JPH11145699A - Method for recognizing electronic parts with insert pin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for recognizing and preventing parts joint failure caused by insert pins not inserted in measuring the correction amount of electronic parts with insert pins. SOLUTION: First, a connector 70 is imaged to obtain an image pattern 72. Next, the center 73 of an electric terminal group is determined by a method similar to the conventional technique, and the determined center 73 of the electric terminal group is offset by a half of part dimension h to obtain the part center 74. And windows 75 are set at positions dx, dy apart from the part center 74 to determine positions 76 of reinforcing insert pins, where dx, dy are offsets from a predetermined part center to the reinforcing insert pins. The offset of the reinforcing insert pins and the electric terminal group is compared to an allowance, and if the offset is out of the allowance, it is judged as a part failure. When it is not a part failure, the part center 74 and the inclination of the part shall be the correction amount.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image recognition method for measuring a mounting position correction amount of an electronic component in an electronic component mounting facility.

[0002]

2. Description of the Related Art In recent years, in the field of electronic component mounting, a technology for mounting electronic components on a circuit board at high speed and with high precision has been required. Generally, image recognition technology that processes image data obtained by imaging an electronic component at high speed, accurately detects the position and rotation amount of the electronic component, and corrects the mounting position and rotation amount of the electronic component. Incorporated. Also, as the number of electrodes and the miniaturization of electronic components increase, the technology of detecting and correcting the electrode position has been used to ensure that the individual electrodes of the electronic components are accurately mounted on the lands of the substrate. It has become.

FIG. 3 illustrates how a connector component, which is a multi-electrode component, is mounted on a substrate. The connector component 40 is sucked from the supply position by the nozzle 31 and is moved onto the substrate 32. When the nozzle 31 sucks the center 33 of the connector component 30 without rotational displacement, when the nozzle 31 is lowered to the mounting position 34 of the substrate 32, the electrode 35 is accurately mounted on the land 36, respectively. However, in practice, the nozzle 33 does not always adsorb the center 33 of the connector component 30 without rotational displacement.
The center and the inclination are detected by recognizing an image of the suction posture of the camera, and correction is performed based on the information to mount the camera on the substrate.

FIGS. 4 and 5 illustrate how the center and inclination of a connector component are detected by image recognition. First, as shown in FIG. 4A, the connector component 40 is imaged by the imaging device 41, and image data 52 is obtained. Next, FIG.
As shown in (b), sampling points 43 at fixed intervals are determined in the obtained image. At the determined sampling point 43, the center of gravity is determined by using the brightness as a weight, and the center is determined as a coarsely determined center (coarse center) 45 of the image pattern 44 of the connector part.
In addition, as shown in FIG. 4C, scan lines 46 at fixed intervals are defined for a certain side of the electrode. First, an edge point 47 having a large change in brightness on the determined scan line 46 is obtained. An angle formed by a straight line connecting the adjacent edge points 47 is obtained, and angles such as θ1, 2, 3, and 4 are obtained. Of these angles, the most frequent angle is defined as the roughly determined inclination (coarse inclination) of the image pattern 44 of the connector part.

[0005] After the coarse center and the coarse inclination are determined, windows 50 are defined at both ends of the electrode row as shown in FIG. The brightness in the determined window 50 is projected in the direction shown in FIG. 5A, and projection data 51 is obtained. In each of the obtained projection data, a position where a change in brightness is large is obtained, and an end point 5
2 is detected. Based on the detected end point, a window 53 is determined as shown in FIG. Defined window 53
Is projected in the direction shown in FIG. 5B, and projection data 54 is obtained. The position of the peak of the data corresponding to the electrode is detected in the obtained projection data, and the electrode position 55 is obtained.
Next, as shown in FIG. 5C, the determined electrode positions 55 are averaged to determine the center 56 of the electrode group. The center 56 of the obtained electrode group is shifted by half the part size h, and the center of the part 5
Get 7.

[0006]

As shown in FIG. 6 (a), some connector parts are provided with an insertion pin 61 for reinforcing the mounting strength on the body part 60.
The reinforcing insertion pin 61 is inserted into the insertion pin hole 63 of the substrate 62, and is attached so as to withstand the lateral load of the component. Normally, the reinforcing insertion pin 71 is formed as an integral part when the body part 60 is molded. Therefore, FIG.
As shown in (1), when the positional relationship between the reinforcing insertion pin 61 and the electrode 64 varies and the electrode is recognized and positioned, the reinforcing insertion pin 61 may not enter the insertion pin hole 63 in some cases. In such a case, the electrode 64 cannot come into contact with the land 65, resulting in poor bonding.

[0007]

According to the first aspect of the present invention, a method of recognizing an electronic component with an insertion pin first detects the electrode position and calculates the center and inclination of the component as in the conventional method. Next, the position of the insertion pin is detected, and it is determined whether the insertion pin is located within a preset allowable range. If the position of the insertion pin is out of the allowable range, it is determined that the component is defective.

The method of recognizing an electronic component with an insertion pin according to the second aspect of the present invention calculates a rough center / inclination of the component as in the conventional method. Next, the position of the insertion pin is detected with reference to the approximate center and inclination. An accurate center / inclination of the component is calculated from the detected position of the insertion pin. The position of the electrode is detected with reference to the calculated accurate center / inclination, and it is determined whether the electrode is located within a preset allowable range. And
If the position of the electrode is out of the allowable range, it is determined that the component is defective.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for recognizing an electronic component with an insertion pin according to an embodiment of the present invention will be specifically described below with reference to the drawings.

An embodiment of the first invention of the present application will be described with reference to FIG. As shown in FIG.
Is captured by a three-dimensional sensor 71 that captures distance information from the imaging device as brightness, and an image pattern 72 is obtained. The closer the three-dimensional sensor 71 is to the obtained image pattern 72, the higher the brightness of the image is. As a result, the image of the reinforcing insertion pin in the body portion, which is difficult to image with a normal imaging device, is captured as high-luminance data. Next, as shown in FIG. 7B, the center 73 of the electrode group is obtained in the same manner as described in the conventional method, and the obtained center 73 of the electrode group is shifted by half the component size h to obtain the component center 74. Then, as shown in FIG. 7 (c), a window 75 having an appropriate size is set at a position separated from the component center 74 by a predetermined offset from the component center to the reinforcing insertion pin by a distance dx, dy. The center of gravity of the luminance within 75 is determined, and that position is defined as a reinforcing insertion pin position 76. The size of the window is set to a size larger than the allowable range used for the judgment. If the positional relationship between the reinforcing insert pin and the electrode group is correct, the reinforcing insert pin position 76 should be located at the center of the window 75, but if the positional relationship is misaligned, it will be shifted from the window center by the amount of misalignment. . The deviation is compared with the allowable range. If the deviation is out of the allowable range, the component is determined to be defective and the component is discarded. The allowable range is calculated from the difference between the insertion hole diameter and the reinforcing insertion pin diameter. If not defective, component center 7
4 and the component inclination are mounted on the board as a correction amount.

An embodiment of the second invention of the present application will be described with reference to FIG. First, as described in the first embodiment of the present invention, an image pattern of a connector component is obtained by a three-dimensional sensor. Next, as shown in FIG.
Of the approximate center 81 and the inclination θ are described in the conventional example, and the offset amount d from the rough center 81 to the reinforcing insertion pin from the predetermined component center is determined.
A window 82 of an appropriate size is set at a position separated by x and dy, the center of luminance in the window 82 is determined, and the position is set as a reinforcing insertion pin position 83. As shown in FIG. 8B, the window center 8 where the reinforcing insertion pin should be originally located
4 and the position 83 of the reinforcing insertion pin, the component center 8 is more accurate than the displacement amounts w1, h1, w2, and h2.
5 and an accurate inclination θ ′ are obtained. Then, as shown in FIG. 8C, a projection window 85 is set at a position distant from the accurate component center 85 by half the component size h, and projection data 87 is obtained. Each electrode position 88 is obtained from the peak position of the projection data, and a deviation amount of a predetermined position where an electrode should exist is compared with an allowable range. If the deviation amount is out of the allowable range, it is determined that the component is defective and the component is determined. Discard. The allowable range is calculated based on the electrode width and the land width in a range where the solder joint strength can be maintained. If the component is not defective, the component is mounted on the board with the component center 85 and the component inclination θ ′ as correction amounts.

[0012]

As described above, in the method for recognizing an electronic component with an insertion pin according to the present invention, since both the electrode and the insertion pin of the electronic component with the insertion pin are detected and corrected, the problem occurs because the insertion pin is not inserted. It is possible to prevent defective parts bonding beforehand.

[Brief description of the drawings]

FIG. 1 is a flowchart of a method for recognizing an electronic component with an insertion pin according to the first invention of the present application.

FIG. 2 is a flowchart of a method for recognizing an electronic component with an insertion pin according to the second invention of the present application;

FIG. 3 is an explanatory diagram relating to correction of a mounting position of a connector component.

FIG. 4 is an explanatory diagram of a mounting position correction amount of a connector component utilizing a conventional technique.

FIG. 5 is an explanatory diagram of a mounting position correction amount of a connector component utilizing the related art.

FIG. 6 is an explanatory view of a failure example of an electronic component with an insertion pin according to the related art.

FIG. 7 is an explanatory diagram of a method for recognizing an electronic component with an insertion pin according to the first invention of the present application.

FIG. 8 is an explanatory diagram of a method for recognizing an electronic component with an insertion pin according to the second invention of the present application.

[Explanation of symbols]

 30, 40, 60, 70 Connector part 31 Suction nozzle 32, 62 Substrate 35, 64 Electrode 36, 65 Land 41, 71 Image pickup device 61 Reinforcement insertion pin 63 Reinforcement insertion pin hole

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masamichi Morimoto 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (2)

[Claims] 1. A first step of capturing an image of an electronic component with an insertion pin for reinforcing attachment to a substrate, a second step of detecting an electrode in the image and calculating the center and tilt of the electronic component, An electronic device with an insert pin, comprising: a third step of detecting an insert pin in an image and calculating a position from the center of the electronic component; and a fourth step of determining whether the position of the insert pin is within a predetermined allowable range. How to recognize parts. 2. A first step of capturing an image of an electronic component with an insertion pin for reinforcing attachment to a substrate, and a second step of detecting an insertion pin in the image and calculating the center / inclination of the electronic component. With an insertion pin consisting of a third step of detecting each electrode in the image and calculating the position from the center of the electronic component and a fourth step of determining whether each electrode position is within a preset allowable range. How to recognize electronic components.