respectively.
It is moved downward against the lifting force of the coil springs 75, 76 (see FIG. 11).

In FIG. 12, the stopper block 9
The vertical rod 94 and the vertical moving plate 93 are urged upward by a coil spring 96 fitted between the cylindrical lever 49 and the cylindrical guide 49 a, and the other end 92 b of the swing lever 92.
The side is urged in a counterclockwise direction, and the one end 92 a side is always in pressure contact with the cam surface of the third cam 18. When the third cam 18 makes one rotation, the swing lever 92 swings about the swing center 92c in the direction of the arrow in FIG. At this time, when the pressing force of the cam surface of the third cam 18 is increased and the swing lever 92 is swung clockwise, the vertically moving plate 93 and the vertically moving rod 94 are moved downward. At this time, the vertical movement levers 97, 9
8 can move the first and second storage pickups 59 and 60 downward against the lifting force of the coil springs 75 and 76 to suck the semiconductor device mounted on the storage-side mounting portion 9b. . When the pressing force of the third cam 18 by the cam surface is weakened and the swing lever 92 is swung in the counterclockwise direction, the urging force of the coil spring 96 raises the vertically moving plate 93 and the up and down rod 94. Move. Further, since the vertical movement levers 97, 98 also move upward, the first and second storage pickups 59, 60 are pulled up by the coil springs 75, 76 and move upward to the original positions.

(Semiconductor Device Storage Operation) Next, the reciprocating operation and the suction operation of the storage pickup 11 for storing the semiconductor device will be described with reference to a timing chart shown in FIG. 13 and a schematic diagram showing the reciprocating operation shown in FIG. explain. In FIG. 13, the solid line on the upper side shows the timing of the reciprocating movement, the suction operation, the vertical movement and the like of the first storage pickup 59, and the broken line part on the middle side shows the reciprocating movement of the transfer tray 9 and the lever for the vertical movement by cam driving. The solid lines on the lower side indicate the timing of the reciprocating movement, the suction operation, the vertical movement, and the like of the second storage pickup 60. FIG. 14 shows the reciprocation of the first and second storage pickups 59 and 60 and the vertical movement of the first and second pickup heads 55 and 56 by arrows.
13 and 14, a dashed line R running vertically
Indicates an intermediate stop position in the second transfer path Q. still,
In the following description, the first and second storage pickups 59,
The drive of the servomotor when moving 60 from the transfer tray toward the storage tray will be described as forward drive, and the reverse drive will be described as reverse drive.

First, the transfer operation of the semiconductor device performed in connection with the storing operation by the storing pickup 11 will be described. When the first cam 16 provided on the cam shaft 15 driven to rotate by the electric motor 1 makes one rotation,
The swing lever 21 swings and the transfer tray 9 reciprocates along the guide rail 26. Specifically, the transfer tray 9 mounts the semiconductor device extracted by the cutting device 3 on the cutting-side mounting portion 9a waiting at the cutting position B, and transfers the semiconductor device to the rotating pickup 10. Reciprocate with C. At the same time, the storage-side mounting portion 9b reciprocates between the transfer position C and the transfer position D below the storage pickup 11 (see FIGS. 2 and 5). The cutting-side mounting portion 9a
The upper and lower rods 48 and the abutting members 50 move up and down when the second cam 17 provided on the cam shaft 15 makes one rotation, and the semiconductor device is transferred to the transfer position C. The semiconductor device is once suction-held by the suction pad 28 which has started the suction operation of the rotary pickup 10. In addition, the rotation cylinder 45 is operated to rotate the upper rotation plate 36, and the direction of the semiconductor device is changed by 90 ° in this embodiment to be held. When the storage-side mounting portion 9b of the transfer tray 9 returns to the transfer position C again,
By moving the rotary pickup 10 up and down, the semiconductor device sucked and held by the suction pad 28 is transferred to the housing-side mounting portion 9b (see FIGS. 2 and 8). Further, when the cam shaft 15 makes one more rotation, the semiconductor device mounted on the storage-side mounting portion 9b of the transfer tray 9 is transferred from the transfer position C to the transfer position D. As described later, the storage pickup 11 moves up and down, and the semiconductor device is delivered.

Referring to FIG. 13, the operation of the first storage pickup 59 for one cycle will be described first.
In the intermediate stop position R, the first storage pickup 59 stops (OFF) the operation of the vertical movement cylinder 77 and moves the height position of the first pickup head 55 to the upper transfer path Q.
1 to the lower transfer path Q2 (arrow in FIG. 14),
The servo motor 83 is rotated (reversely driven) to move to the transfer position D (see FIG. 2) on the transfer tray side (the mold side) (arrow in FIG. 14). The first storage pickup 5
When 9 reaches the delivery position D, the suction operation of the suction pad 54 provided on the first pickup head 55 is started.

When the vertical movement lever 97 is mounted so as to contact the horizontal extension 61a of the vertical mounting plate 61, the rotation of the third cam 18 provided on the cam shaft 15 causes the vertical rod to move. The first storage pickup 59 is further moved below the lower transfer path Q2 by moving the up / down movement lever 97 up and down via 94, and the semiconductor device is sucked and held from the cutting-side mounting portion 9b (arrow in FIG. 14). ). Next, the servo motor 83 is driven to rotate (forward rotation drive), and the first storage pickup 59 holds the height position of the first pickup head 55 in the lower transfer path Q2 while the ball shaft linear guide 80 The semiconductor device is transferred to the storage unit 12 while being suction-held while being guided by the guide (arrows in FIG. 14).

When the first storage pickup 59 reaches the storage tray, the first storage cylinder 57 is turned ON / OFF.
By turning it off, the first pickup head 55 is moved up and down (arrows in FIG. 14). At this time, when the first pickup head 55 reaches the lower end position, the suction pad 5
By stopping the suction operation by 4, the semiconductor device is stored in the storage tray. Then, the first storage pickup 59 activates (turns on) the vertical movement cylinder 77 and moves the height position of the first pickup head 55 from the lower transfer path Q2 to the upper transfer path Q1 against the coil spring 75. (Arrow in FIG. 14).

By driving the servo motor 83 in the reverse direction, the first storage pickup 59 is
The height position of the first pickup head 55 is set to the upper transfer path Q.
1 while moving to the intermediate stop position R while being guided by the ball shaft linear guide 80, and stopped (FIG. 1).
4 arrow). When the detection plate 88 blocks the optical axis of the position detection sensor 90 of the transfer guide 79, the first storage pickup 59 stops driving the servomotor 83 and waits.

Next, the movement of the second storage pickup 60 in one cycle will be described. When the first storage pickup 59 moves to the delivery position D of the semiconductor device (arrow in FIG. 14), the second storage pickup 60
Is operated while the vertical cylinder 78 is operated (ON) to maintain the height position of the second pickup head 56 in the upper transfer path Q1. It moves to the stop position R and stops (arrow in FIG. 14). When the detection plate 89 blocks the optical axis of the position detection sensor 91 of the transfer guide 79, the second storage pickup 60 stops driving the servo motor 83 and waits.

Then, the first storage pickup 59
When the semiconductor device is sucked and held and transferred to the storage section 12 and passes through the intermediate stop position R, the vertical movement cylinder 78 is stopped (OFF) and the height position of the second pickup head 56 is lowered to the lower transfer path. After moving down to Q2 (arrow in FIG. 14), the servo motor 83 is reversely driven by a predetermined amount and moved from the storage section 12 to the transfer position D on the transfer tray side (mold side) (arrow in FIG. 14). When the second storage pickup 60 reaches the delivery position D, the suction operation of the suction pad 54 provided on the second pickup head 56 is started.

When the vertical movement lever 98 is mounted so as to contact the horizontal extension 62a of the vertical mounting plate 62, the rotation of the third cam 18 provided on the cam shaft 15 causes the vertical rod The vertical movement lever 98 is moved up and down through 94 to move the second storage pickup 60 further below the lower transfer path Q2, and the semiconductor device is sucked and held from the cutting-side mounting portion 9b (arrow in FIG. 14). ).

Next, the servo motor 83 is driven to rotate forward,
The second storage pickup 60 holds the height position of the second pickup head 56 on the lower transfer path Q2,
The semiconductor device is transferred to the storage section 12 while being suction-held while being guided by the ball-axis linear guide 81 (arrow in FIG. 14). At this time, the first storage pickup 59 stores the semiconductor device in the storage unit 12 and then moves the vertical movement cylinder 7.
7 is operated (ON), the first pickup head 55 is moved to the intermediate stop position R and stopped while being guided by the ball shaft linear guide 80 while the height position of the first pickup head 55 is held in the upper transfer path Q1 (FIG. 14 arrow). When the second storage pickup 60 passes through the intermediate stop position R, the vertical movement cylinder 77 is stopped (OFF) and the first storage pickup 60 is stopped.
After lowering the height position of the pickup head 55 to the lower transfer path Q2 (arrow in FIG. 14), the servo motor 83 is driven in reverse rotation by a predetermined amount to transfer the transfer tray side (die side) from the storage unit 12 to the transfer tray side. D (arrow in FIG. 14).

As described above, the first and second pickup heads 55 and 56 connect the same suction line to the suction pad 54.
Are moved up and down, so that one of the pickups holding the semiconductor device by suction is held at the intermediate stop position R so as not to interfere with each other when passing on the second transfer path Q. Until passing through the intermediate stop position R of the second transfer path Q, the other pickup is stopped at a different height from the intermediate stop position R.

When the second storage pickup 60 reaches the storage tray, the second storage cylinder 58 is turned ON / OFF.
The second pickup head 56 is moved up and down by turning it off (arrow in FIG. 14). At this time, when the second pickup head 56 reaches the lower end position, the suction pad 5
By stopping the suction operation by 4, the semiconductor device is stored in the storage tray. Then, the second storage pickup 60 activates (turns on) the vertical movement cylinder 78, and moves the height position of the second pickup head 56 from the lower transfer path Q2 to the upper transfer path Q1 against the coil spring 76. (Arrow in FIG. 14). Then, by driving the servo motor 83 in the reverse direction, the second storage pickup 60 is guided by the ball axis linear guide 81 while the height position of the second pickup head 56 is held in the upper transfer path Q1. It moves to the intermediate stop position R and stops (arrow in FIG. 14).

By repeating the above operation, the semiconductor device mounted on the storage-side mounting portion 9b of the transfer tray 9 and transferred is alternately stored in the storage portion 12 by the first and second storage pickups 59 and 60. Can be transferred to and stored. In this embodiment, the processing speed of the cutting device 3 can be as high as about 60 spm.

According to the above configuration, the cycle time from the removal of the semiconductor device individually separated from the cutting device 3 from the mold by the transfer tray 9 to the storage in the storage section 12 can be reduced, and high-speed processing can be performed. became. In particular, the reciprocating movement of the transfer tray 9 required for removing the semiconductor device from the mold, which requires processing time, and the rotating pickup 10 for transfer.
Of the pickup 11 for storage provided on a cam shaft 15 driven to rotate by the electric motor 1.
Since the third and fourth cams 16 to 18 simultaneously transmit and synchronize the driving, high-speed processing is possible. Also, compared to the case where the individual operations from cutting to storage of the semiconductor device are performed by motor drive or cylinder drive, the number of drive sources and the installation of sensors are not required, so the number of parts can be reduced and the manufacturing can be omitted. It has also become possible to reduce costs. The first to third cams 16 to
By adjusting the cam curve 18, the transfer can be performed at a reduced speed just before the start of movement or immediately before the stop, so that the semiconductor device can be transferred safely without impact. Also,
Since the first and second storage pickups 59 and 60 are juxtaposed, it is possible to contribute to high-speed processing, and it is possible to improve productivity by giving approximately twice the storage capacity. Further, the first and second pickup heads 55, 5
6 moves up and down on the same suction line and alternately reciprocates without interfering when passing on the second transfer path Q, so that the installation area of the apparatus is effectively used and the apparatus can be downsized. Can contribute.

As described above, according to the present invention, in addition to the ordinary substrate board type BGA, the micro BGA, the tape BG
The semiconductor device cutting and accommodating device preferably used for manufacturing a BGA type semiconductor device such as A has been described. However, the present invention is not limited to the above-described embodiment, and may be used to manufacture other chip size packages or resin substrates for wiring. It goes without saying that many modifications can be made without departing from the spirit of the invention, such as application to various semiconductor device manufacturing.

[0057]

As described above, according to the present invention, it is possible to shorten the cycle time from the removal of the semiconductor device individually separated by the cutting means from the mold by the transfer means to the storage of the semiconductor device in the storage means, thereby enabling high-speed processing. became. In particular, a cam driven by the same drive source to reciprocate the transfer tray required to remove the semiconductor device from the mold, which requires processing time, move the pickup for rotation up and down, and move the pickup for storage up and down. Since a plurality of cams mounted on the shaft simultaneously transmit and synchronize the drive, high-speed processing is possible. Also, compared to the case where the individual operations from cutting to storage of the semiconductor device are performed by motor drive or cylinder drive, the number of drive sources and the installation of sensors are not required, so the number of parts can be reduced and the manufacturing can be omitted. It has also become possible to reduce costs. In addition, by adjusting the cam curves of the plurality of cams, the transfer can be performed at a reduced speed just before the start of movement or immediately before the stop, so that the semiconductor device can be transferred safely without impact. In addition, when the first and second storage pickups are arranged side by side, it is possible to contribute to high-speed processing and to improve productivity by giving approximately twice the storage capacity. In addition, when the first and second pickup heads move up and down on the same suction line and alternately reciprocate without interfering when passing on the second transfer path, the installation area of the apparatus is effective. To contribute to downsizing of the device.

[Brief description of the drawings]

FIG. 1 is a front view showing the overall configuration of a semiconductor device cutting and storing apparatus.

FIG. 2 is a schematic plan view of the semiconductor device cutting and storing apparatus of FIG.

FIG. 3 is a plan perspective view showing a drive transmission mechanism.

FIG. 4 is a front view showing a transfer tray and a driving mechanism thereof.

FIG. 5 is an explanatory view showing a transfer tray moving mechanism.

FIG. 6 is a front view and a component explanatory view of a rotary pickup.

FIG. 7 is an explanatory view showing a rotation mechanism of a rotation pickup.

FIG. 8 is an explanatory view showing a vertical movement mechanism of a rotary pickup.

FIG. 9 is a right side view of the storage pickup.

FIG. 10 is an explanatory diagram of a pickup head of the storage pickup of FIG. 9;

FIG. 11 is an explanatory diagram showing a second transfer path along which a pickup for storage moves.

FIG. 12 is an explanatory view showing a drive transmission mechanism of the storage pickup.

FIG. 13 is a timing chart showing the movement and suction operation of the storage pickup.

FIG. 14 is a schematic diagram showing a reciprocating operation of the pickup for storage.

FIG. 15 is an explanatory diagram of a conventional lead processing machine for manufacturing a semiconductor device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Electric motor 1a Top plate 2 Loading device 2a Conveyor belt 2b Roller 3 Cutting device 4 Press ram 5 Punch 6 Press bed 6a Guide post 7 Die 8 Transfer device 9 Transfer tray 9a Cutting-side mounting portion 9b Storage-side mounting portion 10 For rotation Pickup 11 Storage pickup 12 Storage section 12a Storage tray supply section 12b Storage tray storage section 13 Drive transmission mechanism 14, 85 Timing belt 15 Cam shaft 16 First cam 17 Second cam 18 Third cam 19, 82 Pulley 20 Rotary encoder 21, 46, 92 Swing lever 22 Movable block 23 Tension spring 24 Transfer tray support member 25, 67, 68 LM guide 26 Guide rail 27 Support plate 28, 54 Suction pad 29 Rotary pickup head 30 Lower plate 3 1 Intermediate Plate 32 Holding Rod 33, 42, 52, 75, 76, 96 Coil Spring 34, 43 Air Tube 35 Piping Rod 36 Upper Rotating Plate 37 Piping Block 38 Rotating Plate Holding Member 38a Bearing 39 Mounting Plate 39a Stopper Pin 40, 71, 72 Vertical rod 41, 51, 95 Stopper block 44 Cylinder holding plate 45 Rotating cylinder 47 Vertical movement block 48, 94 Vertical rod 49 Base plate 49a Cylindrical guide 50 Butt member 53 Fan-shaped extension 55 First pickup Head 56 Second pickup head 57 First storage cylinder 58 Second storage cylinder 59 First storage pickup 60 Second storage pickup 61,62 Vertical mounting plate 61a, 62a Horizontal extension 63,64 Horizontal mounting plate 5,66 Vertical guide rail 69,70 Head holding plate 73,74 Housing 77,78 Vertical moving cylinder 79 Transfer guide 80,81 Ball axis linear guide 83 Servo motor 84 Motor pulley 86,87 Moving body chassis 88,89 Detection plate 90, 91 Position detection sensor 93 Vertical movement plate 97, 98 Vertical movement lever

Claims (8)

[Claims] 1. A driving source; cutting means for individually cutting the semiconductor device from a substrate on which a plurality of semiconductor devices are formed driven by the driving source; and accommodating the semiconductor device cut by the cutting means. Storage means for taking out the semiconductor device after cutting along a first transfer path, and transferring the taken out semiconductor device to the storage means along a second transfer path; The removal of the semiconductor device by the transfer unit and the transfer operation of the removed semiconductor device to the storage unit are performed in a linked manner via a plurality of cams provided on a cam shaft that is driven to rotate more. A semiconductor device cutting and storing device, comprising: a drive transmission mechanism for transmitting drive. 2. The semiconductor device according to claim 1, wherein said transfer means is provided on a first transfer path for removing said semiconductor device after cutting.
And a second transfer means disposed on the second transfer path intersecting the first transfer path, receiving the semiconductor device from the first transfer means and transferring the semiconductor device to the storage means. The semiconductor device cutting and storing apparatus according to claim 1, further comprising: 3. The first transfer means mounts one or more of the semiconductor devices on the cutting-side mounting portion and the storage-side mounting portion, and receives reciprocation by being transmitted by the drive transmission mechanism. A transfer tray that is disposed in the first transfer path, and when the transfer tray reciprocates, receives the semiconductor device from the cutting-side mounting portion and rotates the semiconductor device by a predetermined angle to rotate the storage-side mounting portion. 3. The semiconductor device cutting and accommodating apparatus according to claim 2, further comprising a transfer means for transferring the data to a semiconductor device. 4. The transfer means includes a pickup head equipped with a suction pad capable of holding one or more of the semiconductor devices by suction, a turning means for turning the pickup head at a predetermined angle, and the drive transmission mechanism. 4. The apparatus for cutting and storing a semiconductor device according to claim 3, further comprising: a rotary pickup having a vertical movement mechanism for vertically moving the pickup head by driving transmission. 5. The second transfer means includes a pickup head for holding one or a plurality of the semiconductor devices, and a pickup head for holding the semiconductor device, the pickup head holding the semiconductor device being moved up and down to be placed on the storage means. A storage cylinder having a storage cylinder and reciprocating means for reciprocating the pickup head along the second transfer path, wherein the storage pickup is driven by the drive transmission mechanism to move vertically. 3. The apparatus for cutting and storing a semiconductor device according to claim 2, wherein the semiconductor device is transferred from the first transfer means and transferred to the storage means. 6. The first and second storage pickups, wherein the second transfer unit holds one or more of the semiconductor devices and transfers the semiconductor device to the storage unit alternately along the second transfer path. 6. A vertical movement means for moving the first and second storage pickups by changing their height positions in the second transfer path during forward movement and backward movement, respectively. A semiconductor device cutting and storing apparatus as described in the above. 7. The first and second storage pickups,
7. The semiconductor cutting and storing apparatus according to claim 6, wherein the suction pads of the first and second pickup heads are arranged to move up and down on the same line when the semiconductor device is sucked and held. . 8. Until one of the first and second storage pickups, which holds the semiconductor device by suction, passes through an intermediate stop position of the second transfer path, the other pickup remains at the intermediate position. The semiconductor device cutting and storing apparatus according to claim 7, wherein the semiconductor device is stopped at a different height from the stop position.