JPH11145247A - Semiconductor manufacturing device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize easy maintenance of a semiconductor manufacturing device by changing an operation mode such as removal from or return to an on-line operation at a semiconductor manufacturing device side. SOLUTION: An operation mode change instruction means 18 for changing an operation mode is provided to a semiconductor manufacturing device 12 and the semiconductor manufacturing device 12 changes an operation mode according to operation of the operation mode changing instruction means 18 while the semiconductor manufacturing device 12 is operated by an instruction from an operation control device. The semiconductor manufacturing device 12 transmits information of change of an operation mode to an operation control device and a series of operation mode change treatment is finished. Examples of an operation mode are an on-line operation mode wherein information is transmitted to an operation control device and a maintenance operation mode wherein information is not transmitted. Thereby, it is possible to notice demands for stoppage of a semiconductor manufacturing operation and removal from an on-line to a host computer and to eliminate the need for various kinds of command inputs to a host computer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus used for manufacturing integrated circuits and the like, and more particularly to a semiconductor manufacturing apparatus and a resist coating and developing apparatus in a manufacturing line including a semiconductor exposure apparatus. The present invention relates to a semiconductor manufacturing apparatus used as an online system of a semiconductor manufacturing apparatus in which a plurality of semiconductor manufacturing systems are connected by a network and integratedly managed by a host computer, and a method therefor.

[0002]

2. Description of the Related Art In an online operation of a semiconductor manufacturing apparatus in which a plurality of semiconductor manufacturing apparatuses are connected by a network and integratedly managed by a host computer, in order to maintain and manage the performance of the semiconductor manufacturing apparatuses, the semiconductor manufacturing apparatuses must be manufactured during the online operation. It is necessary to temporarily suspend the work, perform maintenance work, return to online operation again, and continue semiconductor manufacturing.

In order to realize such a departure from online operation, the semiconductor manufacturing operation must be stopped and the online operation must be stopped from a host computer installed in a room different from the installation site of the semiconductor manufacturing apparatus where the maintenance operation is to be performed. It is necessary to execute a departure order. Also, in order to return to online operation, the host computer installed in a different room or a remote place from the installation location of the target semiconductor manufacturing equipment again executes an online operation return instruction and a semiconductor manufacturing work start instruction. And there is a problem that it takes time and effort.

In addition, when a plurality of semiconductor manufacturing systems including a semiconductor manufacturing apparatus and a resist coating and developing apparatus are connected via a network and the semiconductor manufacturing apparatus is integrated and managed from a host computer, the semiconductor manufacturing apparatus is separated from online operation for maintenance work. The timing information of withdrawal from online operation from the apparatus is transmitted to the resist coating and developing apparatus at a preset timing. In such a system, the timing of resist application and transfer of the wafer from the developing apparatus to the semiconductor manufacturing apparatus differs depending on the resist application conditions. There is a problem that the wafer cannot be transmitted to the apparatus, the wafer being processed is left in the middle of the system, and cannot be used, or the performance using the wafer is adversely affected.

[0005]

SUMMARY OF THE INVENTION An object of the present invention has been made in view of the above-mentioned problems in the prior art. In a semiconductor manufacturing system, an operation mode such as a departure from online operation or a return to online operation is performed. Is made executable on the semiconductor manufacturing apparatus side.
In a system having a resist coating and developing device, it is a further object to transmit timing information of withdrawal from online operation at an optimal timing.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, according to the present invention, a semiconductor manufacturing apparatus is installed independently of the semiconductor manufacturing apparatus so that information can be exchanged with the semiconductor manufacturing apparatus. Connected, when manufacturing a semiconductor using a semiconductor manufacturing system including information obtained from the semiconductor manufacturing apparatus and an arithmetic and control unit for managing and controlling the operation mode of the semiconductor manufacturing apparatus, when the semiconductor manufacturing apparatus, An operation mode change instructing unit for changing the operation mode of the semiconductor manufacturing apparatus provided in the semiconductor manufacturing apparatus while the semiconductor manufacturing apparatus is operating in accordance with an instruction from the arithmetic and control unit; Is characterized in that the operation mode is changed in response to an operation on the operation mode change instructing means. If necessary, the semiconductor manufacturing apparatus transmits the information on the operation mode change to the arithmetic and control unit, thereby completing a series of operation mode change processing. The operation modes include, for example, an online operation mode in which information is transmitted to and from the arithmetic and control unit, and a maintenance operation mode in which information is not transmitted to and from the arithmetic and control unit.

When the system includes a wafer loading device for loading a wafer into the semiconductor manufacturing device, the semiconductor manufacturing device responds to an operation state of the wafer loading device when the operation mode change instructing means is operated. The transmission mode is determined and the operation mode is changed, and the operation mode change information is sent to the wafer loading device or the like.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to one embodiment of the present invention,
In the online operation of a semiconductor manufacturing apparatus in which a plurality of semiconductor manufacturing apparatuses are connected by a network and integratedly managed from a host computer, in order to realize a departure from the online operation, a maintenance work transfer selecting means and a maintenance work end selection means are provided for the semiconductor manufacturing apparatus. Means are provided, and the maintenance work technician sets the maintenance work transfer mode from the semiconductor manufacturing equipment to which the maintenance work is to be performed, so that the semiconductor manufacturing equipment notifies the host computer of the stop of the semiconductor manufacture work and the request to withdraw from the online operation. Becomes possible. This eliminates the need to stop the semiconductor manufacturing operation and execute the online operation withdrawal command from a host computer installed in a room different from the installation location or in a remote location.

When ending the maintenance work, the person in charge of the maintenance work makes the maintenance work end setting from the semiconductor manufacturing equipment which wants to end the maintenance work, so that the semiconductor manufacturing equipment gives the host computer an instruction to start the conductor manufacturing work and to start online operation. Can be notified. This eliminates the need to execute a semiconductor manufacturing operation start and online operation start command from a host computer installed in a room different from the installation location or in a remote location.

A plurality of semiconductor manufacturing systems including a semiconductor manufacturing apparatus and a resist coating and developing apparatus are connected by a network, and the on-line operation for maintenance work of the semiconductor manufacturing apparatus, which is integrated and managed from a host computer, requires a resist coating condition. When the transfer timing of the wafer from the resist coating and developing device to the semiconductor manufacturing device is different due to, the maximum waiting time plus the margin time added to the expected maximum wafer loading interval time as the maximum waiting time, as the data of the semiconductor manufacturing device,
By determining the timing of transmitting the online operation withdrawal request to the host computer based on the time, it is possible to withdraw from the online operation at an appropriate timing.

[0011] In addition, the wafer transfer interval time is measured, and the time obtained by adding a margin time to the measurement interval time is determined as the maximum waiting time, and the timing for transmitting the online operation withdrawal request to the host computer is determined. It is possible to withdraw from operation.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a schematic configuration of a semiconductor manufacturing apparatus according to one embodiment of the present invention. As shown in FIG. 1, this device includes an illumination device 1 including a light source and a shutter, and a reticle stage 3 on which a reticle 2 on which a circuit pattern is drawn is mounted.
And a reticle position measuring mechanism 4 for measuring the position of the reticle 2 on the reticle stage 3, an imaging lens 5 serving as a projection optical system for printing, and a wafer 9 to be printed.
XY stage 6 that moves in two directions of X and Y in the Y plane, and laser interferometer 7 that measures the position of XY stage 6
And adjust the focus at the time of exposure by placing the wafer 9 (hereinafter, referred to as
A wafer Z stage 8 for moving the wafer 9 in the vertical direction and an autofocus unit 10 for measuring the focus position of the wafer 9 are provided for this purpose.

FIG. 2 shows a schematic configuration of a semiconductor manufacturing system including a host computer, a semiconductor manufacturing apparatus, and a coating and developing apparatus. The host computer 11 issues a work instruction (start) to the semiconductor manufacturing apparatus 12 and acquires and analyzes data from the semiconductor manufacturing apparatus 12. Information indicating whether or not the semiconductor manufacturing apparatus 12 is in the maintenance mode (hereinafter, referred to as mt_mode) is transmitted from the semiconductor manufacturing apparatus 12 to the host computer 11. The semiconductor manufacturing apparatus 12 includes a workstation 14 including a control unit such as a CPU and a storage device, a console 17 for inputting parameters and commands for controlling the apparatus and displaying data, and the like. Transfer control device 15 for controlling wafer transfer of wafers and unloading of exposed wafers outside the semiconductor manufacturing apparatus
It has.

The console 17 has an operation mode changing means 18 for receiving an instruction to shift to the maintenance mode. The wafer transfer control device 15 has a computer board 16 for performing control related to transfer control and data analysis.

When the operator instructs the shift to the maintenance mode from the console 17, the maintenance mode start instruction information (hereinafter referred to as "mainS") is transmitted from the workstation 14 to the wafer transfer control device 15.
Send When the operator gives an instruction to stop the maintenance mode transfer from the console 17, the workstation 14 sends maintenance mode stop instruction information (hereinafter referred to as “mainE”) to the wafer transfer control device 15.

The wafer transfer control device 15 includes the coating and developing device 1
3, the information indicating whether or not a transition to the maintenance mode is possible (hereinafter referred to as WF).
_Maintmode) to the workstation 14. The wafer transfer control device 15 determines whether or not the coated wafer can be carried into the semiconductor manufacturing apparatus 12 (hereinafter, this is referred to as input_request).
Is transmitted to the transport control device 15.

The coating and developing apparatus 13 includes information as to whether or not the wafer to be carried into the semiconductor manufacturing apparatus 12 is the last wafer of the lot (hereinafter referred to as lot_state), and wafer carrying timing information (hereinafter referred to as wafer).
_In) to the wafer transfer control device 15. The coating and developing device 13 applies a photosensitive agent to the wafer surface,
It has a function of supplying a wafer to the semiconductor manufacturing apparatus 12 and a function of collecting an exposed wafer from the semiconductor manufacturing apparatus 12 and performing a developing process.

The computer board 16 includes the coating and developing device 1
Measure the carry-in time required for wafer carry-in from 3 and calculate WF_m
There is a transmission timing determining means 19 for changing the timing of transmitting the aintmode.

FIG. 3 shows an information communication procedure between the semiconductor manufacturing apparatus 12 and the coating and developing apparatus 13 when mainS is not input to the wafer transfer control device 15. The computer board 16 measures the lot switching time T2-T1 from the time when the last wafer of the lot is carried into the semiconductor manufacturing apparatus 12 from the coating and developing apparatus 13 to the time when the first wafer of the next lot is carried in (T1). .

FIG. 4 shows an information communication procedure between the semiconductor manufacturing apparatus 12 and the coating and developing apparatus 13 when mainS is input to the wafer transfer control unit 15 during lot processing. After the last wafer of the lot is carried into the semiconductor manufacturing apparatus 12 from the coating and developing apparatus 13 by the wafer transfer control apparatus 15,
The t_request is kept in the L (wafer unloadable) state, and when all the wafers being processed in the semiconductor manufacturing apparatus 12 are unloaded outside the semiconductor processing apparatus 12, the lot final wafer unloading which is an internal signal of the wafer transfer control unit 15 is unloaded. Change the signal (last_wf_out) to WF_mai
ntmode is set to H (transition to the maintenance mode is possible).

FIG. 5 shows the semiconductor manufacturing apparatus 12 and the coating / developing process when mainS is input to the wafer transfer control unit 15 after the end of the lot processing and before the leading wafer of the next lot is carried into the wafer transfer control unit 15. 4 shows an information communication procedure between the devices 13.

After the last wafer of the lot is carried into the semiconductor manufacturing apparatus 12 from the coating and developing apparatus 13 by the wafer transfer control apparatus 15, when the next wafer is ready to be processed, i
nput_request is set to H (wafer can be loaded). In this H state, the wafer transfer control device 15
If tS is received, immediately input_request
st is set to L (wafer cannot be loaded). The timing Tp at which the wafer transfer control device 15 sets WF_maintmode to H (transition to the maintenance mode is possible) is determined by the transmission timing determining means 19 based on the waiting time calculated from T1 and T2 and the unloading timing of the last wafer of the lot.

FIGS. 6, 7, and 8 show flowcharts related to the maintenance mode of the semiconductor manufacturing system including the semiconductor manufacturing apparatus, the coating and developing apparatus, and the host computer. In S600, it is determined whether or not the wafer transfer control device 15 has received a start signal from the host computer 11 via the semiconductor manufacturing device 12.
When the start signal has been received, the determination in S601 is repeated, and when the start signal has not been received, the determination in S600 is repeated again. S601
In the above, the wafer transfer control device 15
It is determined whether or not a wafer has been loaded from. When a wafer is loaded, the determination in S602 is repeated, and when no wafer is loaded, the determination in S601 is repeated again. In step S <b> 602, the wafer transfer control device 15 determines whether the lot last wafer has been loaded from the coating and developing device 13. If the last wafer has not been loaded, the process proceeds to S603.

In step S603, the wafer transfer control device 1
5 is input_request =
Transmit 0 (wafer cannot be loaded). In S604,
The transfer control of the wafer carried into the wafer transfer control device 15 is executed. In S605, the wafer transfer control device 1
5 is input_request =
1 (wafer can be loaded) is transmitted. After the process of S605 is completed, the process proceeds to the determination of S601 and waits for the next wafer to be loaded.

If it is determined in step S602 that the loaded wafer is the last wafer, the flow advances to step S701. S70
1, the wafer transfer control device 15
3. Send input_request = 0 to # 3. S7
At 02, transfer control of the wafer (final wafer) carried into the wafer transfer control device 15 is executed. In S703, it is determined whether or not the wafer transfer control device 15 has received mainS from the work station 14. If the mainS has not been received, S704
Proceed to.

In S704, the wafer transfer control device 1
5 is input_request =
Send 1 In step S705, the wafer transfer control unit 15 stores the wafer transfer waiting start time, which is the time when the wafer transfer control unit 15 starts the state of waiting for the transfer of wafers of a new lot from the coating and developing apparatus 13, as a variable T1. In S706, the wafer transfer control device 15 sends ma
It is determined whether or not intS has been received. maint
If S has been received, the process proceeds to S801; otherwise, the process proceeds to S707. In step S707, it is determined whether a new lot of wafers has been loaded from the coating and developing apparatus 13. If the wafer has not been loaded, the process returns to S706, and waits until mainS is input (S706) or the wafer is loaded (S707). On the other hand, if a wafer is loaded, the process proceeds to S708.

In step S708, the transfer control device 15 stores the wafer loading waiting start time, which is the time when a new lot of wafers is loaded from the coating and developing device 13, as a variable T2. In S709, T1, S stored in S705
The difference of T2 stored in 708 is calculated. This value is the time required for switching the lot. A margin of 1.
The value obtained by integrating 4 is stored as Ti.

In the determination in S703, the wafer transfer control device 15 sends the main
S has been received, that is, ma
If intS has been input to wafer transfer control device 15, the process proceeds to S710. In S710, it is determined whether the wafer transfer control device 15 has received mainE from the workstation 14. When the mainE has been received, that is, when the mainS (maintenance mode start) is input during the lot processing, but the mainE (maintenance mode stop) is input before the final wafer is ejected, the process proceeds to S704 and proceeds to S704. Execute the following lot-to-lot processing.

The ma input from the console 17
intS and maintE are the wafer transfer controller 15
Are stored in the buffers S703 and S7.
At 10, the above-mentioned determination is made based on the data in this buffer. The data in the buffer is
It is held until the determination of 710 is executed, but is deleted after the execution.

In the determination at S710, the maint
If E has not been received, the process proceeds to S711. S71
1, the wafer transfer control device 15
It is determined whether or not the last wafer of the lot has been ejected. If the last wafer has not been ejected, the process returns to S710, and waits until mainE is input (S710) or the last wafer is ejected (S711). If the last wafer has been discharged, the process proceeds to S712. In S712,
The wafer transfer control device 15 sends a W
F_maintmode = H (transition to the maintenance mode is possible) is transmitted. Workstation 14 is WF_
When mainmode = H is received, mt_mode is received.
= 1 (during maintenance mode) to the host computer 11.

In S713, the wafer transfer control device 1
5 determines whether mainE has been received from workstation 14. If mainE has not been received, S713 is repeated to wait until mainE is input. During this standby, the semiconductor manufacturing apparatus 12
Maintenance mode. When the operator finishes the maintenance of the semiconductor manufacturing apparatus 12 and inputs “maintE” from the workstation 14, the process proceeds to step S 713.
Is determined to be mainE reception, and the process returns to S600. Thereby, the maintenance mode of the semiconductor manufacturing apparatus 12 ends. Workstation 1
4 transmits mt_mode = 0 (during the online operation mode) to the host computer 11 when mainT is input after mt_mode is transmitted.

In the determination of S706, the wafer transfer control device 15 sends the main
If S has been received, that is, after lot processing,
Maintain until the leading wafer of the next lot is carried into the wafer transfer control device 15 (hereinafter referred to as lot-to-lot).
If S is input to the wafer transfer control device 15, S80
Proceed to 1. In S801, the wafer transfer control device 15
Is input_request = 0 in the coating and developing apparatus 13.
(Wafer cannot be carried in) is transmitted. In step S802, the wafer transfer control device 15
It is determined whether aintE has been received. main
When tE has been received, that is, when mainS (maintenance mode start) is input during processing between lots, but mainE (maintenance mode stop) is input before the final wafer is discharged, the process proceeds to S704. In step S704, the inter-lot processing is executed. on the other hand,
If not, the process proceeds to S803.

In S803, the wafer transfer control device 1
5 judges whether the last wafer of the lot has been discharged to the coating and developing apparatus 13 or not. If the last wafer has not been ejected, the flow returns to S802, and mainE is input (S8).
02) or until the last wafer is discharged (S803). If the last wafer has been ejected, the process proceeds to S804.
In S804, the current time and T1 stored in S705
Is calculated. In S805, it is determined whether or not the wafer transfer control device 15 has received mainE from the work station 14. If the mainE has been received, that is, the mainS
If (maintenance mode start) is input and mainE after the last wafer is ejected (maintenance mode stop), the process proceeds to step S704 to execute the inter-lot processing from step S704. On the other hand, if it has not been received, S80
Proceed to 6. In S806, the Tp stored in S804
Is compared with Ti stored in S709 to determine whether Tp is larger. If Tp is smaller, the process returns to S804, and recalculates Tp (S804),
It waits until intE is input (S805) or Tp becomes larger (S806). On the other hand, if Tp is larger, the process proceeds to S807.

The time for repeating the processing of S804 to S806, that is, the time required for switching the lot, which is the difference between T1 and T2 calculated in S709, has a margin of 1.
WF_maintmode only for the Ti time obtained by adding 4
= H, in S704,
The wafer transfer control device 15 inputs the
t The coating / developing device 13 identifies the signal transmitted request = 1 and starts the coating process on the wafer. After the wafer transfer control device 15 sets WF_maintmode = H, the coated / developed device 13 sends the wafer to the wafer transfer control device 15. Can be prevented from being carried in. The waiting time varies depending on the performance of the coating and developing apparatus, the coating conditions, and the wafer size. However, according to this method, the control by the optimum waiting time is performed by using the time calculated from the actually measured time. Becomes possible.

In S807, the wafer transfer control device 1
5 is WF_maintmod to the workstation 14
e = H (transition to maintenance mode is possible) is transmitted.
The workstation 14 has WF_maintmode =
When H is received, mt_mode = 1 (during maintenance mode) is transmitted to the host computer 11.

In S808, the wafer transfer control device 1
5 determines whether mainE has been received from workstation 14. If mainE has not been received, S808 is repeated to wait until mainE is input. During this standby, the semiconductor manufacturing apparatus 12
Maintenance mode. When the operator finishes the maintenance of the semiconductor manufacturing apparatus 12 and inputs “maintE” from the workstation 14, the above-mentioned S808 is performed.
Is determined to be mainE reception, and the process returns to S600. Thereby, the maintenance mode of the semiconductor manufacturing apparatus 12 ends. Workstation 1
4 transmits mt_mode = 0 (during the online operation mode) to the host computer 11 when mainT is input after mt_mode is transmitted.

[0037]

[Embodiment of Device Production Method] Next, an embodiment of a device production method using the above-described semiconductor manufacturing apparatus or method will be described. FIG. 9 shows a flow of manufacturing micro devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, etc.). In step 1 (circuit design), a device pattern is designed. Step 2 is a process for making a mask on the basis of the designed pattern. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). including. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 10 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 1
In 5 (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the semiconductor manufacturing apparatus described above to print and expose the circuit pattern of the mask onto the wafer.
Step 17 (development) develops the exposed wafer.
In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps,
Multiple circuit patterns are formed on the wafer.

By using the production method of this embodiment, it is possible to produce a highly integrated device, which was conventionally difficult to produce, at low cost.

[0040]

As described above, according to the present invention, in the online operation of a semiconductor manufacturing apparatus in which a plurality of semiconductor manufacturing apparatuses are connected by a network and integratedly managed from a host computer, a maintenance worker can perform maintenance work. By setting the maintenance work transfer mode from the semiconductor manufacturing apparatus to be implemented, the semiconductor manufacturing apparatus can notify the host computer of the request for stopping the semiconductor manufacturing work and leaving the online operation. As a result, the host computer installed in a room different from the installation location of the semiconductor manufacturing apparatus or in a remote location inputs a semiconductor manufacturing operation stop instruction and an online operation exit instruction, an online operation return instruction, and a semiconductor manufacturing operation start instruction. Eliminates the need.

A plurality of semiconductor manufacturing systems including a semiconductor manufacturing apparatus and a resist coating and developing apparatus are connected by a network, and the on-line operation for maintenance work of the semiconductor manufacturing apparatus, which is integrated and managed from a host computer, requires a resist coating condition. If the timing of delivery of the wafer from the resist coating and developing device to the semiconductor manufacturing device is different due to the maximum waiting time, a time obtained by adding a margin time to the anticipated maximum wafer loading interval time as the data of the semiconductor manufacturing device,
By determining the timing of transmitting the online operation withdrawal request to the host computer based on the time, it is possible to withdraw from the online operation at an appropriate timing.

Further, the wafer transfer interval time is measured, and the time when the online operation withdrawal request is transmitted to the host computer is determined as the maximum waiting time by adding a margin time to the measurement interval time. It is possible to withdraw from operation.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a semiconductor manufacturing apparatus according to one embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of a semiconductor manufacturing system including a host computer, a semiconductor manufacturing apparatus, and a coating and developing apparatus.

FIG. 3 is a maintenance mode start instruction information main.
6 is a time chart showing an information communication procedure between the semiconductor manufacturing apparatus and the coating and developing apparatus in the case of normal processing in which tS is not input to the wafer transfer control device.

FIG. 4 is a time chart showing an information communication procedure between a semiconductor manufacturing apparatus and a coating and developing apparatus when maintenance mode start instruction information maintS is input to a wafer transfer control device during lot processing.

FIG. 5 is an information communication procedure between the semiconductor manufacturing apparatus and the coating and developing apparatus in the case where “maintS” is input to the wafer transfer controller while the first wafer of the next lot is loaded into the wafer transfer controller after the end of the lot processing. FIG.

FIG. 6 is a flowchart relating to a maintenance mode of a semiconductor manufacturing system including a semiconductor manufacturing apparatus, a coating and developing apparatus, and a host computer.

FIG. 7 is a flowchart relating to a maintenance mode of a semiconductor manufacturing system including a semiconductor manufacturing apparatus, a coating and developing apparatus, and a host computer.

FIG. 8 is a flowchart relating to a maintenance mode of a semiconductor manufacturing system including a semiconductor manufacturing apparatus, a coating and developing apparatus, and a host computer.

FIG. 9 is a diagram showing a flow of manufacturing a micro device.

FIG. 10 is a diagram showing a detailed flow of a wafer process in FIG. 9;

[Explanation of symbols]

1: lighting device, 2: reticle, 3: reticle stage,
4: reticle position measurement mechanism, 5: projection lens, 6: XY
Stage, 7: laser interferometer, 8: wafer, 9: wafer Z stage, 10: autofocus unit, 11:
Host computer, 12: semiconductor manufacturing apparatus, 13: coating and developing apparatus, 14: workstation, 15: wafer transfer control apparatus, 16: computer board, 17: console, 18: operation mode changing means, 19: transmission timing determining means.

Claims (16)

[Claims] 1. A semiconductor manufacturing apparatus, which is installed independently of the semiconductor manufacturing apparatus, is connected so as to be able to exchange information with the semiconductor manufacturing apparatus, and obtains information obtained from the semiconductor manufacturing apparatus and the semiconductor manufacturing apparatus. A semiconductor manufacturing apparatus used in a semiconductor manufacturing system comprising an arithmetic and control unit for managing and controlling an operation mode of the apparatus, wherein the semiconductor manufacturing apparatus is operated in accordance with an instruction from the arithmetic and control unit, An apparatus for manufacturing a semiconductor, comprising: an operation mode changing unit for changing the operation mode of the semiconductor manufacturing apparatus. 2. When the operation mode is changed by the operation mode changing means, the operation mode change processing is completed by transmitting operation mode change information from the semiconductor manufacturing apparatus to the arithmetic and control unit. 2. The semiconductor manufacturing apparatus according to claim 1, wherein: 3. A semiconductor manufacturing apparatus, which is installed independently of the semiconductor manufacturing apparatus, is connected so as to be able to exchange information with the semiconductor manufacturing apparatus, and obtains information obtained from the semiconductor manufacturing apparatus and the semiconductor manufacturing apparatus. In a semiconductor manufacturing apparatus used for a semiconductor manufacturing system including an arithmetic and control unit for managing and controlling an operation mode of the apparatus, as the operation mode, an online operation mode for transmitting information to and from the arithmetic and control unit; The semiconductor manufacturing device has a maintenance operation mode in which information is not transmitted to and from the arithmetic control device, and the operation of the semiconductor manufacturing device is performed in the semiconductor manufacturing device in a state where the semiconductor manufacturing device is operated according to an instruction from the arithmetic control device. A semiconductor manufacturing apparatus comprising: an operation mode changing unit for changing a mode. 4. When the operation mode is changed by the operation mode changing unit, the operation mode change processing is completed by transmitting operation mode change information from the semiconductor manufacturing apparatus to the arithmetic and control unit. 4. The semiconductor manufacturing apparatus according to claim 3, wherein 5. A semiconductor manufacturing apparatus, which is installed independently of the semiconductor manufacturing apparatus, is connected so as to be able to exchange information with the semiconductor manufacturing apparatus, and obtains information obtained from the semiconductor manufacturing apparatus and the semiconductor manufacturing apparatus. A semiconductor control apparatus for managing and controlling the operation mode of the apparatus, and a semiconductor manufacturing apparatus used in a semiconductor manufacturing system including a wafer loading apparatus for transferring a wafer into the semiconductor manufacturing apparatus; In a state where the semiconductor manufacturing apparatus is operated, the semiconductor manufacturing apparatus includes an operation mode changing unit for changing the operation mode of the semiconductor manufacturing apparatus, and the operation mode changing unit instructs the operation mode change. Operating mode change instructing means for changing an operating mode in response to an operating mode change instruction issued by the operating mode changing instructing means The semiconductor manufacturing apparatus characterized by comprising a transmission timing determination means capable of changing the timing by the operation state of the wafer loading apparatus. 6. An online operation mode for transmitting information to and from the arithmetic and control unit as the operation mode,
6. The semiconductor manufacturing apparatus according to claim 5, further comprising a maintenance operation mode in which no information is transmitted to and from the arithmetic and control unit. 7. The transmission timing determining means has, as a parameter, a delay time determined from a carry-in time required for carrying in the wafer by the wafer carry-in device, and changes a timing of transmitting the operation mode change information based on the delay time. The semiconductor manufacturing apparatus according to claim 5, wherein the semiconductor manufacturing apparatus is capable of performing the following. 8. The transmission timing determining means measures a carry-in time required for carrying in a wafer by the wafer carry-in device,
7. The semiconductor manufacturing apparatus according to claim 5, wherein a timing of transmitting the operation mode change information can be changed according to a measurement delay time calculated and determined from the carry-in time. 9. When the operation mode is changed by the operation mode changing means, the operation mode change information is transmitted from the semiconductor manufacturing apparatus to the arithmetic and control unit to complete the change of the operation mode. The semiconductor manufacturing apparatus according to any one of claims 5 to 8, wherein: 10. A semiconductor manufacturing apparatus, which is installed independently of the semiconductor manufacturing apparatus, is connected so as to be able to exchange information with the semiconductor manufacturing apparatus, and obtains information obtained from the semiconductor manufacturing apparatus and the semiconductor manufacturing apparatus. In a semiconductor manufacturing method using a semiconductor manufacturing system including an arithmetic control device for managing and controlling an operation mode of the device, the semiconductor manufacturing device is operated by the semiconductor manufacturing device according to an instruction from the arithmetic control device. In the state, the semiconductor manufacturing apparatus is provided with an operation mode change instructing means for changing the operation mode of the semiconductor manufacturing apparatus, and the operation mode of the semiconductor manufacturing apparatus is changed according to an operation on the operation mode change instructing means. A semiconductor manufacturing method characterized by performing the following. 11. The semiconductor manufacturing system includes, as the operation modes, an online operation mode in which information is transmitted to and from the arithmetic and control unit and a maintenance operation mode in which information is not transmitted to and from the arithmetic and control unit. The semiconductor manufacturing method according to claim 10, further comprising: 12. The operation mode change process according to claim 10, wherein when the operation mode is changed, the operation mode change processing is completed by transmitting operation mode change information from the semiconductor manufacturing apparatus to the arithmetic and control unit. Semiconductor manufacturing method. 13. The semiconductor manufacturing system further comprises a wafer loading device for loading a wafer into the semiconductor manufacturing device, wherein the semiconductor manufacturing device operates the wafer loading device when the operation mode change instructing unit is operated. 13. The semiconductor manufacturing method according to claim 10, wherein the operation mode is changed by determining a transmission timing according to a state. 14. The semiconductor manufacturing apparatus, wherein the transmission timing is changed using a delay time determined from a carry-in time required for carrying in the wafer by the wafer carry-in device stored in the semiconductor fabricating apparatus as a parameter. 14. The semiconductor manufacturing method according to claim 13, wherein: 15. The semiconductor manufacturing apparatus, wherein a carry-in time required for carrying in a wafer by the wafer carry-in device is measured, and the transmission timing is changed by a measurement delay time calculated and determined from the carry-in time. 14. The semiconductor manufacturing method according to claim 13. 16. A semiconductor device manufactured by using the semiconductor manufacturing apparatus according to any one of claims 1 to 9 or the semiconductor manufacturing method according to any one of claims 10 to 16. Production method.