JPH11162232A - Led lighting module - Google Patents
Led lighting moduleInfo
- Publication number
- JPH11162232A JPH11162232A JP9323551A JP32355197A JPH11162232A JP H11162232 A JPH11162232 A JP H11162232A JP 9323551 A JP9323551 A JP 9323551A JP 32355197 A JP32355197 A JP 32355197A JP H11162232 A JPH11162232 A JP H11162232A
- Authority
- JP
- Japan
- Prior art keywords
- light
- substrate
- led
- lighting module
- control means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＬＥＤを用いた照
明モジュールに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lighting module using LEDs.
【０００２】[0002]
【従来の技術】従来の蛍光灯に代わる新しい光源とし
て、ＬＥＤによる照明が考えられるが、蛍光灯なみの輝
度（照度）を得るには、ＬＥＤチップを複数個並べる必
要がある。しかしＬＥＤチップを複数個並べると、放熱
や配光等種々の問題が発生する。従来ではＬＥＤチップ
個々に砲弾型のプラスチック（エポキシ樹脂やアクリル
やポリカーボネイト等）レンズで封止しているため、個
々のＬＥＤチップの発光は、全方向に広がり、光を有効
に利用できていない。2. Description of the Related Art As a new light source replacing a conventional fluorescent lamp, illumination by an LED can be considered. However, in order to obtain luminance (illuminance) comparable to that of a fluorescent lamp, it is necessary to arrange a plurality of LED chips. However, when a plurality of LED chips are arranged, various problems such as heat radiation and light distribution occur. Conventionally, each LED chip is sealed with a shell-type plastic (epoxy resin, acrylic, polycarbonate, etc.) lens, so that the light emission of each LED chip spreads in all directions, and the light cannot be used effectively.
【０００３】[0003]
【発明が解決しようとする課題】上述のようにＬＥＤの
配光又は集光の制御は個々のチップに夫々全方向に発光
するレンズを設けていたため、配光や集光の効率が悪い
という問題があった。また複数のＬＥＤチップを配列し
た場合、全体の光を制御するに当たっては、個々の砲弾
型のレンズ以外に更に配光や集光のための制御手段を必
要とし、効率が悪いという問題があった。要するに複数
個のＬＥＤチップ全体を考慮した設計が為されたものが
無かった。As described above, the control of the light distribution or light collection of the LED has a problem in that the efficiency of the light distribution or light collection is low because each chip is provided with a lens that emits light in all directions. was there. In the case of arranging a plurality of LED chips, in order to control the entire light, a control means for light distribution and light collection is required in addition to individual bullet-shaped lenses, and there is a problem that efficiency is low. . In short, there has been no design that considers the entirety of a plurality of LED chips.
【０００４】本発明は上記問題点に鑑みて為されたもの
で、その目的とするところは複数のＬＥＤチップを配列
したモジュールにおいて、効率良く配光又は集光の制御
が行えるＬＥＤ照明モジュールを提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide an LED lighting module in which a plurality of LED chips are arranged and in which light distribution or light collection can be controlled efficiently. Is to do.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に請求項１の発明では、ＬＥＤチップを複数個配列した
基板に、ＬＥＤチップからの光を集光又は配光を制御す
る光学制御手段を備えたことを特徴とする。請求項２の
発明では、請求項１の発明において、上記光学制御手段
を基板上のＬＥＤチップを封止する封止材料で構成した
ことを特徴とする。According to a first aspect of the present invention, there is provided an optical control means for condensing light from an LED chip or controlling light distribution on a substrate on which a plurality of LED chips are arranged. It is characterized by having. According to a second aspect of the present invention, in the first aspect, the optical control means is made of a sealing material for sealing the LED chip on the substrate.
【０００６】請求項３の発明では、請求項１の発明にお
いて、発光色が異なるＬＥＤチップを複数個基板に配列
し、光学制御手段の配光制御で発光色を制御することを
特徴とする。請求項４の発明では、請求項１の発明にお
いて、基板と光学制御手段を導光体で構成し、該導光体
の側面にＬＥＤチップを複数配列して前記側面とは異な
る導光体の面を発光させることを特徴とする。According to a third aspect of the present invention, in the first aspect of the present invention, a plurality of LED chips having different emission colors are arranged on a substrate, and the emission color is controlled by light distribution control of an optical control means. According to a fourth aspect of the present invention, in the first aspect of the present invention, the substrate and the optical control means are constituted by a light guide, and a plurality of LED chips are arranged on a side surface of the light guide, and the light guide is different from the side surface. The surface is made to emit light.
【０００７】請求項５の発明では、請求項１の発明にお
いて、光学制御手段を１乃至複数備えるとともに、少な
くとも一つの光学制御手段を可動自在としたことを特徴
とする。請求項６の発明では、請求項１乃至５の発明に
おいて、基板を樹脂成形回路基板により構成して成るこ
とを特徴とする。According to a fifth aspect of the present invention, in the first aspect of the invention, one or more optical control means are provided, and at least one optical control means is movable. According to a sixth aspect of the present invention, in the first to fifth aspects, the substrate is constituted by a resin molded circuit board.
【０００８】[0008]
【発明の実施の形態】以下、本発明を実施形態により詳
説する。 （実施形態１）本実施形態の ＬＥＤ照明モジュール２
は図１（ａ）（ｂ）に示すように複数（例えば１００
個）のＬＥＤチップ２０…を樹脂製の基板２１（例えば
５０×５０ｍｍ）表面に実装するとともに、ＬＥＤチッ
プ２０…を封止するように基板２１表面に透明なアクリ
ル樹脂の成形層２２を形成し、更にＬＥＤ照明モジュー
ル２全体の配光を考慮して発光制御を行うための光学制
御手段たるマイクロレンズを形成したマイクロレンズ板
２３を配置して構成されており、例えばＬＥＤ照明モジ
ュール２全体からの光りの発光角度が−６０°〜６０°
になるようにマイクロレンズ板２３により配光を設定し
てある。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to embodiments. (Embodiment 1) LED lighting module 2 of this embodiment
Are a plurality (for example, 100) as shown in FIGS.
) Are mounted on the surface of a resin substrate 21 (for example, 50 × 50 mm), and a transparent acrylic resin molding layer 22 is formed on the surface of the substrate 21 so as to seal the LED chips 20. Further, a microlens plate 23 on which a microlens serving as an optical control means for performing light emission control in consideration of the light distribution of the entire LED lighting module 2 is arranged. Light emission angle is -60 ° to 60 °
The light distribution is set by the microlens plate 23 so that
【０００９】図１（ｂ）の矢印は光の向きを示す。図２
は以上のように構成されたＬＥＤ照明モジュール２を用
いた照明器具４を構成した例を示しており、図示するよ
うに器具本体１の下面に配設して器具本体１の下面を光
透過性のカバー３で覆って薄型の照明器具４を構成して
いる。本実施形態では、複数のＬＥＤチップ２０…を一
枚の基板２１に配列してあるので効率良く配光制御を行
うことが可能な上に、マイクロレンズ板２３によりＬＥ
Ｄチップ２０の実装に関係なく配光制御を行うことがで
きる。 （実施形態２）上記実施形態１のＬＥＤ照明モジュール
２ではマイクロレンズ板２３をＬＥＤチップ２０…を封
止した成形層２２とは別体に形成配置しているが、本実
施形態では、図３に示すように成形層２２の表面に球面
加工や任意の形状を加工して個々のＬＥＤチップ２０…
からの光の配光を制御する光学制御手段であるマイクロ
レンズを備えたマイクロレンズ２３’を形成してある。
その他の構成は実施形態１と同じである。The arrow in FIG. 1B indicates the direction of light. FIG.
Shows an example in which a lighting fixture 4 using the LED lighting module 2 configured as described above is configured. The lighting fixture 4 is disposed on the lower surface of the fixture main body 1 as shown in FIG. To form a thin lighting device 4. In the present embodiment, since a plurality of LED chips 20 are arranged on one substrate 21, the light distribution control can be performed efficiently.
Light distribution control can be performed regardless of the mounting of the D chip 20. (Embodiment 2) In the LED lighting module 2 of Embodiment 1 described above, the microlens plate 23 is formed and arranged separately from the molding layer 22 in which the LED chips 20 are sealed. As shown in FIG. 3, the surface of the molding layer 22 is processed into a spherical shape or an arbitrary shape to form individual LED chips 20.
A microlens 23 'having a microlens, which is an optical control means for controlling the distribution of light from the lens, is formed.
Other configurations are the same as the first embodiment.
【００１０】勿論ＬＥＤチップ２０個々に光学制御手段
を対応させずに、複数個のＬＥＤチップ２０…（２個〜
任意の個数）からの光を同時に配光制御するよう光学制
御手段を形成しても良い。而して本実施形態のＬＥＤ照
明モジュール２のＬＥＤチップ２０…の光はマイクロレ
ンズ２３’により矢印で示すように配光制御されること
になる。Of course, a plurality of LED chips 20... (2 to
Optical control means may be formed so as to simultaneously control the light distribution of light from any number. Thus, the light distribution of the LED chips 20 of the LED lighting module 2 of the present embodiment is controlled by the microlenses 23 'as shown by arrows.
【００１１】以上のように構成された本実施形態では、
封止材料である成形層２２とマイクロレンズ２３’とを
一体形成してあるので、光のロスが少なくて効率が良
く、また複数個のＬＥＤチップ２０…の配光制御が可能
となるという利点がある。 （実施形態３）蛍光灯に代わって新しい光源とするに
は、太陽構成に近い白色光の発光も必要となる場合があ
る。In the embodiment configured as described above,
Since the molding layer 22, which is a sealing material, and the microlenses 23 'are integrally formed, light loss is small, the efficiency is high, and the light distribution of the plurality of LED chips 20 can be controlled. There is. (Embodiment 3) In order to replace a fluorescent lamp with a new light source, it may be necessary to emit white light close to a solar configuration.
【００１２】この点に鑑みて本実施形態は発光色の異な
るＬＥＤチップを配列し、幾つかの色を混ぜて必要な色
を作るよう構成したもので、異なる色の光を混ぜるよう
に光学制御手段により配光制御を行うようになってい
る。図４はその具体的構成を示しており、ＬＥＤ照明モ
ジュール２は、樹脂製基板２１上に、例えば青色光を発
光するＬＥＤチップ２０B 、緑色光を発光するＬＥＤチ
ップ２０G 、赤色光を発光するＬＥＤチップ２０R 、黄
色光を発光するＬＥＤチップ２０Y の４つのＬＥＤチッ
プを所定間隔で配列し、夫々のＬＥＤチップ２０B 、２
０G 、２０R 、２０Y に対応したプリズム２４B 、２４
G 、２４R 、２４Y をチップ前方に配置し、夫々のＬＥ
Ｄチップ２０B 、２０G 、２０R 、２０Y からの光をプ
リズム２４B 、２４G 、２４R 、２４Y により配光制御
して基板２１の中央部で混ぜ合わせ白色光Ｗとするよう
になっている。In view of this point, in the present embodiment, LED chips having different emission colors are arranged, and some colors are mixed to form a required color. Optical control is performed so that lights of different colors are mixed. Light distribution control is performed by means. FIG. 4 shows a specific configuration thereof. The LED lighting module 2 includes, for example, an LED chip 20 B emitting blue light, an LED chip 20 G emitting green light, and emitting red light on a resin substrate 21. LED chips 20 R, the four LED chips of the LED chip 20 Y that emits yellow light are arranged at predetermined intervals, each LED chip 20 B, 2 to
Prisms 24 B , 24 corresponding to 0 G , 20 R , 20 Y
G , 24 R and 24 Y are placed in front of the chip, and each LE
The light from the D chips 20 B , 20 G , 20 R , and 20 Y is controlled by the prisms 24 B , 24 G , 24 R , and 24 Y so that the white light W is mixed at the center of the substrate 21. Has become.
【００１３】以上のように構成された本実施形態では、
略白色光Ｗを得ることができるので、種々の用途に用い
ることが可能となるという利点がある。勿論プリズム等
の光学制御手段により配光を制御することにより任意の
色を得ることも可能となる。 （実施形態４）本実施形態は図５に示すようにＬＥＤ照
明モジュール２は、ＬＥＤチップ２０…を配列実装して
樹脂封止した基板２１を光学制御手段であるアクリル樹
脂製の直方体状の導光体２５の一側面に配置して構成さ
れるものである。In the embodiment configured as described above,
Since substantially white light W can be obtained, there is an advantage that it can be used for various applications. Of course, an arbitrary color can be obtained by controlling the light distribution by optical control means such as a prism. (Embodiment 4) In this embodiment, as shown in FIG. 5, the LED lighting module 2 has a rectangular parallelepiped board made of acrylic resin, which is an optical control means, which is a board 21 in which LED chips 20 are arranged and mounted and resin-sealed. It is configured by being arranged on one side surface of the light body 25.
【００１４】導光体２５は上記基板２１を配置した一側
面に直交する別の側面の表面に反射パターン２６ａを印
刷した反射パターンシート２６を配置している。またＬ
ＥＤチップ２０…を実装した基板２１の表面側を、ＬＥ
Ｄチップ２０…からの光が導光体２５内に効率良く入射
するように反射板（図示せず）で覆っている。反射パタ
ーンシート２６は反射パターン２６ａを白色で印刷し、
任意の配光を行うことが可能なようにしており、反射パ
ターン２６ａは円形で基板２１に近い方の密度が疎で、
基板２１から遠くなる程密になるようにしてある。The light guide 25 has a reflection pattern sheet 26 on which a reflection pattern 26a is printed on the surface of another side surface orthogonal to one side surface on which the substrate 21 is disposed. Also L
The front side of the substrate 21 on which the ED chips 20 are mounted is LE
The light from the D chips 20 is covered with a reflector (not shown) so as to efficiently enter the light guide 25. The reflection pattern sheet 26 prints the reflection pattern 26a in white,
Arbitrary light distribution can be performed, and the reflection pattern 26a is circular and has a low density near the substrate 21.
The density is increased as the distance from the substrate 21 increases.
【００１５】而してＬＥＤチップ２０…から出た光は、
導光体２５内に入射して反射パターン２６ａ等により多
重反射して反射パターンシート２６ａと対向する側面か
ら矢印で示すように出射する。ここで導光体２５内では
光が多重反射して均一な輝度分布となるため、ＬＥＤチ
ップ２０…の輝度むらがなくなる。The light emitted from the LED chips 20 is
The light enters the light guide 25, is multiply reflected by the reflection pattern 26a or the like, and emerges from the side facing the reflection pattern sheet 26a as indicated by the arrow. Here, since the light is multiply reflected in the light guide 25 to have a uniform luminance distribution, the luminance unevenness of the LED chips 20 is eliminated.
【００１６】尚反射パターン２６ａは直接導光体２５の
表面に印刷しても良く、また印刷以外にも溝加工等で乱
反射するようにしても良い。この場合光の出射が導光体
２５の両側面から行われ、光効率を向上させることがで
きる。また基板２１の表面を封止する封止樹脂材で導光
体２５を一体形成しても良い。更に使用ＬＥＤチップ２
０は単色のものでもよいが、発光色の異なる複数種のＬ
ＥＤチップを用いても良く、この場合、導光体２５内部
の多重反射により、光が混ざり易く、任意の色を得るこ
とが可能となる。The reflection pattern 26a may be printed directly on the surface of the light guide 25, or may be irregularly reflected by groove processing or the like in addition to printing. In this case, light is emitted from both side surfaces of the light guide 25, so that light efficiency can be improved. Further, the light guide 25 may be formed integrally with a sealing resin material for sealing the surface of the substrate 21. Use LED chip 2
0 may be a single color, but a plurality of types of L having different emission colors may be used.
An ED chip may be used. In this case, light is easily mixed due to multiple reflection inside the light guide 25, and an arbitrary color can be obtained.
【００１７】以上のように構成して本実施形態では、配
光制御が導光体２５そのもので可能となるので、光源の
イメージが無くなり、更に色を混ぜる際にも単一のＬＥ
Ｄチップからの発光を一つ一つ制御する必要がなく、導
光体２５以外の学制御手段を省略できるという利点があ
る。 （実施形態５）上記実施形態１乃至４では光学制御手段
を固定配置したものであるが、本実施形態では光学制御
手段を可動可能にしたものである。In the present embodiment constructed as described above, the light distribution can be controlled by the light guide 25 itself, so that the image of the light source is eliminated and a single LE is used when mixing colors.
There is an advantage that it is not necessary to control the light emission from the D chip one by one, and that the scientific control means other than the light guide 25 can be omitted. (Embodiment 5) In Embodiments 1 to 4, the optical control means is fixedly arranged, but in this embodiment, the optical control means is movable.
【００１８】図６は本実施形態の一例を示しており、本
実施形態のＬＥＤ照明モジュール２は、図示するように
基板２１と、基板２１に形成した凹部２１ａ内に配列さ
れた赤色、緑色、青色の各ＬＥＤチップ２０R 、２
０G 、２０B と、封止のための成形層２２と、固定され
た配光制御のための光学制御手段たるプリズムレンズ板
２７ａと、このプリズムレンズ板２７ａの前方に基板２
１と平行する面方向に回転自在に配置した同一形状のプ
リズムレンズ板２７ｂとで構成されている。FIG. 6 shows an example of this embodiment. An LED lighting module 2 according to this embodiment comprises a substrate 21 and red, green, Each blue LED chip 20 R , 2
0 G , 20 B , a molding layer 22 for sealing, a fixed prism lens plate 27 a as optical control means for controlling light distribution, and a substrate 2 in front of the prism lens plate 27 a.
1 and a prism lens plate 27b of the same shape that is rotatably arranged in a plane direction parallel to 1.
【００１９】而してプリズムレンズ板２７ｂの回転させ
ることにより、基板２１に配列したＬＥＤチップ２
０R 、２０G 、２０B 全体の配光を制御して混色の具合
を変化させることができる。勿論ＬＥＤチップとして単
色のものを配列しても良い。また図６は例では、２枚の
プリズムレンズ板２７ａ，２７ｂの内、一方２７ｂを回
転させるようにしてあるが、２枚共回転できるようにし
ても良い。更に可動可能なプリズムレンズ板一枚で光学
制御手段を構成しても良い。By rotating the prism lens plate 27b, the LED chips 2 arranged on the substrate 21 are rotated.
It is possible to change the degree of color mixing by controlling the light distribution of the entire 0 R , 20 G , and 20 B. Of course, a single color LED chip may be arranged. In FIG. 6, one of the two prism lens plates 27a, 27b is rotated in the example, but one of the two prism lens plates 27a, 27b may be rotated. Further, the optical control means may be constituted by a single movable prism lens plate.
【００２０】図７は本実施形態の別の例を示しており、
この例では、基板２１に断面が略直角三角形の突部２１
ｂを複数列平行形成し、各突部２１ｂの傾斜面にＬＥＤ
チップ２０…を配列して実装する段階でＬＥＤチップ２
０…の配光を制御し、この前方に基板２１と平行する面
に回転自在にマイクロレンズ板２８を配置したもので、
レンズ部を一つとしている。FIG. 7 shows another example of the present embodiment.
In this example, a projection 21 having a substantially right triangle
b are formed in parallel in a plurality of rows, and LED is provided on the inclined surface of each projection 21b.
LED chips 2 at the stage of arranging and mounting chips 20.
The light distribution of 0 is controlled, and a microlens plate 28 is rotatably disposed in front of the light distribution on a surface parallel to the substrate 21.
One lens unit.
【００２１】このように本実施形態では上記のようにプ
リズムレンズ板２７ｂやマイクロレンズ板２８のように
光学制御手段として少なくとも可動可能なものを一つ用
い、該光学制御手段を可動することにより、配光を任意
に変えることができ、ユーザの好みにあった配光制御が
設置場所で容易に行える。従ってＬＥＤ照明モジュール
２を組み込んで構成される照明器具では配光を変える
際、照明器具自体の向きを変える必要がないという利点
がある。As described above, in the present embodiment, at least one movable optical control means such as the prism lens plate 27b and the microlens plate 28 is used as described above, and the optical control means is moved. The light distribution can be changed arbitrarily, and light distribution control suited to the user's preference can be easily performed at the installation location. Therefore, there is an advantage that the lighting fixture configured by incorporating the LED lighting module 2 does not need to change the direction of the lighting fixture itself when changing the light distribution.
【００２２】（実施形態６）本実施形態は図８に示すよ
う立体形状に成形可能なＭＩＤ基板からなる基板２１に
よりＬＥＤチップ２０…の実装方向を制御してＬＥＤチ
ップ２０…の配光方向も制御するようにしたものであ
る。従って、プリズムレンズ板２７等の光学制御手段と
組み合わせることにより正確な配光制御が可能となる。(Embodiment 6) In this embodiment, as shown in FIG. 8, the mounting direction of the LED chips 20 is controlled by a substrate 21 made of a MID substrate which can be formed into a three-dimensional shape, and the light distribution direction of the LED chips 20 is also changed. It is intended to be controlled. Therefore, accurate light distribution control becomes possible by combining with optical control means such as the prism lens plate 27.
【００２３】ＭＩＤ基板に用いる樹脂材料は、どのよう
な樹脂材料であっても良いが、基板の電気特性や放熱特
性に優れた材料が望ましく、本実施形態では液晶ポリマ
ーを用いた。また配光方向にＬＥＤチップ２０…が実装
されるように実施形態５の図７の例と同様に断面直角三
角形状の突部２１ｂを形成した三次元形状とし、該突部
２１ｂの斜面を実装面としてある。The resin material used for the MID substrate may be any resin material, but a material having excellent electrical characteristics and heat radiation characteristics of the substrate is desirable. In this embodiment, a liquid crystal polymer is used. Also, as in the example of FIG. 7 of the fifth embodiment, the projection 21b is formed in a three-dimensional shape having a right-angled triangular cross-section so that the LED chips 20 are mounted in the light distribution direction. There is as a face.
【００２４】以上のように構成された本実施形態ではＭ
ＩＤ基板を用いることによりＬＥＤチップ２０を高密度
に配列した小型なＬＥＤ照明モジュール２を実現でき、
また立体形状が可能となるため、光学制御の設計自由度
が大きいという利点がある。In the present embodiment configured as described above, M
By using the ID substrate, a small LED lighting module 2 in which the LED chips 20 are arranged at a high density can be realized,
Further, since a three-dimensional shape is possible, there is an advantage that the degree of freedom in designing optical control is large.
【００２５】[0025]
【発明の効果】請求項１の発明は、ＬＥＤチップを複数
個配列した基板に、ＬＥＤチップからの光を集光又は配
光を制御する光学制御手段を備えたので、ＬＥＤチップ
から配列した基板で効率良く配光又は集光を制御するこ
ができ、またＬＥＤチップの実装に関係なく配光又は集
光を行うことが可能となるという効果がある。According to the first aspect of the present invention, since a substrate on which a plurality of LED chips are arranged is provided with optical control means for condensing or controlling light distribution from the LED chips, the substrate on which the LED chips are arranged is arranged. Thus, light distribution or light collection can be efficiently controlled, and light distribution or light collection can be performed irrespective of the mounting of the LED chip.
【００２６】請求項２の発明は、請求項１の発明におい
て、上記光学制御手段を基板上のＬＥＤチップを封止す
る封止材料で構成したので、封止材料と光学制御手段と
が同じものとなり、そのため光のロスが少なく、効率が
良く、また複数のＬＥＤチップの配光又は集光の制御が
可能となるという効果がある。請求項３の発明は、請求
項１の発明において、発光色が異なるＬＥＤチップを複
数個基板に配列し、光学制御手段の配光制御で発光色を
制御するので、白色光に近い光を得ることができるのは
勿論のこと、任意の色の光を得ることが可能となるとい
う効果がある。According to a second aspect of the present invention, in the first aspect of the present invention, the optical control means is made of a sealing material for sealing the LED chip on the substrate. Therefore, there is an effect that light loss is small, efficiency is high, and light distribution or light collection of a plurality of LED chips can be controlled. According to a third aspect of the present invention, in the first aspect of the invention, a plurality of LED chips having different emission colors are arranged on a substrate, and the emission color is controlled by the light distribution control of the optical control means, so that light close to white light is obtained. It is possible to obtain light of an arbitrary color as well as the effect of being able to obtain light of any color.
【００２７】請求項４の発明は、請求項１の発明におい
て、基板と光学制御手段を導光体で構成し、該導光体の
側面にＬＥＤチップを複数配列して前記側面とは異なる
導光体の面を発光させるので、光源のイメージが無くな
り、また色を混ぜるにも単一のＬＥＤチップからの光を
一つ一つ制御する必要がなく、光学制御手段を導光体の
みとすることができるという効果がある。According to a fourth aspect of the present invention, in the first aspect of the present invention, the substrate and the optical control means are constituted by a light guide, and a plurality of LED chips are arranged on a side surface of the light guide, and a light guide different from the side surface is provided. Since the surface of the light body emits light, the image of the light source is lost, and it is not necessary to control the light from a single LED chip one by one even when mixing colors, and the optical control means is only a light guide. There is an effect that can be.
【００２８】請求項５の発明は、請求項１の発明におい
て、光学制御手段を１乃至複数備えるとともに、少なく
とも一つの光学制御手段を可動自在としたので、光学制
御手段の向きを変えることにより、配光を制御すること
ができ、そのため配光を変える場合に照明器具の向きを
変える必要もなく、しかもユーザの好みに応じた配光を
設置場所で容易に設定することができるという効果があ
る。According to a fifth aspect of the present invention, in the first aspect of the present invention, one or more optical control means are provided and at least one optical control means is movable. It is possible to control the light distribution, so that it is not necessary to change the direction of the lighting equipment when changing the light distribution, and it is possible to easily set the light distribution according to the user's preference at the installation location. .
【００２９】請求項６の発明は、請求項１乃至５の発明
において、基板を樹脂成形回路基板により構成してある
ので、ＬＥＤチップの実装方向等で配光制御を行うこと
ができ、しかもＬＥＤチップの高密度配列や、モジュー
ル全体の小型化を可能とし、また基板形状の立体化が容
易で、光学制御の設計自由度が大きいという効果があ
る。According to a sixth aspect of the present invention, in the first to fifth aspects, since the substrate is formed of a resin-molded circuit board, light distribution can be controlled in the mounting direction of the LED chip and the like. The present invention has the effects of enabling high-density arrangement of chips and miniaturization of the entire module, easy formation of a three-dimensional substrate shape, and great freedom in designing optical control.
【図１】（ａ）は本発明の実施形態１のＬＥＤ照明モジ
ュールの斜視図である。（ｂ）は同上の概略構成図であ
る。FIG. 1A is a perspective view of an LED lighting module according to Embodiment 1 of the present invention. (B) is a schematic block diagram of the same.
【図２】同上を用いた照明器具の一部破断せる斜視図で
ある。FIG. 2 is a partially cutaway perspective view of the lighting apparatus using the above.
【図３】本発明の実施形態２の概略構成図である。FIG. 3 is a schematic configuration diagram of Embodiment 2 of the present invention.
【図４】本発明の実施形態３の概略構成図である。FIG. 4 is a schematic configuration diagram of Embodiment 3 of the present invention.
【図５】本発明の実施形態４の概略分解斜視図である。FIG. 5 is a schematic exploded perspective view of Embodiment 4 of the present invention.
【図６】本発明の実施形態５の一例の概略構成図であ
る。FIG. 6 is a schematic configuration diagram of an example of Embodiment 5 of the present invention.
【図７】同上の別の例の概略構成図である。FIG. 7 is a schematic configuration diagram of another example of the above.
【図８】本発明の実施形態６の概略構成図である。FIG. 8 is a schematic configuration diagram of Embodiment 6 of the present invention.
２ ＬＥＤ照明モジュール ２０ ＬＥＤチップ ２１ 基板 ２２ 成形層 ２３ マイクロレンズ板 2 LED lighting module 20 LED chip 21 Substrate 22 Molding layer 23 Micro lens plate
───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 俊之 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 塩浜 英二 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 杉本 勝 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 山本 正平 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 橋爪 二郎 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 秋庭 泰史 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 田中 孝司 大阪府門真市大字門真1048番地松下電工株 式会社内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Toshiyuki Suzuki 1048 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Works, Ltd. (72) Inventor Eiji Shiohama 1048 Kadoma Kadoma, Kadoma City, Osaka Matsushita Electric Works Co., Ltd. ( 72) Inventor Masaru Sugimoto 1048, Kazuma Kadoma, Kadoma City, Osaka Prefecture, Japan (72) Inventor Shohei Yamamoto 1048, Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Works, Ltd. 1048, Kadoma, Kadoma, Matsushita Electric Works, Ltd. (72) Inventor Yasufumi Akiba, Kazuma, Kazuma, Osaka 1048, Matsushita Electric Works, Ltd. Within a stock company
Claims (6)
ＥＤチップからの光を集光又は配光を制御する光学制御
手段を備えたことを特徴とするＬＥＤ照明モジュール。1. A substrate on which a plurality of LED chips are arranged,
An LED lighting module comprising: an optical control unit that controls light collection or light distribution from an ED chip.
を封止する封止材料で構成したことを特徴とする請求項
１記載のＬＥＤ照明モジュール。2. The LED lighting module according to claim 1, wherein said optical control means is made of a sealing material for sealing an LED chip on a substrate.
に配列し、光学制御手段の配光制御で発光色を制御する
ことを特徴とする請求項１記載のＬＥＤ照明モジュー
ル。3. The LED lighting module according to claim 1, wherein a plurality of LED chips having different emission colors are arranged on the substrate, and the emission colors are controlled by light distribution control of an optical control means.
導光体の側面にＬＥＤチップを複数配列して前記側面と
は異なる導光体の面を発光させることを特徴とする請求
項１記載のＬＥＤ照明モジュール。4. A light guide comprising a substrate and an optical control means, wherein a plurality of LED chips are arranged on a side surface of the light guide, and a light guide surface different from the side surface emits light. The LED lighting module according to claim 1.
に、少なくとも一つの光学制御手段を可動自在としたこ
とを特徴とする請求項１記載のＬＥＤ照明モジュール。5. The LED lighting module according to claim 1, further comprising one or more optical control means, wherein at least one optical control means is movable.
とを特徴とする請求項１乃至請求項５記載のＬＥＤ照明
モジュール。6. The LED lighting module according to claim 1, wherein the substrate is formed of a resin molded circuit board.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32355197A JP3505985B2 (en) | 1997-11-25 | 1997-11-25 | LED lighting module |
| TW087119454A TW408497B (en) | 1997-11-25 | 1998-11-24 | LED illuminating apparatus |
| DE69841798T DE69841798D1 (en) | 1997-11-25 | 1998-11-25 | Luminaire with light emitting diodes |
| EP98203973A EP0921568B1 (en) | 1997-11-25 | 1998-11-25 | LED Luminaire |
| US09/199,893 US6331063B1 (en) | 1997-11-25 | 1998-11-25 | LED luminaire with light control means |
| US09/895,354 US20020006040A1 (en) | 1997-11-25 | 2001-06-29 | Led luminaire with light control means |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32355197A JP3505985B2 (en) | 1997-11-25 | 1997-11-25 | LED lighting module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11162232A true JPH11162232A (en) | 1999-06-18 |
| JP3505985B2 JP3505985B2 (en) | 2004-03-15 |
Family
ID=18155970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32355197A Expired - Fee Related JP3505985B2 (en) | 1997-11-25 | 1997-11-25 | LED lighting module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3505985B2 (en) |
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6396082B1 (en) * | 1999-07-29 | 2002-05-28 | Citizen Electronics Co., Ltd. | Light-emitting diode |
| JP2002231023A (en) * | 2001-01-30 | 2002-08-16 | Rabo Sufia Kk | Interior lighting apparatus |
| JP2002324409A (en) * | 2001-01-20 | 2002-11-08 | Koninkl Philips Electronics Nv | Colored lighting system |
| JP2003109415A (en) * | 2001-10-01 | 2003-04-11 | Matsushita Electric Ind Co Ltd | Lighting system and its manufacturing method |
| US6809475B2 (en) | 2000-06-15 | 2004-10-26 | Lednium Pty Limited | Led lamp with light-emitting junctions arranged in a three-dimensional array |
| EP1521031A2 (en) | 2003-09-30 | 2005-04-06 | Toshiba Lighting & Technology Corporation | Light emitting diode lighting appliance and light emitting diode emergency light using the same |
| JP2006048165A (en) * | 2004-07-30 | 2006-02-16 | Matsushita Electric Works Ltd | Signal light |
| JP2006303509A (en) * | 2005-04-21 | 2006-11-02 | Crf Soc Consortile Per Azioni | Method of manufacturing transparent device having light emitting diode |
| JP2006332638A (en) * | 2005-04-28 | 2006-12-07 | Toyoda Gosei Co Ltd | Light emitting diode apparatus |
| JP2007053352A (en) * | 2005-07-22 | 2007-03-01 | Showa Denko Kk | Light emitting diode light source |
| JP2007101932A (en) * | 2005-10-05 | 2007-04-19 | Matsushita Electric Ind Co Ltd | Display device |
| US7320632B2 (en) | 2000-06-15 | 2008-01-22 | Lednium Pty Limited | Method of producing a lamp |
| KR100824716B1 (en) * | 2006-04-07 | 2008-04-24 | 박종길 | Led chip on board type flat light source module and liquid crystal display comprising the same |
| US7436000B2 (en) | 2005-01-26 | 2008-10-14 | Samsung Electronics Co., Ltd. | Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source |
| US7484877B2 (en) | 2006-05-12 | 2009-02-03 | Epson Imaging Devices Corporation | Light emitting device and liquid crystal device |
| JP2009117375A (en) * | 2009-01-13 | 2009-05-28 | Rabo Sufia Kk | Indoor illuminating device |
| JP2009171904A (en) * | 2008-01-25 | 2009-08-06 | Panasonic Corp | Light emitting diode illuminator |
| US7704762B2 (en) | 2002-06-14 | 2010-04-27 | Lednium Technology Pty Limited | Lamp and method of producing a lamp |
| JP2012234906A (en) * | 2011-04-28 | 2012-11-29 | Panasonic Corp | Light-emitting device and luminaire using the same |
| WO2012176699A1 (en) * | 2011-06-23 | 2012-12-27 | シャープ株式会社 | Light source module, illuminating apparatus, display apparatus, and television receiver |
| JP2014107502A (en) * | 2012-11-29 | 2014-06-09 | Citizen Holdings Co Ltd | Light emitting device |
| US8866168B2 (en) | 2006-04-18 | 2014-10-21 | Lighting Science Group Corporation | Optical devices for controlled color mixing |
| JP2017174832A (en) * | 2011-01-11 | 2017-09-28 | 東芝ライテック株式会社 | Illumination tool |
| JP2018041747A (en) * | 2017-12-13 | 2018-03-15 | 東芝ライテック株式会社 | Lighting fixture |
| JP2018120961A (en) * | 2017-01-25 | 2018-08-02 | パナソニックＩｐマネジメント株式会社 | Light-emitting device and illumination device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4231540B1 (en) | 2008-04-23 | 2009-03-04 | 浩太 須田 | Drilling instrument guide device and drilling device |
-
1997
- 1997-11-25 JP JP32355197A patent/JP3505985B2/en not_active Expired - Fee Related
Cited By (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6396082B1 (en) * | 1999-07-29 | 2002-05-28 | Citizen Electronics Co., Ltd. | Light-emitting diode |
| US6809475B2 (en) | 2000-06-15 | 2004-10-26 | Lednium Pty Limited | Led lamp with light-emitting junctions arranged in a three-dimensional array |
| US7352127B2 (en) | 2000-06-15 | 2008-04-01 | Lednium Pty Limited | LED lamp with light-emitting junction arranged in three-dimensional array |
| US7320632B2 (en) | 2000-06-15 | 2008-01-22 | Lednium Pty Limited | Method of producing a lamp |
| JP2002324409A (en) * | 2001-01-20 | 2002-11-08 | Koninkl Philips Electronics Nv | Colored lighting system |
| JP2002231023A (en) * | 2001-01-30 | 2002-08-16 | Rabo Sufia Kk | Interior lighting apparatus |
| JP2003109415A (en) * | 2001-10-01 | 2003-04-11 | Matsushita Electric Ind Co Ltd | Lighting system and its manufacturing method |
| US7704762B2 (en) | 2002-06-14 | 2010-04-27 | Lednium Technology Pty Limited | Lamp and method of producing a lamp |
| EP1521031A2 (en) | 2003-09-30 | 2005-04-06 | Toshiba Lighting & Technology Corporation | Light emitting diode lighting appliance and light emitting diode emergency light using the same |
| JP2006048165A (en) * | 2004-07-30 | 2006-02-16 | Matsushita Electric Works Ltd | Signal light |
| US7932970B2 (en) | 2005-01-26 | 2011-04-26 | Samsung Electronics Co., Ltd. | Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source |
| US8368846B2 (en) | 2005-01-26 | 2013-02-05 | Samsung Display Co., Ltd. | Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source |
| US7436000B2 (en) | 2005-01-26 | 2008-10-14 | Samsung Electronics Co., Ltd. | Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source |
| JP2006303509A (en) * | 2005-04-21 | 2006-11-02 | Crf Soc Consortile Per Azioni | Method of manufacturing transparent device having light emitting diode |
| JP2006332638A (en) * | 2005-04-28 | 2006-12-07 | Toyoda Gosei Co Ltd | Light emitting diode apparatus |
| JP2007053352A (en) * | 2005-07-22 | 2007-03-01 | Showa Denko Kk | Light emitting diode light source |
| JP2007101932A (en) * | 2005-10-05 | 2007-04-19 | Matsushita Electric Ind Co Ltd | Display device |
| KR100824716B1 (en) * | 2006-04-07 | 2008-04-24 | 박종길 | Led chip on board type flat light source module and liquid crystal display comprising the same |
| US8866168B2 (en) | 2006-04-18 | 2014-10-21 | Lighting Science Group Corporation | Optical devices for controlled color mixing |
| US7484877B2 (en) | 2006-05-12 | 2009-02-03 | Epson Imaging Devices Corporation | Light emitting device and liquid crystal device |
| JP2009171904A (en) * | 2008-01-25 | 2009-08-06 | Panasonic Corp | Light emitting diode illuminator |
| JP2009117375A (en) * | 2009-01-13 | 2009-05-28 | Rabo Sufia Kk | Indoor illuminating device |
| JP2017174832A (en) * | 2011-01-11 | 2017-09-28 | 東芝ライテック株式会社 | Illumination tool |
| JP2012234906A (en) * | 2011-04-28 | 2012-11-29 | Panasonic Corp | Light-emitting device and luminaire using the same |
| WO2012176699A1 (en) * | 2011-06-23 | 2012-12-27 | シャープ株式会社 | Light source module, illuminating apparatus, display apparatus, and television receiver |
| JP2014107502A (en) * | 2012-11-29 | 2014-06-09 | Citizen Holdings Co Ltd | Light emitting device |
| JP2018120961A (en) * | 2017-01-25 | 2018-08-02 | パナソニックＩｐマネジメント株式会社 | Light-emitting device and illumination device |
| JP2018041747A (en) * | 2017-12-13 | 2018-03-15 | 東芝ライテック株式会社 | Lighting fixture |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3505985B2 (en) | 2004-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3505985B2 (en) | LED lighting module | |
| US7534008B2 (en) | Backlight unit and light source for use in same | |
| EP0921568B1 (en) | LED Luminaire | |
| US7830356B2 (en) | Surface light source using LED and backlight unit having the surface light source | |
| US7210839B2 (en) | Backlight system and liquid crystal display employing the same | |
| US7309151B2 (en) | Light emitting panel | |
| KR101361883B1 (en) | Tiles for solid state lighting | |
| US7407316B2 (en) | LCD backlight system using light emitting diode chip | |
| US20070165403A1 (en) | Led surface light source and projection system using the same | |
| RU2502916C2 (en) | Lighting device, display device and television set | |
| US20060267037A1 (en) | Light emitting diode package | |
| JP2013016588A (en) | Led light-emitting device | |
| JP2007073968A (en) | Thin light source using flexible circuit support | |
| JP2011129916A (en) | Light emitting device and light unit employing the same | |
| CN101073292A (en) | Illumination system | |
| JP2006066328A (en) | Light source module and planar lighting device using the light source module | |
| KR101850434B1 (en) | Light emitting device module and lighting system including the same | |
| JP2006190646A (en) | Light emitting diode light source structure | |
| JP3598776B2 (en) | Light source using light emitting diode | |
| JP4501295B2 (en) | Surface emitting device | |
| KR101876901B1 (en) | Lighting module | |
| KR101266709B1 (en) | Backlight unit and liquid crystal display device using the same | |
| JP2007173072A (en) | Light source unit | |
| CN212961082U (en) | Light-emitting device and direct type panel lamp | |
| CN214225665U (en) | Hyperchromic device and projector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20030624 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20031125 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20031208 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071226 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081226 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081226 Year of fee payment: 5 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081226 Year of fee payment: 5 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091226 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091226 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101226 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111226 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121226 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121226 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131226 Year of fee payment: 10 |
|
| LAPS | Cancellation because of no payment of annual fees |