JPH11145168A - Resin injection method in flip-chip package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve productivity of a flip-chip package, by forcefully injecting a resin into a gap between an electronic component and a substrate on a flip- chip package in a short time. SOLUTION: A through-hole 6 and an injection hole 10 are connected together, and a resin pressuring mechanism 7 is located at a predetermined position on a substrate 3. Next, a fluid resin 5 is supplied to the inside of a cylinder 8, the fluid resin 5 is pressured inside the cylinder 8 by a piston 9, and the fluid resin 5 is forcefully pressured and injected in a gap between an electronic part 2 and the substrate 3 through a through-hole 6 in the substrate 3. By doing this, the gap between the electronic part and substrate can be filled up in a short time with the resin and then the productivity of the flip-chip package can be improved. Also, voids pulled in to the resin can be efficiently prevented, and the products with high quality and high reliability can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a method for injecting and filling a resin into a gap between an electronic component such as an IC and a substrate in the flip chip package.

[0002]

2. Description of the Related Art In a conventional method, as shown in FIG. 6, for example, a liquid resin 92 is dropped from a dispenser 93 in order to secure an electrical connection between the electronic component 90 and a substrate 91. The resin 92 is spontaneously injected into the gap 94 between the electronic component 90 and the substrate 91 by utilizing the capillary phenomenon.

[0003]

However, in the method of dropping the liquid resin 92 and injecting the resin 92 into the gap between the electronic component 90 and the substrate 91, the method of dropping the liquid resin 92 and then dropping the liquid resin 92 is described. Since the time required for filling the gap 94 with the resin is considerably long, there is a problem that the productivity of the flip chip package is low. Also,
Since the injection time is long, air and the like are often entangled in the liquid resin 92, and a large amount of voids (bubbles) are generated in the resin, and a product (flip) formed by injecting the resin into the gap 94 is formed. There is a problem that the quality and reliability of the chip package are impaired.

Accordingly, the present invention provides a method of injecting a resin into a gap between an electronic component and a substrate in a flip-chip package in a short time, thereby reducing the productivity of the flip-chip package. The purpose is to improve. Further, the present invention provides a product having high quality and high reliability which can efficiently prevent voids caught in the resin when injecting the resin into the gap between the electronic component and the substrate in the flip chip package. The purpose is to gain.

[0005]

A method for injecting a resin in a flip chip package according to the present invention for solving the above-mentioned technical problem is a method for injecting a resin into a gap between an electronic component and a substrate in a flip chip package. A method for injecting resin into a chip package,
A forced press-fitting step of forcibly press-fitting the resin into the gap is provided.

In addition, a method for injecting a resin in a flip chip package according to the present invention for solving the above-mentioned technical problem is characterized in that the resin is forcibly injected in the forcible press-fitting step.

Further, a method for injecting a resin into a flip chip package according to the present invention for solving the above-mentioned technical problem is characterized in that the forcible press-fitting step suction-injects the resin.

A method for injecting a resin into a flip chip package according to the present invention for solving the above-mentioned technical problem is characterized in that the resin is forcibly transferred through a through hole provided in the substrate. I do.

In addition, a method for injecting a resin in a flip chip package according to the present invention for solving the above technical problem is characterized in that the forcible press-in step injects the resin by utilizing a centrifugal force. And

[0010]

According to the present invention, for example, by pressing a resin into a gap between an electronic component and a substrate in a flip chip package, the resin is forcibly pressed into the gap to inject the resin into the gap. it can. That is, since the resin can be forcibly pressed into the gap between the electronic component and the substrate, the injection time of the resin can be reduced as compared with the method of injecting the resin naturally using the capillary phenomenon. Can be. Therefore, the resin can be injected into the gap in a short time, and the productivity of the flip chip package can be improved. Further, since the resin can be injected into the gap in a short time, the chances of getting air or the like into the liquid resin are reduced as compared with the method of injecting the liquid resin by dropping. Therefore, voids generated in the liquid resin can be efficiently prevented, and a high quality and highly reliable product can be obtained.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. The embodiment shown in FIGS. 1A and 1B will be described.

That is, the flip chip package used in the resin injection method of the present invention includes, for example, an electronic component 2 provided with bumps 1 as shown in FIGS. A substrate 3 on which the electronic component 2 is mounted via the bumps 1, and a gap 4 between the electronic component 2 and the substrate 3.
And a resin 5 or the like which is filled with The substrate 3 is provided with a required number of through holes 6 for transferring the liquid resin corresponding to the positions of the electronic components 2. For example, a configuration in which one through hole 6 is provided at the center of the mounting position of the electronic component 2 on the substrate 3 can be adopted.

As shown in FIGS. 1 (1) and 1 (2), for example, the liquid resin 5 is placed on the side of the substrate 3 opposite to the side on which the bumps 1 are mounted. A resin pressurizing mechanism 7 for pressurizing is provided, and the electronic component 2 and the substrate 3 are connected to the liquid resin 5 by the resin pressurizing mechanism 7 at a required resin pressure (resin pressure) through the through-hole 6. Is configured to be able to be injected into the gap 4. That is, the above-described resin pressing mechanism 7 includes a cylinder 8 for supplying a liquid resin, a piston 9 for pressing the liquid resin,
Injection port 10 for injecting the liquid resin 5 into the through hole 6
It is composed of Therefore, by pressing the liquid resin 5 in the cylinder 8 with the piston 9, the liquid resin 5 is applied to the gap 4 between the electronic component 2 and the substrate 3 from the injection port 10 through the through hole 6. It is configured so that pressure injection (forced injection) can be performed.

That is, as shown in the figure, first, the resin pressurizing mechanism 7 is disposed at a predetermined position on the substrate 3 by joining the through hole 6 and the injection port 10.
Next, the liquid resin 5 is supplied into the cylinder 8 and the piston 9 is used to supply the liquid resin 5 in the cylinder 8.
, The liquid resin 5 can be forcibly injected into the gap 4 between the electronic component 2 and the substrate 3 through the through hole 6 of the substrate 3 at a required tree finger pressure. That is, the resin 5 can be forcibly press-fitted into the gap 4 between the electronic component 2 and the substrate 3 and can be pressurized and injected, so that the resin is naturally injected using the capillary phenomenon. In addition, the injection time of the resin can be reduced.
Therefore, with the configuration as described above, the resin 5 can be injected into the gap 4 in a short time, and the productivity of the flip chip package can be improved. Further, by forcibly injecting the resin 5 into the gap 4 between the electronic component 2 and the substrate 3, the resin 5 is inserted into the gap 4.
Can be injected in a short time, so that the chance of entraining air or the like in the liquid resin 5 is reduced as compared with the method of injecting the liquid resin by dropping. Accordingly, voids generated in the liquid resin 5 can be efficiently prevented, and a product having high quality and high reliability can be obtained.

Further, in the embodiment shown in FIGS. 1 (1) and 1 (2), a configuration is adopted in which a liquid resin supply mechanism 11 for supplying the liquid resin 5 into the cylinder 8 of the resin pressing mechanism 7 is provided. Thereby, the liquid resin 5 can be continuously injected into the gap 4 between the electronic component 2 and the substrate 3 by the resin pressing mechanism 7.

Next, the embodiment shown in FIG. 2 will be described. Note that the basic configuration of the flip-chip package shown in FIG. 2 is the same as the basic configuration of the flip-chip package shown in FIGS.

The bump 1 on the substrate 3 shown in FIG.
On the side opposite to the side where is mounted, a vacuum pump or the like for forcibly sucking and discharging air or the like in the gap 4 between the electronic component 2 and the substrate 3 through the through hole 6 provided in the substrate 3 The pressure reducing mechanism 12 is provided. Note that a configuration in which one through-hole 6 is provided at the center of the mounting position of the electronic component 2 on the substrate 3 can be adopted, for example. The electronic component 2 on the substrate 3
A liquid resin dropping mechanism 13 for dropping (supplying) the liquid resin 5 onto the surface of the substrate 3 is provided on the side where is mounted.

Therefore, as shown in FIG. 2, first, the liquid resin 5 is supplied drop-wise from the above-described dropping mechanism 13 to the outer periphery of the electronic component on the surface of the substrate 3. Next, the liquid resin 5 is injected into the gap 4 between the electronic component 2 and the substrate 3 by forcibly sucking and discharging air and the like in the gap 4 through the through hole 6 by the pressure reducing mechanism 12. At the same time, the liquid resin 5 can be forcibly injected into the gap 4. That is, the pressure reducing mechanism 12
The liquid resin 5 is forcibly pressed into the gap 4 and suction-injected into the gap 4 in the same manner as the resin pressing operation by the resin pressing mechanism 7 in the above-described embodiment by utilizing the forced suction effect of be able to. Therefore, similarly to the above-described embodiment, the liquid resin 5 can be injected into the gap 4 between the electronic component 2 and the substrate 3 in a short time, and the productivity of the flip chip package can be improved. By reducing the chance of entraining air or the like in the liquid resin 5, voids generated in the liquid resin 5 can be efficiently prevented, and a product having high quality and high reliability can be obtained.

In FIG. 2, the electronic component 2
A configuration in which air and the like in the gap 4 between the substrate 3 and the substrate 3 are directly suctioned and discharged by the pressure reducing mechanism 12 without passing through the through hole 6 may be adopted.

The number and position of the through holes 6 shown in FIGS. 1 (1), 1 (2) and 2 are determined according to the gist of the present invention.
An appropriate number and an appropriate position can be set.

Next, the embodiment shown in FIG. 3 will be described. Note that the basic configuration of the flip chip package shown in FIG. 3 is the same as the basic configuration of the flip chip package in each of the above-described embodiments, and thus the same reference numerals are given.

On the side of the substrate 3 shown in FIG. 3 on which the electronic component 2 is mounted, a liquid resin forced pressing mechanism 14 for pressing the liquid resin 5 is provided. The electronic component 2 and the substrate 3 from the 14 injection ports
The liquid resin 5 can be forcibly injected under pressure into the gap 4 between the liquid resin 5 and the liquid resin 5. Therefore, as shown in FIG. 3, first, the injection port of the forcible pressure mechanism 14 is arranged in the gap 4 between the electronic component 2 and the substrate 3. next,
The liquid resin 5 described above can be forcibly injected under pressure into the gap 4 from the injection port of the aforementioned forced pressing mechanism 14. In other words, since the liquid resin 5 can be forcibly pressed into the gap 4 and injected under pressure, the injection time can be shortened. Therefore, similarly to the above-described embodiments, the liquid resin 5 can be injected into the gap 4 in a short time to improve the productivity of the flip chip package, and the liquid resin 5 is filled with air or the like. As a result, the voids generated in the liquid resin 5 can be efficiently prevented, and a product having high quality and high reliability can be obtained.

Next, the embodiment shown in FIG. 4 will be described. The basic configuration of the flip-chip package shown in FIG. 4 is the same as the basic configuration of the flip-chip package in each of the above-described embodiments, and thus the same reference numerals are given.

The embodiment shown in FIG. 4 is provided with a rotating mechanism 20 for rotating a board on which electronic components are mounted, and the rotating mechanism 20 is provided with a required number of boards for supplying and setting the board 3 at a predetermined position. Rotating plate 21 (rotary table) and rotating shaft
22 and driving means (not shown) such as a motor. Therefore, as shown in FIG. 4, first, (the entrance of) the gap 4 between the electronic component 2 and the substrate 3 in the substrate 3 described above.
Is supplied with liquid resin 5. Next, the liquid resin 5
Is set at a predetermined position on the rotating plate 21.
The supply setting is performed in a state where the position of the liquid resin 5 is arranged on the rotating shaft 22 side. Next, while rotating the rotating plate 21 about the rotating shaft 22 (clockwise in the example in the figure),
The liquid resin 5 is forcibly pressed into the outer peripheral direction of the rotation mechanism 20 from the rotation shaft 22 side by using the centrifugal force (action) due to the rotation, so that the gap between the electronic component 2 and the substrate 3 is formed. 4 can be injected. That is, the liquid resin 5 can be forcibly pressed into the gap 4 and injected by the pressing action on the resin due to the centrifugal force of the rotation mechanism 20, so that the injection time can be reduced. . Therefore, similarly to the above-described embodiments, the liquid resin 5 can be injected into the gap 4 in a short time to improve the productivity of the flip chip package, and the liquid resin 5 is filled with air or the like. As a result, the voids generated in the liquid resin 5 can be efficiently prevented, and a product having high quality and high reliability can be obtained.

As shown in FIG. 5, for example, in a state where the rotating plate 21 to which the substrate 3 is supplied and set is inclined in the vertical direction, the rotating plate 21 is rotated in the same manner as in the embodiment shown in FIG. A configuration may be adopted. In this case, similarly to the embodiment shown in FIG. 4, the liquid resin 5 can be forcibly pressed into the gap 4 and injected by the centrifugal force action (pressing action) by the rotation mechanism 20 described above. Therefore, the injection time can be shortened. Therefore, as in the above-described embodiments, the productivity of the flip chip package can be improved, and voids generated in the liquid resin 5 can be efficiently prevented, and high quality and high reliability can be provided. Product can be obtained.

In the embodiment shown in FIGS. 4 and 5, in order to prevent the resin 5 forcibly pressed into the gap (4) from scattering or the like, the pressing direction of the resin 5 is changed. It is possible to adopt a configuration in which weirs 23 (guides) are provided for guiding the resin and leaking the resin to the side of the electronic component 2 on the substrate 3 (see FIG. 4).

The present invention is not limited to the above-described embodiment, but may be arbitrarily and appropriately changed and selected as necessary without departing from the spirit of the present invention. It is.

Further, as the substrate 3 in the above-mentioned flip chip package, for example, a plastic sheet member such as a PC board, a lead frame, or a plate-like member can be adopted.

Further, as the resin 5 in each of the above-described embodiments, a thermosetting resin or a thermoplastic resin can be adopted.

[0030]

According to the present invention, when a resin is injected into a gap between an electronic component and a substrate in a flip chip package, the resin can be injected into the gap in a short time to produce the flip chip package. It has an excellent effect that the performance can be improved.

Further, according to the present invention, when a resin is injected into a gap between an electronic component and a substrate in a flip chip package, voids entrained in the resin can be efficiently prevented, and high quality and high reliability can be achieved. An excellent effect of being able to obtain a product with

[Brief description of the drawings]

FIGS. 1 (1) and 1 (2) are schematic longitudinal sectional views schematically showing a flip chip package used in a resin injection and filling method according to the present invention and its mechanism. FIG. 1A shows a state before resin injection, and FIG. 1B shows a state at the time of resin injection.

FIG. 2 is a schematic vertical sectional view schematically showing a flip chip package used in a resin injection and filling method according to another embodiment of the present invention and a mechanism thereof, showing a state at the time of resin injection. Is shown.

FIG. 3 is a schematic longitudinal sectional view schematically showing a flip chip package used in a resin injection and filling method according to another embodiment of the present invention and a mechanism thereof, showing a state at the time of resin injection; Is shown.

FIG. 4 is a schematic plan view schematically showing a flip chip package used in a method for filling and injecting a resin according to another embodiment of the present invention and a mechanism thereof, showing a state at the time of injecting the resin. Is shown.

FIG. 5 is a schematic plan view schematically showing a flip-chip package used in a method of filling and filling a resin according to another embodiment of the present invention and a mechanism thereof, showing a state at the time of filling the resin. Is shown.

FIG. 6 is a schematic longitudinal sectional view schematically showing a flip chip package used in a conventional resin injection and filling method and its mechanism, and shows a state at the time of resin injection.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Bump 2 Electronic component 3 Board 4 Gap 5 Resin 6 Through hole 7 Resin pressurizing mechanism 8 Cylinder 9 Piston 10 Inlet 11 Liquid resin supply mechanism 12 Pressure reducing mechanism 13 Dropping mechanism 14 Forced pressurizing mechanism 20 Rotary mechanism 21 Rotating plate 22 Rotation Shaft 23 Weir

Claims (5)

[Claims] 1. A method for injecting a resin into a gap between an electronic component and a substrate in the flip chip package, the method including a step of forcibly inserting the resin into the gap. A method of injecting a resin into a flip chip package. 2. The method for injecting a resin into a flip chip package according to claim 1, wherein the forcible press-fitting step includes injecting the resin under pressure. 3. The method for injecting a resin into a flip chip package according to claim 1, wherein the forcible press-in step suctions and injects the resin. 4. The method according to claim 2, wherein the resin is forcibly transferred through a through hole provided in the substrate.
A method for injecting a resin into the flip chip package according to claim 3. 5. The method according to claim 1, wherein the forcible press-fitting step uses a centrifugal force to inject the resin.