JP4100213B2 - Electronic component mounting board and electronic component mounting method - Google Patents

Electronic component mounting board and electronic component mounting method Download PDF

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Publication number
JP4100213B2
JP4100213B2 JP2003082425A JP2003082425A JP4100213B2 JP 4100213 B2 JP4100213 B2 JP 4100213B2 JP 2003082425 A JP2003082425 A JP 2003082425A JP 2003082425 A JP2003082425 A JP 2003082425A JP 4100213 B2 JP4100213 B2 JP 4100213B2
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Japan
Prior art keywords
electronic component
mounting
adhesive
mounting position
external connection
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Expired - Fee Related
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JP2003082425A
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Japanese (ja)
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JP2004289083A (en
Inventor
満 大園
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81192—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting an electronic component and a method of mounting an electronic component which eliminate creeping-up of a resin adhesive to the upper face of the electronic component. <P>SOLUTION: An electronic component 4, having metal bumps 5 for external-connection electrodes on its lower face, is mounted on the substrate 1 for mounting an electronic component. A component mounting area 1b is located at the mounting position to which the electronic component 4 is stuck by the resin adhesive 3. A downward slope 1c is provided on the outer edge of the component mounting area 1b, wherein the height of the downward slope 1c is lower than the component mounting area 1b. In the component mounting process, the resin adhesive 3 pushed out by the electronic component 4 flows down on the downward slope 1c. Thereby, creeping-up of the resin adhesive 3 to the upper face of the electronic component 4 in the electronic-component mounting state is eliminated, and the problem in which the mounting tool is stained by the resin adhesive 3 is prevented. <P>COPYRIGHT: (C)2005,JPO&amp;NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品が実装される電子部品実装用の基板および電子部品実装方法に関するものである。
【０００２】
【従来の技術】
電子部品の種類として、金属バンプなどの外部接続用電極が下面に設けられたフェイスダウン型の電子部品が知られている。このような電子部品を基板に実装する場合には、金属バンプを基板の実装位置に形成された回路電極に半田接合や導電性ペーストなどによって接続する（例えば特許文献１参照）。この実装構造において、金属バンプの接続部を補強してより高い信頼性を確保する必要がある場合には、電子部品と基板との間に樹脂接着材を介在させて補強樹脂部を形成することが行われる。この補強樹脂部の形成には、電子部品の搭載に先立って予め基板に樹脂を塗布しておく方法や、電子部品を基板に搭載した後に樹脂を注入する方法が用いられる。
【０００３】
【特許文献１】
特開昭６３−１２２１３５号公報
【０００４】
【発明が解決しようとする課題】
近年電子部品の薄型化が進み、１００μｍ以下の厚みのものが用いられるようになっている。このような薄型部品について上述の補強樹脂部を形成する場合には、樹脂接着材の挙動に起因して次のような問題が生じる。すなわち、ペースト状の樹脂接着材は、固体面と接触すると表面張力によって固体面に沿って這い上がるという性質を有しており、上述の電子部品実装において樹脂接着材上に電子部品を搭載すると、樹脂接着材は電子部品の側端部から這い上がる。
【０００５】
このとき、電子部品が薄いと這い上がった樹脂接着材が電子部品の上面まで到達してしまい、この樹脂接着材が電子部品の実装に用いられる実装ツールに付着して汚染するという不具合を招き易い。そしてこの問題は、電子部品の搭載後に樹脂接着材を注入する場合においても同様に生じる。
【０００６】
そこで本発明は、樹脂接着材の電子部品上面への這い上りを解消できる電子部品実装用の基板および電子部品実装方法を提供することを目的とする。
【０００８】
【課題を解決するための手段】
請求項１記載の電子部品実装用の基板は、外部接続用電極を介して電子部品が実装される電子部品実装用の基板であって、前記電子部品が接着材により固着される実装位置と、この実装位置に形成され前記外部接続用電極が接続される回路電極と、前記実装位置の外縁部に形成され実装位置に供給された前記接着材が流下する低部とを備え、前記低部が下り勾配の傾斜面である。
【０００９】
請求項２記載の電子部品実装用の基板は、外部接続用電極を介して電子部品が実装される電子部品実装用の基板であって、前記電子部品が接着材により固着される実装位置と、この実装位置に形成され前記外部接続用電極が接続される回路電極と、前記実装位置の外縁部に形成され実装位置に供給された前記接着材が流下する低部とを備え、前記低部が段差部である。
【００１３】
請求項３記載の電子部品実装方法は、外部接続用電極を介して電子部品を基板に実装する電子部品実装方法であって、回路電極が形成され外縁部に高さが低い低部が形成された実装位置に接着材を供給する接着材供給工程と、接着材が供給された実装位置に前記電子部品を前記外部接続用電極を介して搭載する部品搭載工程と、前記実装位置からはみ出した余剰の接着材を前記低部内に流下させる接着材流下工程とを含み、前記低部が下り勾配の傾斜面である。
【００１４】
請求項４記載の電子部品実装方法は、外部接続用電極を介して電子部品を基板に実装する電子部品実装方法であって、回路電極が形成され外縁部に高さが低い低部が形成された実装位置に接着材を供給する接着材供給工程と、接着材が供給された実装位置に前記電子部品を前記外部接続用電極を介して搭載する部品搭載工程と、前記実装位置からはみ出した余剰の接着材を前記低部内に流下させる接着材流下工程とを含み、前記低部が段差部である。
【００１５】
請求項５記載の電子部品実装方法は、外部接続用電極を介して電子部品を基板に実装する電子部品実装方法であって、回路電極が形成され外縁部に高さが低い低部が形成された実装位置に前記外部接続用電極を介して前記電子部品を搭載する部品搭載工程と、前記電子部品の下面と実装位置の上面との間に接着材を供給する接着材供給工程と、前記実装位置からはみ出した余剰の接着材を前記低部内に流下させる接着材流下工程とを含み、前記低部が下り勾配の傾斜面である。
請求項６記載の電子部品実装方法は、外部接続用電極を介して電子部品を基板に実装する電子部品実装方法であって、回路電極が形成され外縁部に高さが低い低部が形成された実装位置に前記外部接続用電極を介して前記電子部品を搭載する部品搭載工程と、前記電子部品の下面と実装位置の上面との間に接着材を供給する接着材供給工程と、前記実装位置からはみ出した余剰の接着材を前記低部内に流下させる接着材流下工程とを含み、前記低部が段差部である。
【００１６】
本発明によれば、電子部品が接着材により固着される実装位置の外縁部に、実装位置に供給された接着材が流下する低部を形成することにより、電子部品搭載状態における接着材の電子部品上面への這い上りを解消することができる。
【００１７】
【発明の実施の形態】
次に本発明の実施の形態を図面を参照して説明する。図１は本発明の一実施の形態の電子部品実装用の基板の斜視図、図２は本発明の一実施の形態の電子部品実装方法の工程説明図、図３は本発明の一実施の形態の電子部品実装用の基板の断面図、図４は本発明の一実施の形態の電子部品実装用の基板の断面図である。
【００１８】
まず、図１を参照して電子部品実装用の基板について説明する。基板１上面において電子部品が実装される実装位置には、平面視して４角形の凸状部１ａが形成されている。凸状部１ａの上面は電子部品が実装される部品実装面１ｂとなっており、部品実装面１ｂの周囲は高さが部品実装面１ｂよりも高さが低いテーパ状下り勾配の傾斜面１ｃとなっている（図２（ａ）も参照）。すなわち、実装位置の外縁部には、高さが部品実装面１ｂよりも低い低部が形成されている。
【００１９】
基板１の凸状部１ａの周囲には複数の回路電極２が形成されている。各回路電極２は部品実装面１ｂの４周まで延出しており、延出端部は部品接続用の端子２ａとなっている。電子部品が基板１に実装された状態では、電子部品の外部接続用電極が端子２ａに接続される。
【００２０】
次に電子部品実装方法について説明する。図２（ａ）は基板１の断面を示している。図２（ｂ）に示すように、部品実装面１ｂには、端子２ａを覆ってペースト状の樹脂接着材（接着材）３が供給される（接着材供給工程）。次いで図２（ｃ）に示すように、樹脂接着材塗布後の基板１には、回路が形成された回路形成面である下面に外部接続用電極である金属バンプ５が形成された電子部品４が搭載される（部品搭載工程）。すなわち、実装位置に電子部品が金属バンプ５を介して搭載される。
【００２１】
この搭載動作においては、電子部品４を下降させて樹脂接着材３を介して金属バンプ５を端子２ａに押し付ける。これにより、金属バンプ５が端子２ａと接続される。そして樹脂接着材３が硬化することにより、電子部品４は基板１に固着され、電子部品４の実装が完了する。
【００２２】
このとき、電子部品４の下面によって押しのけられて部品実装面１ｂの外側に移動した樹脂接着材３は、傾斜面１ｃに沿って下方に流動する。すなわち、電子部品４の下面と部品実装面１ｂとの間に収容されない余剰の樹脂接着材３は、低部である傾斜面１ｃに流下する（接着材流下工程）。
【００２３】
これにより、樹脂接着材３が電子部品４の側端部から這い上がって、電子部品４の上面に到達することによる実装ツールの汚染などの不具合を防止することができる。電子部品４の搭載後に電子部品４の下面と部品実装面１ｂ（実装位置の上面）との間に樹脂接着材３を供給する場合も同様である。但し、電子部品搭載前に実装位置に樹脂接着材３を供給する方が、接着材を迅速に供給できるので望ましい。
【００２４】
なお余剰の樹脂接着材３を流下させる低部の形態としては、上述例の傾斜面１ｃ以外にも各種の形態が可能であり、例えば図３に示すような基板を採用するようにしてもよい。図３（ａ）に示す基板１１は、実装位置に設けられ上面が部品実装面１１ｂである凸状部１１ａの４辺の外縁部に、周囲の基板上面との間に切り立った形状の高さ差がある段差部１１ｃを設けた例を示している。また図３（ｂ）に示す基板２１は、実装位置に設けられた部品実装面２１ａの外縁部に、基板上面から削り込まれた溝部２１ｂを設けた例を示している。
【００２５】
これらの場合においても、部品搭載時に実装位置からはみ出した余剰の樹脂接着材３は、部品実装面よりも高さが低い低部に流入し、同様に樹脂接着材３の電子部品４への這い上がりを防止することができる。
【００２６】
なお、上記実施の形態においては、下面に外部接続用電極を備えた電子部品を、この外部接続用電極が接続される回路電極が形成された基板に搭載する例を示したが、本発明はこれに限られるものではない。
【００２７】
例えば図４に示す基板１Ａのように、電子部品４Ａと接続される外部接続用電極としての金属バンプ５を回路電極２の上面に設けてもよい。要は電子部品が接着材により固着される実装位置の外縁部に実装位置に供給された接着材が流下する低部が存在すればよく、外部接続用電極が電子部品側にあっても回路電極側にあっても構わない。なお、外部接続用電極を電子部品側に設けた方が、基板の構造が容易になるので好ましい。
【００２８】
【発明の効果】
本発明によれば、電子部品が接着材により固着される実装位置の外縁部に、実装位置に供給された接着材が流下する低部を形成することにより、接着材の電子部品上面への這い上りを解消することができ、接着材が電子部品の上面に付着することによる実装ツールの汚染などの不具合を防止することができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態の電子部品実装用の基板の斜視図
【図２】本発明の一実施の形態の電子部品実装方法の工程説明図
【図３】本発明の一実施の形態の電子部品実装用の基板の断面図
【図４】本発明の一実施の形態の電子部品実装用の基板の断面図
【符号の説明】
１，１１，２１ 基板
１ｂ、１１ｂ、２１ａ 部品実装面
１ｃ 傾斜面
２ 回路電極
３ 樹脂接着材
４ 電子部品
５ 金属バンプ
１１ｃ 段差部
２１ｂ 溝部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting substrate on which electronic components are mounted and an electronic component mounting method.
[0002]
[Prior art]
As a type of electronic component, a face-down type electronic component in which an external connection electrode such as a metal bump is provided on the lower surface is known. When mounting such an electronic component on a substrate, metal bumps are connected to circuit electrodes formed at the mounting position of the substrate by solder bonding, conductive paste, or the like (see, for example, Patent Document 1). In this mounting structure, if it is necessary to reinforce the connection part of the metal bumps to ensure higher reliability, a reinforcing resin part is formed by interposing a resin adhesive between the electronic component and the substrate. Is done. For forming the reinforcing resin portion, a method of applying a resin to the substrate in advance before mounting the electronic component or a method of injecting the resin after mounting the electronic component on the substrate is used.
[0003]
[Patent Document 1]
Japanese Patent Laid-Open No. 63-122135
[Problems to be solved by the invention]
In recent years, electronic components have been made thinner, and those having a thickness of 100 μm or less have been used. When the above-described reinforcing resin portion is formed for such a thin part, the following problems occur due to the behavior of the resin adhesive. In other words, the paste-like resin adhesive has the property of crawling along the solid surface by surface tension when it comes into contact with the solid surface, and when the electronic component is mounted on the resin adhesive in the electronic component mounting described above, The resin adhesive crawls up from the side edge of the electronic component.
[0005]
At this time, if the electronic component is thin, the scooped up resin adhesive reaches the upper surface of the electronic component, and this resin adhesive easily adheres to a mounting tool used for mounting the electronic component and is likely to be contaminated. . This problem also occurs when the resin adhesive is injected after mounting the electronic component.
[0006]
Then, an object of this invention is to provide the board | substrate for electronic component mounting which can eliminate the creeping of the resin adhesive to the electronic component upper surface, and the electronic component mounting method.
[0008]
[Means for Solving the Problems]
The electronic component mounting substrate according to claim 1 is an electronic component mounting substrate on which an electronic component is mounted via an external connection electrode, and a mounting position at which the electronic component is fixed by an adhesive; A circuit electrode formed at the mounting position to which the external connection electrode is connected; and a low part formed on an outer edge of the mounting position and supplied with the adhesive supplied to the mounting position. It is an inclined surface with a downward slope.
[0009]
The electronic component mounting substrate according to claim 2 is an electronic component mounting substrate on which the electronic component is mounted via an external connection electrode, and a mounting position where the electronic component is fixed by an adhesive, A circuit electrode formed at the mounting position to which the external connection electrode is connected; and a low part formed on an outer edge of the mounting position and supplied with the adhesive supplied to the mounting position. It is a step part.
[0013]
The electronic component mounting method according to claim 3 is an electronic component mounting method for mounting an electronic component on a substrate via an external connection electrode, wherein a circuit electrode is formed and a low portion having a low height is formed at an outer edge portion. An adhesive supplying step for supplying an adhesive to the mounting position, a component mounting step for mounting the electronic component via the external connection electrode at the mounting position to which the adhesive is supplied, and a surplus protruding from the mounting position. An adhesive material flow-down process for causing the adhesive material to flow down into the low portion , wherein the low portion is a sloped surface having a downward slope.
[0014]
The electronic component mounting method according to claim 4 is an electronic component mounting method for mounting an electronic component on a substrate via an external connection electrode, wherein a circuit electrode is formed and a low portion having a low height is formed at an outer edge portion. An adhesive supplying step for supplying an adhesive to the mounting position, a component mounting step for mounting the electronic component via the external connection electrode at the mounting position to which the adhesive is supplied, and a surplus protruding from the mounting position. An adhesive material flow-down process for causing the adhesive material to flow down into the low part , wherein the low part is a stepped part.
[0015]
The electronic component mounting method according to claim 5 is an electronic component mounting method for mounting an electronic component on a substrate via an external connection electrode, wherein a circuit electrode is formed and a low portion having a low height is formed at an outer edge portion. A component mounting step of mounting the electronic component at the mounting position via the external connection electrode, an adhesive supply step of supplying an adhesive between the lower surface of the electronic component and the upper surface of the mounting position, and the mounting An adhesive material flow-down step of flowing the excess adhesive material protruding from the position into the low part, wherein the low part is an inclined surface having a downward slope.
The electronic component mounting method according to claim 6 is an electronic component mounting method for mounting an electronic component on a substrate via an external connection electrode, wherein a circuit electrode is formed and a low portion having a low height is formed at an outer edge portion. A component mounting step of mounting the electronic component at the mounting position via the external connection electrode, an adhesive supply step of supplying an adhesive between the lower surface of the electronic component and the upper surface of the mounting position, and the mounting An adhesive material flow-down process of flowing excess adhesive material protruding from the position into the low part, wherein the low part is a stepped part.
[0016]
According to the present invention, by forming the low part where the adhesive supplied to the mounting position flows down on the outer edge of the mounting position where the electronic component is fixed by the adhesive, the electronic of the adhesive in the electronic component mounted state is formed. Climbing to the upper surface of the component can be eliminated.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a substrate for mounting an electronic component according to an embodiment of the present invention, FIG. 2 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is a cross-sectional view of an electronic component mounting substrate according to an embodiment of the present invention.
[0018]
First, an electronic component mounting board will be described with reference to FIG. At the mounting position where the electronic component is mounted on the upper surface of the substrate 1, a quadrangular convex portion 1 a is formed in plan view. The upper surface of the convex portion 1a is a component mounting surface 1b on which an electronic component is mounted, and the periphery of the component mounting surface 1b is a tapered downward inclined surface 1c having a height lower than that of the component mounting surface 1b. (See also FIG. 2 (a)). That is, a low portion whose height is lower than the component mounting surface 1b is formed on the outer edge portion of the mounting position.
[0019]
A plurality of circuit electrodes 2 are formed around the convex portion 1 a of the substrate 1. Each circuit electrode 2 extends to the four circumferences of the component mounting surface 1b, and the extended end serves as a component connection terminal 2a. In a state where the electronic component is mounted on the substrate 1, the external connection electrode of the electronic component is connected to the terminal 2a.
[0020]
Next, an electronic component mounting method will be described. FIG. 2A shows a cross section of the substrate 1. As shown in FIG. 2B, a paste-like resin adhesive (adhesive) 3 is supplied to the component mounting surface 1b so as to cover the terminals 2a (adhesive supply step). Next, as shown in FIG. 2 (c), the electronic component 4 in which metal bumps 5 serving as external connection electrodes are formed on the lower surface, which is the circuit forming surface on which the circuit is formed, on the substrate 1 after the application of the resin adhesive. Is mounted (component mounting process). That is, the electronic component is mounted on the mounting position via the metal bump 5.
[0021]
In this mounting operation, the electronic component 4 is lowered and the metal bumps 5 are pressed against the terminals 2a through the resin adhesive 3. Thereby, the metal bump 5 is connected to the terminal 2a. When the resin adhesive 3 is cured, the electronic component 4 is fixed to the substrate 1 and the mounting of the electronic component 4 is completed.
[0022]
At this time, the resin adhesive 3 that is displaced by the lower surface of the electronic component 4 and moves to the outside of the component mounting surface 1b flows downward along the inclined surface 1c. That is, the excess resin adhesive 3 that is not accommodated between the lower surface of the electronic component 4 and the component mounting surface 1b flows down to the inclined surface 1c that is the lower part (adhesive material flow-down step).
[0023]
Thereby, problems such as contamination of the mounting tool due to the resin adhesive 3 climbing up from the side end of the electronic component 4 and reaching the upper surface of the electronic component 4 can be prevented. The same applies to the case where the resin adhesive 3 is supplied between the lower surface of the electronic component 4 and the component mounting surface 1b (the upper surface of the mounting position) after the electronic component 4 is mounted. However, it is desirable to supply the resin adhesive 3 to the mounting position before mounting the electronic component because the adhesive can be supplied quickly.
[0024]
In addition to the inclined surface 1c of the above-described example, various forms are possible as the form of the lower part where the excess resin adhesive 3 flows down. For example, a substrate as shown in FIG. 3 may be adopted. . The substrate 11 shown in FIG. 3A has a height of a shape that is provided at the mounting position and that stands up between the four outer edges of the convex portion 11a whose upper surface is the component mounting surface 11b and the surrounding substrate upper surface. The example which provided the level | step difference part 11c with a difference is shown. Further, the substrate 21 shown in FIG. 3B shows an example in which a groove portion 21b cut from the upper surface of the substrate is provided on the outer edge portion of the component mounting surface 21a provided at the mounting position.
[0025]
Even in these cases, the excess resin adhesive 3 that protrudes from the mounting position when the component is mounted flows into a lower portion that is lower than the component mounting surface, and similarly, the resin adhesive 3 scoops into the electronic component 4. The rise can be prevented.
[0026]
In the above embodiment, an example in which an electronic component having an external connection electrode on the lower surface is mounted on a substrate on which a circuit electrode to which the external connection electrode is connected is formed is shown. It is not limited to this.
[0027]
For example, a metal bump 5 as an external connection electrode connected to the electronic component 4A may be provided on the upper surface of the circuit electrode 2 as in the substrate 1A shown in FIG. In short, it is sufficient that there is a low part where the adhesive supplied to the mounting position flows down at the outer edge of the mounting position where the electronic component is fixed by the adhesive, and the circuit electrode even if the external connection electrode is on the electronic component side May be on the side. Note that it is preferable to provide the external connection electrode on the electronic component side because the structure of the substrate becomes easier.
[0028]
【The invention's effect】
According to the present invention, by forming a low portion where the adhesive supplied to the mounting position flows down on the outer edge of the mounting position where the electronic component is fixed by the adhesive, the adhesive is rubbed onto the upper surface of the electronic component. Ascending can be eliminated, and problems such as contamination of the mounting tool due to the adhesive material adhering to the upper surface of the electronic component can be prevented.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting board according to an embodiment of the present invention. FIG. 2 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of an electronic component mounting board according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of an electronic component mounting board according to an embodiment of the present invention.
1,11,21 Substrate 1b, 11b, 21a Component mounting surface 1c Inclined surface 2 Circuit electrode 3 Resin adhesive 4 Electronic component 5 Metal bump 11c Stepped portion 21b Groove portion

Claims (6)

外部接続用電極を介して電子部品が実装される電子部品実装用の基板であって、前記電子部品が接着材により固着される実装位置と、この実装位置に形成され前記外部接続用電極が接続される回路電極と、前記実装位置の外縁部に形成され実装位置に供給された前記接着材が流下する低部とを備え、前記低部が下り勾配の傾斜面であることを特徴とする電子部品実装用の基板。 An electronic component mounting substrate on which an electronic component is mounted via an external connection electrode, the mounting position where the electronic component is fixed by an adhesive, and the external connection electrode formed at the mounting position and circuit electrodes, and a lower portion of the mounting position the adhesive which formed is supplied to the mounting position on the outer edge of the flow down, you wherein lower portion is an inclined surface with a descending slope substrates for electronic component mounting. 外部接続用電極を介して電子部品が実装される電子部品実装用の基板であって、前記電子部品が接着材により固着される実装位置と、この実装位置に形成され前記外部接続用電極が接続される回路電極と、前記実装位置の外縁部に形成され実装位置に供給された前記接着材が流下する低部とを備え、前記低部が段差部であることを特徴とする電子部品実装用の基板。 An electronic component mounting substrate on which an electronic component is mounted via an external connection electrode, the mounting position where the electronic component is fixed by an adhesive, and the external connection electrode formed at the mounting position and circuit electrodes, low portion and a characteristic and to that electronic components that the lower portion is a stepped portion where the mounting position the adhesive material supplied to the formed mounting position on the outer edge of the flow down PCB for mounting. 外部接続用電極を介して電子部品を基板に実装する電子部品実装方法であって、回路電極が形成され外縁部に高さが低い低部が形成された実装位置に接着材を供給する接着材供給工程と、接着材が供給された実装位置に前記電子部品を前記外部接続用電極を介して搭載する部品搭載工程と、前記実装位置からはみ出した余剰の接着材を前記低部内に流下させる接着材流下工程とを含み、前記低部が下り勾配の傾斜面であることを特徴とする電子部品実装方法。 An electronic component mounting method for mounting an electronic component on a substrate via an external connection electrode, and supplying an adhesive to a mounting position where a circuit electrode is formed and a low portion having a low height is formed on an outer edge portion A supplying step, a component mounting step of mounting the electronic component on the mounting position supplied with the adhesive via the external connection electrode, and an adhesive that causes the excess adhesive protruding from the mounting position to flow down into the lower portion wood and a falling step, wherein the that electronic parts mounting method to said lower portion is an inclined surface with a descending slope. 外部接続用電極を介して電子部品を基板に実装する電子部品実装方法であって、回路電極が形成され外縁部に高さが低い低部が形成された実装位置に接着材を供給する接着材供給工程と、接着材が供給された実装位置に前記電子部品を前記外部接続用電極を介して搭載する部品搭載工程と、前記実装位置からはみ出した余剰の接着材を前記低部内に流下させる接着材流下工程とを含み、前記低部が段差部であることを特徴とする電子部品実装方法。 An electronic component mounting method for mounting an electronic component on a substrate via an external connection electrode, and supplying an adhesive to a mounting position where a circuit electrode is formed and a low portion having a low height is formed on an outer edge portion A supplying step, a component mounting step of mounting the electronic component on the mounting position supplied with the adhesive via the external connection electrode, and an adhesive that causes the excess adhesive protruding from the mounting position to flow down into the lower portion and a timber falling step, the to that electronic component mounting method characterized in that the lower portion is stepped portion. 外部接続用電極を介して電子部品を基板に実装する電子部品実装方法であって、回路電極が形成され外縁部に高さが低い低部が形成された実装位置に前記外部接続用電極を介して前記電子部品を搭載する部品搭載工程と、前記電子部品の下面と実装位置の上面との間に接着材を供給する接着材供給工程と、前記実装位置からはみ出した余剰の接着材を前記低部内に流下させる接着材流下工程とを含み、前記低部が下り勾配の傾斜面であることを特徴とする電子部品実装方法。An electronic component mounting method for mounting an electronic component on a substrate via an external connection electrode, wherein the circuit electrode is formed and a low portion having a low height is formed on the outer edge portion, and the external connection electrode is interposed in the mounting position. A component mounting step of mounting the electronic component, an adhesive supply step of supplying an adhesive between the lower surface of the electronic component and the upper surface of the mounting position, and excess adhesive protruding from the mounting position. An electronic material mounting method, wherein the low part is an inclined surface having a downward slope. 外部接続用電極を介して電子部品を基板に実装する電子部品実装方法であって、回路電極が形成され外縁部に高さが低い低部が形成された実装位置に前記外部接続用電極を介して前記電子部品を搭載する部品搭載工程と、前記電子部品の下面と実装位置の上面との間に接着材を供給する接着材供給工程と、前記実装位置からはみ出した余剰の接着材を前記低部内に流下させる接着材流下工程とを含み、前記低部が段差部であることを特徴とする電子部品実装方法。An electronic component mounting method for mounting an electronic component on a substrate via an external connection electrode, wherein the circuit electrode is formed and a low portion having a low height is formed on the outer edge portion, and the external connection electrode is interposed in the mounting position. A component mounting step of mounting the electronic component, an adhesive supply step of supplying an adhesive between the lower surface of the electronic component and the upper surface of the mounting position, and excess adhesive protruding from the mounting position. An electronic material mounting method, wherein the low part is a stepped part.
JP2003082425A 2003-03-25 2003-03-25 Electronic component mounting board and electronic component mounting method Expired - Fee Related JP4100213B2 (en)

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