JPH11140698A - Plating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent scum from falling into a plating cell and to prevent the deterioration of the plating quality of an article to be plated by providing the apparatus with an electrode and a scum receiver disposed in the lower part of the sliding surface of a pantagraph. SOLUTION: In electroplating, the article 5 to be plated is mounted at a receiving plate 2 and while the article is immersed into the plating liquid in the plating cell, the article 5 to be plated is subjected to energizing. The pantagraph 3 is disposed between the electrode 1 and the receiving plate 2 for the purpose of the energization. The article 5 to be plated moves together with the receiving plate 2 and the pantagraph 3 to the next treating vessel for washing, etc., during or after the end of the plating. At this time, the electrode 1 and the pantagraph 3 slide and, therefore, the scum which is oxides, etc., of these surfaces falls into the scum rest 4. As a result, the scum falls into the plating liquid in the plating cell and the adhesion of the scum existing on the surface of the plating liquid and within the liquid to the article 5 to be plated is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a plating apparatus,
In particular, it relates to a plating apparatus for electrolytic plating such as solder plating.

[0002]

2. Description of the Related Art In general, in order to apply electrolytic plating such as solder plating to a component used for an IC or the like, a pantograph 3 is placed between an electrode 1 and a receiving plate 2 holding an object 5 as shown in FIG. Provided for conduction. Since the plating object 5 moves together with the receiving plate 2 to the next processing tank, the electrode 1 and the pantograph 3 slide while keeping the contact point. At this time, scraps such as oxides generated on the electrode 1 and the pantograph 3 due to the atmosphere of the plating solution or the like are peeled off and fall into the plating tank.

In order to remove the scum, for example, Japanese Patent Application Laid-Open
As described in JP-A-239604, there is a method of removing using a spatula that automatically moves vertically and horizontally.

[0004]

The first problem is that, in the prior art, the plating quality of the object to be plated deteriorates due to scum such as oxide.

[0005] The reason is that, while the residue floating on the surface can be removed using a spatula or the like, the residue that has entered the plating solution cannot be removed.

[0006] An object of the present invention is to provide a plating apparatus that prevents generated scum from falling into a plating tank and does not deteriorate the plating quality of an object to be plated.

[0007]

The plating apparatus of the present invention comprises:
An electrode, a receiving plate made of a conductive material for holding an object to be plated below, a pantograph provided on the receiving plate to slide the electrode and establish conduction, and sliding of the electrode and the pantograph And a scrap receiver provided at a lower portion of the surface. In particular, the cross-sectional shape of the residue is concave.

[0008] The scum generated by the sliding of the electrode and the pantograph is received by the scum receptacle, so that it does not fall into the plating tank.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a vicinity of a pantograph for explaining a first embodiment of the present invention, and FIGS. 2 (a) and 2 (b).
FIG. 1 is a top view of a pantograph and an electrode and a cross-sectional view taken along line AA. In particular, the cross-sectional view shows a waste receptacle and a plating tank.

Referring to FIGS. 1 and 2 (a) and 2 (b), the plating apparatus according to the first embodiment holds an electrode 1 and an object 5 such as a lead frame with a clip pin or the like. A receiving plate 2 made of stainless steel or the like, a pantograph 3 connected to an upper portion of the receiving plate 2 by a bolt or the like, and sliding on the electrode 1, and a cross-sectional shape provided below a sliding surface of the electrode 1 and the pantograph 3 It is configured to include a concave waste receptacle 4.

Next, the operation of the first embodiment of the present invention will be described in detail with reference to FIG.

When performing electrolytic plating, plating is performed by passing electricity through the plating object 5 while attaching the plating object 5 to the receiving plate 2 and immersing it in the plating solution 8 in the plating tank 7. Note that a pantograph 3 is provided between the electrode 1 and the receiving plate 2 in order to pass electricity through the object 5 to be plated.

The plating object 5 moves to a processing tank for the next washing or the like together with the receiving plate 2 and the pantograph 3 while plating is performed or when plating is completed. That is, the electrode 1 and the pantograph 3 slide. At this time, a residue 6 such as an oxide on the surface of the electrode 1 or the pantograph 3 is formed.
Falls into the waste receptacle 4. If there is no dregs receiver 4, dregs 6 fall into plating solution 8 in plating tank 7,
Since the plating solution 8 is present on the surface or inside, the scum 6 adheres to the plating object 5 and the quality is deteriorated.

FIG. 3 is a cross-sectional view for explaining a second embodiment of the present invention. It is a larger one.

FIG. 4 is a cross-sectional view for explaining a third embodiment of the present invention. In order to obtain the same effect as that of the second embodiment, the electrode 1 is connected to the waste receiver 4B. is there.

These scrap receivers 4A and 4B are connected to the receiving plate 2
Are provided with a gap therebetween to prevent the plated object 5 from dropping or the like due to interference when sliding.

FIG. 5 is a perspective view showing the vicinity of an electrode and a pantograph for explaining a fourth embodiment of the present invention.

In the fourth embodiment, the contact portion between the pantograph 3A and the electrode 1 is provided on the side opposite to the receiving plate 2, and accordingly, the waste receptacle 4C is also set on the opposite side and fixed to the lower surface of the electrode. Thereby, the waste does not fall from the gap between the waste receiver 4C and the electrode 1 and the waste receiver 4C and the receiving plate 2
Never fall from the gap.

[0019]

The first effect is that scum such as an oxide film on the surface of the electrode and the pantograph does not fall into the plating tank. As a result, the quality of plating does not deteriorate due to the adhesion of scum to the object to be plated.

The reason is that a waste receptacle is provided so that the waste does not fall into the plating tank.

[Brief description of the drawings]

FIG. 1 is a perspective view of a vicinity of a pantograph for explaining a first embodiment of the present invention.

FIG. 2 is a top view and a cross-sectional view of a pantograph and electrodes for describing a first embodiment of the present invention.

FIG. 3 is a cross-sectional view for explaining a second embodiment of the present invention.

FIG. 4 is a cross-sectional view for explaining a third embodiment of the present invention.

FIG. 5 is a perspective view showing the vicinity of an electrode and a pantograph for explaining a fourth embodiment of the present invention.

FIG. 6 is a perspective view of the vicinity of an electrode and a pantograph of a conventional plating apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electrode 2 Receiving plate 3.3A Pantograph 4, 4A-4C Scrap receiver 5 Plated object 6 Scrap 7 Plating tank 8 Plating solution

Claims (5)

[Claims] An electrode, a receiving plate made of a conductive material for holding an object to be plated downward, a pantograph provided on an upper portion of the receiving plate for sliding the electrode to establish conduction.
A plating apparatus comprising: the electrode; and a dregs receiver provided below a sliding surface of the pantograph. 2. The plating apparatus according to claim 1, wherein the surface of the electrode on which the pantograph slides is on the receiving plate side. 3. The plating apparatus according to claim 1, wherein the surface of the electrode on which the pantograph slides is opposite to the side of the receiving plate. 4. The plating apparatus according to claim 1, wherein the waste receptacle has a concave cross-sectional shape. 5. The plating apparatus according to claim 1, wherein the waste receptacle is attached to a lower surface of the electrode.